CN108084910A - A kind of heat-conducting glue band - Google Patents
A kind of heat-conducting glue band Download PDFInfo
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- CN108084910A CN108084910A CN201711460918.4A CN201711460918A CN108084910A CN 108084910 A CN108084910 A CN 108084910A CN 201711460918 A CN201711460918 A CN 201711460918A CN 108084910 A CN108084910 A CN 108084910A
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- polyether polyol
- heat
- conducting glue
- glue band
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/48—Polyethers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2110/00—Foam properties
- C08G2110/0083—Foam properties prepared using water as the sole blowing agent
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/24—Presence of a foam
- C09J2400/243—Presence of a foam in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
- C09J2475/006—Presence of polyurethane in the substrate
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Polyurethanes Or Polyureas (AREA)
Abstract
The present invention provides a kind of heat-conducting glue bands.A kind of heat-conducting glue band, including release film, adhesive layer, metal foil and the foam being bonded successively；The foam is fitted in by cast in the metal foil.The foamed cotton layer is mainly made of following material mixed foaming：By weight, 1~2.5 part of 100 parts of polyether polyol, 25~40 parts of methyl diphenylene diisocyanate, 0.8~2 part of water, 0.3~1 part of catalyst and silicone oil；The hydroxyl value of the polyether polyol is 80~140.Compared with prior art, the invention has the characteristics that：1st, metal foil and foam need not be bonded by pressure sensitive adhesive.The present invention is by way of cast metal foil to be made to be bonded as one with foam, avoids the problem that introducing pressure sensitive adhesive causes integral heat sink reduction；2nd, the resistance of foam improves.
Description
Technical field
The present invention relates to tape technology field, more particularly, to a kind of heat-conducting glue band.
Background technology
In the component of electronic equipment, heat-conducting glue band is a kind of necessary membrane material, mainly plays conductive force.As electronics is set
Standby fast development, current heat-conducting glue band tends to Mobyneb, in addition to heat conduction, also has both the functions such as enhancing, shatter-resistant.With anti-
Exemplified by the heat-conducting glue band of fragmentation, general structure is：Copper foil is integrated with foam by PSA stickups；However, it is needed due to pasting
Certain thickness PSA is wanted, and PSA is high-molecular compound, heat transfer efficiency is relatively low, therefore, reduces whole heat dissipation effect.
In view of this, it is special to propose the present invention.
The content of the invention
It is an object of the invention to provide a kind of heat-conducting glue band, the heat-conducting glue band solves existing heat-conducting glue band heat dissipation
The problem of effect is poor.
In order to achieve the goal above, the present invention provides following technical schemes.
A kind of heat-conducting glue band, including release film, adhesive layer, metal foil and the foamed cotton layer being bonded successively；
The foamed cotton layer is fitted in by cast in the metal foil.
Compared with prior art, the invention has the characteristics that：Metal foil and foamed cotton layer need not be bonded by pressure sensitive adhesive.
The present invention is by way of cast metal foil to be made to be bonded as one with foam, and introducing pressure sensitive adhesive is avoided to cause entirety
The problem of thermal diffusivity reduces.
The present invention is equal to the material of metal foil and material, the purposes of adhesive tape of adhesive layer, and there is no limit.
Certainly, aluminium foil, copper foil or tinfoil paper can be selected as the main body of heat conduction it is necessary to have good thermal conductivity in metal foil
Deng.
In order to further improve the comprehensive performance of heat-conducting glue band, can also improve from the following aspect.
Preferably, the adhesive layer is pressure-sensitive adhesive layer, preferably polyacrylic, polyurethanes or organic silicon.
Pressure-sensitive adhesive layer is glue type the most commonly used in current liquid crystal display processing, in order to extend the scope of application of the present invention,
It is preferred that pressure-sensitive adhesive layer.
Available pressure-sensitive adhesive layer has polyacrylic, polyurethanes or organic silicon.
Preferably, the method for the cast is：Uncured foam after foaming is directly poured on copper foil, resolidification.
Preferably, the foamed cotton layer is mainly made of following material mixed foaming：By weight, 100 parts of polyether polyol,
1~2.5 part of 25~40 parts of methyl diphenylene diisocyanate, 0.8~2 part of water, 0.3~1 part of catalyst and silicone oil；The polyethers
The hydroxyl value of polyalcohol is 80~140.
Preferably, the foamed cotton layer is mainly made of following material mixed foaming：By weight, 100 parts of polyether polyol,
1~2 part of 25~35 parts of methyl diphenylene diisocyanate, 0.8~1.5 part of water, 0.5~1 part of catalyst and silicone oil；The polyethers
The hydroxyl value of polyalcohol is 110~130.
Preferably, the polyether polyol passes through following pretreatment：By polyether polyol under the conditions of 130-140 DEG C vacuum
Dehydration, moisture are less than 0.3%.
Preferably, the foamed cotton layer is mainly made of following material mixed foaming：
By weight, 100 parts of polyether polyol, 30~40 parts of methyl diphenylene diisocyanate (MDI), 1~2 part of water,
1.5~2.5 parts of 0.3~0.8 part of catalyst and silicone oil；
The hydroxyl value of the polyether polyol is 80~140.
The present invention is otherwise varied with the raw material used in conventional polyurethanes, to obtain different performances.
On the one hand polyurethane foam used in the present invention plays cushioning effect, on the other hand also to avoid generating in assembling process
Dust pick up issues, therefore the present invention foam need to have certain resistance.In consideration of it, it is of the invention using water as foaming agent,
And polyether polyol that certain hydroxyl value is 80~140 is selected then to be equipped with monomer methyl diphenylene diisocyanate as monomer, urge
Agent and foaming stabiliser silicone oil, the impedance of made foam can reach 1012More than Ω.
Since foaming agent used, monomer and the prior art are had any different, suitable blowing temperature is also had any different, this hair
The temperature of bright suitable mixed foaming is 80~90 DEG C, such as 80 DEG C, 82 DEG C, 84 DEG C, 85 DEG C, 86 DEG C, 88 DEG C, 90 DEG C etc., hair
The bubble reaction time is 5-10min.
Polyether polyol used in the present invention is handled preferably through vacuum dehydration, to reduce the adverse effect to foaming, is contained
Water is excellent to be less than 0.3%.
Preferably, the foamed cotton layer is mainly made of following material mixed foaming：
By weight, 100 parts of polyether polyol, 35~40 parts of methyl diphenylene diisocyanate, 1~1.5 part of water, catalysis
1.5~2 parts of 0.5~0.8 part of agent and silicone oil；
The hydroxyl value of the polyether polyol is 80~110.
Preferably, the mixing of reinforcing agent or fire retardant or both is additionally added when preparing the foamed cotton layer.
The intensity and flame retardant property of foam can be improved respectively by adding in reinforcing agent and fire retardant, and especially flame retardant property is to electricity
Sub- product is of crucial importance.
Preferably, the reinforcing agent is the one or more in nano silicon dioxide, montmorillonite, carbon black and carbon nanotubes,
Such as the mixing of nano silicon dioxide, montmorillonite, carbon black, carbon nanotubes or carbon black and carbon nanotubes；It is preferred that carbon black or carbon are received
The mixing of mitron or both.
Preferably, the fire retardant be halogenated flame retardant, preferably 2,3- dibromo-propanols.
The additional proportion of reinforcing agent and fire retardant can also influence the performance of foam, through investigating, using following ratio：
Preferably, the reinforcing agent and the mass ratio of the polyether polyol are 4~10：100, preferably 5~10：100；
Preferably, the fire retardant and the mass ratio of the polyether polyol are 4~6：100.
Preferably, the catalyst is one kind or more in stannous octoate, stannous iso caprylate and dibutyl tin laurate
Kind, preferably octanoic acid stannous；
Preferably, the molecular weight of the polyether polyol is 800~1500, preferably 1000~1500 or 800-1200.
The above-mentioned heat-conducting glue band of the present invention can be used arbitrary method and be made, such as described below.
Prepare foam：According to default formula, then all raw material mixed foamings are poured into metal foil, Zhi Hou
The opposite side pressure-sensitive adhesive coating (PSA) of metal foil, then release film is pasted, it winds.
To sum up, compared with prior art, invention achieves following technique effects：
(1) existing foam and the bonding mode of metal foil are changed：
In so avoiding the problem of thermal conductivity reduction, and PSA is saved, reduce cost of material；
(2) foam and heat-conducting glue band collection are integrated, avoid the problem of heavy industry is poor when substep processes screen；
(3) its impedance behavior is improved by improving the formula of foam；
(4) modifying agent such as reinforcing agent, fire retardant are added in the raw material of foam, improve the comprehensive performance of foam.
Description of the drawings
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution of the prior art
Embodiment or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, in describing below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, can also be obtained according to these attached drawings other attached drawings.
Fig. 1 is the structure diagram for the heat-conducting glue band that the embodiment of the present invention 1 provides.
Specific embodiment
Technical scheme is clearly and completely described below in conjunction with the drawings and specific embodiments, but
It is it will be understood to those of skill in the art that following described embodiment is part of the embodiment of the present invention rather than whole
Embodiment is merely to illustrate the present invention, and is not construed as limiting the scope of the invention.Based on the embodiments of the present invention, ability
Domain those of ordinary skill all other embodiments obtained without making creative work, belong to guarantor of the present invention
The scope of shield.The person that is not specified actual conditions in embodiment, the condition suggested according to normal condition or manufacturer carry out.Agents useful for same
Or production firm person is not specified in instrument, is the conventional products that can be obtained by commercially available purchase.
All embodiments of the present invention are based on following nuclear structure and material：
A kind of heat-conducting glue band, including release film, adhesive layer, metal foil and the foam being bonded successively；
The foam is fitted in by cast in the metal foil.
On the basis of more than core scheme, each embodiment of the invention is also improved from the following aspect.
Preferably, the metal foil is aluminium foil, copper foil or tinfoil paper；
Preferably, the adhesive layer is pressure-sensitive adhesive layer, preferably polyacrylic, polyurethanes or organic silicon；
Preferably, the method for the cast is：Uncured foam after foaming is directly poured on copper foil, resolidification；
Preferably, the foamed cotton layer is mainly made of following material mixed foaming：By weight, 100 parts of polyether polyol,
1~2.5 part of 25~40 parts of methyl diphenylene diisocyanate, 0.8~2 part of water, 0.3~1 part of catalyst and silicone oil；The polyethers
The hydroxyl value of polyalcohol is 80~140；
Preferably, the foamed cotton layer is mainly made of following material mixed foaming：By weight, 100 parts of polyether polyol,
1~2 part of 25~35 parts of methyl diphenylene diisocyanate, 0.8~1.5 part of water, 0.5~1 part of catalyst and silicone oil；The polyethers
The hydroxyl value of polyalcohol is 110~130；
Preferably, the polyether polyol passes through following pretreatment：By polyether polyol under the conditions of 130-140 DEG C vacuum
Dehydration, moisture are less than 0.3%.
Preferably, the foamed cotton layer is mainly made of following material mixed foaming：
By weight, 100 parts of polyether polyol, 30~40 parts of methyl diphenylene diisocyanate, 1~2 part of water, catalyst
0.3~0.8 part and 1.5~2.5 parts of silicone oil；
The hydroxyl value of the polyether polyol is 80~140.
Preferably, the foamed cotton layer is mainly made of following material mixed foaming：
By weight, 100 parts of polyether polyol, 35~40 parts of methyl diphenylene diisocyanate, 1~1.5 part of water, catalysis
1.5~2 parts of 0.5~0.8 part of agent and silicone oil；
The hydroxyl value of the polyether polyol is 80~110.
Preferably, the temperature of the mixed foaming is 80~90 DEG C.
Preferably, the mixing of reinforcing agent or fire retardant or both is additionally added when preparing the foamed cotton layer.
Preferably, the reinforcing agent is the one or more in nano silicon dioxide, montmorillonite, carbon black and carbon nanotubes,
It is preferred that the mixing of carbon black or carbon nanotubes or both；
Preferably, the fire retardant be halogenated flame retardant, preferably 2,3- dibromo-propanols.
Preferably, the reinforcing agent and the mass ratio of the polyether polyol are 4~10：100, preferably 5~10：100；
Preferably, the fire retardant and the mass ratio of the polyether polyol are 4~6：100.
Preferably, the catalyst is one kind or more in stannous octoate, stannous iso caprylate and dibutyl tin laurate
Kind, preferably octanoic acid stannous.
Preferably, the molecular weight of the polyether polyol is 800~1500, preferably 1000~1500 or 800-1200.
Hereafter the thickness of foam is 0.12mm or so in all embodiments.
Embodiment 1
A kind of heat-conducting glue band：
Prepare foam：
The vacuum dehydration under the conditions of 130-140 DEG C by polyether polyol, moisture are less than 0.3%, and polyether polyol (is divided
Son amount：1000, hydroxyl value：110) 100 parts, 35 parts of MDI, water (foaming agent)：1.5 parts, stannous octoate (catalyst)：0.5 part, silicon
Oil：2 parts, 5 parts of carbon nanotubes, 80-82 DEG C of reaction temperature is reacted 10min, is then directly poured on copper foil, and copper foil is thickness 9
μm rolled copper foil.
In the opposite side of copper foil, PSA is coated with using slit type extrusion pressing type coating machine (slot die), coating thickness is 10 μ
M, then release film is pasted, it winds.
Final structure as shown in Figure 1, include release film 1, psa layer 2, copper foil 3, foamed cotton layer 4 successively.
Embodiment 2
It is different from the composition that the main distinction of embodiment 1 is foam, it is specific as follows.
Prepare foam：
The vacuum dehydration under the conditions of 130-140 DEG C by polyether polyol, moisture are less than 0.3%, and polyether polyol (is divided
Son amount：1000, hydroxyl value：110) 100 parts, MDI30 parts, water (foaming agent)：2 parts, stannous octoate (catalyst)：0.3 part, silicone oil：
2.5 parts, 4 parts of carbon nanotubes, 2,3- 6 parts of dibromo-propanols, 88-90 DEG C of reaction temperature, react 5min, be then directly poured into copper foil
On, copper foil is the rolled copper foil of 9 μm of thickness.
In the opposite side of copper foil, PSA is coated with using slit type extrusion pressing type coating machine (slot die), coating thickness is 10 μ
M, then release film is pasted, it winds.
Embodiment 3
It is different from the composition that the main distinction of embodiment 1 is foam, it is specific as follows.
Prepare foam：
The vacuum dehydration under the conditions of 130-140 DEG C by polyether polyol, moisture are less than 0.3%, and polyether polyol (is divided
Son amount：1000, hydroxyl value：110) 100 parts, 40 parts of MDI, water (foaming agent)：1 part, stannous octoate (catalyst)：0.8 part, silicone oil：
1.5 parts, 6 parts of carbon nanotubes, 2,3- 4 parts of dibromo-propanols, 88-90 DEG C of reaction temperature, react 5min, be then directly poured into copper foil
On, copper foil is the rolled copper foil of 9 μm of thickness.
In the opposite side of copper foil, PSA is coated with using slit type extrusion pressing type coating machine (slot die), coating thickness is 10 μ
M, then release film is pasted, it winds.
Embodiment 4
It is different from the hydroxyl value that the main distinction of embodiment 1 is polyether polyol, it is specific as follows.
Prepare foam：
The vacuum dehydration under the conditions of 130-140 DEG C by polyether polyol, moisture are less than 0.3%, and polyether polyol (is divided
Son amount：1500, hydroxyl value：140) 100 parts, 35 parts of MDI, water (foaming agent)：1.5 parts, stannous octoate (catalyst)：0.5 part, silicon
Oil：2 parts, 5 parts of carbon nanotubes, 80-82 DEG C of reaction temperature reacts 10min, is then poured into mold, obtains 0.1mm's or so
Foam.
In the opposite side of copper foil, PSA is coated with using slit type extrusion pressing type coating machine (slot die), coating thickness is 10 μ
M, then release film is pasted, it winds.
Embodiment 5
It is different from the hydroxyl value that the main distinction of embodiment 1 is polyether polyol, it is specific as follows.
Prepare foam：
The vacuum dehydration under the conditions of 130-140 DEG C by polyether polyol, moisture are less than 0.3%, and polyether polyol (is divided
Son amount：800, hydroxyl value：80) 100 parts, 35 parts of MDI, water (foaming agent)：1.5 parts, stannous octoate (catalyst)：0.5 part, silicone oil：
2 parts, 5 parts of carbon nanotubes, 80-82 DEG C of reaction temperature is reacted 10min, is then directly poured on copper foil, and copper foil is 9 μm of thickness
Rolled copper foil.
In the opposite side of copper foil, PSA is coated with using slit type extrusion pressing type coating machine (slot die), coating thickness is 10 μ
M, then release film is pasted, it winds.
Embodiment 6
It is different that the raw material proportioning of foam is essentially consisted in from the difference of embodiment 1, it is specific as follows.
The vacuum dehydration under the conditions of 130-140 DEG C by polyether polyol, moisture are less than 0.3%, and polyether polyol (is divided
Son amount：1000, hydroxyl value：140) 100 parts, 25 parts of MDI, water (foaming agent)：1.5 parts, stannous octoate (catalyst)：0.5 part, silicon
Oil：2 parts, 5 parts of carbon nanotubes, 80-82 DEG C of reaction temperature is reacted 10min, is then directly poured on copper foil, and copper foil is thickness 9
μm rolled copper foil.
In the opposite side of copper foil, PSA is coated with using slit type extrusion pressing type coating machine (slot die), coating thickness is 10 μ
M, then release film is pasted, it winds.
Comparative example 1
Difference lies in foam formula is different from embodiment 1：
The vacuum dehydration under the conditions of 130-140 DEG C by polyether polyol, moisture are less than 0.3%, polyether polyol (hydroxyl
Value：430) 100 parts, 125 parts of MDI, HCFC-14LB (foaming agent)：25 parts, stannous octoate (catalyst)：1 part, silicone oil：2 parts,
0.5 part of carbon nanotubes, 20-25 DEG C of reaction temperature are reacted 10min, are then directly poured on copper foil, and copper foil is 9 μm of thickness
Rolled copper foil.
Remaining prepares the process of adhesive tape with embodiment 1.
Comparative example 2
It is different with the laminating type of copper foil difference lies in foam from embodiment 1：
Prepare foam：
The vacuum dehydration under the conditions of 130-140 DEG C by polyether polyol, moisture are less than 0.3%, and polyether polyol (is divided
Son amount：1000, hydroxyl value：110) 100 parts, 35 parts of MDI, water (foaming agent)：1.5 parts, stannous octoate (catalyst)：0.5 part, silicon
Oil：2 parts, 5 parts of carbon nanotubes, 80-82 DEG C of reaction temperature reacts 10min, and then casting mold is into it is 0.12mm that thickness, which is made,
Foam.
In the one side of copper foil, PSA is coated with using slit type extrusion pressing type coating machine (slot die), coating thickness is 10 μm,
Then it is bonded foam；PSA is also coated in the opposite side of copper foil, coating thickness is 10 μm, then pastes release film, is wound.
The performance such as table 1 for the foam that all of above embodiment and comparative example provide.
The performance of the different foams of table 1
| Impedance/Ω | Compressive strength/MPa | Anti-flammability | |
| Embodiment 1 | 1011.5 | 0.35 | V2 |
| Embodiment 2 | 1012 | 0.3 | V1 |
| Embodiment 3 | 1011 | 0.45 | V1 |
| Embodiment 4 | 1011.5 | 0.37 | V2 |
| Embodiment 5 | 1011.5 | 0.32 | V2 |
| Embodiment 6 | 1011.5 | 0.35 | V2 |
| Comparative example 1 | 1013 | 0.1 | <V2 |
| Comparative example 2 | 1011.5 | 0.35 | V2 |
The heat conductivility such as table 2 for the adhesive tape that all of above embodiment and comparative example provide.
The shading performance of the different adhesive tapes of table 2
Note：
Thermal conductivity factor is surveyed using heat conduction coefficient tester (LW9389, ASTM 5470)；It is tested using vertical burn test instrument
Anti-flammability, test establishing criteria UL-94.
It can determine according to the result of Tables 1 and 2：
1st, the mode bonded compared to PSA, pouring type obtain the thermal conductivity factor higher of heat-conducting glue band；
2nd, the composition of foam has a major impact performance：Foam density is smaller, and thermal conductivity factor is lower in Z-direction.
Finally it should be noted that：The above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe is described in detail the present invention with reference to foregoing embodiments, it will be understood by those of ordinary skill in the art that：Its according to
Can so modify to the technical solution recorded in foregoing embodiments either to which part or all technical characteristic into
Row equivalent substitution；And these modifications or replacement, the essence of appropriate technical solution is not made to depart from various embodiments of the present invention technology
The scope of scheme.
Claims (10)
1. a kind of heat-conducting glue band, which is characterized in that including release film, adhesive layer, metal foil and the foamed cotton layer being bonded successively；
The foamed cotton layer is fitted in by pouring type in the metal foil.
2. heat-conducting glue band according to claim 1, which is characterized in that the metal foil is aluminium foil, copper foil or tinfoil paper；
Preferably, the adhesive layer is pressure-sensitive adhesive layer, preferably polyacrylic, polyurethanes or organic silicon；
Preferably, the method for the cast is：Uncured foam after foaming is directly poured on copper foil, resolidification；
Preferably, the foamed cotton layer is mainly made of following material mixed foaming：By weight, 100 parts of polyether polyol, hexichol
1~2.5 part of 25~40 parts of dicyclohexylmethane diisocyanate, 0.8~2 part of water, 0.3~1 part of catalyst and silicone oil；The polyether polyols
The hydroxyl value of alcohol is 80~140；
Preferably, the foamed cotton layer is mainly made of following material mixed foaming：By weight, 100 parts of polyether polyol, hexichol
1~2 part of 25~35 parts of dicyclohexylmethane diisocyanate, 0.8~1.5 part of water, 0.5~1 part of catalyst and silicone oil；The polyether polyols
The hydroxyl value of alcohol is 110~130；
Preferably, the polyether polyol passes through following pretreatment：By polyether polyol, vacuum takes off under the conditions of 130-140 DEG C
Water, moisture are less than 0.3%.
3. heat-conducting glue band according to claim 1 or 2, which is characterized in that the foamed cotton layer is mainly mixed by following material
Foaming is made：
By weight, 100 parts of polyether polyol, 30~40 parts of methyl diphenylene diisocyanate, 1~2 part of water, catalyst 0.3
~0.8 part and 1.5~2.5 parts of silicone oil；
The hydroxyl value of the polyether polyol is 80~140.
4. heat-conducting glue band according to claim 3, which is characterized in that the foamed cotton layer is mainly by following material mixed foaming
It is made：
By weight, 100 parts of polyether polyol, 35~40 parts of methyl diphenylene diisocyanate, 1~1.5 part of water, catalyst
0.5~0.8 part and 1.5~2 parts of silicone oil；
The hydroxyl value of the polyether polyol is 80~110.
5. heat-conducting glue band according to claim 3, which is characterized in that the method for the foaming is：80-90 DEG C is heated to,
React 5-10min.
6. heat-conducting glue band according to claim 2, which is characterized in that reinforcing agent or resistance are additionally added when preparing the foamed cotton layer
Fire the mixing of agent or both.
7. heat-conducting glue band according to claim 6, which is characterized in that the reinforcing agent for nano silicon dioxide, montmorillonite,
The mixing of one or more in carbon black and carbon nanotubes, preferably carbon black or carbon nanotubes or both；
Preferably, the fire retardant be halogenated flame retardant, preferably 2,3- dibromo-propanols.
8. heat-conducting glue band according to claim 6, which is characterized in that the reinforcing agent and the quality of the polyether polyol
Than for 4~10：100, preferably 5~10：100；
Preferably, the fire retardant and the mass ratio of the polyether polyol are 4~6：100.
9. heat-conducting glue band according to claim 2, which is characterized in that the catalyst is stannous octoate, stannous iso caprylate
With the one or more in dibutyl tin laurate, preferably octanoic acid stannous.
10. heat-conducting glue band according to claim 2, which is characterized in that the molecular weight of the polyether polyol for 800~
1500, preferably 1000~1500 or 800-1200.
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| CN111793187A (en) * | 2020-08-04 | 2020-10-20 | 湖南省普瑞达内装材料有限公司 | High-density high-thermal conductivity polyurethane foam and preparation method thereof |
| CN111875953A (en) * | 2020-07-31 | 2020-11-03 | 湖南省普力达高分子新材料股份有限公司 | High-density high-thermal-conductivity polyurethane foam and preparation method thereof |
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