CN108070833A - Focusing ring and its method of work - Google Patents
Focusing ring and its method of work Download PDFInfo
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- CN108070833A CN108070833A CN201611012477.7A CN201611012477A CN108070833A CN 108070833 A CN108070833 A CN 108070833A CN 201611012477 A CN201611012477 A CN 201611012477A CN 108070833 A CN108070833 A CN 108070833A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
- H01J37/32642—Focus rings
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Abstract
The present invention provides a kind of focusing ring and its method of work, wherein, focusing ring includes：Ring body, the ring body includes the first opposite face and the second face and the first cylinder and the second cylinder between the first face and the second face, and the both sides of first cylinder and the second cylinder are connected respectively with the first face and the second face, the busbar of first cylinder and the second cylinder is parallel；Opening in the ring body, the opening extends to the second face from the first face, and the opening is through to the second cylinder from the first cylinder；The ring body has ring body projecting figure in the plane perpendicular to first cylinder or the second segment of a cylinder, and the ring body is projected as closed ring.The ring body is projected as closed ring, then when respectively the opening sidewalls apply different potentials when, the magnetic distribution that the electric current in the focusing ring generates can be made more uniform.Therefore, the film thickness formed by the focusing ring is more uniform.
Description
Technical field
The present invention relates to semiconductor sputtering target manufacturing field more particularly to a kind of focusing ring and its method of works.
Background technology
Sputtering technology is one kind in physical vapour deposition (PVD) (Physical Vapor Deposition, PVD), refer to
Particle (ion or neutral atom, molecule) the bombardment surface of solids of certain energy, the atom or molecule for making solid near surface obtain
The technique that sufficiently large energy escapes the surface of solids and reaches substrate.
Under normal conditions, during sputter coating, metal ion is sputtered out from sputtering target material surface, along multiple and different sides
To target material surface is left, in this way, the target material reached on substrate is seldom, most of target material is wasted.In order to avoid this
Problem, focusing ring is provided in sputtering equipment, and the focusing ring is used for focusing ions to substrate.Focusing ring is to being formed
The quality tool of film has a significant impact.
However, existing focusing ring easily makes the in uneven thickness of the film to be formed.
The content of the invention
It is of the invention to solve the problems, such as to be to provide a kind of focusing ring and its method of work, formed film thickness can be improved
Uniformity.
To solve the above problems, the present invention provides a kind of focusing ring, including：Ring body, the ring body include opposite first
Face and the second face and the first cylinder and the second cylinder between the first face and the second face, and first cylinder and
The both sides of two cylinders are connected respectively with the first face and the second face, and the busbar of first cylinder and the second cylinder is parallel；Positioned at institute
The opening in ring body is stated, the opening extends to the second face from the first face, and the opening is through to the second column from the first cylinder
Face；The ring body has ring body projecting figure in the plane perpendicular to first cylinder or the second segment of a cylinder, and described
Ring body is projected as closed ring.
Optionally, the ring body further includes：Positioned at the first end face and second end face of the opening sidewalls.
Optionally, the first end face and second end face are plane, and the first end face has with first segment of a cylinder
There is the first acute angle, the second end face has the second acute angle with first segment of a cylinder.
Optionally, the first end face is parallel with the second end face.
Optionally, first acute angle is 60 °~70 °, and second acute angle is 60 °~70 °.
Optionally, the distance between the first end face and second end face are 5.7mm~7mm.
Optionally, the first end face and second end face are cylindrical surface, the first end face and the friendship of first cylinder
Line is parallel to the busbar of the first end face, and the intersection of the second end face and first cylinder is parallel to the mother of second end face
Line.
Optionally, the first end face has groove；The second end face has protrusion.
Optionally, the recess sidewall surface is cylindrical surface, and the busbar of the recess sidewall is perpendicular to first cylinder
Busbar；The cam surface is cylindrical surface, and the busbar of the protrusion sidewall surfaces is perpendicular to first segment of a cylinder.
Optionally, the protrusion includes：The first side and second side of interconnection；The recess sidewall includes：
The 3rd side and the 4th side being connected with each other.
Optionally, the first side, second side, the 3rd side and the 4th side are plane；The first side with
3rd side is parallel；The second side is parallel with the 4th side.
Optionally, the ring body is 45mm~55mm along the size on the first segment of a cylinder direction.
Optionally, the ring body is torus, and the outer diameter of the ring body is 260mm~300mm；The internal diameter of the ring body is
200mm~240mm.
Optionally, the material of the ring body is tantalum or titanium.
Optionally, the center overlapping of axles of first cylinder and the second cylinder, and first cylinder is to the center
Wheelbase is with a distance from more than second cylinder to the central shaft.
Optionally, which is characterized in that second spherocylindrical surface has decorative pattern.
Optionally, the focusing ring further includes：Positioned at the boss of first spherocylindrical surface of ring body.
The present invention also provides a kind of method of work of focusing ring, including：Target, substrate and focusing ring, the target are provided
Material includes sputter face, and the substrate includes coated surface；Make the coated surface opposite with the sputter face；Make the coated surface and institute
After stating sputter face relatively, the focusing ring is placed between the target and substrate, the mother of the first cylinder of the focusing ring
Line is vertical with the sputter face；After the focusing ring is placed between the target and substrate, respectively to the opening sidewalls
Apply different current potentials；After the focusing ring is placed between the target and substrate, the target as sputter is made to go out to sputter grain
Son, and the sputtering particle is made to reach the substrate through the focusing ring.
Optionally, after the opening sidewalls being applied with different current potentials, the target as sputter is made to go out sputtering particle.
Compared with prior art, technical scheme has the following advantages：
Technical solution of the present invention provide focusing ring in, the focusing ring in use, the ring body near zone
Electromagnetic field be oriented parallel to the busbar of first cylinder.Throwing of the ring body in the plane perpendicular to first cylinder
Shadow figure is closed ring, then when the opening sidewalls apply different potentials, having electric current in the focusing ring respectively
Projecting figure of the region in the plane perpendicular to first cylinder is also the annular of closing, then the electromagnetism near the opening
The intensity difference of other areas adjacent electromagnetic fields of field intensity with the ring body is smaller, so that the electric current in the focusing ring generated
Magnetic distribution is more uniform, and then makes the focusing ring more uniform to the convergence effect of sputtering particle.Therefore, the focusing is passed through
The film thickness that ring is formed is more uniform.
In the method for work for the gathering ring that technical solution of the present invention provides, respectively the opening sidewalls are applied with different electricity
Position, makes to generate electric current in the ring body, the focusing ring in use, put down by the electromagnetism field direction of the ring body near zone
Row is in the busbar of first cylinder.Projecting figure of the ring body in the plane perpendicular to first cylinder is closed-loop
Shape, then when the opening sidewalls apply different potentials, the region with electric current is perpendicular to described in the ring body respectively
Projecting figure in the plane of first cylinder is also the annular of closing, then the electromagnetic field intensity near the opening and the ring body
The intensity difference of other areas adjacent electromagnetic fields is smaller, so that the magnetic distribution that the electric current in the focusing ring generates is more equal
It is even, and then make the focusing ring more uniform to the convergence effect of sputtering particle.Therefore, the film formed by the focusing ring is thick
It spends more uniform.
Description of the drawings
Fig. 1 is a kind of structure diagram of focusing ring；
Fig. 2 to Fig. 4 is the structure diagram of the focusing ring of the present invention；
Fig. 5 is the structure diagram of another embodiment of focusing ring of the present invention；
Fig. 6 is the structure diagram of the another embodiment of focusing ring of the present invention；
Fig. 7 is the structure diagram of the focusing ring fourth embodiment of the present invention；
Fig. 8 is the structure diagram of one embodiment of focusing ring method of work of the present invention.
Specific embodiment
Focusing ring is there are problems, for example, even using the uneven film thickness that focusing ring is formed.
In conjunction with a kind of structure of focusing ring, the reason for uneven film thickness formed using focusing ring is even is analyzed：
Fig. 1 is a kind of structure diagram of focusing ring.
It please refers to Fig.1, the focusing ring includes：Ring body 100, the ring body 100 include opposite the first cylindrical surface and the
Two cylindrical surfaces, have opening 101 in the ring body 100, and 101 side walls of the opening are parallel with first cylindrical surface busbar.
Wherein, the application method of the focusing ring includes：Substrate and target are provided, the substrate includes coated surface, described
Target includes：Sputter face, the sputter face are opposite and parallel with the coated surface.The focusing ring in use, by institute
It states focusing ring to be placed between target and substrate, the busbar of the first cylinder of focusing ring is vertical with the sputter face.The opening
101 side wall for applying different ac potentials respectively, so as to form alternating current in the ring body, and then in the ring
Electromagnetic field is formed around body.From the particle that target as sputter goes out substrate film coating face is converged under the action of the electromagnetic field.It reaches
The part plasma sputter on 320 surface of substrate is attached to the substrate film coating face；Reach the part sputtering of the substrate surface
Ion is emitted back towards focusing ring by 320 backwash of substrate, forms reverse sputtering ion.The magnetic that the reverse sputtering ion is generated in focusing ring
It is accumulated under the action of to the substrate film coating face.
However, due to not having electric current in the opening 101, the electromagnetic field for causing 101 peripheral regions of the opening is weaker, right
Particle convergence effect it is poor so that from it is described opening 101 peripheral regions arrival substrate particle it is less, and then cause with it is described
The film thickness formed on the substrate of 101 corresponding positions that is open is smaller.Therefore, the uneven film thickness that the focusing ring is formed
It is even.
To solve the technical problem, the present invention provides a kind of focusing ring, including：Ring body, the ring body include opposite
The first face and the second face and the first cylinder and the second cylinder between the first face and the second face, and first column
Face and the both sides of the second cylinder are connected respectively with the first face and the second face, and the busbar of first cylinder and the second cylinder is parallel；
Opening in the ring body, the opening extends to the second face from the first face, and the opening is through to from the first cylinder
Second cylinder；The ring body has ring body projecting figure in the plane perpendicular to first cylinder or the second segment of a cylinder,
And the ring body is projected as closed ring.
Wherein, in use, the electromagnetic field of the ring body near zone is oriented parallel to described to the focusing ring
The busbar of one cylinder.Projecting figure of the ring body in the plane perpendicular to first cylinder be closed ring, then when point
Not when the opening sidewalls apply different potentials, there is the region of electric current perpendicular to first cylinder in the focusing ring
Plane in projecting figure be also the annular of closing, then the electromagnetic field intensity near the opening and other regions of the ring body
The intensity difference of neighbouring electromagnetic field is smaller, so that the magnetic distribution that the electric current in the focusing ring generates is more uniform, and then makes
The focusing ring is more uniform to the convergence effect of sputtering particle.Therefore, the film thickness formed by the focusing ring is more uniform.
It is understandable for the above objects, features and advantages of the present invention is enable to become apparent, below in conjunction with the accompanying drawings to the present invention
Specific embodiment be described in detail.
Fig. 2 to Fig. 4 is the structure diagram of one embodiment of focusing ring of the present invention.
It please refers to Fig.2 to Fig. 4, Fig. 3 is Fig. 2 regions 1 along at second port and perpendicular to the first segment of a cylinder direction (X side
To) view, Fig. 4 for ring body 200 along the top view (Y-direction) parallel to the first generatrix direction, the focusing ring includes：
Ring body 200, the ring body 200 include the first opposite face and the second face and positioned at the first face and the second face it
Between the first cylinder 201 and the second cylinder 202, and the both sides of first cylinder, 201 and second cylinder 202 respectively with the first face
It is connected with the second face, first cylinder 201 is parallel with the busbar of the second cylinder 202；
Opening 210 in the ring body 200, the opening 210 extend to the second face, and the opening from the first face
210 are through to the second cylinder 202 from the first cylinder 201；
The ring body 200 in the plane perpendicular to 201 or second cylinder of the first cylinder, 202 busbar there is ring body to throw
Shadow figure, and the ring body is projected as closed ring.
In use, the electromagnetic field of 200 near zone of ring body is oriented parallel to described first to the focusing ring
The busbar of cylinder 201.Projecting figure of the ring body 200 in the plane perpendicular to first cylinder 201 is closed ring,
Then it is described opening 210 near electromagnetic field intensity and the intensity difference of other areas adjacent electromagnetic fields of ring body 200 it is smaller, then when
Respectively when 210 side walls of the opening apply different potentials, there is the region of electric current perpendicular to described the in the ring body 200
Projecting figure in the plane of one cylinder 201 is also the annular of closing, then the electromagnetic field intensity near the opening 210 with it is described
The intensity difference of other areas adjacent electromagnetic fields of ring body 200 is smaller, so that the electromagnetic field point that the electric current in the focusing ring generates
Cloth is more uniform, and then makes the focusing ring more uniform to the convergence effect of sputtering particle.Therefore, formed by the focusing ring
Film thickness is more uniform.
The opening 210 includes：First port 213 and second port 214, the first port 213 are located at described first
In face, the second port 214 is located in second face.
In the present embodiment, the first port 213 has first in the plane perpendicular to 201 busbar of the first cylinder
Projecting figure, the second port 214 have the second projecting figure in the plane perpendicular to 201 busbar of the first cylinder,
First projecting figure and the second projecting figure neck connect or are not overlapped, then the ring body 200 is perpendicular to first cylinder
Annular projection's figure in 201 plane is closed ring.
In the present embodiment, the material of the ring body 200 is titanium.In other embodiments, the material of the ring body can be with
For tantalum.
In the present embodiment, the ring body 200 further includes first end face 211 and second end positioned at 210 side walls of the opening
Face 212.
In the present embodiment, the first end face 211 and second end face 212 are plane, the first end face 211 and described the
The busbar of one cylinder 201 has the first acute angle；The busbar of the second end face 212 and first cylinder 201 has the
Two acute angles.
In the present embodiment, the first end face 211 is parallel with the second end face 212.In other embodiments, described
End face can not also be parallel with second end face.
In the present embodiment, if the first end face 211 and the acute angle of 201 busbar of the first cylinder are too small, no
Easily make first end face 211 and the contact projection of the second end face 212 in the plane perpendicular to 201 busbar of the first cylinder；
If the first end face 211 and the acute angle of 201 busbar of the first cylinder are excessive, the opening 210 along described first
Cylinder 201 and the size on 211 intersection direction of first end face are larger, so as to easily increase the electricity that the 210 pairs of focusing rings that are open generate
The influence in magnetic field.Specifically, in the present embodiment, first acute angle is 60 °~70 °；It is described that the second acute angle is
60 °~70 °.
In the present embodiment, size of the ring body 200 on 201 generatrix direction of the first cylinder is 45mm~55mm,
For example, 50.8mm.
If the first end face 211 and the distance between second end face 212 are excessive, easily increase by 210 pairs of institute's shapes of opening
Into the influence of electromagnetic field, increase the inhomogeneities for forming electromagnetic field；If the first end face 211 and second end face 212 it
Between distance it is too small, the first end face 211 is easily made to be contacted with second end face 212, so as to easily making the first end face 211
It leaks electricity between second end face 212.Specifically, in the present embodiment, between the first end face 211 and second end face 212
Distance for 5.7mm~7mm, such as 6.35mm.
In the present embodiment, the ring body 200 is annulus, and the outer diameter of the ring body 200 is 260mm~300mm, such as
287mm；The internal diameter of the ring body is 200mm~240mm.
In the present embodiment, the center overlapping of axles of 201 and second cylinder 202 of the first cylinder, and first cylinder 201
Wheelbase to the center is arrived from more than second cylinder 202 with a distance from the central shaft.
The focusing ring further includes：Boss (not shown) positioned at 200 first cylinder of ring body, 211 surface.
The boss is used to that the ring body ring 200 to be fixed.
In the present embodiment, the focusing ring further includes：Positioned at the decorative pattern of second spherocylindrical surface of ring body.The decorative pattern is used
In the coefficient of friction for increasing by second cylinder 212, so as to increase suction-operated of the ring body 200 to sputtering particle, so as to reduce
Pollution of the particle to sputtering chamber of substrate is not reached.
It should be noted that in the present embodiment, the opening two side is plane, in other embodiments, the opening
Side wall can also be curved surface.
Fig. 5 is refer to, is the structure diagram of another embodiment of focusing ring of the present invention.
Fig. 5 is identical with the view direction of Fig. 4.The something in common of focusing ring shown in focusing ring and Fig. 1 to Fig. 4 shown in Fig. 5
This will not be repeated here, and difference includes：The first end face 301 and second end face 302 can also be curved surface, for example, described
First end face 301 and second end face 302 are cylindrical surface, and the intersection of the first end face 301 and first cylinder is parallel to institute
State the busbar of first end face 301, the intersection of the second end face 302 and first cylinder is parallel to the second end face 301
Busbar.
Fig. 6 is the structure diagram of the another embodiment of focusing ring of the present invention.
Fig. 6 is refer to, the view direction of Fig. 6 is identical with the view direction of Fig. 3.
This will not be repeated here to the something in common of focusing ring shown in Fig. 4 by the focusing ring and Fig. 2, the difference is that：
Fig. 6 is refer to, the first end face 221 has groove, and the second end face 222 has protrusion.
In the present embodiment, the cam surface surrounds the opening 220 with the recess sidewall surface.
In the present embodiment, the recess sidewall surface is cylindrical surface, and the busbar on the recess sidewall surface is perpendicular to institute
State the first segment of a cylinder.The cam surface is cylindrical surface, and the busbar of the protrusion side wall is perpendicular to first cylinder
Busbar.
Fig. 7 is the structure diagram of the focusing ring fourth embodiment of the present invention.
Fig. 7 is refer to, the view direction of Fig. 7 is identical with the view direction of Fig. 3.
In the present embodiment, the something in common of the focusing ring and the focusing ring shown in Fig. 6 does not repeat herein, difference
Place, is：
Fig. 7 is refer to, the protrusion includes：The first side 241 of interconnection and second side 242；The groove
Side wall includes：The 3rd side 251 and the 4th side 252 being connected with each other.
In the present embodiment, the first side 241, second side 242, the 3rd side 251 and the 4th side 252 are flat
Face.In other embodiments, the first side, second side, the 3rd side and the 4th side can also be cylindrical surface, described
First side, second side, the 3rd side and the busbar of the 4th side are respectively parallel to first side, second side, the 3rd side
Face, the 4th side and the intersection of first cylinder.
In the present embodiment, the intersection of the first side 241 and second side 242 and the busbar of first cylinder hang down
Directly；The intersection of 3rd side 251 and the 4th side 252 is vertical with the busbar of first cylinder.
In the present embodiment, the first side 241 is parallel with the 3rd side 251, the second side 242 with it is described
4th side 252 is parallel.In other embodiments, first side can be not parallel with the 3rd side, the second side
It can not also be parallel with the 4th side.
To sum up, in focusing ring provided in an embodiment of the present invention, the focusing ring in use, the ring body nearby area
The electromagnetic field in domain is oriented parallel to the busbar of first cylinder.The ring body is in the plane perpendicular to first cylinder
Projecting figure is closed ring, then when the opening sidewalls apply different potentials, having electric current in the focusing ring respectively
Projecting figure of the region in the plane perpendicular to first cylinder be also the annular of closing, then the electricity near the opening
The intensity difference of other areas adjacent electromagnetic fields of magnetic field intensity with the ring body is smaller, so that the electric current in the focusing ring generates
Magnetic distribution it is more uniform, and then make the focusing ring more uniform to the convergence of sputtering particle effect.Therefore, by described poly-
The film thickness that burnt ring is formed is more uniform.
Fig. 8 is the structure diagram of one embodiment of method of work of the focusing ring of the present invention.
Fig. 8 is refer to, provides target 310, substrate 320 and focusing ring 400, the target 310 includes sputter face, described
Substrate 320 includes coated surface.
In the present embodiment, the structure of the focusing ring 400 is identical with the structure of the focusing ring shown in Fig. 2 to 4, does not do herein
It repeats.
With continued reference to Fig. 8, make the coated surface opposite with the sputter face；Make the coated surface opposite with the sputter face
Afterwards, the focusing ring 400 is placed between the target 310 and substrate 320, the mother of the first cylinder of the focusing ring 400
Line is vertical with the sputter face.
With continued reference to Fig. 8, after the focusing ring 400 is placed between the target 310 and substrate 320, respectively to institute
It states opening sidewalls and applies different current potentials.
The opening sidewalls are applied with different current potentials, so that electric current is generated in 400 ring body of the focusing ring, it is described poly-
In use, the electromagnetic field of the ring body near zone is oriented parallel to the busbar of first cylinder to burnt ring 400.It is described
Projecting figure of the ring body in the plane perpendicular to first cylinder is closed ring, then applies not when in the opening sidewalls
With current potential when, there is in the ring body projecting figure of the region of electric current in the plane perpendicular to first cylinder to be also
The annular of closing, then the intensity difference of electromagnetic field intensity Yu the ring body other areas adjacent electromagnetic fields near the opening compared with
It is small, so that the magnetic distribution that the electric current in the ring body generates is more uniform, and then make the focusing ring 400 to sputtering particle
Convergence effect it is more uniform.Therefore, the film thickness formed by the focusing ring 400 is more uniform.
It is ac potential to the current potential that the opening sidewalls apply, so that the electric current in the ring body is alternating current,
So as to form electromagnetic field around the ring body.
With continued reference to Fig. 8, after the focusing ring 400 is placed between the target 310 and substrate 320, make the target
Material 310 sputters sputtering particle, and the sputtering particle is made to reach the substrate 320 through the focusing ring 400.
In the present embodiment, bombard the target 310 by using energetic particle beam, make atom in the target 310 or
Molecule sputters out, and forms sputtering particle.It is converged under the action of the electromagnetic field that the sputtering particle is generated in the focusing ring 400
It is poly-, reach 320 surface of substrate.The part plasma sputter for reaching 320 surface of substrate is attached to the substrate film coating face；
Reach the part plasma sputter on 320 surface of substrate and focusing ring 400 be emitted back towards by 320 backwash of substrate, formed reverse sputtering from
Son.It is accumulated under the action of the magnetic field that the reverse sputtering ion is generated in focusing ring 400 to the substrate film coating face.
In the present embodiment, after the opening sidewalls are applied with different current potentials, the target 310 is made to sputter sputtering grain
Son.
In the present embodiment, since the magnetic distribution of the focusing ring 400 is than more uniform, so as to the sputtering particle
Convergence effect is more uniform, and then makes the thickness ratio for the film to be formed more uniform.
In the present embodiment, respectively the opening sidewalls are applied with different current potentials, makes to generate electric current in the ring body.It is described
Projecting figure of the ring body in the plane perpendicular to first cylinder is closed ring, then when being applied respectively in the opening sidewalls
When adding different potentials, projecting figure of the region with electric current in the plane perpendicular to first cylinder in the ring body
For the annular of closing, then the intensity difference of electromagnetic field intensity Yu the ring body other areas adjacent electromagnetic fields near the opening compared with
It is small, so that the magnetic distribution that the electric current in the focusing ring generates is more uniform, and then make the focusing ring to sputtering particle
Convergence effect it is more uniform.Therefore, the film thickness formed by the focusing ring is more uniform.
To sum up, in the method for work of gathering ring provided in an embodiment of the present invention, the opening sidewalls are applied respectively different
Current potential, make to generate electric current in the ring body, the focusing ring in use, the electromagnetic field side of the ring body near zone
To the busbar parallel to first cylinder.Projecting figure of the ring body in the plane perpendicular to first cylinder is envelope
Closed-loop shaped, then when the region when the opening sidewalls apply different potentials, in the ring body respectively with electric current perpendicular to
Projecting figure in the plane of first cylinder is also the annular of closing, then the electromagnetic field intensity near the opening with it is described
The intensity difference of other areas adjacent electromagnetic fields of ring body is smaller so that the magnetic distribution that generates of electric current in the focusing ring compared with
Uniformly, and then make the focusing ring more uniform to the convergence effect of sputtering particle.Therefore, the film formed by the focusing ring
Thickness is more uniform.
Although present disclosure is as above, present invention is not limited to this.Any those skilled in the art are not departing from this
It in the spirit and scope of invention, can make various changes or modifications, therefore protection scope of the present invention should be with claim institute
Subject to the scope of restriction.
Claims (19)
1. a kind of focusing ring, which is characterized in that including：
Ring body, the ring body include the first opposite face and the second face and the first column between the first face and the second face
Face and the second cylinder, and the both sides of first cylinder and the second cylinder are connected respectively with the first face and the second face, described first
The busbar of cylinder and the second cylinder is parallel；
Opening in the ring body, the opening extends to the second face from the first face, and the opening is passed through from the first cylinder
It wears to the second cylinder；
The ring body has ring body projecting figure in the plane perpendicular to first cylinder or the second segment of a cylinder, and described
Ring body is projected as closed ring.
2. focusing ring as described in claim 1, which is characterized in that the ring body further includes：Positioned at the of the opening sidewalls
End face and second end face.
3. focusing ring as claimed in claim 2, which is characterized in that the first end face and second end face are plane, described the
End face and first segment of a cylinder have the first acute angle, and the second end face and first segment of a cylinder have the
Two acute angles.
4. focusing ring as claimed in claim 3, which is characterized in that the first end face is parallel with the second end face.
5. focusing ring as claimed in claim 4, which is characterized in that first acute angle be 60 °~70 °, described second
Acute angle is 60 °~70 °.
6. focusing ring as claimed in claim 4, which is characterized in that the distance between the first end face and second end face are
5.7mm~7mm.
7. focusing ring as claimed in claim 2, which is characterized in that the first end face and second end face are cylindrical surface, described
The intersection of first end face and first cylinder is parallel to the busbar of the first end face, the second end face and first column
The intersection in face is parallel to the busbar of second end face.
8. focusing ring as claimed in claim 2, which is characterized in that the first end face has groove；The second end mask
There is protrusion.
9. focusing ring as claimed in claim 8, which is characterized in that the recess sidewall surface be cylindrical surface, the groove side
The busbar of wall is perpendicular to first segment of a cylinder；The cam surface be cylindrical surface, the mother of the protrusion sidewall surfaces
Line is perpendicular to first segment of a cylinder.
10. focusing ring as claimed in claim 8, which is characterized in that the protrusion includes：The first side of interconnection and
Second side；The recess sidewall includes：The 3rd side and the 4th side being connected with each other.
11. focusing ring as claimed in claim 10, which is characterized in that the first side, second side, the 3rd side and
Four sides are plane；
The first side is parallel with the 3rd side；The second side is parallel with the 4th side.
12. focusing ring as described in claim 1, which is characterized in that the ring body is along the first segment of a cylinder direction
Size is 45mm~55mm.
13. focusing ring as described in claim 1, which is characterized in that the ring body is torus, and the outer diameter of the ring body is
260mm~300mm；The internal diameter of the ring body is 200mm~240mm.
14. focusing ring as described in claim 1, which is characterized in that the material of the ring body is tantalum or titanium.
15. focusing ring as described in claim 1, which is characterized in that the center overlapping of axles of first cylinder and the second cylinder,
And first cylinder to the center wheelbase with a distance from more than second cylinder to the central shaft.
16. focusing ring as claimed in claim 15, which is characterized in that second spherocylindrical surface has decorative pattern.
17. focusing ring as claimed in claim 15, which is characterized in that, the focusing ring further includes：Positioned at the ring body first
The boss of spherocylindrical surface.
18. a kind of method of work of focusing ring, which is characterized in that including：
There is provided target, substrate and the focusing ring as described in claim 1 to 17 any one claim, the target includes
Sputter face, the substrate include coated surface；
Make the coated surface opposite with the sputter face；
After making the coated surface opposite with the sputter face, the focusing ring is placed between the target and substrate, it is described
The busbar of first cylinder of focusing ring is vertical with the sputter face；
After the focusing ring is placed between the target and substrate, respectively the opening sidewalls are applied with different current potentials；
After the focusing ring is placed between the target and substrate, the target as sputter is made to go out sputtering particle, and made described
Sputtering particle reaches the substrate through the focusing ring.
19. the method for work of focusing ring as claimed in claim 18, which is characterized in that the opening sidewalls are applied different
After current potential, the target as sputter is made to go out sputtering particle.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611012477.7A CN108070833B (en) | 2016-11-17 | 2016-11-17 | Focusing ring and working method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611012477.7A CN108070833B (en) | 2016-11-17 | 2016-11-17 | Focusing ring and working method thereof |
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| CN108070833A true CN108070833A (en) | 2018-05-25 |
| CN108070833B CN108070833B (en) | 2019-12-13 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101565819A (en) * | 2009-06-04 | 2009-10-28 | 西北稀有金属材料研究院 | Magnetic controlled sputtering ring |
| CN104561912A (en) * | 2013-10-15 | 2015-04-29 | 宁波江丰电子材料股份有限公司 | Production method of titanium focus ring |
| US20160312891A1 (en) * | 2015-04-22 | 2016-10-27 | Federal-Mogul Corporation | Coated sliding element |
-
2016
- 2016-11-17 CN CN201611012477.7A patent/CN108070833B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101565819A (en) * | 2009-06-04 | 2009-10-28 | 西北稀有金属材料研究院 | Magnetic controlled sputtering ring |
| CN104561912A (en) * | 2013-10-15 | 2015-04-29 | 宁波江丰电子材料股份有限公司 | Production method of titanium focus ring |
| US20160312891A1 (en) * | 2015-04-22 | 2016-10-27 | Federal-Mogul Corporation | Coated sliding element |
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|---|---|
| CN108070833B (en) | 2019-12-13 |
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