CN1080670A - Non metal electroplate process - Google Patents
Non metal electroplate process Download PDFInfo
- Publication number
- CN1080670A CN1080670A CN92105061.5A CN92105061A CN1080670A CN 1080670 A CN1080670 A CN 1080670A CN 92105061 A CN92105061 A CN 92105061A CN 1080670 A CN1080670 A CN 1080670A
- Authority
- CN
- China
- Prior art keywords
- metal
- non metal
- electroplate process
- square decimeter
- electroplate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
Abstract
The present invention be a kind of can be successfully at the power on novel electroplating technology of metals such as copper facing, silver, gold of various non-metallic material material products.It is to adopt to apply one deck anticorrosive adhesive on a kind of on-metallic article earlier, and coated with conductive coating makes product surface form one deck conductive layer again, directly carries out electric plating method then.It can greatly widen the field of using of electroplating at enterprising electroplatings of various on-metallic articles such as various plastics, pottery, gypsum, mud pottery, cement, brick and tile, stone, rostones.
Description
The present invention relates to a kind of novel on non-metallic material the technology of plated metal.
Because the various in style and low price of non-metallic material, thereby people have done big quantity research to its electroplating technology.But at present only can be on limited several non-metallic material such as ABS plastic, acetal plastic, glass reinforced plastic plated metal, and complex process generally need be carried out steps such as degreasing, alligatoring, sensitization, activation, dispergation, electroless plating, preplating, plating.Japan has introduced in the clear 55-79871 patent with carbon particulate or silver, copper, nickel powder organic binder bond, ORGANIC SOLVENT MIXTURES and has formed mobile suspension; be coated in and form conductive layer on the non-metallic material; carry out electric plating method then; in addition; introduce a kind of waterproof paint and electrically conducting coating of on non-metallic material, applying in the flat 1-301882 patent of Japan, carried out electric plating method after the drying again.Existing problem is in the above-described processing method, electrically conducting coating is difficult to all have good sticking power with various non-metallic material, thereby can not guarantee to plate out good metal coating various nonmetal powering on, the anti-plating bath erosion of its water-proof coating is not strong in addition, requirement just increases an electrode when electroplating area above the 3-5 square decimeter.
The objective of the invention is to provides a kind of can powering at most non-metal material surfaces to plate the processing method of good metal at the deficiency in the above technology, and method is simple, and cost is lower.
The objective of the invention is to reach by following measure, its non metal electroplate process step is: precoating waterproof glue against corrosion on non-metallic material, at this coated with conductive coating again above glue-line, use the diluted acid activation treatment after dry, and carry out Metal plating again.
The present invention is described in further detail below with reference to embodiment.
Example 1, copper facing, gold-plated on rostone (mixtures of a spot of resin and finely powdered non-metallic material such as a large amount of talcum powder or cement) goods.
Earlier product surface is sprayed last layer waterproof glue against corrosion.Resist and cover the mixture that waterproof glue is a kind of styrenic polymer and solvent, at its conductive coating spray during complete drying not, this coating is the mixture of styrenic polymer, solvent and fine copper powder, under 50 ℃ of conditions dry 20 minutes afterwards, the mixing solutions activation treatment that 3% sulfuric acid and a small amount of washing composition are arranged after the cooling again, the copper facing of washing back is to electroplate 30 minutes under 3 square decimeters the condition in current density, and is gold-plated then.
Example 2, in the stronger non-metallic material of water-absorbent, as carrying out acid bright copper plating on the plastering, imitative old.
Earlier with three times waterproof glues against corrosion of its goods dip-coating, its prescription is the same with example 1, conductive coating spray then, and its prescription is consistent with example 1.Oven dry is 40 minutes under 60 ℃ of conditions, directly carries out acid bright copper plating after the cooling, and its electroplating technology is all consistent with example 1.
More than goods among two embodiment when Metal plating, electroplate area below the 10-15 square decimeter, can adopt an electrode, greater than the 10-15 square decimeter, every increases 10-15 square decimeter needs anode contact of increase.
Claims (4)
1, a kind of non metal electroplate process is characterized in that; Precoating waterproof glue against corrosion on non-metallic material at this coated with conductive coating again above glue-line, is used the diluted acid activation treatment after dry, carries out Metal plating again.
2, non metal electroplate process according to claim 1 is characterized in that: waterproof glue against corrosion is the mixture of styrenic polymer, solvent.
3, non metal electroplate process according to claim 1 is characterized in that: electrically conducting coating is a styrenic polymer, the mixture of solvent and fine copper powder.
4, non metal electroplate process according to claim 1 is characterized in that: during Metal plating, electroplate area below the 10-15 square decimeter, can adopt an electrode, greater than the 10-15 square decimeter, every increase 10-15 square decimeter needs to increase an anode contact.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN92105061.5A CN1029413C (en) | 1992-06-26 | 1992-06-26 | Non metal electroplate process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN92105061.5A CN1029413C (en) | 1992-06-26 | 1992-06-26 | Non metal electroplate process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1080670A true CN1080670A (en) | 1994-01-12 |
| CN1029413C CN1029413C (en) | 1995-08-02 |
Family
ID=4941161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN92105061.5A Expired - Fee Related CN1029413C (en) | 1992-06-26 | 1992-06-26 | Non metal electroplate process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1029413C (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1860258B (en) * | 2003-08-21 | 2010-06-16 | 株式会社秀峰 | Method of preparing printed or daubed image and printed or daubed image element by it |
| CN102127764A (en) * | 2011-01-28 | 2011-07-20 | 厦门建霖工业有限公司 | Method for implementing semi-dry plating on surface of plastic substrate |
| CN103029373A (en) * | 2011-09-30 | 2013-04-10 | 孙宝春 | Stone with functional thin film layer and manufacturing method thereof |
| CN103952736A (en) * | 2014-05-14 | 2014-07-30 | 石家庄东方紫铜浮雕工艺品有限公司 | Electroplating process for redwood screen base |
| CN105219202A (en) * | 2015-09-15 | 2016-01-06 | 熊平伟 | For the conductive resin of non-metal electroplating and the mould made thereof and electro-plating method thereof |
| CN108221017A (en) * | 2018-03-02 | 2018-06-29 | 张磊 | A kind of non-metallic process product and electroplating manufacturing process |
| CN113645825A (en) * | 2021-08-11 | 2021-11-12 | 中国电子科技集团公司第十四研究所 | Preparation method of electromagnetic shielding composite film based on non-metallic material |
-
1992
- 1992-06-26 CN CN92105061.5A patent/CN1029413C/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1860258B (en) * | 2003-08-21 | 2010-06-16 | 株式会社秀峰 | Method of preparing printed or daubed image and printed or daubed image element by it |
| CN102127764A (en) * | 2011-01-28 | 2011-07-20 | 厦门建霖工业有限公司 | Method for implementing semi-dry plating on surface of plastic substrate |
| CN102127764B (en) * | 2011-01-28 | 2013-03-27 | 厦门建霖工业有限公司 | Method for implementing semi-dry plating on surface of plastic substrate |
| CN103029373A (en) * | 2011-09-30 | 2013-04-10 | 孙宝春 | Stone with functional thin film layer and manufacturing method thereof |
| CN103952736A (en) * | 2014-05-14 | 2014-07-30 | 石家庄东方紫铜浮雕工艺品有限公司 | Electroplating process for redwood screen base |
| CN105219202A (en) * | 2015-09-15 | 2016-01-06 | 熊平伟 | For the conductive resin of non-metal electroplating and the mould made thereof and electro-plating method thereof |
| CN108221017A (en) * | 2018-03-02 | 2018-06-29 | 张磊 | A kind of non-metallic process product and electroplating manufacturing process |
| CN113645825A (en) * | 2021-08-11 | 2021-11-12 | 中国电子科技集团公司第十四研究所 | Preparation method of electromagnetic shielding composite film based on non-metallic material |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1029413C (en) | 1995-08-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C15 | Extension of patent right duration from 15 to 20 years for appl. with date before 31.12.1992 and still valid on 11.12.2001 (patent law change 1993) | ||
| OR01 | Other related matters | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |