CN108087853A - Thick film steam generation facility and with its household electrical appliance - Google Patents
Thick film steam generation facility and with its household electrical appliance Download PDFInfo
- Publication number
- CN108087853A CN108087853A CN201711372606.8A CN201711372606A CN108087853A CN 108087853 A CN108087853 A CN 108087853A CN 201711372606 A CN201711372606 A CN 201711372606A CN 108087853 A CN108087853 A CN 108087853A
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- substrate layer
- thick film
- steam generation
- generation facility
- thick
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F22—STEAM GENERATION
- F22B—METHODS OF STEAM GENERATION; STEAM BOILERS
- F22B1/00—Methods of steam generation characterised by form of heating method
- F22B1/28—Methods of steam generation characterised by form of heating method in boilers heated electrically
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- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Physics & Mathematics (AREA)
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- General Engineering & Computer Science (AREA)
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Abstract
The invention discloses a kind of thick film steam generation facility and with its household electrical appliance, the thick film steam generation facility includes thick-film heating plate and cavity, the thick-film heating plate includes composite substrate and the thick film circuit board for being attached at one side surface of composite substrate, the cavity covers at the thick-film heating plate, and the cavity has towards the concave tortuous recess portion in the direction away from the composite substrate, and another side surface of the tortuous recess portion and the composite substrate limits tortuous flow path, the tortuous flow path has inlet and venthole, wherein, the composite substrate includes first substrate layer and second substrate layer, and the ratio of the thermal conductivity factor of the second substrate layer and the thermal conductivity factor of the first substrate layer is R1, R1 >=5.Thick film steam generation facility according to embodiments of the present invention, have it is simple in structure, the thermal efficiency is high, good heat conduction effect, and can be used for generate superheated steam.
Description
Technical field
The present invention relates to household electrical appliance technical field, more particularly, to a kind of thick film steam generation facility and with it
Household electrical appliance.
Background technology
Thick film heating device in correlation technique is widely used in household appliance technical field, for example, applied to instant electric
Tap, instant electric water heater, boiled water machine, coffee machine etc. can heat water in household electrical appliance etc., however, by
In substrate of 304/430 stainless steel of generally use in thick film heating device as heater circuit, heater circuit power density is larger
And be substantially uniformly, and during for generating superheated steam, water becomes saturated vapor stage absorption heat from liquid
Measure larger, and it is smaller to become superheated steam stage caloric receptivity by saturated vapor, in this way, extra heat can not export in time, causes
Heater circuit surface temperature is steeply risen, thick film heating device damage is in turn resulted in, therefore, to avoid dry combustion method, correlation technique
In thick film heating device commonly used in heating water to 95 DEG C, but superheated steam can not be generated, influence being applicable in for device
Scope.
In addition, the runner in thick film heating device is mostly based on tubular structure, and runner design is relatively simple, is susceptible to
Hot-spot is caused in dead zone, is unsuitable for generating superheated steam.
The content of the invention
It is contemplated that at least solve one of technical problem in the prior art.For this purpose, the present invention proposes a kind of thickness
Film steam generation facility, the thick film steam generation facility have that simple in structure, the thermal efficiency is high, good heat conduction effect, and can be with
For generating superheated steam.
The invention also provides a kind of household electrical appliance with above-mentioned thick film steam generation facility.
The thick film steam generation facility of embodiment according to a first aspect of the present invention, including：Thick-film heating plate, the thick film add
Hot plate includes composite substrate and the thick film circuit board for being attached at one side surface of composite substrate；Cavity, the cavity cover at
The thick-film heating plate, and the cavity has towards the concave tortuous recess portion in the direction away from the composite substrate, and the song
Another side surface of folding recess portion and the composite substrate limits tortuous flow path, and the tortuous flow path has inlet and goes out vapour
Mouthful；Wherein, the composite substrate includes first substrate layer and second substrate layer, and the thermal conductivity factor of the second substrate layer and institute
The ratio of the thermal conductivity factor of first substrate layer is stated as R1, R1 >=5.
Thick film steam generation facility according to embodiments of the present invention, by the way that the composite substrate of thick-film heating plate to be arranged to have
There are the first substrate layer of different thermal conductivity factors and second substrate layer, and cause the heat conduction system of second substrate layer and first substrate layer
Number R1 are more than or equal to 5, in this way, using the big characteristic of the thermal conductivity factor of second substrate layer, can improve the thermal conductivity of composite substrate
Can, so as to improve the thermal efficiency of thick film steam generation facility, it is also possible to so that when some interior position of tortuous flow path goes out current situation
Portion overheat when, heat is quickly conducted to remaining low temperature part, so as to avoid thick film steam generation facility because hot-spot and
Cause to damage, prolong the service life, and then can be applied to generate superheated steam.
According to some embodiments of the present invention, the S-shaped detour extension of the tortuous flow path, and the flanging of the tortuous flow path
Section rounding off.
According to some embodiments of the present invention, the first substrate layer is stainless steel flaggy, and the second substrate layer is copper
Flaggy.
According to some embodiments of the present invention, the composite substrate further includes：3rd substrate layer, the first substrate layer and
3rd substrate layer is located at the both sides of the second substrate layer respectively, and the thick film circuit board is attached at the 3rd substrate layer
Backwards to the second substrate layer a side surface.
Some examples according to the present invention, the heat conduction system of the thermal conductivity factor of the second substrate layer and the 3rd substrate layer
Several ratio be R2, R2 >=5.
Some examples according to the present invention, the first substrate layer be food-grade stainless steel flaggy, the second substrate layer
For copper plate layer, the 3rd substrate layer is common stainless steel flaggy.
Some examples according to the present invention, the thickness of the first substrate layer are 0.3mm-0.7mm, the second substrate layer
Thickness for 1mm-2mm, the thickness of the 3rd substrate layer is 0.3mm-0.7mm.
According to some embodiments of the present invention, the thick-film heating plate and cavity difference are vertically extending,
In, the thick film circuit board include upper circuit board and lower circuit board, the upper circuit board, the lower circuit board respectively with the song
The top in baffling road, the lower part of the tortuous flow path correspond to, and the power density of the lower circuit board is more than the upper circuit board
Power density.
Some examples according to the present invention, the power density of the lower circuit board and the power density of the upper circuit board
Ratio is S, 2≤S≤3.
Some examples according to the present invention, the water inlet are arranged on the lower part of the cavity, and the venthole is arranged on described
The top of cavity, and the water inlet and the venthole are located at the both sides of the tortuous flow path.
Some examples according to the present invention, the thick film steam generation facility further include gasket, and the gasket is arranged on
Between the cavity and the thick-film heating plate.
The household electrical appliance of embodiment according to a second aspect of the present invention include the thick film of embodiment according to a first aspect of the present invention
Steam generation facility.
Household electrical appliance according to embodiments of the present invention, by using the thick film steam of embodiment according to a first aspect of the present invention
Generating means has the characteristics that simple in structure, the thermal efficiency is high, good heat conduction effect, has a wide range of application.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
It obtains substantially or is recognized by the practice of the present invention.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention will become in the description from combination accompanying drawings below to embodiment
Substantially and it is readily appreciated that, wherein：
Fig. 1 is the front view of thick film steam generation facility according to embodiments of the present invention；
Fig. 2 is the side view of thick film steam generation facility according to embodiments of the present invention；
Fig. 3 is the rearview of thick film steam generation facility according to embodiments of the present invention；
Fig. 4 is the explosive view of thick film steam generation facility according to embodiments of the present invention；
Fig. 5 is the section view of the composite substrate of thick film steam generation facility according to embodiments of the present invention.
Reference numeral：
Thick film steam generation facility 100；
Cavity 10；Tortuous recess portion 11；Flanging section 111；Venthole 12；Inlet 13；
Thick-film heating plate 20；Thick film circuit board 21；
Composite substrate 22；First substrate layer 221；Second substrate layer 222；3rd substrate layer 223；
Gasket 30；Steam outlet pipe 41；Water inlet pipe 42.
Specific embodiment
The embodiment of the present invention is described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning to end
Same or similar label represents same or similar element or has the function of same or like element.Below with reference to attached
The embodiment of figure description is exemplary, and is only used for explaining the present invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", " outer ", " up time
The orientation or position relationship of the instructions such as pin ", " counterclockwise ", " axial direction ", " radial direction ", " circumferential direction " be based on orientation shown in the drawings or
Position relationship is for only for ease of the description present invention and simplifies description rather than instruction or imply that signified device or element must
There must be specific orientation, with specific azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, limit
Surely there is " first ", one or more this feature can be expressed or be implicitly included to the feature of " second ".The present invention's
In description, unless otherwise indicated, " multiple " are meant that two or more.
In the description of the present invention, it is necessary to illustrate, unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected or be integrally connected；It can
To be mechanical connection or be electrically connected；It can be directly connected, can also be indirectly connected by intermediary, Ke Yishi
Connection inside two elements.For the ordinary skill in the art, with concrete condition above-mentioned term can be understood at this
Concrete meaning in invention.
Below with reference to the accompanying drawings the thick film steam generation facility 100 of embodiment according to a first aspect of the present invention, the thickness are described
Film steam unit can be applied to the electric appliances such as steam oven, steam kitchen ventilator.
As shown in Figures 1 to 5, thick film steam generation facility 100 according to embodiments of the present invention includes thick-film heating plate 20
With cavity 10.
Thick-film heating plate 20 includes composite substrate 22 and thick film circuit board 21, and thick film circuit board 21 is attached at composite substrate 22
A side surface, for example, as shown in figure 4, thick film circuit board 21 is attached at the rear side surface of composite substrate 22 by squeezing.Cavity
10 cover at thick-film heating plate 20, also, cavity 10 has tortuous recess portion 11, and tortuous recess portion 11 is directed away from composite substrate 22
Direction is recessed, for example, as shown in Figure 4, tortuous recess portion 11 is recessed towards front side direction, tortuous recess portion 11 and composite substrate 22
Another side surface (front side surface of the composite substrate 22 in such as Fig. 4) limits tortuous flow path jointly, and tortuous flow path has feed liquor
Mouth 13 and venthole 12, wherein, inlet 13 can be connected with water inlet pipe 42, and venthole 12 can be connected with steam outlet pipe 41, this
Sample, water are entered by water inlet pipe 42 inside tortuous flow path, and being then heated becomes saturated vapor, and then is heated and becomes superheated steam
Afterwards, discharged from steam outlet pipe 41, so as to be user-friendly.
Further, composite substrate 22 includes first substrate layer 221 and second substrate layer 222, and second substrate layer 222 is led
The thermal conductivity factor ratio of hot coefficient and first substrate layer 221 is R1, R1 >=5, that is to say, that the heat conduction system of second substrate layer 222
Number is much larger than the thermal conductivity factor of first substrate layer 221, for example, in the example shown in fig. 4, thick film circuit board 21 is attached at the second base
The rear side surface of flaggy 222, cavity 10 cover at the front side surface of first substrate layer 221, in this way, utilizing second substrate layer 222
The big characteristic of thermal conductivity factor, can both improve the heat conductivility of composite substrate 22, heat quickly be conducted to remaining low temperature portion
Point so that the distribution of the heat of composite substrate 22 is relatively uniform, so that thick-film heating circuit board surface temperature be avoided drastically to raise
Cause to damage, prolong the service life.
Thick film steam generation facility 100 according to embodiments of the present invention as a result, by by the composite base of thick-film heating plate 20
Plate 22 is arranged to the first substrate layer 221 with different thermal conductivity factors and second substrate layer 222, and causes second substrate layer
222 are more than or equal to 5 with the thermal conductivity factor R1 of first substrate layer 221, in this way, big using the thermal conductivity factor of second substrate layer 222
Characteristic can both improve the heat conductivility of composite substrate 22, so as to improve the thermal efficiency of thick film steam generation facility 100, meanwhile,
It is also possible that when hot-spot occurs in some position in tortuous flow path, heat is quickly conducted to remaining low temperature part, from
And thick film steam generation facility 100 is avoided to cause to damage because of hot-spot, prolong the service life, and then can be applied to produce
Raw superheated steam.
As shown in Figure 1 and Figure 4, in some embodiments of the invention, tortuous flow path detour S-shaped along the vertical direction is prolonged
It stretches, tortuous flow path has flanging section 111,111 rounding off of flanging section, for example, flanging section 111 can be formed as arc, in this way,
On the one hand both dead zone can have occurred to avoid runner using S-shaped tortuous flow path, and avoid generating hot-spot in runner, on the other hand, S
Shape tortuous flow path is advantageously implemented vapor-liquid separation, avoids the entrainment with steam drop discharged from tortuous flow path venthole 12.
In some embodiments of the invention, first substrate layer 221 can be stainless steel plate layer, in this way, and tortuous flow path
When contacting directly, stainless steel material corrosion resistance characteristic can be utilized, composite substrate 22 is avoided to generate corrosion and damage, is prolonged as a result,
The service life of long thick film steam generation facility 100.
Such as Fig. 5, in other embodiments of the present invention, composite substrate 22 further includes the 3rd substrate layer 223, first substrate
221 and the 3rd substrate layer 223 of layer is respectively arranged on the both sides of second substrate layer 222, also, thick film circuit board 21 is attached at the 3rd base
One side surface of the second substrate layer 222 backwards of flaggy 223, that is to say, that thick film circuit board 21 is attached at the 3rd substrate layer 223
Rear side surface, in this way, can be carried out using 221 and the 3rd substrate layer 223 of first substrate layer of both sides to second substrate layer 222
It protects to improve use reliability.
Further, the ratio R 2 of the thermal conductivity factor of the thermal conductivity factor of second substrate layer 222 and the 3rd substrate layer 223 be more than etc.
In 5, that is to say, that the thermal conductivity factor of second substrate layer 222 is more than first substrate layer 221 and is more than the 3rd substrate layer 223, by
This, second substrate layer 222 can be both protected using 221 and the 3rd substrate layer 223 of first substrate layer of both sides, meanwhile, utilize
The big characteristic of the thermal conductivity factors of two substrate layers 222 can also improve the heat conductivility of composite substrate 22, heat is quickly conducted to
Remaining low temperature part so that the heat distribution of composite substrate 22 is relatively uniform, so as to avoid thick-film heating circuit board surface temperature
It drastically raises and causes to damage, further prolong the service life.
The present invention some examples in, first substrate layer 221 can be food-grade stainless steel flaggy, second substrate layer
222 be copper plate layer, and the 3rd substrate layer 223 is common stainless steel flaggy, for example, composite substrate 22 can be that food-grade 304 is stainless
+ 430 stainless steel flaggy of steel+copper plate layer or, or+304 stainless steel flaggy of 304 stainless steels of food-grade+copper plate layer, by
This, is contacted directly using food-grade stainless steel flaggy and steam in tortuous flow path, can be polluted to avoid to water vapour, and the
Three substrate layers 223 can reduce cost using common stainless steel flaggy.
In some examples of the present invention, the thickness of first substrate layer 221 can between 0.3mm-0.7mm any value,
The thickness of second substrate layer 222 can be any value in 1mm-2mm, and the thickness of the 3rd substrate layer 223 can be 0.3mm-0.7mm
Between any value, for example, first substrate layer 221, the 3rd substrate layer 223 can be with 0.3mm, 0.5mm or 0.7mm, second substrate layer
222 can be 1mm, 1.5mm or 2mm, thus, it is possible to ensure that 22 integral thickness of composite substrate is smaller, so as to ensure thick film steam
The overall volume of generating means 100 is smaller, convenient for assembling, using.
Such as Fig. 3 and Fig. 4, in some embodiments of the invention, thick-film heating plate 20 and the difference of cavity 10 are vertically
(vertical direction as shown in Figure 4) extends, wherein, thick film circuit board 21 includes upper circuit board and lower circuit board, tortuous flow path
Including upper and lower part, upper circuit board is corresponding with top and lower circuit board and lower part are corresponding, meanwhile, the power density of lower circuit board
More than the power density of upper circuit board.
In this way, using the small structure of the power density of big, the upper circuit board of lower circuit board power density of thick film circuit board 21,
It can to obtain larger heat when becoming the saturated vapor stage by liquid from the water of the entrance of inlet 13 of tortuous flow path
(since lower circuit board power density is big, so as to which the heat generated is more), can absorb when becoming superheated steam by saturated vapor
Smaller heat (since upper circuit board power density is small, so as to which the heat generated is few), thus, it is possible to avoid tortuous flow path top
There is hot-spot phenomenon.
It is that saturated vapor is further avoided to become upper circuit board production during superheated steam in the further example of the present invention
Raw heat is excessive, and then generates hot-spot phenomenon, the power density of lower circuit board and the power density ratio S of upper circuit board
Any value in 2-3 is taken, for example, S can be 2, or the other values such as 2.5 or 3.
As shown in figure 4, in some optional examples of the present invention, inlet 13 is arranged on the lower part of cavity 10, venthole 12
Arranged on the top of cavity 10, and inlet 13 and venthole 12 are located at the both sides of tortuous flow path respectively, for example, shown in Fig. 4
In example, inlet 13 is located on the right side of the lower part of cavity 10, and venthole 12 is located at the upper left-hand of cavity 10, so as to further subtract
The occupied space of small thick film steam generation facility 100, is easily installed arrangement.
Such as Fig. 4, in some embodiments of the invention, thick film steam generation facility 100 further includes gasket 30, gasket
30 are located between the front side surface of the rear side surface of cavity 10 and thick-film heating plate 20, so as to be sealed to tortuous flow path, keep away
Exempt from water, vapour is revealed and thick film steam generation facility 100 is caused to damage.
The household electrical appliance of embodiment according to a second aspect of the present invention include the thick film of embodiment according to a first aspect of the present invention
Steam generation facility 100.
Household electrical appliance according to embodiments of the present invention, by using thick film steam generation according to the above embodiment of the present invention
Device 100 has the characteristics that simple in structure, the thermal efficiency is high, good heat conduction effect, has a wide range of application.
Thick film steam generation facility 100 according to embodiments of the present invention and other configuration examples with its household electrical appliance with
And operation is all for those of ordinary skills known, is not detailed herein.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " illustrative examples ",
The description of " example ", " specific example " or " some examples " etc. means to combine specific features, the knot that the embodiment or example describe
Structure, material or feature are contained at least one embodiment of the present invention or example.In the present specification, to above-mentioned term
Schematic representation may not refer to the same embodiment or example.Moreover, specific features, structure, material or the spy of description
Point can in an appropriate manner combine in any one or more embodiments or example.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that：Not
In the case of departing from the principle of the present invention and objective a variety of change, modification, replacement and modification can be carried out to these embodiments, this
The scope of invention is limited by claim and its equivalent.
Claims (12)
1. a kind of thick film steam generation facility, which is characterized in that including：
Thick-film heating plate, the thick-film heating plate include composite substrate and the thick film electricity for being attached at one side surface of composite substrate
Road plate；
Cavity, the cavity covers at the thick-film heating plate, and the cavity has towards the direction away from the composite substrate
Concave complications recess portion, and another side surface of the tortuous recess portion and the composite substrate limits tortuous flow path, the song
Baffling road has inlet and venthole；
Wherein, the composite substrate include first substrate layer and second substrate layer, and the thermal conductivity factor of the second substrate layer with
The ratio of the thermal conductivity factor of the first substrate layer be R1, R1 >=5.
2. thick film steam generation facility according to claim 1, which is characterized in that the S-shaped detour of tortuous flow path is prolonged
It stretches, and the flanging section rounding off of the tortuous flow path.
3. thick film steam generation facility according to claim 1, which is characterized in that the first substrate layer is stainless steel plate
Layer, the second substrate layer are copper plate layer.
4. thick film steam generation facility according to claim 1, which is characterized in that the composite substrate further includes：
3rd substrate layer, the first substrate layer and the 3rd substrate layer are located at the both sides of the second substrate layer, institute respectively
State the side surface that thick film circuit board is attached at the second substrate layer backwards of the 3rd substrate layer.
5. thick film steam generation facility according to claim 4, which is characterized in that the thermal conductivity factor of the second substrate layer
It is R2 with the ratio of the thermal conductivity factor of the 3rd substrate layer, R2 >=5.
6. thick film steam generation facility according to claim 4, which is characterized in that the first substrate layer for food-grade not
Rust steel plate layer, the second substrate layer are copper plate layer, and the 3rd substrate layer is common stainless steel flaggy.
7. thick film steam generation facility according to claim 4, which is characterized in that the thickness of the first substrate layer is
0.3mm-0.7mm, the thickness of the second substrate layer is 1mm-2mm, and the thickness of the 3rd substrate layer is 0.3mm-0.7mm.
8. thick film steam generation facility according to claim 1, which is characterized in that the thick-film heating plate and the cavity
It is vertically extending respectively,
Wherein, the thick film circuit board include upper circuit board and lower circuit board, the upper circuit board, the lower circuit board respectively with
The top of the tortuous flow path, the lower part of the tortuous flow path correspond to, and the power density of the lower circuit board is more than described power on
The power density of road plate.
9. thick film steam generation facility according to claim 8, which is characterized in that the power density of the lower circuit board with
The ratio of the power density of the upper circuit board be S, 2≤S≤3.
10. thick film steam generation facility according to claim 8, which is characterized in that the inlet is arranged on the cavity
Lower part, the venthole is arranged on the top of the cavity, and the inlet and the venthole are located at the tortuous flow path
Both sides.
11. the thick film steam generation facility according to any one of claim 1-10, which is characterized in that further include sealing
Pad, the gasket are arranged between the cavity and the thick-film heating plate.
12. a kind of household electrical appliance, which is characterized in that including the thick film steam generation according to any one of claim 1-11
Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711372606.8A CN108087853A (en) | 2017-12-19 | 2017-12-19 | Thick film steam generation facility and with its household electrical appliance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711372606.8A CN108087853A (en) | 2017-12-19 | 2017-12-19 | Thick film steam generation facility and with its household electrical appliance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108087853A true CN108087853A (en) | 2018-05-29 |
Family
ID=62176024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711372606.8A Pending CN108087853A (en) | 2017-12-19 | 2017-12-19 | Thick film steam generation facility and with its household electrical appliance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108087853A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113317686A (en) * | 2021-06-30 | 2021-08-31 | 广东美的厨房电器制造有限公司 | Steam generator and cooking equipment |
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| US20160177450A1 (en) * | 2014-12-22 | 2016-06-23 | Tokyo Electron Limited | Heat treatment apparatus |
| CN107166353A (en) * | 2017-06-08 | 2017-09-15 | 广东美的厨房电器制造有限公司 | Steam generator and steam-heating apparatus |
| CN107343330A (en) * | 2017-07-26 | 2017-11-10 | 湖南利德电子浆料股份有限公司 | A kind of thick film hybrid（HIC）Zone of heating and its heater |
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2017
- 2017-12-19 CN CN201711372606.8A patent/CN108087853A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1270753A (en) * | 1997-08-05 | 2000-10-18 | 斯特里克斯有限公司 | Sensor devices and analytical methods using them |
| CN201787715U (en) * | 2010-07-26 | 2011-04-06 | 于晖 | Quick thick film water heater |
| CN203550173U (en) * | 2013-10-14 | 2014-04-16 | 林小里 | Thick film heater |
| US20160177450A1 (en) * | 2014-12-22 | 2016-06-23 | Tokyo Electron Limited | Heat treatment apparatus |
| CN107166353A (en) * | 2017-06-08 | 2017-09-15 | 广东美的厨房电器制造有限公司 | Steam generator and steam-heating apparatus |
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| CN113317686A (en) * | 2021-06-30 | 2021-08-31 | 广东美的厨房电器制造有限公司 | Steam generator and cooking equipment |
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Application publication date: 20180529 |