CN108054074A - A kind of pedestal and the semiconductor processing equipment including the pedestal - Google Patents
A kind of pedestal and the semiconductor processing equipment including the pedestal Download PDFInfo
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- CN108054074A CN108054074A CN201810026173.9A CN201810026173A CN108054074A CN 108054074 A CN108054074 A CN 108054074A CN 201810026173 A CN201810026173 A CN 201810026173A CN 108054074 A CN108054074 A CN 108054074A
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- heater
- radio
- separation layer
- pedestal
- gas passage
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- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 title claims abstract description 73
- 238000012545 processing Methods 0.000 title claims abstract description 30
- 239000004065 semiconductor Substances 0.000 title claims abstract description 11
- 238000000926 separation method Methods 0.000 claims abstract description 81
- 238000002955 isolation Methods 0.000 claims abstract description 16
- 239000011810 insulating material Substances 0.000 claims abstract description 8
- 239000007789 gas Substances 0.000 claims description 49
- 238000010438 heat treatment Methods 0.000 claims description 12
- 239000011261 inert gas Substances 0.000 claims description 8
- 238000005240 physical vapour deposition Methods 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 4
- 238000005245 sintering Methods 0.000 claims description 3
- 238000007664 blowing Methods 0.000 description 24
- 238000007789 sealing Methods 0.000 description 22
- 238000000034 method Methods 0.000 description 16
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000002184 metal Substances 0.000 description 15
- 239000000498 cooling water Substances 0.000 description 13
- 239000004020 conductor Substances 0.000 description 9
- 238000001816 cooling Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- -1 Polytetrafluoroethylene Polymers 0.000 description 1
- 239000010407 anodic oxide Substances 0.000 description 1
- 238000009411 base construction Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000002320 enamel (paints) Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000011796 hollow space material Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000005619 thermoelectricity Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32568—Relative arrangement or disposition of electrodes; moving means
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
Abstract
The embodiment of the present invention provides a kind of pedestal and the semiconductor processing equipment including the pedestal.The pedestal is for carrying workpiece to be machined, and including the heater, separation layer and radio-frequency electrode being cascading, the separation layer is insulating materials, by both the heater and the radio-frequency electrode potential isolation.Heater and radio-frequency electrode potential isolation, reduce the use of wave filter in the pedestal of the embodiment of the present invention.
Description
Technical field
The embodiment of the present invention is related to a kind of pedestal and the semiconductor processing equipment including the pedestal.
Background technology
, it is necessary to use radio frequency (RF) and direct current (DC) simultaneously in hard mask (Hardmask) technique in IC manufacturing
The process environments of power supply and high temperature, so as to etch target and so that it is deposited on substrate.In 28nm techniques, generally make
It can meet process requirements with low frequency (such as 13MHz) and low pressure RF.
Now with the development of IC manufacturing industry, 14/16nm techniques have also gradually gone on the stage of history, hard
In mask field, film forming needs the density of bigger, therefore, it has to introduce very high frequency(VHF) (such as 60MHz) and hyperbar and higher
Technological temperature meet process requirements, and need on pedestal plus radio-frequency power.With the complication of hardware, add perhaps
More problems to be solved.
The content of the invention
A kind of pedestal and the semiconductor processing equipment including the pedestal are provided according to an embodiment of the invention, in pedestal
Heater and radio-frequency electrode potential isolation, so as to which heater is from the influence of radio-frequency power supply.In addition, heater and being connected thereto
Circuit can be grounded, reduce the use of wave filter in system.
A kind of pedestal is provided according to one embodiment of present invention, for carrying workpiece to be machined, wherein, the pedestal bag
Include the heater being cascading, separation layer and radio-frequency electrode, the separation layer is insulating materials, by the heater and
Both radio-frequency electrode potential isolations.
In some instances, the heater is configured as being grounded.
In some instances, first gas passage, first gas are provided between the heater and the separation layer
Body passage is connected with supply air line, and the supply air line is used to be passed through inert gas to the first gas passage；The isolation
Second gas passage is provided between layer and the radio-frequency electrode, is equipped in the separation layer by the first gas passage and institute
State the interface channel of second gas passage connection.
In some instances, it is evenly arranged on the heater face opposite with the separation layer in concentric circles distribution
A plurality of first annular groove and the first radial groove that a plurality of first annular groove is interconnected；First ring
Connected in star and first radial groove form the first gas passage.
In some instances, it is evenly arranged on the radio-frequency electrode face opposite with the separation layer and is distributed in concentric circles
A plurality of second annular groove and the second radial groove that a plurality of second annular groove is interconnected；Described second
Annular groove and second radial groove form the second gas passage.
In some instances, the contact surface palette between the heater, the separation layer and the radio-frequency electrode,
For by the inert gas seal in the first gas passage and the second gas passage.
In some instances, third gas passage, the third gas passage and air supply pipe are provided in the heater
Road connects, and the supply air line is used to be passed through inert gas to the third gas passage；Is provided in the radio-frequency electrode
Four gas passages are equipped with interface channel in the separation layer, and the third gas passage and the 4th gas passage pass through institute
Interface channel is stated to be connected.
In some instances, between the heater and the separation layer and the separation layer and the radio-frequency electrode it
Between pass through sintering or plating mode connect.
A kind of semiconductor processing equipment is provided according to another embodiment of the invention, including chamber and radio frequency source, wherein,
Pedestal described in any one of the above embodiments is provided in the cavity, and the radio frequency source is for the radio frequency electrical into the pedestal
Pole provides radio-frequency power.
In some instances, the chamber is physical vapor deposition chamber.
Description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, will simply it be situated between to the attached drawing of embodiment below
It continues, it should be apparent that, the accompanying drawings in the following description merely relates to some embodiments of the present invention rather than limitation of the present invention.
Fig. 1 is a kind of structure diagram of pedestal according to embodiments of the present invention；
Fig. 2 is the structure diagram that the back of the body blows passage in pedestal according to embodiments of the present invention；
Fig. 3 is a kind of structure diagram of semiconductor processing equipment including pedestal according to embodiments of the present invention.
Specific embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with the embodiment of the present invention
Attached drawing, the technical solution of the embodiment of the present invention is clearly and completely described.Obviously, described embodiment is this hair
Bright part of the embodiment, instead of all the embodiments.Based on described the embodiment of the present invention, ordinary skill
Personnel's all other embodiments obtained on the premise of without creative work, belong to the scope of protection of the invention.
Unless otherwise defined, the technical term or scientific terminology that the present invention uses should be tool in fields of the present invention
The ordinary meaning that the personage for having general technical ability is understood." first ", " second " and the similar word used in the present invention is simultaneously
It does not indicate that any order, quantity or importance, and is used only to distinguish different components." comprising " or "comprising" etc.
Either object covers the element or object for appearing in the word presented hereinafter to the element that similar word means to occur before the word
And its it is equivalent, and it is not excluded for other elements or object.
In a kind of processing equipment including heating pedestal, the lower electrode of heater and processing equipment is structure as a whole.It should
DC power can only be applied in processing chamber in processing equipment, there is no the isolating problem of radio frequency, overall structure is fairly simple.So
And have the demand introduced for radio-frequency power in present many processing technologys, if introducing radio frequency work(in the processing equipment
Rate, then since heater does not have bonding shell, can cause can starter below heater.
In the processing equipment that another includes heating pedestal, heating pedestal is integrated with radio frequency introducing member, so as to
To apply radio-frequency power.In addition, the introducing of cooperation radio-frequency power, is also added into separation layer and shielded layer on pedestal, to meet
Add the requirement of radio-frequency power in technique.For example, the base part of the processing equipment includes heater body (it is suspension).Separately
Outside, radio frequency lead-in, thermocouple, heater strip are all connected in heater body.Therefore, heater body end just becomes radio frequency
End, is structure as a whole with radio-frequency electrode.Radio frequency starter below chamber in order to prevent, it is also necessary to be set below heater body
Earth shield, and isolation ceramics are set between heater body and earth shield, to isolate radio-frequency head (heater body) and ground
(earth shield) prevents the build-up of luminance below chamber.In addition, in order to seal vacuum, also in heater body with isolating between ceramics
And O-ring is set between isolation ceramics and earth shield, prevent leakage in heater.Further, since O-ring is generally using elasticity
Material is made, and neighbouring O-ring is burnt when heter temperature is excessively high in order to prevent, it is also necessary to set O-ring cold near O-ring
But water route.
Above-mentioned to add the heating pedestal of radio frequency for a sandwich structure, radio-frequency electrode and heater (integral structure) is most
Upper strata.Because radio-frequency electrode, thermocouple, heater strip are all metal, therefore radio-frequency power can be disturbed by thermocouple and heater strip
Power supply and test equipment, therefore to add in wave filter.That is, the heater strip of heater, thermocouple, cooling water in pedestal
Road, radio frequency lead-in are all a current potentials, to prevent radio frequency interference, therefore all to add in wave filter at heater strip, thermocouple end,
The invisible size and cost for adding pedestal integrated box.Therefore, lower electrode (radio-frequency electrode) load in said base is complicated, adds
It is unfavorable for process control after bias (Bias).In addition, the sandwich structure in said base has two layers of sealing ring (O-ring),
There is interior danger of leaking out in installation, and one of O-ring is close to heater, there is the danger being burned out.
The embodiment of the present invention provides a kind of pedestal and the semiconductor processing equipment including the pedestal.It is real according to the present invention
The pedestal of example is applied for carrying workpiece to be machined, including the heater, separation layer and radio-frequency electrode being cascading, it is described every
Absciss layer is insulating materials, by both the heater and the radio-frequency electrode potential isolation.Due to radio-frequency electrode and heater
Potential isolation, therefore, heater can cause heater and line-to-ground connected to it from the influence of radio-frequency power supply,
So as to avoid addition wave filter.
Technical scheme is described further and illustrated below according to some embodiments of the present invention.
Embodiment one
Fig. 1 is the schematic diagram according to the heating pedestal of one embodiment of the invention.As shown in Figure 1, the base body of the pedestal
Including radio-frequency electrode 301, separation layer 302 and the heater 303 that vertical direction is cascading from the top down along figure.Radio frequency
Electrode 301 is for applying the electrode of radio-frequency power.Here electrode 301 is known as radio-frequency electrode and refers to that it can be applied in radio frequency
Power, but it is not meant to that it cannot apply other kinds of power supply or power.Separation layer 302 is insulating materials, will be heated
Device 303 and radio-frequency electrode 301 are isolated.
In some instances, which further includes from heater 303 away from the one side of separation layer 302 and stretches into pedestal sheet
The introducing circuit of the inside of body.For example, introduce circuit can be radio frequency lead-in shown in Fig. 1, back of the body blowing service,
Any one of thermocouple is several, and various circuits will be further described in more detail below.For example, introducing circuit includes
Radio frequency lead-in 306, radio frequency lead-in 306 are electrically connected through heater 303 and separation layer 302 and with radio-frequency electrode 301, with for
Radio-frequency electrode 301 provides radio-frequency power supply.Radio frequency lead-in 306 includes the rf signal line 310 of transmitting radio frequency signal, heater
303 with radio frequency lead-in 306 in 310 potential isolation of rf signal line.
In the present specification, will be referred to as introducing circuit through the electrode wires of heater 303 or pipeline.Used here as
" introducing circuit " is these connection relations and sealing means for introducing between circuits and heater for convenience of explanation.For example, such as
Fruit needs to introduce radio-frequency power, then needs to stretch into inside base body and pass through from heater 303 away from the one side of separation layer 302
Wear the radio frequency lead-in of heater 303 and separation layer 302.In addition, in order to carry out temperature survey to pedestal or other component, then also
It can include the thermocouple of measurement temperature.In order between auxiliary heater 303 and separation layer 302 and separation layer 302 and electrode
The back of the body between layer 301 needed for heat transfer blows the back of the body blowing of passage offer, then can add the back of the body blowing through heater 303
Supply air line.Certainly, introducing circuit can also be including the All other routes in addition to above-mentioned circuit.
In some instances, introduce by welded seal or close by metal seal between circuit and heater 303
Envelope.Therefore, heater can seal as a whole with introducing circuit, reduce the risk of interior leakage in pedestal, and simplify sealing knot
Structure.If for example, being sealed by metal seal, metal seal can include copper band or metal-O-ring etc..It is right
In carrying out welded seal, for example, can be welded at the lower surface of heater in the introducing circuit position adjacent with heater
It connects.It is welded it is of course also possible to introduce the circuit position adjacent with heater at two surfaces up and down of heater.
What relative position relation and connection relation between above-mentioned introducing circuit and heater 303 were merely exemplary,
The separation layer 302 being formed by insulating materials is by the basis of both heater 303 and radio-frequency electrode 301 potential isolations, lead-in
Relative position relation and connection relation between road and heater 303 can also take other any suitable schemes.
It is close between potential isolation and various introducing circuits and heater for above-mentioned rf signal line and heater
Envelope mode will be described in more detail for all parts below.
Heater
For example, heater 303 includes heater body 3031 and heater strip 3032.Heater body 3031 is, for example, metal
Plate, for example, it can be made of the good metal of heat conductivility.For example, heater body 3031 is by systems such as metallic aluminium, stainless steels
Into, but it is without being limited thereto according to an embodiment of the invention.For example, heater strip 3032 is arranged on heater body 3031 away from separation layer
302 one side.For example, the side surface of heater body 3031 can include the groove for accommodating heater strip, heater strip
3032 can be arranged in the groove of heater body 3031.However, being not restricted to this according to an embodiment of the invention, heat
Silk 3032 can also be formed at the other positions of heater body 3032, for example, it can be arranged on heater body 3031
Inside.For example, heater strip 3032 is uniformly distributed in heater body 3031, so that heater 303 is in its plane
The Temperature Distribution at each position on direction is more uniform, and the pending chip for being conducive to carry the pedestal carries out uniform
Heating.The thickness of heater body 3031 is arbitrarily selected in the case where meeting its heat transfer property and mechanical performance,
The shape and size of plane can also adjust according to actual needs and arbitrarily.For example, in order in entire radio-frequency electrode 301
The structure of side is heated, for example, on the direction of the heater body, the edge of heater body 3031 is at least
It aligns with the edge of radio-frequency electrode 301 or extends beyond the edge of radio-frequency electrode 301 in a lateral direction.
Radio-frequency electrode
Radio-frequency electrode 301 carries out the electrode of supply voltage needed for treatment process to apply, as described above, it can be applied in
Power supply include but not limited to radio-frequency power supply.For example, the electrode can be applied in DC power supply or radio-frequency power supply.Radio-frequency electrode
301 can be metal, for example, it may be aluminium, copper, gold, stainless steel etc., this is not particularly limited in the embodiment of the present invention.Separately
Outside, the top of radio-frequency electrode 301 (namely away from the one side of separation layer 302), insulating layer is also provided with, for example, pottery
Enamel coating or anodic oxide coating etc..In an embodiment according to the present invention, the radio-frequency electrode 301 is by being subsequently described in more detail
Radio frequency lead-in realizes the input of radio-frequency power supply, so as to meet the needs of the technique of needs pedestal loading radio-frequency power supply.
Separation layer
Separation layer 302 is arranged between heater 303 and radio-frequency electrode 301, for by heater 303 and radio-frequency electrode
301 are physically and electrically isolated, and therefore, load radio-frequency power supply voltage or other supply voltages in radio-frequency electrode 301
It can not be applied on heater 303.Therefore, in an embodiment according to the present invention, radio-frequency electrode 301 and heater 303 can
With potential isolation.For example, heater according to embodiments of the present invention can be configured as and connect when installing in processing
Ground so as to which several other components or circuit that are connected with heater can also be grounded, installs additional so as to avoid on partial line road
The wave filter for preventing radio-frequency power supply from disturbing.
In addition, the material of separation layer 302 is, for example, heat safe insulating materials.For example, separation layer 302 can be by ceramic shape
Into the separation layer formed by ceramic material can cause point of the heat of heater generation on the in-plane of electrode layer 301
Cloth is more uniform, so as to ensure that the uniformity of the temperature parameter at the different position of chip during the working process.
In addition, the thickness of separation layer 302 be arranged so that between electrode layer 301 and heater 303 have safe insulation away from
From.Therefore, the thickness of separation layer 302 can be calculated according to the actual conditions of equipment or technological parameter in the embodiment of the present invention
And it selects.
The connection mode between lead-in road and heater or sealing means are further described below.Such as Fig. 1 institutes
Show, the heater 303 in pedestal is in the lower section of entire base construction, as long as heater 303 can seal vacuum, then chamber is true
Sky would not be revealed, and separation layer 302 is in Chamber vacuum environment, without the concern for separation layer 302 to the close of atmospheric environment
Envelope.Therefore, between each layer in part of the heater more than 303 of pedestal, it is no longer necessary to which air is arranged with vacuum insulating in chamber
It applies, so as to avoid further avoiding elastic O when heater 303 is in high temperature using O-ring near heater
The risk that shape ring is burnt.
Radio frequency lead-in
As shown in Figure 1, coaxial line for example may be employed in radio frequency lead-in 306.For example, radio frequency lead-in 306 includes being located at
The center conductor 310 at coaxial line center, the shielded layer 312 for wrapping up center conductor 310 and positioned at center conductor 310 and shielded layer
Filler 311 between 312.Center conductor 310 can for example be made of metal with good conductivity, for example, gold, copper etc..In
Heart conductor 310 is used as rf signal line, is used for transmission radio-frequency power supply signal, radio-frequency power supply power is applied to radio-frequency electrode
301.Shielded layer 312 can be made by metal layer, be used for shielded radio frequency power supply signal, to prevent radio-frequency power supply signal to it
He generates interference by component.For example, shielded layer 312 can be configured as ground connection.Filler 311 is insulating materials, such as can be
Polytetrafluoroethylene (PTFE) or ceramics.For example, filler 311 has good insulation performance, by center conductor 310 and shielded layer
312 is insulated from each other.The material composition of above-mentioned radio frequency lead-in each several part be it is illustrative, according to an embodiment of the invention can be with
Other any suitable materials are chosen according to actual needs.In addition, for the size of coaxial line, it can be by required resistance to intensity of flow
It is obtained with required impedance computation, so as to take different relevant parameters under different application environments.For example, for radio frequency
Lead-in can control its characteristic impedance by the packing material and size of filler 311.
For example, radio frequency lead-in is stretched into away from the one side of separation layer 302 inside base body from heater 303, and pass through
It wears heater 303 and separation layer 302 and is electrically connected with radio-frequency electrode 301.For example, center conductor 310 is electrically connected with radio-frequency electrode 301
It connects, so as to provide radio-frequency power supply signal for radio-frequency electrode 301.At the surface through heater, radio frequency lead-in 306 can be with
The heater body 3031 of heater 303 is sealed.For example, the shielded layer 312 and heater body of radio frequency lead-in 306
3031 welded seals are sealed by metal seal.In this way, it not only ensure that close between radio frequency lead-in and heater
Envelope can also apply identical current potential to shielded layer and heater, for example, can be to ground connection.
In addition, the radio frequency lead-in for using coaxial line, the end away from heater 303, which is also possible to be in, to be exposed to
State in atmospheric environment.Therefore, can also be sealed in end of the radio frequency lead-in 306 away from base body.For example, radio frequency
The end of the separate base body of lead-in 306 can be sealed by copper band 304.Further, since radio frequency lead-in 306 is remote
From heater 303 farther out, sealing means are not limited to be sealed using copper band, can also for end from base body
Using other sealing means, it is sealed for example, elastic seal ring may be employed.
Carry on the back blowing service
As shown in Figure 1, there is the separation layer 302 for isolating the two between radio-frequency electrode 301 and heater 303.
In order to preferably be transmitted to the heat that heater 303 generates at radio-frequency electrode 301 and its top, according to the present invention one implements
The pedestal of example further includes interface between separation layer 302 and heater 303 and separation layer 302 and radio-frequency electrode 301
Between the back of the body of interface blow passage 309.Include for example, the back of the body blows passage 309 between separation layer 302 and heater 303
First back of the body of interface blows passage and second back of the body between separation layer 302 and radio-frequency electrode 301 blows passage.In addition, may be used also
Passage 309 is blown and through the interface channel 307 of separation layer 302 with the back of the body for including connecting above-mentioned two interface.When gas is being carried on the back
When blowing flowing in passage and interface channel, can promote the heat that heater 303 generates heater 303 and separation layer 302 it
Between and the transmission between separation layer 302 and electrode layer 301.Further, since between separation layer 302 and heater 303
The back of the body of interface between interface and separation layer 302 and radio-frequency electrode 301 blows connection of the passage by running through separation layer and leads to
Road connects, and the heat that heater 303 generates can also be transported to radio frequency by heat by flowing through the back of the body blowing of heater surfaces
The lower section of electrode 301, so as to improve the efficiency of heating surface.
First back of the body that Fig. 2 schematically shows at the section between heater 303 and separation layer 302 blows passage.
As shown in Fig. 2, a plurality of first ring being distributed in concentric circles is evenly arranged on the face opposite with separation layer 302 of heater 303
Connected in star 3091 and the first radial groove 3092 that a plurality of first annular groove 3091 is interconnected；First annular groove
3091 and first radial groove 3092 form first gas passage 309 between heater 303 and separation layer 302.In Fig. 2
In, three first annular grooves and five the first radial grooves are only schematically shown, however, first annular groove and
The quantity of one radial groove is without being limited thereto, but can arbitrarily be selected according to actual conditions.In addition, a plurality of first annular groove
It radially can uniformly or non-uniformly be distributed, a plurality of first radial groove can also uniformly or non-uniformly divide along circumferential direction
Cloth.
Similarly, can be evenly arranged on the face opposite with separation layer 302 of radio-frequency electrode 301 in the more of concentric circles distribution
Second annular groove and the second radial groove that a plurality of second annular groove is interconnected；Second annular groove and
Two radial grooves form second gas passage.The distribution form of above-mentioned a plurality of second annular groove and a plurality of second radial groove can
With with reference to first annular groove shown in Fig. 2 and the first radial groove.In addition, the number of second annular groove and the second radial groove
Amount and can be identical or different with first annular groove and the first radial groove along the distribution on in-plane.
In some instances, the inside of radio-frequency electrode and heater can also be located at by carrying on the back blowing passage.For example, heater
Third gas passage is provided in 303, third gas passage is connected with supply air line, and supply air line is used for the third gas
Passage is passed through inert gas；It is provided with the 4th gas passage in radio-frequency electrode 301, is equipped with interface channel in separation layer 302, the 3rd
Gas passage and the 4th gas passage are connected by interface channel.The specific setting of third gas passage and the 4th gas passage
Form is referred to the setting form of above-mentioned first back of the body blowing passage described in conjunction with Figure 2.For example, third gas passage
It can include circular passage and the radial passage for connecting circular passage respectively with the 4th gas passage, but it is according to the present invention
Embodiment is without being limited thereto.In addition, blow passage for the back of the body in pedestal, it can select that first back of the body blows passage and second back of the body blows passage
Combination and the 3rd back of the body blow passage and the 4th back of the body blows one of combination of passage, can also be completely provided with the two combinations.
As described above, back of the body blowing needs are introduced from outside into, therefore, it is necessary to introduce the back of the body blowing supply pipe of back of the body blowing
Road 313.As shown in Figure 1, back of the body blowing service 313 also stretches into pedestal from heater 303 away from the one side of separation layer 302
Body interior, and reach the interface between heater 303 and separation layer 302 through heater 303.Carry on the back blowing supply pipe
The interface between interface and separation layer 302 and radio-frequency electrode 301 between road 313 and separation layer 302 and heater 303
The back of the body blow passage and be connected, being transported to the back of the body so as to will carry on the back blowing blows passage.It is similar with radio frequency lead-in, it blows passage in the back of the body and passes through
At the position of heater 303, welding manner can be taken to be sealed or be sealed using metal seal.
The back of the body blowing blown for carrying out the back of the body, such as the inert gases such as helium may be employed, but according to an embodiment of the invention
It is not restricted to this.Back of the body blowing enters chamber interior and influences treatment process in order to prevent, heater 303 and separation layer 302
Between and separation layer 302 and radio-frequency electrode 301 between carry out face sealing.For example, due between back of the body blowing and cavity environment
The requirement of sealing be not very high, therefore, these interfaces for sealing of needs are simultaneously not required O-ring to be sealed, and therefore, keep away
The risk that elastomeric O ring is burned out near heater is exempted from.As shown in Figure 1, for carrying on the back the sealing of blowing, it is necessary to heater
303 face in face of the surface of separation layer, two opposite surfaces of separation layer 302 and radio-frequency electrode 301 under separation layer 302
Surface carries out face sealing.For example, between heater 303 and separation layer 302 and between separation layer 302 and radio-frequency electrode 301 into
The sealing of row face can realize sealing by the contact of smooth surface each other, that is to say, that heater 303, separation layer
Contact surface palette between 302 and radio-frequency electrode 301, for by inert gas seal in first gas passage and the second gas
In body passage.Therefore it may only be necessary to which surface between layers is smooth can to meet corresponding seal request, simplify component and answer
It is miscellaneous to spend and reduce the risk that elastomeric O ring is burned out.It is however, without being limited thereto according to an embodiment of the invention.For example, at some
In example, by being sintered or the side of plating between heater 303 and separation layer 302 and between separation layer 302 and radio-frequency electrode 301
Formula connects.
Thermocouple
In some instances, pedestal also has temperature measuring equipment.For example, pedestal according to an embodiment of the invention includes thermoelectricity
Even 308.For example, thermocouple 308 can also stretch into heater 303 from heater 303 away from the one side of separation layer 302, and arrive
Up to the position for needing measurement temperature.If above-mentioned radio frequency lead-in is similar with back of the body blowpipe road, at least one of heater is passed through at it
At surface, between thermocouple 308 and heater 303 welded seal or metal seal can be taken to be sealed, here no longer
It repeats.It should be noted that pedestal can include more thermocouples, different thermocouples can measure the temperature of different position,
So as to which its measurement end can be arranged at different positions.For example, thermocouple includes shielded-plate tube and the electricity in shielded-plate tube
Thermo wires, shielded-plate tube are sealed with the heater welded seal or by metal seal.
In the above-described embodiments, add using radio frequency lead-in, back of the body blowing feeding pipe and thermocouple as example to running through
The circuit of hot device is described.However, this is not restricted to according to an embodiment of the invention.For example, in some embodiments,
Pedestal can only include one or more of these circuits；For example, in some above-mentioned embodiments, heater 303 with every
It is led using the back of the body blowing interface between interface and separation layer 302 and radio-frequency electrode 301 between absciss layer 302
Heat.However, in some embodiments, the heat conduction of above-mentioned two interface can not also use back of the body blowing to carry out heat conduction.For example,
The interface between interface and separation layer 302 and radio-frequency electrode 301 between heater 303 and separation layer 302 can be with
The modes such as sintering, plating is taken to conduct heat, improve heat transfer efficiency.In this case, it is not required that back of the body blowing pipe
Road introduces back of the body blowing, and therefore, the circuit in these embodiments through heater can not include back of the body blowing pipeline.
And in other embodiments, pedestal can include other in addition to above-mentioned circuit through the heater
Circuit.In the above-described embodiments, through heater circuit can welded seal or metallic sealing section sealing by way of with
Heater connects, so as to which heater forms the entirety of a sealing in itself.When the pedestal is arranged on the chamber of Processing Equipment
When interior, heater can be used for the vacuum insulating between atmospheric environment and cavity environment in itself, so as to avoid the heating of pedestal
It is sealed between each layer in part on device using O-ring, avoids the elastomeric O ring near heater and be in heater
The risk being burned out during high temperature.
Cooling water channel
Except it is above-mentioned through the circuit of heater in addition to, pedestal according to some embodiments of the invention can also include being used for
The cooling water channel cooled down to heater 303.As shown in Figure 1, cooling water channel 305 is arranged on the lower section of heater 303.Example
Such as, cooling water channel 305 can be arranged near the heater strip 3032 of heater, so as to preferably be cooled down to heater.Separately
Outside, cooling water channel can also be connected to heater by welding, so that structure is than stronger.Furthermore, it is necessary to it says
It is bright, although referred herein as " cooling water channel ", the cooling media to circulate wherein is not limited to water, can also adopt
With any other suitable cooling media.In addition, cooling media is also not necessarily limited to be liquid, suitable gas can also be used to carry out
Cooling.In addition, cooling water channel includes an inlet and an outlet, the two is connected respectively with for the pipeline of input/output cooling media,
Form circulating cooling.In addition, during treatment process carries out, it can be by the implementation temperature value judgement that is obtained by thermocouple
Whether temperature value exceeds default wafer temperature value.If real-time temperature values exceed default wafer temperature value, can increase
The flow of cooling agent and/or the temperature for reducing cooling agent.
Bellows
In some embodiments in accordance with the present invention, pedestal is further included positioned at heater 303 away from 302 one side of separation layer
Bellows 314.As shown in Figure 1, one end of bellows 314 is welded on heater 303.For above-mentioned introducing circuit, from
Outside passes through at the hollow shaft of bellows 314 and reaches at heater 303 when introducing.Bellows 314 is by welding and adds
Hot device 303 and formed sealing, when 314 free end as shown in Figure 1 of bellows is connected in Processing Equipment, bellows
314 hollow mandrel interior is connected with atmospheric environment, but the circuit due to being introduced from outside into and heater be by welded seal, because
This, can keep the vacuum insulating between atmospheric environment and cavity environment, this will carry out more detailed in subsequent processing equipment
Description.
In the description carried out above to embodiment, the physical connection structure between all parts is essentially described, so as to
It can ensure sealing performance.
In addition to the sealing performance that above-mentioned physical connection generates improves, pedestal according to embodiments of the present invention is due to above-mentioned
Connection structure, thermocouple, heating wire, heater body, cooling water channel on heater etc. can be connected with current potential, that is, be protected
Hold identical current potential.Moreover, above-mentioned component can be grounded, so as to avoid wave filter is used.In addition, according to the present invention one
In a little embodiments, bellows is made of conductive material, and one end of bellows is welded on heater, and the other end of bellows
May be coupled to the chamber of Processing Equipment, in this way, due to chamber be ground connection, it is thus possible to so that heater and and its
The other component of connection is also ground connection, simplifies the complexity of processing equipment.
In addition, for radio frequency lead-in, since its shielded layer is made for metal and is configured as being grounded, in radio frequency
When lead-in passes through heater, its shielded layer can be welded on heater, in this way, ensure that sealing performance, and ensured
Shielded layer and heater are earthing potentials.
Embodiment two
The present embodiment provides a kind of semiconductor processing equipment, for example, the processing equipment can be physical vapour deposition (PVD) (PVD)
Equipment etc..The equipment includes chamber and radio frequency source, the pedestal being provided in chamber in above-described embodiment, and radio frequency source is used for pedestal
In radio-frequency electrode provide radio-frequency power.
For example, chamber is physical vapour deposition (PVD) (PVD) chamber.
For example, pedestal is in a chamber, and the heater is connected to away from the one side of the separation layer by bellows
On the bottom wall of the chamber.It is made for example, conductive material may be employed in bellows, on the bellows-welding to the heater
Or it is sealed to by metal seal on the heater.
That is, the opposite end of one end welded with heater of bellows is connected on the bottom wall of chamber.Bellows
The mode being connected on the bottom wall of chamber is not particularly limited.For example, as shown in figure 3, one end of bellows 314 is welded to flange
On 316, then flange is connected to the bottom wall of chamber, these connections are, for example, to be tightly connected.That is, bellows is connected to
It is sealed between one end of the bottom wall of chamber and the bottom wall of chamber.
For example, as shown in figure 3, introduce the hollow shaft that circuit and cooling water channel pass through bellows 314, and from chamber 315
Bottom wall in the outside of chamber 315 is reached in the region that is limited by bellows 314.For example, it is introduced into the radiofrequency signal in circuit
Line 310 is connected with radio frequency source 400, so that radio frequency source can apply radio-frequency power to radio-frequency electrode.
Hollow space in the bellows under heater is connected with atmospheric environment.However, as described above, by
It is tightly connected in heater circuit connected to it, therefore, heater has isolated atmospheric environment and cavity environment.Therefore, it is right
In the embodiment of the present invention, heater is with introducing circuit as an entirety, the interior danger of leaking out when can reduce installation.From Fig. 3
It can be seen that part and atmosphere in bellows under heater, and the part outside chamber inner corrugated pipe then belongs to
Cavity environment, for example, can be vacuum environment.
Further, since the heater of pedestal is welded to bellows, and bellows is connected to chamber, and the chamber for the treatment of process
Usually it is grounded.Therefore, the current potential or earthing potential of heater.In addition, the other component being connected with heater, example
Such as, thermocouple, cooling water channel, the shielded layer of radio frequency lead-in also can be earthing potential.Therefore, it is no longer necessary in order to prevent
Radio frequency interference and additionally all add in wave filter in heater strip and thermocouple end, so as to reduce pedestal integrated box (Pedestal
Integration Box, PIB) size and cost.
As shown in figure 3, it only schematically shows the part-structure of processing equipment, place according to embodiments of the present invention
Reason process equipment can also include other parts.For example, at the roof of chamber, top electrode can also be included.Therefore, on pedestal
Electrode layer can be referred to as lower electrode.Pedestal for the embodiment of the present invention or the Processing Equipment including the pedestal,
Its lower electrode load is simple, therefore, easily technique can be regulated and controled after biasing.
In addition, for the processing equipment of the present embodiment, the various heating pedestals described in embodiment one can be used, are not had
There is the corresponding portion that the part described in the present embodiment is referred in embodiment one.Equally, adding described in embodiment one
Advantageous effects caused by hot radical seat can also obtain in the process equipment in embodiment two, therefore, no longer superfluous here
It states.
The description of above example is not restricted, for the component not referred in above example or is set
Mode is put, any suitable technical solution in this field can be taken.For example, the sealing for pedestal or processing equipment, is removed
Outside the sealing submitted in above-described embodiment, if it is desired, can also be sealed at other positions.For example, cooling water channel
If through bellows, can be sealed between cooling water channel and bellows, it, can also be for the shielded-plate tube of thermocouple
Its one end away from base body is sealed.
The above be only the present invention exemplary embodiment, protection domain and is not intended to limit the present invention, this hair
Bright protection domain is determined by appended claim.
Claims (10)
1. a kind of pedestal, for carrying workpiece to be machined, wherein, the pedestal includes the heater being cascading, isolation
Layer and radio-frequency electrode, the separation layer is insulating materials, by both the heater and the radio-frequency electrode potential isolation.
2. pedestal according to claim 1, wherein, the heater is configured as being grounded.
3. pedestal according to claim 1, wherein, it is provided with first gas between the heater and the separation layer and leads to
Road, the first gas passage are connected with supply air line, and the supply air line is used to be passed through inertia to the first gas passage
Gas；It is provided with second gas passage between the separation layer and the radio-frequency electrode, is equipped in the separation layer by described the
The interface channel that one gas passage is connected with the second gas passage.
4. pedestal according to claim 3, wherein, the heater is evenly arranged on the face opposite with the separation layer
The a plurality of first annular groove being distributed in concentric circles and the first radial direction that a plurality of first annular groove is interconnected are recessed
Slot；The first annular groove and first radial groove form the first gas passage.
5. pedestal according to claim 3, wherein, the radio-frequency electrode is uniformly arranged on the face opposite with the separation layer
There are a plurality of second annular groove being distributed in concentric circles and the second radial direction that a plurality of second annular groove is interconnected
Groove；The second annular groove and second radial groove form the second gas passage.
6. pedestal according to any one of claim 3 to 5, wherein, the heater, the separation layer and the radio frequency
Contact surface palette between electrode, for by the inert gas seal in the first gas passage and second gas
In body passage.
7. heating pedestal according to claim 1, wherein, it is provided with third gas passage in the heater, described
Three gas passages are connected with supply air line, and the supply air line is used to be passed through inert gas to the third gas passage；It is described
It is provided with the 4th gas passage in radio-frequency electrode, is equipped with interface channel in the separation layer, the third gas passage and described
4th gas passage is connected by the interface channel.
8. heating pedestal according to claim 1, wherein, between the heater and the separation layer and the isolation
It is connected between layer and the radio-frequency electrode by sintering or plating mode.
9. a kind of semiconductor processing equipment, including chamber and radio frequency source, wherein, it is provided in the cavity according to claim
1-8 any one of them pedestals, the radio frequency source provide radio-frequency power for the radio-frequency electrode into the pedestal.
10. semiconductor processing equipment according to claim 9, wherein, the chamber is physical vapor deposition chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810026173.9A CN108054074A (en) | 2018-01-11 | 2018-01-11 | A kind of pedestal and the semiconductor processing equipment including the pedestal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810026173.9A CN108054074A (en) | 2018-01-11 | 2018-01-11 | A kind of pedestal and the semiconductor processing equipment including the pedestal |
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| Publication Number | Publication Date |
|---|---|
| CN108054074A true CN108054074A (en) | 2018-05-18 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810026173.9A Pending CN108054074A (en) | 2018-01-11 | 2018-01-11 | A kind of pedestal and the semiconductor processing equipment including the pedestal |
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