CN108073253A - The temprature control method of logical device - Google Patents
The temprature control method of logical device Download PDFInfo
- Publication number
- CN108073253A CN108073253A CN201611024137.6A CN201611024137A CN108073253A CN 108073253 A CN108073253 A CN 108073253A CN 201611024137 A CN201611024137 A CN 201611024137A CN 108073253 A CN108073253 A CN 108073253A
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- temperature
- logical device
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- waveform
- control
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Control Of Temperature (AREA)
Abstract
The embodiment of the present invention discloses a kind of temprature control method of logical device, and method includes：At least one register of the logical device is set to temperature control register, the waveform for being overturn with toggle frequency and being transmitted with transmission frequency to temperature control register input；By adjusting to the parameter of the waveform of each register input with the temperature that controls the logical device or by adjusting the quantity of the temperature control register to control the temperature of the logical device.The embodiment of the present invention is by register input waveform, with the dynamic power consumption of control register, so as to realize that controllable heat generation circuit carrys out the temperature of control device in logical device, so that the chip of low job class can realize the requirement of high workload level chip, cost is greatlyd save.
Description
Technical field
The present invention relates to electronic related technologies fields, particularly a kind of temprature control method of logical device.
Background technology
In general, electronic device, such as logical device are specially field programmable gate array chip (Field-
Programmable Gate Array, FPGA), following four is divided into according to temperature grade：Business level chip (0-70 degree),
Technical grade chip (- 40-85 degree), military project grade chip (- 55-125 degree), automotive grade chip (- 55-125 degree).Due to production quantity
And the factor of each side such as process complexity.Being embodied on final chip price has very big difference, often promotes one etc.
Grade, price at least promote 15%~25%.
It can be seen that low-temperature working scope is the important requirement to chip level.The logical device of low job class is nothing
What method worked at a temperature of high workload grade.However, inventor has found that temperature range is wider during invention is realized,
Device price is higher or even some logical devices are can not to meet harsh temperature range demand.
The content of the invention
Based on this, it is necessary to can not work for the logical device of the prior art at a temperature of less than its job class
Technical problem, improves the temprature control method and logical device of a kind of logical device, and cost is greatly saved, so low work
The requirement of high workload level chip can be reached by making the method for the chip combination present invention of grade.
The embodiment of the present invention provides a kind of temprature control method of logical device, including：
At least one register of the logical device is set to temperature control register, inputs to turn over to the temperature control register
Turn the waveform that frequency is overturn and is transmitted with transmission frequency；
By adjusting to the parameter of the waveform of each register input to control the temperature of the logical device,
Or by adjusting the quantity of the temperature control register to control the temperature of the logical device.
Further, it is described by adjusting to the parameter of the waveform of each register input to control described patrol
The temperature of volume device or by adjusting the temperature control register quantity to control the temperature of the logical device, it is specific to wrap
It includes：
Monitor the temperature of the logical device, when temperature and the preset temperature of the logical device are inconsistent, adjust to
The parameter of the waveform of each register input is posted with controlling the temperature of the logical device or adjusting the temperature control
The quantity of storage is to control the temperature of the logical device.
Further, it is described to adjust the parameter to the waveform of each register input to control the logic
The temperature of device, specifically includes:
When the temperature of the logical device is more than preset temperature, then the waveform to each register input is reduced
Toggle frequency, to reduce the temperature of the logical device；
When the temperature of the logical device is less than preset temperature, then increase the waveform to each register input
Toggle frequency, to increase the temperature of the logical device.
Further, it is described to adjust the parameter to the waveform of each register input to control the logic
The temperature of device, specifically includes:
When the temperature of the logical device is more than preset temperature, then the waveform to each register input is reduced
Transmission frequency, to reduce the temperature of the logical device；
When the temperature of the logical device is less than preset temperature, then increase the waveform to each register input
Transmission frequency, to increase the temperature of the logical device.
Further, the quantity of the adjustment temperature control register is to control the temperature of the logical device, specifically
Including:
When the temperature of the logical device is more than preset temperature, then the quantity of the temperature control register is reduced, to reduce
State the temperature of logical device；
When the temperature of the logical device is less than preset temperature, then increase the quantity of the temperature control register, to increase
State the temperature of logical device.
The embodiment of the present invention is by register input waveform, with the dynamic power consumption of control register, so as in logic device
Realize that controllable heat generation circuit carrys out the temperature of control device in part, so that the chip of low job class can be realized
The requirement of high workload level chip, greatlys save cost.
Description of the drawings
Fig. 1 is a kind of temperature controlled work flow diagram for logical device that one embodiment of the invention provides；
Fig. 2 is a kind of register connection diagram for logical device that alternative embodiment of the present invention provides；
Fig. 3 is a kind of temperature controlled work flow diagram for logical device that alternative embodiment of the present invention provides；
Fig. 4 is a kind of module diagram for logical device that one embodiment of the invention provides.
Specific embodiment
The present invention will be further described in detail in the following with reference to the drawings and specific embodiments.
Embodiment one
A kind of temprature control method of the logical device provided as shown in Figure 1 for one embodiment of the invention, including：
At least one register of the logical device is set to temperature control register by step S101, is deposited to the temperature control
The waveform that device input is overturn with toggle frequency and is transmitted with transmission frequency；
Step S102, by adjusting to the parameter of the waveform of each register input to control the logic device
The temperature of part or by adjusting the quantity of the temperature control register to control the temperature of the logical device.
Logical device, such as FPGA, including multiple registers, the dynamic power consumption of each register can follow incoming wave deformation
Change.Therefore, several registers in some logical devices are set to temperature control register, such as posting in Fig. 2 in step S101
Storage 21.Then to the register input waveform, such as square wave, sine wave etc., increase the dynamic power consumption of register, generate heat
Amount, and in step s 102, by the control to institute's input waveform or to enabling, not enabling temperature control register, so as to fulfill
Controllable heat generation circuit improves the temperature of device.
The embodiment of the present invention is by register input waveform, with the dynamic power consumption of control register, so as in logic device
Realize that controllable heat generation circuit carrys out the temperature of control device in part, so that the chip of low job class can be realized
The requirement of high workload level chip, greatlys save cost.
Embodiment two
A kind of temprature control method for logical device that alternative embodiment of the present invention provides is illustrated in figure 3, including：
At least one register of the logical device is set to temperature control register by step S301, is deposited to the temperature control
The waveform that device input is overturn with toggle frequency and is transmitted with transmission frequency；
Step S302 monitors the temperature of the logical device, when temperature and the preset temperature of the logical device are inconsistent
When, the parameter to the waveform of each register input is adjusted to control the temperature of the logical device or adjustment
The quantity of the temperature control register is to control the temperature of the logical device.
The temperature of logical device can by the chip of logical device outside or chip on temperature sensor monitor.
Specifically, Ke Yishi：
When the temperature of the logical device is more than preset temperature, then the waveform to each register input is reduced
Toggle frequency, to reduce the temperature of the logical device；
When the temperature of the logical device is less than preset temperature, then increase the waveform to each register input
Toggle frequency, to increase the temperature of the logical device.
Or：
When the temperature of the logical device is more than preset temperature, then the waveform to each register input is reduced
Transmission frequency, to reduce the temperature of the logical device；
When the temperature of the logical device is less than preset temperature, then increase the waveform to each register input
Transmission frequency, to increase the temperature of the logical device.
Or：
When the temperature of the logical device is more than preset temperature, then the quantity of the temperature control register is reduced, to reduce
State the temperature of logical device；
When the temperature of the logical device is less than preset temperature, then increase the quantity of the temperature control register, to increase
State the temperature of logical device.
The dynamic power consumption of registerWherein, a is the toggle frequency of input waveform, i.e. high level 1
With the toggle frequency of low level 0, and C be register internal capacitance,For rated voltage, f is transmission frequency.Wherein, C and
It is rated value, can not adjusts, and a and f are then different according to different waveforms.When improving a or f, then dynamic power consumption can be improved,
So as to generate heat, and a or f is reduced, then can reduce dynamic power consumption, so as to reduce heat.Alternatively, it is also possible to by reduce or
The quantity for increasing temperature control register carrys out the temperature of control logic device, specifically, can be deposited by enabling several temperature controls
Device increases the temperature of logical device, can reduce the temperature of logical device by not enabling several temperature control registers.
E=Pt=aCV2Ft=aCV2·L
This formula, which is also put into, to go ahead, and it is all right to make a simple declaration.
The embodiment of the present invention is by register input waveform, with the dynamic power consumption of control register, so as in logic device
Realize that controllable heat generation circuit carrys out the temperature of control device in part, so that the chip of low job class can be realized
The requirement of high workload level chip, greatlys save cost.It in addition, is monitored by the temperature to logical device so that device
It is kept constant after reaching particular job temperature.
Embodiment three
A kind of module diagram of logical device of one embodiment of the invention offer is provided, including：
Temperature control register setup module 401, is used for：At least one register of the logical device is set to temperature control deposit
Device, the waveform for being overturn with toggle frequency and being transmitted with transmission frequency to temperature control register input；
Temperature adjusts module 402, is used for：By adjusting to the parameter of the waveform of each register input to control
Make the temperature of the logical device or by adjusting the quantity of the temperature control register to control the temperature of the logical device
Degree.
The embodiment of the present invention is by register input waveform, with the dynamic power consumption of control register, so as in logic device
Realize that controllable heat generation circuit carrys out the temperature of control device in part, so that the chip of low job class can be realized
The requirement of high workload level chip, greatlys save cost.
Example IV
A kind of logical device that alternative embodiment of the present invention provides, including：
Temperature control register setup module, is used for：At least one register of the logical device is set to temperature control register,
The waveform for being overturn with toggle frequency and being transmitted with transmission frequency to temperature control register input；
Temperature adjusts module, is used for：The temperature of the logical device is monitored, when temperature and the default temperature of the logical device
When spending inconsistent, the parameter to the waveform of each register input is adjusted to control the temperature of the logical device,
Or the quantity of the temperature control register is adjusted to control the temperature of the logical device.
Specifically, Ke Yishi：
When the temperature of the logical device is more than preset temperature, then the waveform to each register input is reduced
Toggle frequency, to reduce the temperature of the logical device；
When the temperature of the logical device is less than preset temperature, then increase the waveform to each register input
Toggle frequency, to increase the temperature of the logical device.
Or：
When the temperature of the logical device is more than preset temperature, then the waveform to each register input is reduced
Transmission frequency, to reduce the temperature of the logical device；
When the temperature of the logical device is less than preset temperature, then increase the waveform to each register input
Transmission frequency, to increase the temperature of the logical device.
Or：
When the temperature of the logical device is more than preset temperature, then the quantity of the temperature control register is reduced, to reduce
State the temperature of logical device；
When the temperature of the logical device is less than preset temperature, then increase the quantity of the temperature control register, to increase
State the temperature of logical device.
The embodiment of the present invention is by register input waveform, with the dynamic power consumption of control register, so as in logic device
Realize that controllable heat generation circuit carrys out the temperature of control device in part, so that the chip of low job class can be realized
The requirement of high workload level chip, greatlys save cost.It in addition, is monitored by the temperature to logical device so that device
It is kept constant after reaching particular job temperature.
Fifth embodiment of the invention provides a kind of nonvolatile computer storage media, and the computer storage media is deposited
Computer executable instructions are contained, which can perform the logical device in above-mentioned any means embodiment
Temprature control method.
Sixth embodiment of the invention provides the logical device of the temprature control method of execution logic device part, the logic device
Part can：Perform method flow as shown in Figure 1 and Figure 2.
The said goods can perform the method that the embodiment of the present application is provided, and possesses the corresponding function module of execution method and has
Beneficial effect.The not technical detail of detailed description in the present embodiment, reference can be made to the method that the embodiment of the present application is provided.
The logical device of the embodiment of the present invention can be applied to various electronic, include but not limited to:
(1) electronic control unit (Electronic Control Unit, ECU) is also known as " car running computer ", " vehicle-mounted computer "
Deng.Mainly by microprocessor (CPU), memory (ROM, RAM), input/output interface (I/O), analog-digital converter (A/D) and
The large scale integrated circuits such as shaping, driving form.
(2) mobile communication equipment:The characteristics of this kind equipment is that possess mobile communication function, and to provide speech, data
It communicates as main target.This Terminal Type includes:Smart mobile phone (such as iPhone), multimedia handset, functional mobile phone and low
Hold mobile phone etc..
(3) super mobile personal computer equipment:This kind equipment belongs to the scope of personal computer, there is calculating and processing work(
Can, generally also possess mobile Internet access characteristic.This Terminal Type includes:PDA, MID and UMPC equipment etc., such as iPad.
(4) portable entertainment device:This kind equipment can show and play multimedia content.The kind equipment includes:Audio,
Video player (such as iPod), handheld device, e-book and intelligent toy and portable car-mounted navigation equipment.
(5) server:The equipment for providing the service of calculating, the composition of server are total including processor, hard disk, memory, system
Line etc., server is similar with general computer architecture, but due to needing to provide highly reliable service, in processing energy
Power, stability, reliability, security, scalability, manageability etc. are more demanding.
(6) other have the function of the electronic device of data interaction.
In addition, above-mentioned logical order can be realized by the form of SFU software functional unit and be independent production marketing
Or it in use, can be stored in a computer read/write memory medium.Based on such understanding, technical scheme
The part substantially to contribute in other words to the prior art or the part of the technical solution can be in the form of software products
It embodies, which is stored in a storage medium, is used including some instructions so that one mobile whole
End (can be personal computer, server or the network equipment etc.) performs the whole of each embodiment the method for the present invention
Or part steps.And foregoing storage medium includes：USB flash disk, mobile hard disk, read-only memory (ROM, Read-Only
Memory), random access memory (RAM, Random Access Memory), magnetic disc or CD etc. are various can store journey
The medium of sequence code.
The apparatus embodiments described above are merely exemplary, wherein the unit illustrated as separating component can
To be or may not be physically separate, the component shown as unit may or may not be physics list
Member, you can be located at a place or can also be distributed in multiple network element.It can be selected according to the actual needs
In some or all of module realize the purpose of the embodiment of the present invention.Those of ordinary skill in the art are not paying wound
In the case of the work for the property made, you can to understand and implement.
Through the above description of the embodiments, those skilled in the art can be understood that each embodiment can
It is realized by the mode of software plus required general hardware platform, naturally it is also possible to pass through hardware.Based on such understanding, on
Technical solution is stated substantially in other words to embody the part that the prior art contributes in the form of software product, it should
Computer software product can store in a computer-readable storage medium, such as ROM/RAM, magnetic disc, CD, including several fingers
Order, which is used, so that computer equipment (can be personal computer, server or the network equipment etc.) performs each implementation
Method described in some parts of example or embodiment.
Finally it should be noted that：Above example is only to illustrate the technical solution of the embodiment of the present invention rather than it is limited
System；Although the embodiment of the present invention is described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should
Understand：It can still modify to the technical solution recorded in foregoing embodiments or to which part technical characteristic
Carry out equivalent substitution；And these modifications or replacement, the essence of appropriate technical solution is not made to depart from various embodiments of the present invention skill
The spirit and scope of art scheme.
Claims (5)
1. a kind of temprature control method of logical device, which is characterized in that including：
At least one register of the logical device is set to temperature control register, inputs to overturn frequency to the temperature control register
The waveform that rate is overturn and is transmitted with transmission frequency；
By adjusting to the parameter of the waveform of each register input with control the temperature of the logical device or
By adjusting the quantity of the temperature control register to control the temperature of the logical device.
2. the temprature control method of logical device according to claim 1, which is characterized in that described by adjusting to each
The parameter of the waveform of register input is posted with the temperature that controls the logical device or by adjusting the temperature control
The quantity of storage is specifically included with controlling the temperature of the logical device：
The temperature of the logical device is monitored, when the temperature of the logical device is inconsistent with preset temperature, is adjusted to each
The parameter of the waveform of register input is to control the temperature of the logical device or the adjustment temperature control register
Quantity to control the temperature of the logical device.
3. the temprature control method of logical device according to claim 2, which is characterized in that described to adjust to each described
The parameter of the waveform of register input is specifically included with controlling the temperature of the logical device:
When the temperature of the logical device is more than preset temperature, then turning over for the waveform to each register input is reduced
Turn frequency, to reduce the temperature of the logical device；
When the temperature of the logical device is less than preset temperature, then increase turning over for the waveform to each register input
Turn frequency, to increase the temperature of the logical device.
4. the temprature control method of logical device according to claim 2, which is characterized in that described to adjust to each described
The parameter of the waveform of register input is specifically included with controlling the temperature of the logical device:
When the temperature of the logical device is more than preset temperature, then the biography of the waveform to each register input is reduced
Defeated frequency, to reduce the temperature of the logical device；
When the temperature of the logical device is less than preset temperature, then increase the biography of the waveform to each register input
Defeated frequency, to increase the temperature of the logical device.
5. the temprature control method of logical device according to claim 2, which is characterized in that the adjustment temperature control is posted
The quantity of storage is specifically included with controlling the temperature of the logical device:
When the temperature of the logical device is more than preset temperature, then the quantity of the temperature control register is reduced, to be patrolled described in reduction
Collect the temperature of device；
When the temperature of the logical device is less than preset temperature, then increase the quantity of the temperature control register, to be patrolled described in increase
Collect the temperature of device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611024137.6A CN108073253A (en) | 2016-11-17 | 2016-11-17 | The temprature control method of logical device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201611024137.6A CN108073253A (en) | 2016-11-17 | 2016-11-17 | The temprature control method of logical device |
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| Publication Number | Publication Date |
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| CN108073253A true CN108073253A (en) | 2018-05-25 |
Family
ID=62160983
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| CN201611024137.6A Withdrawn CN108073253A (en) | 2016-11-17 | 2016-11-17 | The temprature control method of logical device |
Country Status (1)
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101303711A (en) * | 2008-07-10 | 2008-11-12 | 北京中星微电子有限公司 | Gating clock for on-site programmable gate array and implementing method thereof |
| CN103412990A (en) * | 2013-08-05 | 2013-11-27 | 北京航空航天大学 | Multi-level collaborative low-power design method |
| CN103616628A (en) * | 2013-11-21 | 2014-03-05 | 北京工业大学 | Method and device for measuring temperature rising and heat resistance of Schottky grid field effect transistor |
-
2016
- 2016-11-17 CN CN201611024137.6A patent/CN108073253A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101303711A (en) * | 2008-07-10 | 2008-11-12 | 北京中星微电子有限公司 | Gating clock for on-site programmable gate array and implementing method thereof |
| CN103412990A (en) * | 2013-08-05 | 2013-11-27 | 北京航空航天大学 | Multi-level collaborative low-power design method |
| CN103616628A (en) * | 2013-11-21 | 2014-03-05 | 北京工业大学 | Method and device for measuring temperature rising and heat resistance of Schottky grid field effect transistor |
Non-Patent Citations (2)
| Title |
|---|
| 威斯特（ WESTE，H.E.）、哈里斯（HARRIS，D.）: "《CMOS超大规模集成电路设计 第3版》", 30 April 2006 * |
| 马光胜，冯刚著: "《SoC设计与IP核重用技术》", 31 August 2006 * |
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