CN108052701B - Method for controlling stress and warpage of substrate glass - Google Patents
Method for controlling stress and warpage of substrate glass Download PDFInfo
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- CN108052701B CN108052701B CN201711176245.XA CN201711176245A CN108052701B CN 108052701 B CN108052701 B CN 108052701B CN 201711176245 A CN201711176245 A CN 201711176245A CN 108052701 B CN108052701 B CN 108052701B
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- G06—COMPUTING; CALCULATING OR COUNTING
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- G06F30/00—Computer-aided design [CAD]
- G06F30/20—Design optimisation, verification or simulation
- G06F30/23—Design optimisation, verification or simulation using finite element methods [FEM] or finite difference methods [FDM]
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
- G06F2119/18—Manufacturability analysis or optimisation for manufacturability
Abstract
The invention provides a method for controlling stress and warpage of substrate glass, which comprises the following steps: step one, obtaining a substrate glass ribbon cooling curve according to thermal flow field simulation software; step two, obtaining a stress distribution curve and a warping shape of a thermal history interval in the substrate glass forming according to the substrate glass cooling curve obtained in the step one; step three, calculating the residual stress of the thermal history interval of the substrate glass according to the stress distribution curve of the substrate glass in the thermal history interval obtained in the step two; step four, judging whether the residual stress of the substrate glass obtained in the step three meets the product process requirements of the substrate glass: when the stress distribution and the warpage obtained in the third step meet the requirements of the glass substrate product, carrying out the next step; when the stress distribution and the warpage obtained in the third step can not meet the requirements of the glass substrate product, firstly returning to the second step, adjusting the process parameters in the thermal flow field simulation software in the second step, and then repeating the second step, the third step and the fourth step; and fifthly, adjusting the temperature distribution of the on-site forming device by utilizing the substrate glass cooling curve corresponding to the residual stress meeting the product process requirements of the substrate glass.
Description
Technical Field
The invention relates to substrate glass manufacturing, in particular to a substrate glass stress and warpage control method.
Background
Substrate glass used in the field of manufacturing flat panel displays such as general TFT-LCDs (thin film transistor displays) and PDPs (plasma display panels) is manufactured by an overflow down-draw method, and in a molding process, molten glass melted by a glass melting furnace is supplied to a fusion overflow down-draw molding apparatus. The surface flatness of the substrate glass must be within about 100um and 190um, and any warp or fluctuation will negatively impact the quality of the display.
The Coefficient of Thermal Expansion (CTE) of the substrate glass has a significant nonlinear region, i.e., the glass transition region, which is in the Glass Transition Temperature Range (GTTR), as a function of temperature. At temperatures above the GTTR, the glass behaves substantially as a viscous liquid; at temperatures below the GTTR, the glass behaves essentially as an elastic solid. The glass gradually increases in viscosity from high temperature to low temperature in the glass transition temperature range, and exhibits viscoelasticity with remarkable viscous and elastic properties. The glass is basically viscous fluid above the glass transition region, and the stress can be quickly released; below this region, the glass is sufficiently rigid to resist bending.
Since the substrate glass is thin, stress can be released by flexure, which occurs in the finished state of the substrate glass and in the manufacturing process. Cooling of the glass ribbon causes the glass to transition from a viscoelastic material to a thin elastic material. In viscoelastic materials, stress can be released quickly, while thin elastic materials can withstand tensile stress but react to compressive stress by flexing.
In order to improve production efficiency and reduce cost, a plurality of panels are generally simultaneously manufactured on a single substrate, and the substrate is divided into several small portions along cutting lines. The cutting operation changes the stress distribution of the substrate glass, and the stress is released at the cutting line, so that the shape of the glass sub-sheet is changed, and the distortion phenomenon is generated. Warp is a defect in the glass of a substrate that is characterized by an out-of-plane. Warping has become one of the most troublesome and persistent problems in substrate glass manufacturing.
Disclosure of Invention
The invention aims to provide a method for controlling stress and warpage of substrate glass, which solves the defect that the subsequent process is inconvenient due to the existence of undesirable stress on a glass plate in the existing glass forming process.
In order to achieve the purpose, the invention adopts the technical scheme that:
the invention provides a method for controlling stress and warpage of substrate glass, which comprises the following steps:
step one, obtaining a substrate glass ribbon cooling curve according to process parameters required by substrate glass molding input in thermal flow field simulation software;
step two, obtaining a stress distribution curve of a thermal history interval in the substrate glass forming according to the substrate glass cooling curve obtained in the step one;
step three, calculating the residual stress of the thermal history interval of the substrate glass according to the stress distribution curve of the substrate glass in the thermal history interval obtained in the step two;
step four, judging whether the residual stress of the substrate glass obtained in the step three meets the product process requirements of the substrate glass:
when the stress distribution and the warpage obtained in the third step meet the requirements of the glass substrate product, performing a fifth step;
when the stress distribution and the warpage obtained in the third step can not meet the requirements of glass substrate products, firstly adjusting process parameters in the thermal flow field simulation software in the first step, and then returning to the second step;
and fifthly, adjusting the temperature distribution of the on-site forming device by utilizing the substrate glass cooling curve corresponding to the residual stress meeting the product process requirements of the substrate glass.
Preferably, in the first step, the specific method for obtaining the cooling curve of the substrate glass ribbon comprises: firstly, establishing a simulation three-dimensional model of a glass forming system in drawing software; and then, importing the established simulated three-dimensional model into thermal flow field simulation software to perform simulation calculation to obtain a substrate glass ribbon cooling curve of a key thermal process interval.
Preferably, in the second step, the specific method for obtaining the stress distribution curve and the warp shape of the substrate glass is as follows: firstly, establishing a finite element thermal stress simulation model of the substrate glass by adopting ANSYS software; and then, coupling the substrate glass cooling curve obtained in the step one to a finite element thermal stress simulation model of the substrate glass to obtain a substrate glass stress distribution curve in a thermal history interval.
Preferably, when the substrate glass cooling curve is coupled to the finite element thermal stress simulation model of the substrate glass, the stress distribution curve of the substrate glass in the thermal history interval includes a relaxation region and a residual stress region by adopting a free boundary condition.
Preferably, in the third step, the specific method for calculating the residual stress in the thermal history interval of the substrate glass is to set: when the total stress in the thermal history interval of the substrate glass is Q, the stress in the residual stress area is sigma, and the stress in the relaxation area is S, then:
σ＝Q-2.0×S
wherein S is obtained by the linear integral of the stress distribution curve of the relaxation area; the total stress Q of the substrate glass is obtained as a linear integral along the glass overflow draw-down path.
Preferably, the thermal process interval comprises a main body temperature reduction interval, a glass transition temperature zone, a GTTR interval, an annealing zone and a stress zone.
Compared with the prior art, the invention has the beneficial effects that:
according to the method for controlling the stress and warpage of the substrate glass, provided by the invention, the temperature reduction curve of each thermal history interval and the stress distribution corresponding to the temperature reduction curve in the forming process of the simulated glass plate are analyzed, and then each process parameter in the forming process of the simulated glass plate is adjusted until the simulated stress distribution meets the production process of producing the glass plate. And then adjusting the technological parameters in the glass plate forming process through the technological parameters corresponding to the optimal or nearly optimal cooling curve. The invention effectively solves the problem that the technological parameters in the field forming equipment are not easy to adjust, thereby eliminating the stress which should not exist in the produced glass plate.
Drawings
FIG. 1 is a schematic illustration of an overflow downdraw process configuration;
FIG. 2 is an invention flow diagram;
FIG. 3 is a schematic view of a cooling curve of a substrate glass;
FIG. 4 is a schematic view of a stress distribution curve corresponding to a cooling curve of a substrate glass;
FIG. 5 is an enlarged view of a portion of FIG. 4 at A;
FIG. 6 is a partial enlarged view of FIG. 4 at B;
FIG. 7 is a schematic view of the dotted cooling line and stress distribution of the substrate glass in the GTTR region;
FIG. 8 is a schematic view of a temperature drop dotted line and stress distribution of a glass substrate in a glass transition temperature region;
FIG. 9 is a schematic diagram of the temperature drop dotted line and stress distribution of the substrate glass in the strained region;
wherein, 1, an overflow brick 2, a substrate glass 3, a zero stress control line 4, a glass overflow down-draw path 5, a position 6 for cutting a glass belt, a substrate glass cooling curve 7, a starting constant temperature area 8, an end constant temperature area 9, a cooling area 10, a substrate glass stress distribution curve 11, a relaxation area 12, a first linear substrate glass belt cooling curve 13, a second linear substrate glass belt cooling curve 14, a third linear substrate glass belt cooling curve 15, a fourth linear substrate glass belt cooling curve 16, a first substrate glass stress distribution curve 17, a second substrate glass stress distribution curve 18, a third substrate glass stress distribution curve 19, a fourth substrate glass stress distribution curve 20, a first nonlinear substrate glass belt cooling curve 21, a second nonlinear substrate glass belt cooling curve 22, a glass belt cooling curve 22, A third nonlinear substrate glass ribbon cooling curve 23, a fourth nonlinear substrate glass ribbon cooling curve 24, a fifth substrate glass stress distribution curve 25, a sixth substrate glass stress distribution curve 26, a seventh substrate glass stress distribution curve 27, an eighth substrate glass stress distribution curve 28, a fifth nonlinear substrate glass ribbon cooling curve 29, a sixth nonlinear substrate glass ribbon cooling curve 30, a fifth linear substrate glass ribbon cooling curve 31, a ninth substrate glass stress distribution curve 32, a tenth substrate glass stress distribution curve 33, and an eleventh substrate glass stress distribution curve
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
As shown in fig. 1, when the substrate glass is produced by the melt overflow method, the molten glass melted in the glass melting furnace is supplied to overflow bricks 1 in the melt overflow molding apparatus in the molding step, and substrate glass 2 is formed by overflowing from both sides of the overflow bricks 1. The range from the zero stress control line 3 to the cutting outlet line 5 of the forming device is the range of the stress simulation model of the invention; the glass overflow downdraw path 4 is a path of stress integration of the present invention, and is also a thermal history direction of each point on the stress simulation model.
The zero stress control line 3 means that the comprehensive stress in the glass before the line is zero, namely the glass softening point temperature control line.
As shown in fig. 2, the method for controlling stress and warpage of a substrate glass provided by the invention comprises the following steps:
the method comprises the following steps that firstly, a thermal process interval is obtained according to a temperature reference point, wherein the temperature reference point comprises a strain point, a transformation point, an annealing point, a deformation point and a softening temperature, and the thermal process interval comprises a main body cooling interval, a glass transition temperature area, a GTTR interval, an annealing area and a stress area;
step two, obtaining a substrate glass ribbon cooling curve according to thermal flow field simulation software, specifically:
firstly, establishing a simulated three-dimensional model of a glass forming system in drawing software (such as CAD software);
then, the created simulated three-dimensional model is introduced into thermal flow field simulation software (such as FLOEFD and ANSYS), process parameters required by substrate glass forming are input into the thermal flow field simulation software, then simulation calculation is performed, and finally a substrate glass ribbon cooling curve in a key thermal process interval is obtained, wherein the substrate glass ribbon cooling curve comprises a starting constant temperature area 7, a cooling area 9 and an end point constant temperature area 8, as shown in FIG. 2.
Step three, obtaining a stress distribution curve and a warping shape of the substrate glass according to the substrate glass cooling curve obtained in the step two, specifically:
firstly, establishing a finite element thermal stress simulation model of the substrate glass by adopting ANSYS software, wherein the finite element thermal stress simulation model of the substrate glass is shown in figure 3, and a zero stress control line 3 is positioned at a position 5 where a glass belt is cut in the process of forming the substrate glass;
and then, coupling the substrate glass cooling curve obtained in the second step to a finite element thermal stress simulation model of the substrate glass to obtain a stress distribution curve 10 corresponding to the substrate glass, as shown in fig. 4.
Step four: calculating the residual stress of the substrate glass according to the stress distribution curve of the substrate glass obtained in the step three:
in order to approximately simulate the stress relaxation of the substrate glass, therefore, when a finite element thermal stress simulation model of the substrate glass is established, a free boundary condition is adopted, namely no fixed constraint exists; the stress profile 10 of the substrate glass includes a relaxed region 11 and a residual stress region.
Setting: the total stress of the substrate glass along the glass overflow pull-down path 4 is Q, the stress of the residual stress area is sigma, and the stress of the relaxation area is S, then:
σ＝Q-2.0×S
wherein S is obtained by the linear integral of the stress distribution curve of the relaxation area;
the moment when each point on the path of the glass ribbon leaves the lehr is completely equivalent, and by converting the path to time based on the draw speed (the drawing speed of the glass in the drawing direction), the stress profile 10 of the substrate glass can be converted to the stress at each moment of the annealing time history, and the total stress of the substrate leaving the lehr should be the integral along the time history (path), which is the linearization integration processing method of the present invention, and the final stress Q of the stress profile 10 of the substrate glass can be obtained by the linearization processing.
An excessive compressive stress (negative stress) may lead to an unfavorable warpage, while a proper tensile stress (positive stress) or zero stress is advantageous for obtaining a flat glass.
Step five, judging whether the residual stress of the substrate glass obtained in the step four meets the product process requirements of the substrate glass:
when the stress distribution and the warping obtained in the step four meet the requirements of the glass substrate product, carrying out the next step;
when the stress distribution and the warpage obtained in the step four cannot meet the requirements of the glass substrate product, repeating the simulation in the step two by adjusting the process parameters, such as a heating or cooling unit, in the thermal flow field simulation software in the step two to obtain a new annealing cooling curve; and repeating the third step, coupling the new annealing cooling curve to the finite element stress simulation model to perform stress simulation calculation and analysis again until the residual stress on the substrate glass meets the product process requirements of the substrate glass.
And step six, when the residual stress obtained in the step four or the step five meets the product process requirements of the substrate glass, adjusting the temperature distribution of the on-site forming device by using the substrate glass cooling curve corresponding to the residual stress.
The invention is equivalent to a thin film linearization treatment method for a very thin substrate glass, which ignores the thermal stress in the thickness direction of the glass (the ignorance is based on the fact that the glass is thin enough), and only studies the stress of the glass in the surface direction.
Example 1
By the method for controlling the stress and warpage of the substrate glass, provided by the invention, the temperature-reducing curves of the substrate glass ribbon in the GTTR region are obtained, and as shown in fig. 7, in the present embodiment, a total of four temperature-reducing curves of the substrate glass ribbon are obtained, namely a first linear temperature-reducing curve 12 of the substrate glass ribbon, a second linear temperature-reducing curve 13 of the substrate glass ribbon, a third linear temperature-reducing curve 14 of the substrate glass ribbon, and a fourth linear temperature-reducing curve 15 of the substrate glass ribbon.
In this embodiment, the four substrate glass ribbon cooling curves correspond to the four obtained substrate glass stress distribution curves, which specifically are: a first linear substrate glass ribbon cooling curve 12 corresponds to a first substrate glass stress distribution curve 16, a second linear substrate glass ribbon cooling curve 13 corresponds to a second substrate glass stress distribution curve 17, a third linear substrate glass ribbon cooling curve 14 corresponds to a third substrate glass stress distribution curve 18, and a fourth linear substrate glass ribbon cooling curve 15 corresponds to a fourth substrate glass stress distribution curve 19.
From the figure, it can be derived: in the range of about 700-790 ℃, the linear temperature curve generates a compression peak (negative stress) in the glass, the compression peak is positioned near the deformation point temperature, and a tension peak (positive stress) is generated near the glass transition temperature point; an excessive compressive stress (negative stress) may lead to an unfavorable warpage, while a proper tensile stress (positive stress) or zero stress is advantageous for obtaining a flat glass.
Non-uniform shrinkage occurs when the glass sheet cools through this range. (1) Along with the difference of the cooling speed, the position of the compression peak moves along with the deformation point, namely the compression peak corresponds to the deformation point. (2) The linear cooling speed is increased, and the position of a compression peak moves forward; the linear cooling rate is reduced and the position of the compression peak is moved backwards. The increase of the linear cooling speed of the main body of the forming device is beneficial to generating tensile stress (positive stress), and the reduction of the speed generates more compressive stress (negative stress).
Example 2
By the substrate glass stress and warpage control method provided by the invention, the substrate glass ribbon cooling curve of the glass transition temperature region is obtained, as shown in fig. 8, in the embodiment, four substrate glass ribbon cooling curves are obtained in total, namely a first nonlinear substrate glass ribbon cooling curve 20, a second nonlinear substrate glass ribbon cooling curve 21, a third nonlinear substrate glass ribbon cooling curve 22 and a fourth nonlinear substrate glass ribbon cooling curve 23.
In this embodiment, the four substrate glass ribbon cooling curves correspond to the four obtained substrate glass stress distribution curves, which specifically are: a first nonlinear substrate glass ribbon cooling curve 20 corresponds to a fifth substrate glass stress distribution curve 24, a second nonlinear substrate glass ribbon cooling curve 21 corresponds to a sixth substrate glass stress distribution curve 25, a third nonlinear substrate glass ribbon cooling curve 22 corresponds to a seventh substrate glass stress distribution curve 26, and a fourth nonlinear substrate glass ribbon cooling curve 23 corresponds to an eighth substrate glass stress distribution curve 27.
The inflection point of the nonlinear temperature curve is designed to be near the deformation point (the highest point of the CTE-T curve), and the end point of the nonlinear temperature curve is designed to be near the glass transition temperature point. The position of the compression peak of the stress curve can follow the inflection point, and the position of the tension peak of the stress curve is basically kept unchanged.
The position of the compression peak corresponds to the deformation point temperature. The linear cooling speed is changed from fast to slow, and the position of a compression peak moves forwards; the linear cooling speed is changed from slow to fast, and the position of a compression peak is moved backwards.
As shown in fig. 8, the fourth nonlinear substrate glass ribbon cooling curve 23 is gradually increased in the glass transition temperature range with the inflection point as the inflection point, and more compressive stress is generated in the glass ribbon.
Example 3
By the method for controlling the stress and warpage of the substrate glass, provided by the invention, the temperature reduction curves of the substrate glass strips in the stress area are obtained, as shown in fig. 9, in the embodiment, three temperature reduction curves of the substrate glass strips are obtained in total, namely a fifth nonlinear substrate glass strip temperature reduction curve 28, a sixth nonlinear substrate glass strip temperature reduction curve 29 and a fifth linear substrate glass strip temperature reduction curve 30.
In this embodiment, the three substrate glass ribbon cooling curves correspond to the obtained three substrate glass stress distribution curves, which specifically are: a fifth nonlinear substrate glass ribbon cooling curve 28 corresponds to a ninth substrate glass stress distribution curve 31, a sixth nonlinear substrate glass ribbon cooling curve 29 corresponds to a tenth substrate glass stress distribution curve 32, and a fifth linear substrate glass ribbon cooling curve 36 corresponds to an eleventh substrate glass stress distribution curve 33.
The thermal power of the fifth linear substrate glass ribbon cooling curve 30 increases in the stress region, which will generate more compressive stress in the glass ribbon; while the fifth nonlinear substrate glass ribbon cooling curve 28 has reduced thermal power in the stress region to facilitate the generation of tensile stress in the glass ribbon.
Claims (5)
1. A method for controlling stress and warpage of a substrate glass is characterized by comprising the following steps:
step one, obtaining a substrate glass ribbon cooling curve according to process parameters required by substrate glass molding input in thermal flow field simulation software;
step two, obtaining a stress distribution curve of a thermal history interval in the substrate glass forming according to the substrate glass cooling curve obtained in the step one;
step three, calculating the residual stress of the thermal history interval of the substrate glass according to the stress distribution curve of the substrate glass in the thermal history interval obtained in the step two;
step four, judging whether the residual stress of the substrate glass obtained in the step three meets the product process requirements of the substrate glass:
when the stress distribution and the warpage obtained in the third step meet the requirements of the glass substrate product, performing a fifth step;
when the stress distribution and the warpage obtained in the third step can not meet the requirements of glass substrate products, firstly adjusting process parameters in the thermal flow field simulation software in the first step, and then returning to the second step;
fifthly, adjusting the temperature distribution of the on-site forming device by utilizing the substrate glass cooling curve corresponding to the residual stress meeting the product process requirements of the substrate glass;
in the first step, the specific method for obtaining the cooling curve of the substrate glass ribbon comprises the following steps: firstly, establishing a simulation three-dimensional model of a glass forming system in drawing software; and then, importing the established simulated three-dimensional model into thermal flow field simulation software, inputting technological parameters required by substrate glass molding in the thermal flow field simulation software, and then carrying out simulation calculation to finally obtain a substrate glass ribbon cooling curve in a key thermal process interval.
2. The method for controlling the stress and the warpage of the substrate glass according to claim 1, wherein in the second step, the specific method for obtaining the stress distribution curve and the warpage shape of the substrate glass is as follows: firstly, establishing a finite element thermal stress simulation model of the substrate glass by adopting ANSYS software; and then, coupling the substrate glass cooling curve obtained in the step one to a finite element thermal stress simulation model of the substrate glass to obtain a substrate glass stress distribution curve in a thermal history interval.
3. The method of claim 2, wherein the stress and warpage control of the substrate glass is performed using free boundary conditions when coupling the cooling profile of the substrate glass to the finite element thermal stress simulation model of the substrate glass, such that the stress profile of the substrate glass during the thermal history interval includes a relaxed region and a residual stress region.
4. The method for controlling stress and warpage of substrate glass according to claim 3, wherein in the third step, the specific method for calculating the residual stress in the thermal history interval of the substrate glass is to set: when the total stress in the thermal history interval of the substrate glass is Q, the stress in the residual stress area is sigma, and the stress in the relaxation area is S, then:
σ＝Q-2.0×S
wherein S is obtained by the linear integral of the stress distribution curve of the relaxation area; the total stress Q of the substrate glass is obtained as a linear integral along the glass overflow draw-down path.
5. The method of claim 1, wherein the thermal history zones comprise a bulk cooling zone, a glass transition temperature zone, a GTTR zone, an annealing zone, and a stress zone.
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| CN108793688B (en) * | 2018-07-24 | 2021-10-08 | 彩虹显示器件股份有限公司 | Glass substrate forming thickness control method |
| CN111116014B (en) * | 2019-12-30 | 2021-08-13 | 彩虹显示器件股份有限公司 | Control method for temperature field of forming device |
| CN112759234B (en) * | 2021-01-29 | 2023-01-17 | 彩虹显示器件股份有限公司 | Design method of glass substrate overflow forming annealing device |
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