CN108054268A - A kind of spraying powder method - Google Patents
A kind of spraying powder method Download PDFInfo
- Publication number
- CN108054268A CN108054268A CN201711426379.2A CN201711426379A CN108054268A CN 108054268 A CN108054268 A CN 108054268A CN 201711426379 A CN201711426379 A CN 201711426379A CN 108054268 A CN108054268 A CN 108054268A
- Authority
- CN
- China
- Prior art keywords
- powder
- fluorophor
- chip
- nano
- chip surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Abstract
A kind of spraying powder method, including by die bond equipment chip being made to be connected and fixed to the place on line of substrate with crystal-bonding adhesive, then high temperature die bond is carried out, after nanometer yellow fluorescent powder, nano-glass micro mist, scaling powder, solvent to be made into fluorophor by powder spraying apparatus by fluorophor even application in chip surface, finally carry out hot setting.This method is compared with existing technology, it eliminates and makees fluorescence powder carrier this process using resin or silica gel, fluorophor is made by nanometer yellow fluorescent powder, nano-glass micro mist, scaling powder, solvent to be sprayed on chip surface, so can be to avoid the phenomenon that glue yellow occurs or splits glue be encapsulated under long-time hot operation, the luminous flux sustainment rate of product is high；Simultaneously as be to use powder spraying apparatus by fluorophor even application in chip surface, and Nano glass powder is combined with fluorescent powder, can so fluorophor be made closely to be covered in chip surface, improves the air-tightness of LED component.
Description
Technical field
The present invention relates to LED manufacturing fields, and in particular to a kind of spraying powder method.
Background technology
The LED of conventional package makees fluorescence powder carrier coated in blue chip surface using resin or silica gel mostly, and blue light swashs
Fluoresce powder so that white light.Glue is encapsulated under long-time hot operation to be present with aging xanthochromia and even split glue phenomenon, so as to
Cause LED failure.
The content of the invention
It can guarantee that LED component air-tightness is good, luminous flux sustainment rate is high the technical problem to be solved in the present invention is to provide one kind
Spraying powder method.
In order to solve the above-mentioned technical problem, the present invention comprises the following steps：
Crystal-bonding adhesive is located to the place on line set on substrate, by die bond equipment chip is made to be connected and fixed to crystal-bonding adhesive A,
The place on line of substrate；
B, good material admittedly is subjected to high temperature die bond；
C, nanometer yellow fluorescent powder, nano-glass micro mist, scaling powder, solvent are made into fluorophor, it then will by powder spraying apparatus
Fluorophor even application is in chip surface；
D, scaling powder and solvent is made to volatilize the material sprayed progress hot setting, nano-glass micro mist fusion nanometer yellow is glimmering
Light powder forms glass crystal curing and is bonded on chip surface.
This method is eliminated and makees fluorescence powder carrier this process using resin or silica gel, by receiving compared with existing technology
Ecru fluorescent powder, nano-glass micro mist, scaling powder, solvent are made into fluorophor to be sprayed on chip surface, so can be to avoid
The phenomenon that glue yellow occurs or splits glue is encapsulated under long-time hot operation, the luminous flux sustainment rate of product is high；Simultaneously as it is
Using powder spraying apparatus by fluorophor even application in chip surface, and Nano glass powder is combined with fluorescent powder, can so be made glimmering
Body of light is closely covered in chip surface, improves air-tightness, improves the air-tightness of LED component.
As a further improvement on the present invention, in step：The crystal-bonding adhesive is nano-silver colloid, and the chip is upside-down mounting
Chip, the surface of flip-chip is roughening structure, and the substrate is ceramic substrate.
As a further improvement on the present invention, in stepb：The temperature of high temperature die bond is 100-300 DEG C, time 2-
5min。
As a further improvement on the present invention, in step C：By nanometer yellow fluorescent powder, nano-glass micro mist, help weldering
Agent, solvent press 4：2：0.2：6 are made into fluorophor.
As a further improvement on the present invention, in step D：The temperature of hot setting is 250-300 DEG C, time 1.5-
2H。
In conclusion it is an advantage of the invention that ensure that LED component air-tightness is good, luminous flux sustainment rate is high.
Description of the drawings
It is next with reference to the accompanying drawings and detailed description that the present invention will be further described in detail.
Fig. 1 is the substrate of the present invention and flip-chip, the mutual alignment schematic diagram of fluorophor.
Fig. 2 is the flow chart of the present invention.
Specific embodiment
The present invention comprises the following steps：
Nano-silver colloid is set to the place on line set on substrate 1, by die bond equipment flip-chip 2 is made to connect with nano-silver colloid A,
It connects and is fixed on the place on line of substrate, the surface of flip-chip 2 is roughening structure, and specifically, the surface of flip-chip 2 is equipped with
Cutting groove, in the present embodiment, nano-silver colloid includes nano-silver powder, scaling powder and micro silica gel, and the content of specific silica gel is nanometer
1 the percent of solution after silver powder, scaling powder and silica gel mixing, substrate is ceramic substrate or aluminium nitride substrate or oxidation
Aluminum substrate；
B, admittedly good material being placed in progress high temperature die bond in eutectic furnace or oven, the temperature of high temperature die bond is 100-300 DEG C,
Time is 2-5min；
C, nanometer yellow fluorescent powder, nano-glass micro mist, scaling powder, solvent are pressed 4：2：0.2：6 are made into fluorophor 3, Ran Houtong
Powder spraying apparatus is crossed by fluorophor even application in flip chip surface；Wherein solvent is the organic solvent for being easy to volatilization, main to make
With being dilution, convenient for fluorescent powder jet printing；In the present embodiment, solvent is silica Anhui；
D, the material sprayed is placed in progress hot setting in eutectic furnace or oven makes scaling powder and solvent volatilize, hot setting
Temperature for 250-300 DEG C, time 1.5-2H, nano-glass micro mist fusion nanometer yellow fluorescent powder forms glass crystal and cures
It is bonded on flip chip surface.
Fig. 1 is the substrate of the present invention and flip-chip, the mutual alignment schematic diagram of fluorophor.Fig. 2 is the flow of the present invention
Figure.This method is eliminated and makees fluorescence powder carrier this process using resin or silica gel, pass through nanometer yellow compared with existing technology
Fluorescent powder, nano-glass micro mist, scaling powder, solvent are made into fluorophor to be sprayed on chip surface, so can be to avoid for a long time
The phenomenon that glue yellow occurs or splits glue is encapsulated under hot operation, the luminous flux sustainment rate of product is high；Simultaneously as it is using spray
Powder equipment is by fluorophor even application in chip surface, and Nano glass powder is combined with fluorescent powder, can so make fluorophor tight
It is close to be covered in chip surface, improve the air-tightness of LED component.
Claims (5)
1. a kind of spraying powder method, which is characterized in that comprise the following steps：
Crystal-bonding adhesive is located to the place on line set on substrate, by die bond equipment chip is made to be connected and fixed to crystal-bonding adhesive A,
The place on line of substrate；
B, good material admittedly is subjected to high temperature die bond；
C, nanometer yellow fluorescent powder, nano-glass micro mist, scaling powder, solvent are made into fluorophor, it then will by powder spraying apparatus
Fluorophor even application is in chip surface；
D, scaling powder and solvent is made to volatilize the material sprayed progress hot setting, nano-glass micro mist fusion nanometer yellow is glimmering
Light powder forms glass crystal curing and is bonded on chip surface.
2. by spraying powder method described in claim 1, it is characterised in that：In step：The crystal-bonding adhesive be nano-silver colloid, institute
Chip is stated as flip-chip, the surface of flip-chip is roughening structure, and the substrate is ceramic substrate.
3. by spraying powder method described in claim 1, it is characterised in that：In stepb：The temperature of high temperature die bond is 100-300
DEG C, time 2-5min.
4. by spraying powder method described in claim 1, it is characterised in that：In step C：By nanometer yellow fluorescent powder, nanometer glass
Glass micro mist, scaling powder, solvent press 4：2：0.2：6 are made into fluorophor.
5. by spraying powder method described in claim 1, it is characterised in that：In step D：The temperature of hot setting is 250-300
DEG C, time 1.5-2H.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711426379.2A CN108054268A (en) | 2017-12-26 | 2017-12-26 | A kind of spraying powder method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711426379.2A CN108054268A (en) | 2017-12-26 | 2017-12-26 | A kind of spraying powder method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108054268A true CN108054268A (en) | 2018-05-18 |
Family
ID=62131332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711426379.2A Pending CN108054268A (en) | 2017-12-26 | 2017-12-26 | A kind of spraying powder method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108054268A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102730980A (en) * | 2012-07-04 | 2012-10-17 | 张国生 | High-reliability and high-efficiency fluorescent glass for packaging LED (light emitting diode) and preparation method thereof |
| CN102730974A (en) * | 2012-06-08 | 2012-10-17 | 王双喜 | Slurry for preparation of glass fluorescent layer used for LED encapsulation |
| CN104882525A (en) * | 2015-06-02 | 2015-09-02 | 张国生 | White LED lamp wick with single glass substrate and manufacturing method thereof |
-
2017
- 2017-12-26 CN CN201711426379.2A patent/CN108054268A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102730974A (en) * | 2012-06-08 | 2012-10-17 | 王双喜 | Slurry for preparation of glass fluorescent layer used for LED encapsulation |
| CN102730980A (en) * | 2012-07-04 | 2012-10-17 | 张国生 | High-reliability and high-efficiency fluorescent glass for packaging LED (light emitting diode) and preparation method thereof |
| CN104882525A (en) * | 2015-06-02 | 2015-09-02 | 张国生 | White LED lamp wick with single glass substrate and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180518 |