CN108062498A - Identification of fingerprint module and its manufacturing method - Google Patents
Identification of fingerprint module and its manufacturing method Download PDFInfo
- Publication number
- CN108062498A CN108062498A CN201610979528.7A CN201610979528A CN108062498A CN 108062498 A CN108062498 A CN 108062498A CN 201610979528 A CN201610979528 A CN 201610979528A CN 108062498 A CN108062498 A CN 108062498A
- Authority
- CN
- China
- Prior art keywords
- ultraviolet light
- identification
- fingerprint
- color ink
- coining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
Abstract
The disclosure provides a kind of identification of fingerprint module and its manufacturing method, which includes a color ink layer of a fingerprint sensor and embossed processing procedure.The manufacturing method comprises the following steps：(a) fingerprint sensor is provided, which has a sensor chip and encapsulate an encapsulated layer of the sensor chip；(b) ink material is coated on the encapsulated layer, and forms the color ink layer；(c) coining is performed to the color ink layer with a coining tool, a upper surface of the color ink layer is made to form one first high finish surface；And (d) implements Baking out or ultraviolet light exposure to the color ink layer, so that the color ink layer hardens.
Description
Technical field
This disclosure relates to a kind of identification of fingerprint module and its manufacturing method, a kind of particularly fingerprint with high finish surface is distinguished
Know module and its manufacturing method.
Background technology
With the development of science and technology, there are more and more electronic devices to be configured with identification of fingerprint module at present, and pass through fingerprint
Identification module performs unlock.Identification of fingerprint module has a contact area and a fingerprint sensor, in a user in finger
When head presses on the finger contact area, fingerprint sensor can detect the finger fingerprint positioned at contact area.
Tradition is that the contact area of identification of fingerprint module is formed in a manner of spraying, however, being had no in a manner of spraying
Method well controls the smoothness and thickness of the contact area, and smoothness not enough then shows coarse, influences beauty, and sprays out
Thickness is blocked up and influences fingerprint detection accuracy.It is identified in addition, can not also be formed using the mode of spraying in the contact area.Cause
This, the space that existing identification of fingerprint module still there is a need to improve.
The content of the invention
The main purpose of the disclosure is to provide a kind of identification of fingerprint module and its manufacturing method, by imprinting process and shape
Into smooth high finish surface, and the accuracy of identification of fingerprint module can be improved.
The one of the disclosure preferably implements concept, is to provide a kind of manufacturing method of identification of fingerprint module, including following step
Suddenly：
(a) fingerprint sensor is provided, which has a substrate, one be arranged on the substrate sensing core
Piece and the encapsulated layer for encapsulating the sensor chip；
(b) ink material is coated on the encapsulated layer, and forms a color ink layer；
(c) coining is performed to the color ink layer with a coining tool, a upper surface of the color ink layer is made to form one
First high finish surface；And
(d) Baking out or ultraviolet light exposure are implemented to the color ink layer, so that the color ink layer hardens.
In a preferred embodiment, following step is also included after step (d)：
(e) a ultraviolet light photopolymerization resin material is coated on the color ink layer, and forms a ultraviolet light photopolymerization resin bed；
(f) coining is performed to the ultraviolet light photopolymerization resin bed with the coining tool, on make ultraviolet light photopolymerization resin bed one
Surface is formed as one second high finish surface；And
(g) ultraviolet light exposure is implemented to the ultraviolet light photopolymerization resin bed, so that the ultraviolet light photopolymerization resin bed hardens.
In a preferred embodiment, following step is also included after step (d)：
(d ') is coated with an anti-fingerprint plated film in first high finish surface of the color ink layer.
In a preferred embodiment, following step is also included after step (g)：
(g ') is coated with an anti-fingerprint plated film in second high finish surface of the ultraviolet light photopolymerization resin bed.
In a preferred embodiment, the thickness range of the fingerprint sensor is between 15-30 microns, the ultraviolet light photopolymerization tree
The thickness range of lipid layer is between 10-15 microns, and the thickness range of the anti-fingerprint plated film is between 1-3 microns.
In a preferred embodiment, in step (c), which has a stamping surface, which is disk
One of one shiny surface, a figure line face or portion smooth part figure line composite surface, in the coining tool to the color ink layer
When the upper surface performs coining, the stamping surface of the coining tool is moulding to the upper surface of the color ink layer simultaneously.
In a preferred embodiment, in step (f), which has a stamping surface, which is disk
One composite surface of one shiny surface, a figure line face or portion smooth part figure line, in the coining tool to the ultraviolet light photopolymerization tree
When the upper surface of lipid layer performs coining, the stamping surface of the coining tool simultaneously to the ultraviolet light photopolymerization resin bed this on
Surface is moulding.
In a preferred embodiment, the ink material is for a light curable type ink, a thermohardening type printing ink or doped with light
One mixed type ink of curable ink and thermohardening type printing ink.
In a preferred embodiment, which is a coining wheel or a platen.
Another preferable implementation concept of the disclosure, is to provide a kind of identification of fingerprint module, including：
One fingerprint sensor, has a substrate, a sensor chip and an encapsulated layer, which is located at the substrate
On, and the encapsulated layer encapsulates the substrate and the sensor chip；And
One color ink layer, is coated on the encapsulated layer, which makes the color oily due to receiving coining processing
Layer of ink has one first high finish surface.
In a preferred embodiment, which further includes an anti-fingerprint plated film, is coated on the color ink layer
First high finish surface.
In a preferred embodiment, which further includes a ultraviolet light photopolymerization resin bed, the ultraviolet light photopolymerization
Resin bed is coated on the color ink layer, and the ultraviolet light photopolymerization resin bed makes the ultraviolet light photopolymerization because receiving when coining is handled
Resin bed has one second high finish surface.
In a preferred embodiment, which further includes an anti-fingerprint plated film, is coated on the ultraviolet light photopolymerization
Second high finish surface of resin bed.
In a preferred embodiment, the thickness range of the fingerprint sensor is between 15-30 microns, the ultraviolet light photopolymerization tree
The thickness range of lipid layer is between 10-15 microns, and the thickness range of the anti-fingerprint plated film is between 1-3 microns.
Description of the drawings
Fig. 1 is the manufacturing method of disclosure identification of fingerprint module.
Fig. 2A is the diagrammatic cross-section of the fingerprint sensor of disclosure identification of fingerprint module.
Fig. 2 B are the diagrammatic cross-section of one color ink layer of coating above the fingerprint sensor of disclosure identification of fingerprint module.
Fig. 2 C are the diagrammatic cross-section that disclosure identification of fingerprint module is not yet performed coining by a coining tool.
Fig. 2 D are that the color ink layer of disclosure identification of fingerprint module is just shown by the section of coining tool execution coining
It is intended to.
Fig. 2 E are that the color ink layer of disclosure identification of fingerprint module is just being baked the section of heating or ultraviolet light exposure
Schematic diagram.
Fig. 2 F are that the color ink layer of disclosure identification of fingerprint module has disengaged from the diagrammatic cross-section of the coining tool.
Fig. 3 A are that cuing open for a ultraviolet light photopolymerization resin bed is coated with above the color ink layer of disclosure identification of fingerprint module
Face schematic diagram.
Fig. 3 B are the diagrammatic cross-section that disclosure identification of fingerprint module is not yet performed coining by a coining tool.
Fig. 3 C are that the ultraviolet light photopolymerization resin bed of disclosure identification of fingerprint module just performs coining by the coining tool
Diagrammatic cross-section.
Fig. 3 D are that the color ink layer of disclosure identification of fingerprint module is just being baked the section of heating or ultraviolet light exposure
Schematic diagram.
Fig. 3 E are that the section that the ultraviolet light photopolymerization resin bed of disclosure identification of fingerprint module has disengaged from the coining tool shows
It is intended to.
Fig. 3 F are that the ultraviolet light photopolymerization resin bed of disclosure identification of fingerprint module is coated with anti-fingerprint plated film diagrammatic cross-section.
Fig. 4 A are the section signal that disclosure identification of fingerprint module includes color ink layer and ultraviolet light photopolymerization resin bed
Figure.
Fig. 4 B are the coining work that the ultraviolet light photopolymerization resin bed of disclosure identification of fingerprint module just has figure line face by one
Tool performs the diagrammatic cross-section of coining.
Fig. 4 C are that the ultraviolet light photopolymerization resin bed of disclosure identification of fingerprint module has disengaged from the coining with figure line face
The diagrammatic cross-section of instrument.
Reference sign
1 identification of fingerprint module, 10 fingerprint sensor
101 substrate, 102 sensor chip
103 encapsulated layer, 12 color ink layer
125 first high finish surface, 14 ultraviolet light photopolymerization resin bed
145 second high finish surface, 16 anti-fingerprint plated film
9 coining tools 9 ' have the coining tool in figure line face
(a)~(g) step (a)~step (g)
Specific embodiment
Fig. 2A is the diagrammatic cross-section of the fingerprint sensor of disclosure identification of fingerprint module.As shown in Figure 2 A, the disclosure
Fingerprint sensor 10 is attached by viscose glue with a substrate 101, a sensor chip 102 and an encapsulated layer 103, sensor chip 102
It on the substrate 101, is electrically connected with each other as between sensor chip 102 and substrate 101 by a routing.Encapsulated layer 103 is also
It is arranged on substrate 101, and encapsulated layer 103 encapsulates sensor chip 102 in substrate 101, wherein, encapsulated layer 103, which is preferably one, to be made
With epoxy moldable resin (Epoxy Molding Compound；EMC) material is designed with the encapsulation that etching technique is made, but
A limitation is not made.
Fig. 1 is the manufacturing method of disclosure identification of fingerprint module.Please refer to Fig. 1 to Fig. 2 E, step (a) is first carried out
The fingerprint sensor 10 such as preceding segment description is provided, fingerprint sensor 10 has substrate 101, the sensing being arranged on substrate 101
Chip 102 and the encapsulated layer 103 for encapsulating sensor chip 102.
After step (a), step (b) is performed.It please join the fingerprint that Fig. 1 and Fig. 2 B, Fig. 2 B are disclosure identification of fingerprint module 1
The diagrammatic cross-section of 10 one color ink layer 12 of top coating of sensor, in step (b), one ink material of coating is in encapsulated layer
On 103, and form a color ink layer 12.The composition of color ink layer 12 makes color ink layer doped with toner or mill base
Color possessed by 12 can substantially cover in fingerprint sensor 10, so the apperance of fingerprint sensor 10 can be avoided to appear,
And user will not be immediately seen fingerprint sensor 10.
After step (b), step (c) is performed.It please join Fig. 1, Fig. 2 C and Fig. 2 D, Fig. 2 C as disclosure identification of fingerprint module still
The diagrammatic cross-section of coining is not performed by a coining tool, Fig. 2 D are the color ink layer just quilt of disclosure identification of fingerprint module
Coining tool 9 performs the diagrammatic cross-section of coining, and in step (c), coining is performed to color ink layer 12 with coining tool 9,
Coining tool 9 belongs in Embosser the element for being responsible for that contact printing is performed with object to be pressed, and can be a coining wheel or one
Platen.The step of passing through coining a so that upper surface of the color ink layer 12 being stamped forms one first bloom (high-
Gloss) surface 125 have gloss oil sense in specular appearance without coarse as high finish surface referred herein for fineness is high
Surface.
After step (c), step (d) is performed.It please join the face that Fig. 1 and Fig. 2 E, Fig. 2 E are disclosure identification of fingerprint module
Color ink layer is just being baked the diagrammatic cross-section of heating or ultraviolet light exposure.In step (d), color ink layer 12 is implemented to dry
Roasting heating or ultraviolet light exposure, so that color ink layer 12 hardens and integral strength increase.Color ink layer 12 is solidified in hardening
It is i.e. not easily to fall off afterwards.Wherein, ink material for a light curable type ink, a thermohardening type printing ink or doped with light-cured type oil
Ink and thermohardening type printing ink a mixed type ink one of those.If ink material is the light curable type ink, with purple
Outer light performs exposure to color ink layer 12, so that color ink layer 12 hardens.If ink material is the thermohardening type printing ink,
Heating is performed to color ink layer 12 with roasting mode, so that color ink layer 12 hardens.
After step (d) terminates, coining tool 9 can depart from color ink layer 12, as shown in Figure 2 F.So far, fingerprint is distinguished
Module 1 is known in foring bloom (high-gloss) surface on color ink layer 12, and color ink layer 12 is because of embossed system
Journey and thickness itself is thinner, therefore, good function can be played when identification of fingerprint module 1 performs identification of fingerprint, identification spirit
Sensitivity can be substantially improved.
In addition, after step (d), step (d ') can also be included and be coated with an anti-fingerprint plated film (not shown) in color oil
First high finish surface 125 of layer of ink 12, thus, which the first high finish surface 125 of color ink layer 12 would not latent prints
Greasy dirt.
Fig. 3 A are that cuing open for a ultraviolet light photopolymerization resin bed is coated with above the color ink layer of disclosure identification of fingerprint module
Face schematic diagram.After completing the color ink layer 12 to the identification of fingerprint module 1 of the disclosure and imprinting, it is preferred that in color oil
One layer of protective layer with protective effect is covered in layer of ink 12 again, is not easy to grind to slow down the external force suffered by color ink layer 12
Damage.Therefore after step (d), also comprising following step.Step (e), one ultraviolet light photopolymerization resin material of coating is in the color ink
On layer 12, and a ultraviolet light photopolymerization resin bed 14 is formed, be transparent coating on surface structure.Ultraviolet light photopolymerization resin material is general
After ultraviolet light irradiation is received, physical and chemical changes can occur within the short time for also known as photosensitive resin rapidly, and then
The oligomer of crosslinking curing is made of resin monomer (monomer) and performed polymer (oligomer).
After step (e), step (f) is performed.It is disclosure identification of fingerprint module that please join Fig. 1, Fig. 3 B and Fig. 3 C, Fig. 3 B
The ultraviolet light photopolymerization resin bed is not yet stamped the diagrammatic cross-section that instrument 9 performs coining, and Fig. 3 C are disclosure identification of fingerprint mould
The ultraviolet light photopolymerization resin bed of block is just being stamped the diagrammatic cross-section that instrument 9 performs coining.In step (f), to imprint work
9 pairs of ultraviolet light photopolymerization resin beds 14 of tool perform coining, and making a upper surface of ultraviolet light photopolymerization resin bed 14, to be formed as one second high
Optical surface 145, as shown in Figure 3 C.
After step (f), step (g) is performed.It please join the face that Fig. 1 and Fig. 3 D, Fig. 3 D are disclosure identification of fingerprint module
Color ink layer is just being baked the diagrammatic cross-section of heating or ultraviolet light exposure.As shown in Figure 3D.In step (g), to ultraviolet light
Hard resin-layer 14 implements ultraviolet light exposure, so that ultraviolet light photopolymerization resin bed 14 hardens, and ultraviolet light photopolymerization resin bed 14 is then
As the outermost layer of disclosure identification of fingerprint module, and it is the transparent protective layer with high rigidity.After step (g), such as
Shown in Fig. 3 E, coining tool 9 departs from ultraviolet light photopolymerization resin bed 14.Thereby manufacturing process, disclosure identification of fingerprint module 1 is most
Outer layer has high finish surface, also has higher identification precision in addition to beauty.
In addition, after step (g), an anti-fingerprint plated film 16 also is coated in ultraviolet light photopolymerization resin bed comprising step (g ')
14 the second high finish surface 145, thus, which the second high finish surface 145 of ultraviolet light photopolymerization resin bed 14 would not be remained and referred to
Line greasy dirt.
Via the making of above-mentioned processing procedure, the thickness range of the fingerprint sensor 10 of disclosure identification of fingerprint module 1 is in 15-30
Between micron, between 10-15 microns, the thickness range of anti-fingerprint plated film exists the thickness range of the ultraviolet light photopolymerization resin bed 14
Between 1-3 microns.But this only as an example of lift rather than make one limitation.
Furthermore coining tool 9 has a stamping surface, and stamping surface is a shiny surface, a figure line face or portion smooth
One composite surface of part figure line.If stamping surface is shiny surface, the color ink layer 12 or ultraviolet light photopolymerization resin being stamped
Layer 14 is then rendered as shiny surface.If stamping surface is figure line face, the color ink layer 12 or ultraviolet light photopolymerization resin being stamped
Layer 14 is then rendered as figure line face.
As shown in Fig. 4 A~Fig. 4 C, Fig. 4 A include color ink layer and ultraviolet light photopolymerization for disclosure identification of fingerprint module
The diagrammatic cross-section of resin bed, Fig. 4 B are that the ultraviolet light photopolymerization resin bed of disclosure identification of fingerprint module just has figure line by one
The coining tool in face performs the diagrammatic cross-section of coining, and Fig. 4 C are the ultraviolet light photopolymerization resin bed of disclosure identification of fingerprint module
Have disengaged from the diagrammatic cross-section of the coining tool with figure line face.In present embodiment embodiment, by with figure line face
Coining tool 9 ' imprint color ink layer 12 or ultraviolet light photopolymerization resin bed 14 can be correspondingly formed as figure line face, the sample of figure line
Formula such as commodity sign.If stamping surface is the composite surface of portion smooth part figure line, can be shown by figure line face pressure print part
Go out commodity sign, be in shiny surface by shiny surface coining part.Therefore, identification of fingerprint module is manufactured by imprinting process, can made
Go out high finish surface and commodity sign, institute is time-consuming when manufacture is also greatly saved.
In conclusion disclosure identification of fingerprint module by imprinting process by color ink layer and ultraviolet light photopolymerization resin
High finish surface is printed off in lamination, and then with mirror effect, promotes product aesthetic feeling, simultaneously, can also pass through this imprinting process pressure
Commodity sign is printed on high finish surface.In addition, disclosure identification of fingerprint module can well control color ink by imprinting process
The thickness of layer and ultraviolet light photopolymerization resin bed, and then promote sensitivity of identification of fingerprint module when sensing.
Above-described embodiment is only that the principle of the disclosure and its technology of technique effect and the explaination disclosure is illustrated
Feature, not for the protection category of the limitation disclosure.Any those skilled in the art can be in the technology without prejudice to the disclosure
In the case of principle and spirit, it unlabored can change or the arrangement of isotropism belongs to the scope that the disclosure is advocated.Cause
This, listed by the claim that the rights protection scope of the disclosure should be as be described hereinafter.
Claims (14)
1. a kind of manufacturing method of identification of fingerprint module, comprises the following steps：
(a) provide a fingerprint sensor, the fingerprint sensor have a substrate, be arranged on the substrate a sensor chip, with
And encapsulate an encapsulated layer of the sensor chip；
(b) ink material is coated on the encapsulated layer, and forms a color ink layer；
(c) coining is performed to the color ink layer with a coining tool, a upper surface of the color ink layer is made to form one first
High finish surface；And
(d) Baking out or ultraviolet light exposure are implemented to the color ink layer, so that the color ink layer hardens.
2. the manufacturing method of identification of fingerprint module as described in claim 1, wherein also including following step after step (d)：
(e) a ultraviolet light photopolymerization resin material is coated on the color ink layer, and forms a ultraviolet light photopolymerization resin bed；
(f) coining is performed to the ultraviolet light photopolymerization resin bed with the coining tool, makes a upper surface of ultraviolet light photopolymerization resin bed
Be formed as one second high finish surface；And
(g) ultraviolet light exposure is implemented to the ultraviolet light photopolymerization resin bed, so that the ultraviolet light photopolymerization resin bed hardens.
3. the manufacturing method of identification of fingerprint module as described in claim 1, wherein also including following step after step (d)：
(d ') is coated with an anti-fingerprint plated film in first high finish surface of the color ink layer.
4. the manufacturing method of identification of fingerprint module as claimed in claim 2, wherein also including following step after step (g)：
(g ') is coated with an anti-fingerprint plated film in second high finish surface of the ultraviolet light photopolymerization resin bed.
5. the manufacturing method of identification of fingerprint module as claimed in claim 4, wherein the thickness range of the fingerprint sensor is in 15-
Between 30 microns, the thickness range of the ultraviolet light photopolymerization resin bed is between 10-15 microns, the thickness range of the anti-fingerprint plated film
Between 1-3 microns.
6. the manufacturing method of identification of fingerprint module as described in claim 1, wherein in step (c), which has
One stamping surface, the stamping surface are a composite surfaces of one shiny surface of disk, a figure line face or portion smooth part figure line, in
When the coining tool performs coining to the upper surface of the color ink layer, the stamping surface of the coining tool is simultaneously to the face
The upper surface of color ink layer is moulding.
7. the manufacturing method of identification of fingerprint module as claimed in claim 2, wherein in step (f), which has
One stamping surface, the stamping surface are a composite surfaces of one shiny surface of disk, a figure line face or portion smooth part figure line, in
When the coining tool performs coining to the upper surface of the ultraviolet light photopolymerization resin bed, the stamping surface of the coining tool is simultaneously
It is moulding to the upper surface of the ultraviolet light photopolymerization resin bed.
8. the manufacturing method of identification of fingerprint module as described in claim 1, the wherein ink material for a light curable type ink,
One thermohardening type printing ink or doped with light curable type ink and a mixed type ink of thermohardening type printing ink.
9. the manufacturing method of identification of fingerprint module as described in claim 1, the wherein coining tool are a coining wheel or a pressure
Printing forme.
10. a kind of identification of fingerprint module, including：
One fingerprint sensor has a substrate, a sensor chip and an encapsulated layer, which is located on the substrate, and
The encapsulated layer encapsulates the sensor chip；And
One color ink layer, is coated on the encapsulated layer, which makes the color ink layer because receiving when coining is handled
With one first high finish surface.
11. identification of fingerprint module as claimed in claim 10 further includes an anti-fingerprint plated film, is coated on the color ink layer
First high finish surface.
12. identification of fingerprint module as claimed in claim 10 further includes a ultraviolet light photopolymerization resin bed, the ultraviolet light photopolymerization tree
Lipid layer is coated on the color ink layer, and the ultraviolet light photopolymerization resin bed makes the ultraviolet light photopolymerization tree because receiving when coining is handled
Lipid layer has one second high finish surface.
13. identification of fingerprint module as claimed in claim 12 further includes an anti-fingerprint plated film, the ultraviolet light photopolymerization tree is coated on
Second high finish surface of lipid layer.
14. identification of fingerprint module as claimed in claim 13, wherein the thickness range of the fingerprint sensor is in 15-30 microns
Between, for the thickness range of the ultraviolet light photopolymerization resin bed between 10-15 microns, the thickness range of the anti-fingerprint plated film is micro- in 1-3
Between rice.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610979528.7A CN108062498A (en) | 2016-11-08 | 2016-11-08 | Identification of fingerprint module and its manufacturing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610979528.7A CN108062498A (en) | 2016-11-08 | 2016-11-08 | Identification of fingerprint module and its manufacturing method |
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| CN108062498A true CN108062498A (en) | 2018-05-22 |
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| US20150187707A1 (en) * | 2012-10-14 | 2015-07-02 | Synaptics Incorporated | Biometric Image Sensor Packaging and Mounting |
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