CN108089413B

CN108089413B - Processing equipment

Info

Publication number: CN108089413B
Application number: CN201711164011.3A
Authority: CN
Inventors: 托马斯·瓦尔; 卡斯滕·康泰克; 约克·保姆巴赫
Original assignee: Manz AG
Current assignee: Manz AG
Priority date: 2016-11-21
Filing date: 2017-11-21
Publication date: 2021-07-30
Anticipated expiration: 2037-11-21
Also published as: DE102016122355A1; DE102016122355B4; CN108089413A

Abstract

In order to further develop a processing device for plate-shaped bodies, in particular plate-shaped substrate bodies to be exposed, having two plate sides arranged opposite one another, in order to make it possible, for example, to precisely recognize the orientation of the plate-shaped body and, in particular, to orient the structures provided on the two plate sides as precisely as possible with respect to one another, it is proposed that the processing device comprises an embossing system having two partial embossing units which are arranged on both sides of a geometric embossing reference surface, each of the partial embossing units comprising at least one embossing punch facing the geometric embossing reference surface, and that the processing device has a guide for the plate-shaped body which orients the plate-shaped body substantially in the embossing reference surface.

Description

Processing equipment

Technical Field

The invention relates to a processing device for a plate-shaped body having two plate sides arranged opposite one another, in particular for a substrate body to be exposed.

Background

Such processing equipment is known.

In particular, such a processing device is provided for equipping at least one of the two oppositely disposed plate sides, in particular both plate sides, with a predefined structure.

In the known processing device there is the problem that the orientation of the plate-like body should be accurately recognized.

There is also the problem that the predefined structures, which are introduced on both plate sides, should be oriented as precisely as possible with respect to one another.

In some known processing apparatuses, the corners and/or edge strips of the plate-like body are used to identify the orientation, in particular the position, of the plate-like body, for example by means of an image recognition system.

However, in this case, there is the problem that the identification device cannot or cannot reliably function when the edge strips are rough or uneven and/or when the rounding of the corners is too great.

Furthermore, it may happen that the extent of the edge strip in the recognition area of the image recognition system is not large enough for an accurate detection of the edge strip and therefore an accurate detection cannot be achieved.

In other known processing devices, marks, in particular spot-like exposed marks, are introduced in the photosensitive layer of the plate-like body by exposure, for example by means of a UV laser.

This has the disadvantage that in some photosensitive materials no colour change occurs upon exposure and that no markings can be introduced in this way which can be recognized by an image recognition system.

Another disadvantage is that the color change is delayed in some photochemical processes, so that only after the delay is the marking recognized and the plate-like body can be further processed and thus undesired waiting times occur in the processing method of the plate-like body.

DE 102008038835 describes a method in which a marking is introduced on one of the two plate sides by means of a spindle integrated in the exposure stage, while the other of the two plate sides is exposed.

The disadvantage here is that the plate-shaped body is held by vacuum fixing and the pressing force of the mandrel must be smaller than the holding force produced by the vacuum, but this pressing force is too small to produce a sufficiently large and reliable marking.

Disclosure of Invention

The invention is therefore based on the object of improving a processing device of this type, for example in such a way that the orientation of the plate-like body can be precisely recognized and in particular the structures associated with the two plate sides can be oriented relative to one another as precisely as possible.

According to the invention, the object is achieved by a processing device of the type mentioned at the outset, in that the processing device comprises an embossing system which comprises at least one associated partial embossing mechanism on each side of the geometric embossing reference plane, wherein each of the partial embossing mechanisms comprises at least one embossing punch facing the geometric embossing reference plane, and the processing device has a guide for the plate-shaped body which orients the plate-shaped body substantially in the embossing reference plane.

The embossing system therefore comprises at least two partial embossing units, for example exactly two partial embossing units, wherein at least one partial embossing unit is provided on each side of the geometric embossing reference plane.

One of the advantages of the solution according to the invention is that the embossing marks can be pressed into one of the two oppositely situated plate flanks by means of one or more embossing punches of one of the two sub-embossing mechanisms, which embossing punches is/are directed towards the embossing reference plane, and into the other of the two oppositely situated plate flanks by means of one or more embossing punches of the other of the two sub-embossing mechanisms, which embossing punches is directed towards the embossing reference plane.

In an advantageous manner, therefore, the positioning and/or orientation of the plate-like body can be realized when one of the two plate sides is viewed, and in particular a predefined structure is applied precisely on the plate side of the plate-like body in an oriented manner by means of the embossed marks.

For example, the predefined structures to be applied to the two plate sides can be precisely aligned with respect to one another by means of embossed marks applied to the two oppositely situated plate sides.

The precise orientation of the predefined structures is important, for example, when the predefined structures form conductor tracks of the circuit board in a further method step and, for example, the conductor tracks are to be connected electrically conductively through the plate-like body.

In addition, the embossed marks can be recorded in particular precisely and reliably.

A further advantage of the solution according to the invention is that the embossed marks can be introduced into the plate-like body independently of the material of which the plate-like body is made.

Furthermore, one advantage of the solution according to the invention is that the embossed marks can be recognized immediately after embossing and therefore no waiting time is required between the processing steps.

In particular, the embossed marks may also be introduced into the plate-like body before the further processing step in time, so that the marks of the plate-like body may not influence the further processing step and thus the further processing step may be carried out without time loss.

No further description is presently made regarding the arrangement of the embossing punches.

In a particularly advantageous embodiment, it is provided that, when the plate-shaped body is arranged in the stamping position, the stamping punch of one of the two partial stamping means is aligned with one of the two plate-shaped body sides, and the stamping punch of the other of the two partial stamping means is aligned with the other of the two plate-shaped body sides.

Thus, one of the stamping punches of the two sub-stamping mechanisms stamps the stamping mark on one of the two plate sides and the other stamping punch of the two sub-stamping mechanisms stamps the stamping mark on the other of the two plate sides, and the two plate sides are thus provided with the stamping mark.

In addition, the embossing marks are advantageously pressed into both plate sides substantially simultaneously, and the embossing process is thus terminated particularly quickly.

Furthermore, the embossing marks can thereby be pressed into the two plate sides in a precisely aligned manner with respect to one another and, in particular, predefined structures can be applied to the two plate sides in a precisely aligned manner with respect to one another by means of the embossing marks.

The plate-like body is not described in more detail at present.

The plate-like body is, for example, a substrate body, in particular a substrate body to be exposed.

In particular, it is provided that the plate-like body is preferably provided with a predefined structure on both plate sides.

Provision is preferably made for the predefined structures to be introduced into the plate-like body by means of an exposure method.

In this case, it is particularly advantageous if the plate-like body, in particular the substrate body to be exposed, has one or more layers at least on one of the two plate sides, preferably on both plate sides.

One or more of the layers is, for example, a metal layer, preferably a copper layer, from which an electrically conductive conductor track is formed, in particular in the case of processing devices.

In particular, one or more of the layers is a photosensitive layer. In particular, photochemical changes are triggered in the photosensitive layer by exposure.

Furthermore, in some embodiments, it is provided that one or more of the layers is a protective layer, for example mylar (polyester film). The protective layer protects, for example, the other layers from mechanical effects and/or electromagnetic radiation, in particular from light radiation which triggers photochemical processes in these layers.

The plate-like body preferably comprises a carrier plate, wherein the layer is applied in particular on one side, preferably on opposite sides, of the carrier plate.

In particular, the plate-like body extends in a geometric body plane, wherein a plate-like body extending substantially in the body plane is to be understood, for example, as meaning that the extension of the plate-like body in the geometric body plane is substantially greater, preferably at least 5 times greater, advantageously at least 10 times greater, than the extension of the plate-like body perpendicular to the body plane.

The body plane extends, for example, through the carrier plate and the carrier plate preferably extends substantially in the body plane.

In particular, the geometric body plane extends between two oppositely disposed plate sides, so that the two oppositely disposed plate sides are disposed on different sides of the geometric body plane.

In particular, the two opposing plate sides each extend substantially in a geometric plane running substantially parallel to the geometric body plane.

A plate side is to be understood to mean, in particular, a volume region of the plate-like body which extends, in particular, from the outer surface of the plate-like body inwards, in particular in the direction of the geometric body plane, into the plate-like body.

In particular, the oppositely disposed plate sides each comprise one or more, in particular all, of the layers of the plate-shaped body.

No further description is currently made in the context of geometrically impressing a datum plane.

It is particularly advantageous if the geometric stamping reference plane extends substantially parallel to the main body plane of the plate-like body arranged in the stamping position.

The embossing marks can thus be introduced into the two plate sides in an advantageous manner by means of the embossing punch with accuracy and precision.

Above and below, planes and/or axes which extend substantially parallel to one another are to be understood in particular as planes and/or axes which extend parallel to one another or form an angle of at most 20 °, for example at most 10 °, preferably at most 5 °, with one another.

In a particularly advantageous embodiment, it is provided that the processing device comprises a bearing surface on which the plate-like body rests at least partially in the stamping position.

In this way, for example, the plate-like body is positioned in the embossing position in a position-adapted manner and thus, in particular, the embossing marks are pressed into the two plate sides precisely and accurately.

The support surface is for example a substantially continuous plane.

In other embodiments, it can be provided that the bearing surface is essentially formed by a frame, on which the plate-like body lies.

In particular, the bearing surface and the geometric stamping reference surface extend substantially parallel to each other.

In particular, it is provided that the plate-like body lies with one of the two plate sides substantially on the bearing surface in the stamping position.

Thus, for example, the bearing surface and the geometric impression reference surface are arranged at a distance from one another.

No more detailed description is presently made regarding the embossing punch.

In particular, the stamping punch is provided for pressing the stamping mark into the plate-like body, for example.

Advantageously, the embossing punch is force-loaded.

In particular, these embossing punches have an embossing head on one of their ends, with which the embossing marks are embossed into the plate-like body.

In particular, the stamping punch is arranged movably in order to be able to effect the pressing of the stamped marks into the plate-like body.

It is particularly advantageous if the embossing punch is arranged to be linearly movable substantially in the axial direction of the punch axis.

In a particularly preferred embodiment, it is provided that a plurality of, in particular all, embossing punches are each arranged so as to be movable essentially linearly in the axial direction of the respective punch axis.

The stamping punch can therefore be aligned particularly advantageously in an advantageous manner with the plate-like body arranged in the stamping position and the stamping mark can be introduced particularly precisely.

It is particularly advantageous if one of the punch axes or punch axes of the embossing punches extends at least approximately perpendicularly to the geometric embossing reference plane.

The expression "at least approximately" is understood above and below to include deviations of not more than 20%, preferably not more than 10%, in particular not more than 5%, particularly preferably not more than 2%, of the stated values.

In particular, it is provided that an embossing punch of one of the two partial embossing units and an embossing punch of the other partial embossing unit together form a punch system.

In particular, it is advantageous if a plurality of, in particular all, embossing punches of one of the two partial embossing units and embossing punches of the other of the two partial embossing units each form a punch system.

In this case, it is provided in particular that the two embossing punches, in particular their embossing heads, which together form the punch system, are arranged offset in the axial direction of the axis of the punch system.

The embossed marks are therefore pressed into the two plate sides in a mutually adapted manner, so that preferably mutually exactly adapted patterns of the embossed marks are pressed into the two plate sides.

Thus, for example, the two board sides can be provided with a predefined structure that is precisely oriented relative to one another by means of a mutually adapted pattern of embossed marks in a particularly advantageous manner.

In particular, two embossing punches which are arranged substantially offset to one another in the axial direction of the punch system axis are to be understood as meaning embossing punches which are arranged offset to one another in the axial direction of the punch system axis and are arranged offset to one another in the direction radially to the punch system axis by at most 20 μm, preferably at most 10 μm, particularly preferably at most 5 μm, in a particularly advantageous manner at most 2 μm.

Preferably, the projections of the two embossing marks, which are each pressed in by one of the two embossing punches which together form the punch system, onto the geometric embossing reference surface and/or the geometric main body plane are arranged offset from one another by at most 20 μm, preferably by at most 10 μm, in particular by at most 5 μm, particularly advantageously by at most 2 μm.

Preferably, one punch system axis and/or a plurality, in particular all, punch system axes extend at least approximately perpendicularly to the geometric stamping reference plane, and therefore preferably two stamping punches of each punch system each press two stamping marks, which are oriented precisely relative to one another, into each of the two plate flanks of the plate-shaped body.

It is particularly advantageous if the punch axis of the stamping punch of the punch system substantially coincides with the punch system axis in one punch system and/or in a plurality, in particular all, punch systems.

In particular, it is thus possible to achieve a particularly precise pressing-in of the embossing marks and a particularly precise orientation of the embossing marks pressed in by the two embossing punches of the punch system relative to one another.

In this context, two substantially coinciding axes are to be understood as meaning, in particular, axes which extend substantially parallel to one another and/or whose intersection points are at a distance of at most 20 μm, preferably at most 10 μm, particularly preferably at most 5 μm, particularly preferably at most 2 μm from the geometric impression reference plane.

In a particularly advantageous embodiment, it is provided that the arrangement of the stamping punches of one of the two partial stamping units and the arrangement of the stamping punches of the other of the two partial stamping units are configured to be adapted to one another.

In this case, preferably, mutually adapted arrangements of the embossing punches are pressed into the two plate sides, by means of which arrangements, in particular, predefined structures can be applied to the two plate sides in a precisely aligned manner with respect to one another.

When the arrangement of the embossing punches is configured to be adapted to one another, for example, deviations that may exist between the individual embossing punches are precisely determined, so that data records of the precisely determined deviations can be made available to other processing devices of the processing system, for example as correction tables.

It is particularly advantageous if the arrangement of the embossing punches of one of the two partial embossing units and the arrangement of the embossing punches of the other of the two partial embossing units are substantially symmetrical to one another with respect to a geometric embossing reference plane.

The two plate sides of the plate-like body are therefore provided with embossed marks arranged substantially symmetrically to one another, and it is therefore preferred that the predefined structures are precisely orientable with respect to one another on the two plate sides.

In principle, it can be provided that the two partial embossing units each comprise a different number of embossing punches.

However, it is advantageous if the two partial embossing mechanisms each comprise the same number of embossing punches.

The two partial embossing units preferably each comprise exactly one embossing punch, for example.

The two partial embossing devices preferably each comprise at least two embossing punches.

In particular, the two partial embossing units each comprise exactly two embossing punches.

The embossing punches are therefore arranged sufficiently in the two secondary embossing regions in order to detect the orientation of the plate-like body, which is equipped with embossing marks by the embossing punches, and at the same time to provide a low-cost and simple embodiment.

In a particularly advantageous embodiment, it is provided that the two partial embossing units each comprise exactly three embossing punches.

In a further particularly advantageous embodiment, it is provided that the two partial embossing units each comprise exactly four embossing punches.

In a further advantageous embodiment, it is provided that the two partial embossing units each comprise exactly five or exactly six embossing punches.

Therefore, it is preferable to improve the accuracy of detecting the position and/or orientation of the plate-like body, each plate side of which is provided with a plurality of embossed marks, for example, the position and/or the rotational angle of the plate-like body can be thus determined with higher accuracy.

Furthermore, in these embodiments, it is possible, for example, to determine the two scale factors in mutually orthogonal directions (which are in particular substantially parallel to the body plane) and/or to determine the displacement angle for converting the coordinates of the predefined structure to the two plate sides.

In particular, it is provided that the embossing punches each introduce embossing marks into one of the two plate sides with their embossing heads.

In particular, the embossed marking is a geometric deformation which is irreversible in one of the two plate sides, preferably in the surface region of the plate side.

In particular, the embossed mark is a recess in one of the two plate sides, which is at least partially introduced from the outer surface of the plate-like body in the direction of the body plane.

Here, the imprint head of the imprint punch takes various shapes.

At least one of the imprint heads of the imprint head has, for example, a substantially flat imprint surface.

In particular, a structurally simple embodiment is thus provided.

In particular, the flat stamping surface is oriented towards the plate-shaped body arranged in the stamping position and thus presses the stamping mark into the plate-shaped body, the stamping mark being in the form of a recess having a bottom surface which is substantially identical to the shape of the flat stamping surface.

In a further advantageous embodiment, it is provided that at least one embossing head of the embossing punch has a tip, in particular a tip oriented toward the geometric embossing reference plane and/or the plate-like body arranged in the embossing position.

In particular, precise, for example sharply defined, embossed marks can thus be introduced into the plate-like body.

In some preferred embodiments, it is provided that the at least one imprint head of the imprint punch has at least one edge strip, wherein in particular the at least one edge strip extends from a geometric surface extending substantially parallel to the imprint reference surface in the direction of the geometric imprint reference surface and/or in the direction of the plate-shaped body arranged in the imprint position.

The edge strips have, for example, substantially flat end faces.

In a further embodiment, it is provided that the edge strips substantially intersect at an acute angle.

Furthermore, it can be provided that the at least one imprint head has a plurality of edge strips, and that these edge strips are arranged, for example, along the contour of a polygon, for example a triangle or a quadrangle.

Therefore, the shape-optimized embossed marks are preferably introduced into the plate-like body for a recording apparatus for recording.

No more detailed description is presently made regarding other components and/or devices of the processing apparatus.

The processing device preferably has a stop mechanism which prevents the embossed marks from being pressed too far in.

Thus, for example, a precisely defined introduction of the embossed marks can be achieved.

Furthermore, in particular, excessive deformation of the plate-like body and, for example, damage to the plate-like body are prevented.

In particular, the stop means stop the embossing punch before the embossing punch and/or the embossing punches, in particular all embossing punches, reach the geometric embossing reference surface, in particular with their embossing heads.

It is particularly advantageous if the stop structure prevents further pressing of the one embossing punch and/or the plurality of, in particular all, embossing punches into the plate-shaped body before the one or more or all embossing punches reach the geometric body plane of the plate-shaped body, in particular arranged in the embossing position.

The one and/or more, in particular all, embossing punches are thus pressed into the plate-like body up to the geometric body plane.

Preferably, the stop means prevent further pressing of the one embossing punch and/or the plurality of, in particular all, embossing punches into the plate-like body before one or more or all of the embossing punches have completely penetrated the surface volume region of the side of the plate.

In particular, the surface volume region of the plate side comprises a volume region of the plate side which extends from the surface of the plate side into the plate-like body in the direction of the geometric main body plane and has an extension of at most one quarter, preferably at most one tenth, of the entire extension of the plate-like body perpendicular to the main body plane.

That is, in particular, the plate-like body is thus prevented from being deformed too sharply and from being damaged thereby.

In a particularly preferred embodiment, it is provided that the stop means prevent a further pressing-in of the embossing punch and/or of the embossing punches, in particular of all embossing punches, into the plate-like body before one or more or all embossing punches have completely penetrated one or more layers of the plate-like body.

Thus, in these embodiments, the stamping punch is only pressed into one or more layers of the plate-like body.

Thus, on the one hand the plate-like body is provided with embossed marks and on the other hand a large part of the plate-like body, for example its carrier plate, remains unarmed during the embossing process.

In particular, the carrier plate carries the layer.

The stop mechanism comprises, for example, a pressure sensor, wherein preferably the stamping punch is prevented from being pressed further in if the pressure sensor is subjected to an excessive counterforce.

In a further embodiment, the stop means is formed mechanically, for example by a stop.

Furthermore, it can be provided that the stop arrangement comprises a measuring device which measures the pressing-in of the stamping punch or of the stamping punches, in particular of all stamping punches, and prevents further pressing-in if a predefined setpoint pressing-in value of the stamping punch or stamping punches is exceeded.

In a particularly advantageous embodiment, the processing device has one or more stops.

In particular, the stop or the stops are provided for the positionally adapted arrangement of the plate-like body, for example in the stamping position of the plate-like body.

The precise orientation of the plate-like body with respect to the embossing process is therefore simplified in an advantageous manner.

The stop or stops are, for example, arranged at the edge of the embossed area.

In particular, the stop and/or the stops extend at least approximately perpendicularly to the geometric stamping reference plane.

In particular, it is provided that the processing device comprises a recording device for recording the embossed marks.

In particular, the recording device comprises one or more recording cameras for recording the position of the embossed marks of the plate-like body arranged in the recording position.

In a particularly preferred embodiment, it is provided that the processing device also has an exposure device.

In particular, the exposure device has an exposure system with which the plate-shaped body arranged in the exposure position, in particular the substrate body to be exposed, is exposed, in particular along a predefined structure.

The processing device is designed, for example, as an embossing device.

In some embodiments the embossing device is a separate machine.

The processing devices of the processing plant are preferably connected by means of a transport device which transports the plate-shaped body from one of the processing devices onwards to the next processing device.

In a particularly advantageous embodiment, provision is made in the processing device for one of the components, for example the integrated stamping device, to have a stamping punch and for the processing device to have further devices for processing the plate-shaped body.

The processing apparatus is, for example, an exposure apparatus for a plate-like body, in particular for a substrate body to be exposed.

In the processing device, for example, the plate-like body is provided with a predefined structure.

The predefined structure is preferably introduced into the plate-like body by laser machining.

The processing device preferably comprises one or more lasers for this purpose.

In another preferred embodiment, the exposure apparatus comprises a light emitting diode.

The invention further relates to a method for producing a plate-shaped body, wherein the plate-shaped body has two plate flanks which are arranged opposite one another on both sides of a main body plane.

In particular, the method is a method for exposing a plate-like body.

In particular, the plate-like body has one or more of the above-mentioned features.

The basic task is to improve the method, in particular to equip the two plate sides with predefined structures oriented precisely relative to each other.

In the method according to the invention, at least one embossing mark is pressed into each of the two opposite plate sides.

In particular, the position and/or orientation of the plate-like body can thus be realized in a particularly advantageous manner by means of the respective at least one embossed marking.

The method preferably has one or more of the features mentioned above.

One or more of the above-mentioned advantages are thus transferred to the method according to the invention.

In particular, in the method, it is provided that the embossed marking is pressed into one of the two plate sides in a direction extending at least approximately perpendicularly to the body plane, opposite the embossed marking pressed into the other of the two plate sides.

In particular, it is advantageous if the embossed marks are pressed into the other of the two plate sides in a direction extending at least approximately perpendicularly to the body plane, in each case opposite a plurality of embossed marks, in particular all embossed marks pressed into one of the two plate sides.

In particular, it is thereby possible to apply the predefined structures to one and the other of the two plate sides in a precisely aligned manner with respect to one another by means of the embossed marks pressed in opposite directions.

In an advantageous manner, it is provided that the same number of embossed marks are each pressed into two opposite plate sides.

For example, exactly one or exactly two or exactly three or exactly four or exactly five or exactly six embossing marks are respectively pressed into two opposite plate sides.

It is particularly advantageous if the embossed marks are pressed into the two oppositely arranged plate flanks substantially symmetrically to one another, in particular substantially symmetrically with respect to the main body plane of the plate-like body.

The predefined structures are therefore applied in a particularly advantageous manner to the two plate sides in a precisely oriented manner relative to one another.

In a further particularly advantageous embodiment of the method, it is provided that the data record with the spatial offset between two embossed marks, in particular parallel to the main body plane, which are pressed into one of the two plate sides and into the other plate side opposite one another, is transmitted to a further processing device, in which the plate-shaped body is processed.

In a further particularly advantageous embodiment, it is provided that the data records, in particular the data records parallel to the main body plane with a spatial offset between two embossing marks, which are pressed into one of the two plate sides and the other plate side opposite one another, are stored in a further processing device, for example in the form of a correction table, in which method the plate-shaped body is processed in the further processing device.

The spatial offset is therefore adjustable in the further processing device in the further method step, and the position of the embossed mark on one of the two plate sides facing away from the detection device can be determined by detecting the embossed mark on the other side facing the detection device by means of a data recording of the spatial offset.

In particular, it is provided that one or more, in particular all, embossed marks are pressed into the main body plane of the plate-shaped body at most.

It is particularly advantageous to press an embossed mark, preferably a plurality of embossed marks, in particular all of them, only into the surface layer volume region of the side of the plate.

The surface volume region of the plate side extends, for example, from the surface of the plate side in the direction of the body plane with an extent of up to a quarter, preferably up to a tenth, of the entire extent of the plate body perpendicular to the body plane into the plate body.

It is particularly advantageous to press one or more, in particular all, embossed marks into one or more layers of the plate-like body only.

In particular, it is provided that the carrier plate of the plate-shaped body, in particular of the carrier layer, remains undeformed during the pressing in of the embossing marks.

Thus, for example, the plate-like body is provided with embossed markings on the one hand and the deformation of the plate-like body is kept as small as possible on the other hand.

It is particularly advantageous to press the embossed marks on one or both of the two oppositely disposed plate sides outside the structural region to be provided with the predefined structure.

The monitoring of the orientation of the plate-like body can thus be carried out on the one hand by means of the pressed-in embossed marks and on the other hand without damaging the structural region, so that in particular a predefined structure can thus be applied without causing damage within the structural region by means of the embossed marks.

The structure region is in particular the structure region to be exposed.

Furthermore, it is particularly advantageous to detect the position and/or orientation of the plate-like body by means of pressed-in embossed marks.

Preferably, the structure is applied by means of pressed-in embossed marks in an oriented manner on one of the two oppositely disposed plate sides, in particular on both plate sides.

In particular, the structure is applied to one or both of the two opposite plate sides by means of embossed marks, preferably precisely aligned with respect to one another.

In particular, the embossed marking is preferably embodied in a precisely aligned manner with one of the two plate sides, in particular with both plate sides.

It is particularly advantageous to apply a suitable structure, in particular an exposure-suitable structure, on the two opposite plate sides by means of the embossed marks.

Further features and advantages of the solution according to the invention are the subject of the following description and the accompanying drawings.

Drawings

In the figure:

FIG. 1 shows a schematic view of an embodiment of a processing plant according to the invention;

fig. 2 shows a perspective view of a coated substrate body, for example for a plate-shaped body, which has no embossed marks on one side and embossed marks on the other side;

FIG. 3 shows a schematic view of a predefined structure;

fig. 4 shows a schematic view of an embossing device according to the invention;

FIG. 5 shows a schematic diagram of an embossing system consisting of two embossing punches;

fig. 6 shows a view of different imprint heads according to different embodiments of the solution of the present invention.

Detailed Description

An embodiment of an exposure system, which is designated as a whole by 10 and is shown schematically in fig. 1, is described by way of example for the processing device 8.

The processing device 8 is arranged for processing a plate-like body 12.

The exposure system 10 provided for exposing the plate-like body 12 includes an exposure device 16, a recording device 18, and an imprint device 20.

The plate-like body 12 is, for example, a base plate body 13, which is substantially plate-like in configuration (fig. 2).

In particular, the plate-like body 12, for example the substrate body 13, extends substantially in a geometric body plane 24.

The extension of the substrate body 13 in the body plane 24 is significantly greater, for example at least by a factor of 10 greater, than the extension of the substrate body 13 perpendicular to the body plane 24.

The base body 13 comprises two

plate sides

26 and 28 arranged opposite each other.

The geometric body plane 24 extends between the plate sides 26 and 28, so that the plate sides 26 and 28 are thus arranged on opposite sides of the geometric body plane 24.

The plate flanks 26 and 28 are substantially flat and extend substantially, in particular, in a geometric plane extending substantially parallel to the geometric main body plane 24.

The substrate body 13 comprises in particular a carrier plate 32 through which the body plane 24 extends, for example.

The carrier plate 32 is coated with a plurality of layers next to the opposing plate sides 26 and 28.

The substrate body 13 has, in particular next to each of the plate sides 26 and 28, a copper layer 34, from which a conductor track is formed during the production process.

Furthermore, the substrate body 13 has, next to each of the plate sides 26 and 28, a photosensitive layer 36, which is exposed with the structures to be exposed in an exposure step of the production method.

In particular, in the case of suitable exposure, photochemical processes are triggered in the photosensitive layer 36, whereby the material of the photosensitive layer 36 is converted.

The chemically converted material preferably protects the underlying regions of the copper layer 34, so that only the unconverted regions of the photosensitive layer 36 and the correspondingly underlying regions of the copper layer 34 are etched away during the etching process.

Thus, by exposing the regions of the photosensitive layer 36 corresponding to the predefined structures, the predefined structures can be applied to the plate-like body 12, in particular to the substrate body 13.

Furthermore, it is preferably provided that the substrate body 13 has a protective layer 38 on each of the oppositely disposed side faces 26 and 28.

The exposure device 16 includes a light source 42 that is controlled by a control system 44.

The light source 42 preferably comprises one or more lasers or Light Emitting Diodes (LEDs).

Furthermore, the exposure device 16 comprises a memory 46 in which structures 48 to be exposed are stored.

The structure 48 to be exposed is in particular built up from a plurality of structural elements 52.

The plurality of structural elements 52 are in particular of identical design.

Each of the structural elements 52 is constructed from a plurality of members 54.

These components 54 form, for example, a conductor circuit and these components 52 form a conductor circuit system for electronic or electrical functional elements.

The structure 48 to be exposed is stored in the memory 46 in the form of its position coordinates (X, Y), i.e. in particular the position coordinates (X, Y) of the structural elements 52 and of the component 54 are stored in the memory 46 (fig. 3).

The structure 48 to be exposed, i.e. in particular the structural element 52, is preferably arranged in a structural region 56, whose position coordinates (X, Y) are likewise stored in the memory 46.

Further, the exposure device 16 includes a holding device 62 that holds the substrate main body 13 in the exposure position in the exposure step.

In the exposure position, one of the plate sides 26 and 28 faces the light source 42 and can therefore be exposed by the light source.

In particular, the substrate body 13 is arranged substantially in the geometric exposure plane 64 in the exposure position.

In the exposure position, the body plane 24 and the exposure plane 64 preferably extend substantially parallel to one another.

The substrate body 13 can be transported from the recording device 18 into the exposure device 16, in particular into a transport path exposure position, by means of the transport device 68.

The recording device 18 records, for example by means of a recording camera 72, the position and orientation of the substrate body 13 in the transport device 68.

The transport device 68 transports the substrate body 13 from the recording device 18 to the exposure device 16 preferably in a linear transport direction 76, which extends, for example, in the exposure plane 64.

Here, the transport device accurately detects a path through which the substrate main body 13 passes.

Thus, the orientation a and the position of the substrate body 13, in particular previously recorded in the recording device 18, can also be precisely tracked and determined by the transport device 68 while transporting the substrate body 13.

The orientation a of the substrate body 13 is transmitted to the exposure device 16 by means of a data line 78 between the recording device 18 and the exposure device 16.

The recording device 18 recognizes the orientation a of the substrate body 13 by means of the embossed marks 112 provided on the substrate body 13.

In particular, embossed marks 112 are detected by an image processing system of recording device 18.

The imprint apparatus 20 imprints the imprint marks 112 into the substrate body 13.

The imprint apparatus 20 includes a guide portion 122 (fig. 4).

The guide 122 positions the substrate body 13 in the imprinting area 124, in particular during imprinting

In particular, the substrate body 13 rests with the plate side 28 on the support surface 125 in the stamping position.

The geometric imprint reference plane 126 extends through the imprint region 124 and the guide 122 orients the substrate body 13 to the geometric imprint reference plane, in particular in its imprint position.

The geometric imprint reference plane 126 extends substantially through the substrate body 13, in particular during the imprinting process, and the opposing plate sides 26 and 28 of the substrate body 13 lie on different sides of the imprint reference plane 126.

The body plane 24 and the imprint reference plane 126 preferably extend substantially parallel to each other during the imprinting process, in particular, the two planes coincide during the imprinting process.

The imprint apparatus 20 includes an imprint system 130 that includes two

sub-imprint mechanisms

132 and 134.

The two

sub-imprint mechanisms

132 and 134 are disposed on different sides of the imprint reference surface 124.

Each of the

sub-embossing mechanisms

132, 134 includes two punch arrangements 142.

The punch devices 142 are substantially identical and are described jointly below as long as they are not configured differently.

The punch assembly 42 includes an imprint punch 144 having an imprint head 146.

The stamping punch 144 is arranged in the punch arrangement 142 so as to be movable and in particular force-loaded.

The embossing punch 144 is provided, for example, so as to be linearly movable.

The coining punch 144 is preferably arranged to move along a punch axis 152 in an axial direction of the punch axis.

In particular, the punch axis 152 extends at least approximately perpendicular to the geometric stamping reference plane 126.

An imprint head 146 is arranged on the end of the imprint punch 144, in particular facing the geometric imprint reference plane 126.

The imprint punch 144 presses the imprint mark 112 into the substrate body 13 using the imprint head 146.

Punch device 142 preferably includes a stop mechanism 162.

The stop mechanism 162 is used to prevent further depression of the imprint head 146 into the substrate body 13 during imprinting.

The stop mechanism 162 preferably prevents the imprint head 146 from being pressed in before the imprint head 146 reaches the carrier plate 32.

In particular, imprint head 146 only impresses into the superficial volume region of substrate body 13.

Two of the four punch means 142 are disposed on one side of the pressing reference surface 126, and the other two of the four punch means 142 are disposed on the other side of the pressing reference surface 126.

Therefore, two punch devices 142 are provided on both sides of the imprint reference surface 126, respectively.

The punch arrangement 142, in particular the stamping punch 144 of the punch arrangement, is preferably arranged in a precisely defined arrangement with respect to one another.

In particular, the distance of the embossing punches 144 from one another is determined and known as precisely as possible, for example, with a deviation of not more than 15 μm at the most, preferably not more than 5 μm at the most, particularly preferably not more than 1 μm at the most.

The embossing punches 144 are advantageously arranged in such a way that they are outside the structured region 56 of the substrate body 13 to be embossed and thus press the embossed marks 112 into the substrate body 13 outside the structured region 56.

The arrangement of the punch arrangements 142 of one of the sub-embossing mechanisms 132 is preferably substantially symmetrical to the arrangement of the punch arrangements 142 of the other sub-embossing mechanism 134 with respect to the geometric embossing reference plane 126.

In particular, one punch arrangement 142 of one of the partial embossing units 132 and one punch arrangement 142 of the other partial embossing unit 134 together form a punch system 172 (fig. 5), respectively.

The punch system 172 preferably has a punch system axis 174.

The stamping punches 144 of the two punch arrangements 142 of the punch system 172 are preferably arranged opposite one another with reference to the geometric stamping reference surface 126.

In particular, the stamping punches 144 of the punch system 172 stamp the stamping marks 112 into the substrate body 13, which are arranged offset in the axial direction of the punch system axis 174.

In particular, the punch system axis 174 extends through the imprinted indicia 112 produced by the imprint punch 144 of the punch system 172 in the substrate body 13.

In particular, the punch system axis 174 extends at least approximately parallel to the punch axes 152 of the two punch devices 142 of the punch system 172. In particular, these

axes

152, 174 substantially coincide.

Furthermore, the imprinting device 20 preferably comprises one or more stops 182, by means of which the substrate body 13 can be oriented, preferably aligned, and/or held in position during the imprinting process.

The substrate body 13 is therefore provided with the imprint marks 112 by the imprint device 20 in such a way that the structures 48 to be exposed on the plate sides 26, 28 can be precisely aligned to one another by means of the imprint marks 112.

Here, the imprint process is part of an exposure method of the substrate body 13 to be exposed.

The substrate body 13 is brought into the embossing position by the guide 122 and is fixed there during the embossing process.

The substrate body 13 is preferably oriented by means of the one or more stops 182 and is advantageously held in position by the stops 182.

The embossed marking 112 is pressed into one of the plate sides 26 of the opposite plate sides 26 and 28 by the embossing punch 144 of one of the partial embossing units 132 and the embossed marking 112 is pressed into the other plate side 28 of the substrate body 13 by the embossing punch 144 of the other partial embossing unit 134.

By means of the precisely defined arrangement of the embossing punches 144, the embossing marks 112 are also pressed into the plate flanks 26 and 28 in an advantageously defined arrangement.

In particular, only the embossed marks 112 are pressed into one or more of the

layers

34, 36, 38 of the substrate body 13 and the carrier plate 32 remains undeformed during the embossing.

The substrate main body 13 is brought from the imprint apparatus 20 to the recording apparatus 18.

The recording device 18 detects the embossed marks 112 on the substrate body 13 and determines therefrom the orientation a and the position of the substrate body on the transport device 68.

The arrangement of embossed marks 112 is stored in recording device 18, for example.

Thus, the recording device 18 detects the precise position and orientation of the substrate body 13.

The substrate body 13 is brought into the holding device 62 by the transport device 68 with a precisely defined transport path.

Since the position of the substrate body 13 in the imprint apparatus 20 and the transport path are precisely known, the position of the substrate body in the holding apparatus 62 is also precisely known.

The substrate body 13 is preferably transported linearly in the exposure plane 64 from the recording device 18 to the exposure device 16 in a transport direction 76.

The precise orientation a of the substrate body 13 is transferred from the recording device 18 to the exposure device 16.

In the exposure device 16, the position coordinates (X, Y) of the predefined structure 48 are converted into a coordinate system of the orientation a of the substrate body 13.

One of the opposing board sides 26 and 28 of the substrate body 13 is exposed according to the converted position coordinates of the structure 48 to be exposed.

In a further step, the substrate body 13 is rotated so that the other plate side 28 of the opposing plate sides 26 and 28 is exposed in a similar manner.

Here, the embossed marks 112 on the board side 28 are recorded and the structures 48 to be exposed are applied accordingly.

Since the embossed marks 112 are pressed into the two

plate sides

26, 28 in a precisely adapted manner, the structures 48 to be exposed, which are aligned by means of the embossed marks 112, are correspondingly applied in a precisely adapted manner to one another.

In various variants of the above-described embodiments, the embossing head 146 is configured differently.

The printing surface 212 of the print head 146 is, for example, flat (fig. 6 a).

The imprint face 212 of the imprint head 146 faces the substrate body 13 during imprinting.

The base surface of the print head is, for example, substantially circular or rectangular in shape.

The base surface of imprint head 146 preferably extends at least approximately in a geometric plane that extends at least approximately perpendicular to a punch axis 152.

In a further variant, provision is made for the stamping head 146 to have a tip 222 (fig. 6 b).

The tip 222 is, for example, conical or pyramidal.

In a further variant, provision is made for the embossing head 146 to have a strip 232 which protrudes beyond the geometric reference surface 234 (fig. 6c and 6 d).

In particular, the geometric reference surface 234 extends at least approximately perpendicular to the punch axis 152.

In particular, the edge strips 232 project away from the stamping head 146 toward the geometric stamping reference plane 126.

In particular, the edge strip 232 is arranged on the end of the imprint head 146 facing the substrate body 13 during the imprinting process.

In particular, bead 232 defines a recess 236.

In particular, the recess 236 penetrates into the stamping head 146 substantially in the axial direction of the punch axis 152.

The recess 236 preferably extends substantially no further into the imprint head 146 than the geometric reference plane 234.

The edge strip 232 projects, for example, from the geometric reference surface 234 on both sides of the edge strip, which extend substantially parallel to one another, to the end of the edge strip remote from the geometric reference surface 234.

In a further variant, it is provided that the two sides of the edge strip meet at an acute angle.

In particular, strakes 232 that extend at an acute angle to each other meet at an acute angle at the end of strakes 232 away from geometric reference plane 234.

The edge strip 232 surrounds, for example, the recess 236, in particular in the circumferential direction around the punch axis 152.

In a further variant, provision is made for the recess 236 to be delimited at least one by a plurality of webs 232.

Claims

1. Machining device (8) for a plate-shaped body (12, 13) having two plate flanks (26, 28) arranged opposite one another,

characterized in that the processing device (8) comprises an embossing system (130) having two sub-embossing mechanisms (132, 134), the two sub-embossing mechanisms (132, 134) being arranged on both sides of the geometric embossing reference plane (126), each of the sub-embossing mechanisms (132, 134) comprising at least one embossing punch (144) facing the geometric embossing reference plane (126), and in that the processing device (8) has a guide (122) for the plate-shaped body (12, 13) which guide orients the plate-shaped body substantially in the embossing reference plane (126).

2. The processing device (8) according to claim 1, characterized in that, when the plate-shaped body (12, 13) is placed in the stamping position, the stamping punch (144) of one of the two sub-stamping mechanisms (132, 134) is aligned with one of the two plate-side faces (26, 28) of the plate-shaped body (12, 13), and the stamping punch (144) of the other of the two sub-stamping mechanisms (132, 134) is aligned with the other of the two plate-side faces (26, 28) of the plate-shaped body (12).

3. The processing device (8) according to claim 1, characterized in that the geometric stamping reference plane (126) extends substantially parallel to the main body plane (24) of the plate-like body (12, 13) arranged in the stamping position, wherein the plate-like body (12, 13) extends substantially in the main body plane (24).

4. The processing device (8) according to claim 1, characterized in that it comprises a support surface (125) on which the plate-like body (12, 13) lies at least partially in the stamping position.

5. The processing device (8) according to claim 4, characterized in that the bearing surface (125) and the geometric stamping reference surface (126) extend substantially parallel to one another and/or are arranged at a distance from one another.

6. The processing device (8) according to claim 1, characterized in that the embossing punch (144) or the embossing punches (144) or both of them, respectively, are arranged so as to be linearly movable substantially in the axial direction of the punch axis (152).

7. Machining device (8) according to claim 6, characterized in that the punch axis (152) of the embossing punch (144) or a plurality or all of the punch axes (152) extend at least approximately perpendicularly to the geometric embossing reference plane (126).

8. The processing device (8) according to claim 1, wherein one stamping punch (144) of one of the two sub-stamping mechanisms (132, 134) and one stamping punch (144) of the other of the two sub-stamping mechanisms (132, 134) together form a punch system (172), wherein the two stamping punches (144) are arranged offset from each other substantially in the axial direction of a punch system axis (174).

9. The processing plant (8) according to claim 1, characterized in that a plurality of or all stamping punches (144) of one of the two sub-stamping mechanisms (132, 134) together with a stamping punch (144) of the other of the two sub-stamping mechanisms (132, 134) form in each case one punch system (172).

10. Machining device (8) according to claim 1, characterized in that one punch system axis (174) or a plurality or all of the punch system axes (174) extend at least approximately perpendicularly to the geometric stamping reference plane (126).

11. The machining apparatus (8) as claimed in claim 1, characterized in that the punch axis (152) of the stamping punch (144) of the punch system (172) substantially coincides with the punch system axis (174) in one punch system (172) or in a plurality or all of the punch systems (172).

12. The processing apparatus (8) according to claim 1, wherein the arrangement of the stamping punches (144) of one of the two sub-stamping mechanisms (132, 134) and the arrangement of the stamping punches (144) of the other of the two sub-stamping mechanisms (132, 134) are configured to be adapted to each other.

13. The processing apparatus (8) according to claim 1, wherein the arrangement of the stamping punches (144) of one of the two sub-stamping mechanisms (132, 134) and the arrangement of the stamping punches (144) of the other of the two sub-stamping mechanisms (132, 134) are substantially mirror images of each other with respect to the geometrical stamping reference plane (126).

14. The processing apparatus (8) according to claim 1, wherein the two sub-embossing mechanisms (132, 134) each comprise the same number of embossing punches (144).

15. The processing device (8) according to claim 1, characterized in that the two sub-embossing mechanisms (132, 134) each comprise exactly one or exactly two or exactly three or exactly four or exactly five or exactly six embossing punches (144).

16. The processing apparatus (8) as claimed in claim 1, characterized in that the at least one imprint head (146) of the imprint punch (144) has a substantially flat imprint surface (212) and/or the at least one imprint head (146) of the imprint punch (144) has a tip (222) and/or the at least one imprint head (146) of the imprint punch (144) has at least one edge strip (232).

17. The processing device (8) according to claim 1, characterized in that it has a stop mechanism (162) which prevents the embossed marks (112) from being pressed too far in.

18. Machining device (8) according to claim 1, characterized in that the stop means (162) prevent the further pressing of the one or more or all stamping punches (144) into the plate-like body (12, 13) before the one or more or all stamping punches (144) reach the geometric body plane (24) of the plate-like body (12, 13) arranged in the stamping position.

19. The processing device (8) according to claim 1, characterized in that the stop means (162) prevent the further pressing-in of the one or more or all stamping punches (144) into the plate-like body (12, 13) before the one or more or all stamping punches (144) have completely penetrated the superficial volume region and/or the one or more layers (34, 36, 38) of the plate-like body.

20. Machining device (8) according to claim 1, characterized in that it has one or more stops (182) for the positionally conforming arrangement of the plate-like bodies (12, 13).

21. The processing apparatus (8) according to claim 1, characterized by a recording device (18) for recording the embossed marks (112).

22. The processing apparatus according to claim 1, characterized in that an exposure device (16) is provided.

23. The processing apparatus (8) according to claim 1, characterized in that it is used for a substrate body (13) to be exposed.

24. Processing device (8) according to one of claims 2 to 16 and 18 and 20 to 23, characterized in that it has a stop mechanism (162) which prevents the embossed marks (112) from being pressed too far in.

25. Machining device (8) according to one of claims 2 to 19 and 21 to 23, characterized in that it has one or more stops (182) for the positionally conforming arrangement of the plate-shaped bodies (12, 13).

26. Processing device (8) according to one of claims 2 to 20 and 22 to 23, characterized by a recording device (18) for recording the embossed marks (112).

27. Method for producing a plate-shaped body (12, 13), wherein the plate-shaped body (12, 13) has two plate sides (26, 28) which are opposite one another and which are located on both sides of a main body plane (124), characterized in that at least one embossing marking (112) is pressed into each of the two plate sides (26, 28) which are opposite one another.

28. Method according to claim 27, characterized in that the method is a method for exposing a plate-like body (12, 13).

29. Method according to claim 27, characterized in that the embossed marking (112) is pressed into one of the two plate sides (26, 28) in a direction extending at least approximately perpendicularly to the main body plane (24), opposite the embossed marking (112) pressed into the other of the two plate sides (26, 28).

30. Method according to claim 27, characterized in that the embossed marking (112) is embossed on one of the two plate sides (26, 28) in a direction running at least approximately perpendicularly to the main body plane (24), in each case opposite a plurality of embossed markings (112) or all embossed markings embossed on the other of the two plate sides (26, 28).

31. Method according to claim 27, characterized in that the same number of embossed marks (112) is pressed into the two opposite plate sides (26, 28) each.

32. Method according to claim 27, characterized in that the embossed marks (112) are pressed into the two opposite plate sides (26, 28) substantially mirror-symmetrically to each other.

33. Method according to claim 27, characterized in that a data record of the spatial offset between two stamping marks (112) parallel to the main body plane (24) is transmitted to and/or stored in a further processing device, the two stamping marks being pressed into one of the two plate sides (26, 28) and into the other plate side opposite one another, in which method the plate-shaped bodies (12, 13) are processed in the further processing device.

34. Method according to claim 27, characterized in that one or more or all embossed marks (112) are pressed into the main body plane (24) of the plate-like body (12, 13) at the deepest.

35. A method according to claim 27, characterized in that one or more or all embossed marks (112) are pressed into one or more layers (34, 36, 38) of the plate-like body (12, 13) only.

36. Method according to claim 27, characterized in that the carrier plate (32) of the plate-like body (12, 13) carrying the layer (34, 36, 38) is kept undeformed during the pressing in of the embossed marks (112).

37. Method according to claim 27, characterized in that the embossed marking (112) is pressed out of the structured area (56) on one or both of the two opposite plate sides (26, 28).

38. Method according to claim 27, characterized in that the position and/or orientation of the plate-like body (12, 13) is detected by means of pressed-in embossed marks (112).

39. Method according to claim 27, characterized in that the application of the structure on one or both of the two oppositely arranged plate sides (26, 28) is oriented by means of an embossed marking (112) that is pressed in.

40. Method according to claim 27, characterized in that the mutually adapted structures or the exposed mutually adapted structures are applied to the two oppositely arranged plate sides (26, 28) by means of pressed-in embossed marks (112).

41. Method according to claim 27, characterized in that the embossed marks (112) are pressed into the two opposite plate flanks (26, 28) essentially mirror-symmetrically with respect to a main body plane (24) of the plate-like body (12, 13) parallel to the plate flanks (26, 28).

42. The method according to claim 27, characterized in that one or more or all embossed marks (112) are pressed into the surface layer volume area of the plate side only.

43. Method according to claim 27, characterized in that the embossed marking (112) is pressed out of the structural region (56) to be exposed on one or both of the two opposite plate sides (26, 28).

44. Method according to claim 27, characterized in that the exposure is directed by means of an embossed marking (112) pressed in on one or both of the two oppositely arranged plate sides (26, 28).

45. Method according to one of claims 28 to 32 and 34 to 44, characterized in that a data record of the spatial offset between two stamping marks (112) parallel to the main body plane (24) is transmitted to and/or stored in a further processing device, the two stamping marks being pressed into one of the two plate side faces (26, 28) and the other plate side face opposite one another, in which method the plate-shaped bodies (12, 13) are processed in the further processing device.

46. Method according to one of claims 28 to 34 and 36 to 44, characterized in that one or more or all embossed marks (112) are pressed into one or more layers (34, 36, 38) of the plate-like body (12, 13) only.

47. Method according to one of claims 28 to 35 and 37 to 44, characterized in that the carrier plate (32) of the plate-like body (12, 13) carrying the layer (34, 36, 38) is kept undeformed during the pressing in of the embossed marks (112).

48. Method according to one of claims 28 to 37 and 39 to 44, characterized in that the position and/or orientation of the plate-like body (12, 13) is detected by means of pressed-in embossed marks (112).

49. Method according to one of claims 28 to 28 and 40 to 44, characterized in that the application of the structure on one or both of the two oppositely disposed plate sides (26, 28) is oriented by means of an embossed marking (112) which is pressed in.