CN108051980A - Mask plate and preparation method thereof, mask plate exposure system, splicing exposure method - Google Patents
Mask plate and preparation method thereof, mask plate exposure system, splicing exposure method Download PDFInfo
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- CN108051980A CN108051980A CN201810004543.9A CN201810004543A CN108051980A CN 108051980 A CN108051980 A CN 108051980A CN 201810004543 A CN201810004543 A CN 201810004543A CN 108051980 A CN108051980 A CN 108051980A
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- mask plate
- chromium oxide
- splicing
- light absorbing
- exposure area
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- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 238000002834 transmittance Methods 0.000 claims abstract description 43
- 239000011358 absorbing material Substances 0.000 claims abstract description 23
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 69
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 69
- 239000011248 coating agent Substances 0.000 claims description 41
- 238000000576 coating method Methods 0.000 claims description 41
- 230000008859 change Effects 0.000 claims description 19
- 230000008569 process Effects 0.000 claims description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 5
- 229910021555 Chromium Chloride Inorganic materials 0.000 claims description 5
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- 239000011651 chromium Substances 0.000 claims description 5
- QSWDMMVNRMROPK-UHFFFAOYSA-K chromium(3+) trichloride Chemical compound [Cl-].[Cl-].[Cl-].[Cr+3] QSWDMMVNRMROPK-UHFFFAOYSA-K 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims description 4
- 238000010521 absorption reaction Methods 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 2
- 229910052760 oxygen Inorganic materials 0.000 claims 2
- 239000001301 oxygen Substances 0.000 claims 2
- 230000003247 decreasing effect Effects 0.000 claims 1
- 238000009738 saturating Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 description 8
- 230000007423 decrease Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000035699 permeability Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000007062 hydrolysis Effects 0.000 description 3
- 238000006460 hydrolysis reaction Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 238000000862 absorption spectrum Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910001430 chromium ion Inorganic materials 0.000 description 1
- JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 208000017983 photosensitivity disease Diseases 0.000 description 1
- 231100000434 photosensitization Toxicity 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- -1 that is Chemical compound 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/54—Absorbers, e.g. of opaque materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/22—Exposing sequentially with the same light pattern different positions of the same surface
Abstract
The disclosure provides a kind of mask plate and preparation method thereof, mask plate exposure system and splicing exposure method, is related to technical field of semiconductors.The mask plate includes mask plate body and the ultraviolet light absorbing layer positioned at the splicing exposure area of mask plate body；In the ultraviolet light absorbing layer content of UV light absorbing materials in exposure area is spliced along preset direction alternation so that through the uv transmittance of the splicing exposure area along preset direction alternation；Wherein, the UV light absorbing materials of different content correspond to different ultraviolet light light transmittances.The disclosure can avoid the phenomenon that splicing faulted joint and promote the fault-tolerant ability of stitching portion.
Description
Technical field
This disclosure relates to technical field of semiconductors more particularly to a kind of mask plate and preparation method thereof, mask plate exposure system
System and splicing exposure method.
Background technology
With the development of optical technology and semiconductor technology, with liquid crystal display (Liquid Crystal Display,
LCD) and organic light emitting diode display (Organic Light Emitting Diode, OLED) be representative FPD
Utensil has the features such as frivolous, low energy consumption, reaction speed is fast, excitation purity is good and contrast is high, is occupied in display field leading
Status.
In existing manufacturing process, array substrate or color membrane substrates are limited be subject to mask board size and substrate size
It is fixed so that the single panel of portioned product needs to expose by the splicing of at least 2 times.Based on this Exposure mode, such as Fig. 1 institutes
Show, be limited to exposure accuracy so that mask plate 01 and mask plate 02 are difficult to ensure that splicing exposure directions in splicing exposure area 03
The stringent docking of (arrow direction in figure) for example horizontal/longitudinal figure.In addition, it is 100% energy in each mask plate
Under conditions of exposure, as shown in Fig. 2, the photoactive substance 04 of double exposure process can be completely photosensitive, it may so cause to splice
It stitches 05 fracture and causes display abnormal, caused by for black matrix (Black Matrix, BM) layer is then light leak.
It should be noted that information is only used for strengthening the reason to the background of the disclosure disclosed in above-mentioned background section
Solution, therefore can include not forming the information to the prior art known to persons of ordinary skill in the art.
The content of the invention
Be designed to provide a kind of mask plate and preparation method thereof, mask plate exposure system and the splicing of the disclosure expose
Light method, and then one or more caused by the limitation of correlation technique and defect is overcome to ask at least to a certain extent
Topic.
Other characteristics and advantage of the disclosure will be by the following detailed description apparent from or partially by the disclosure
Practice and acquistion.
According to one aspect of the disclosure, a kind of mask plate is provided, including mask plate body and positioned at the mask plate
The ultraviolet light absorbing layer of the splicing exposure area of body；
In the ultraviolet light absorbing layer content of UV light absorbing materials in the splicing exposure area along preset direction
Alternation so that through the splicing exposure area uv transmittance along the preset direction alternation；
Wherein, the UV light absorbing materials of different content correspond to different ultraviolet light light transmittances.
In a kind of exemplary embodiment of the disclosure, the ultraviolet light absorbing layer includes chromium oxide coating, the ultraviolet light
Absorbing material includes chromium oxide.
In a kind of exemplary embodiment of the disclosure, the content of chromium oxide is exposed according to the splicing in the chromium oxide coating
Distance in light region with splicing seams changes linearly.
In a kind of exemplary embodiment of the disclosure, the concentration of chromium oxide is along the preset direction in the chromium oxide coating
Alternation.
In a kind of exemplary embodiment of the disclosure, along the preset direction, chromium oxide is dense in the chromium oxide coating
Consecutive variations are spent, so that the uv transmittance is by 0 consecutive variations to 100%.
In a kind of exemplary embodiment of the disclosure, along the preset direction, chromium oxide is dense in the chromium oxide coating
Spend Discrete Change；
Wherein, the splicing exposure area includes multiple uptake zones, aoxidizing in the chromium oxide coating of each uptake zone
The concentration of chromium corresponds to multiple concentration values of alternation respectively so that the uv transmittance respectively correspond to 0~100% in it is multiple
Transmitance.
In a kind of exemplary embodiment of the disclosure, the thickness of the chromium oxide coating is along the preset direction alternation.
In a kind of exemplary embodiment of the disclosure, along the preset direction, the thickness of the chromium oxide coating continuously becomes
Change, so that the uv transmittance is by 0 consecutive variations to 100%.
In a kind of exemplary embodiment of the disclosure, along the preset direction, the discrete change of thickness of the chromium oxide coating
Change；
Wherein, the splicing exposure area includes multiple uptake zones, the thickness of the chromium oxide coating of each uptake zone
Incremental multiple thickness values are corresponded to respectively, so that the uv transmittance corresponds to multiple transmitances in 0~100% respectively.
In a kind of exemplary embodiment of the disclosure, the UV light absorbing materials are 350~450nm for absorbing wavelength
Black light.
According to one aspect of the disclosure, a kind of preparation method of mask plate is provided, including：
Ultraviolet light absorbing layer is formed in the splicing exposure area of mask plate body, ultraviolet light is inhaled in the ultraviolet light absorbing layer
Receive material content it is described splicing exposure area in along preset direction alternation so that through it is described splicing exposure area it is ultraviolet
Light transmission rate is along the preset direction alternation；
Wherein, the UV light absorbing materials of different content correspond to different ultraviolet light light transmittances.
In a kind of exemplary embodiment of the disclosure, the formation ultraviolet light absorbing layer includes：
It generates hydrated chromium oxide using chromium chloride Hydrolyze method and passes through spraying process and form chromium oxide coating.
According to one aspect of the disclosure, a kind of mask plate exposure system is provided, including above-mentioned mask plate.
According to one aspect of the disclosure, a kind of splicing exposure method is provided, including：
One group of above-mentioned mask plate is provided, this group of mask plate has common splicing exposure area；
Exposure base is treated using this group of mask plate to be exposed, so that a mask plate is in the splicing exposure area
UV light permeability amount be incremented by according to reference direction, another mask plate the splicing exposure area uv transmittance
Successively decrease according to reference direction；
Wherein, the reference direction is the splicing exposure directions of this group of mask plate and corresponds to the pre- of wherein one mask plate
Set direction.
Mask plate that disclosure illustrative embodiments are provided and preparation method thereof, mask plate exposure system and spelling
Exposure method is connect, by forming ultraviolet light absorbing layer in the splicing exposure area of mask plate body and controlling the ultraviolet light absorbing layer
The content gradual change of middle UV light absorbing materials can be directed to the light intensity tune that the splicing exposure area carries out uv transmittance
System.It based on this, during exposure is spliced, treats exposure base using groups of multiple mask plates and is exposed, so that should
The splicing exposure area of multiple mask plates after multiexposure, multiple exposure by that can reach the 100% of light intensity, i.e., by repeatedly incomplete
It exposes and realizes the complete exposure of 100% light intensity, so can effectively avoid the boundary in splicing exposure area because repeatedly
Completely exposure and caused by splicing seams be broken, include horizontal and vertical splicing effect so as to improve all directions, while can also
Ensure in the case of slight shift splicing part mutually in succession, so as to improve the fault-tolerant ability of stitching portion.
It should be appreciated that above general description and following detailed description are only exemplary and explanatory, not
The disclosure can be limited.
Description of the drawings
Attached drawing herein is merged in specification and forms the part of this specification, shows the implementation for meeting the disclosure
Example, and for explaining the principle of the disclosure together with specification.It should be evident that the accompanying drawings in the following description is only the disclosure
Some embodiments, for those of ordinary skill in the art, without creative efforts, can also basis
These attached drawings obtain other attached drawings.
Fig. 1 schematically shows the schematic diagram of mask plate splicing exposure in the prior art；
Fig. 2 schematically shows the schematic diagram of splicing seams fracture in the prior art；
Fig. 3 schematically shows the structure diagram of mask plate in disclosure exemplary embodiment；
Fig. 4 schematically shows the schematic diagram of mask plate splicing exposure in disclosure exemplary embodiment
Fig. 5 schematically shows the uv absorption spectra of chromium oxide in disclosure exemplary embodiment；
Fig. 6 schematically shows the UV energy change curve for splicing exposure area in disclosure exemplary embodiment；
Fig. 7 schematically shows the schematic diagram of the preparation facilities of chromium oxide coating in disclosure exemplary embodiment；
Fig. 8 schematically shows the flow chart for splicing exposure method in disclosure exemplary embodiment.
Specific embodiment
Example embodiment is described more fully with reference to the drawings.However, example embodiment can be real in a variety of forms
It applies, and is not understood as limited to example set forth herein；On the contrary, these embodiments are provided so that the disclosure will more comprehensively and
Completely, and by the design of example embodiment comprehensively it is communicated to those skilled in the art.Described feature, structure or characteristic
It can in any suitable manner be incorporated in one or more embodiments.In the following description, many details are provided
Embodiment of the disclosure is fully understood so as to provide.It will be appreciated, however, by one skilled in the art that the disclosure can be put into practice
Technical solution and omit one or more in the specific detail or may be employed other methods, constituent element, device,
Step etc..In other cases, known solution is not shown in detail or describes to avoid all aspects of this disclosure is made to become mould
Paste.
In addition, attached drawing is only the schematic illustrations of the disclosure, it is not necessarily drawn to scale.The thickness of each layer in attached drawing
Do not reflect actual proportions with shape, be merely for convenience and purposes of illustration content of this disclosure.Identical reference numeral represents identical in figure
Or similar part, thus repetition thereof will be omitted.
This example embodiment provides a kind of mask plate 10, including splicing exposure area 10a and separate exposures region
10b carries out splicing exposure for treating exposure base.As shown in figure 3, the mask plate 10 can include mask plate body 101
And the ultraviolet light absorbing layer 102 of 101 surface of mask plate body and corresponding splicing exposure area 10a are covered in, which inhales
Receive layer 102 in UV light absorbing materials content can in exposure area 10a splice along preset direction alternation for example incrementally or
Person successively decreases so that through splicing exposure area 10a uv transmittance can along preset direction alternation for example be incremented by or
Successively decrease.
Wherein, the UV light absorbing materials can be used for the black light that absorbing wavelength is 350~450nm, different content
UV light absorbing materials correspond to different ultraviolet light light transmittances.
It should be noted that：The preset direction refers to splicing exposure side of the different mask plates 10 when carrying out splicing exposure
To such as mask plate body 101 laterally and/or longitudinally, splicing exposure region can be specifically directed toward by separate exposures region 10b
Domain 10a, at this time the content of UV light absorbing materials can successively decrease along preset direction or can also by splice exposure area 10a refer to
To separate exposures region 10b, the content of UV light absorbing materials can be incremented by along preset direction at this time.
The mask plate 10 that disclosure illustrative embodiments are provided passes through the splicing exposure region in mask plate body 101
Domain 10a forms ultraviolet light absorbing layer 102 and controls the content gradual change of UV light absorbing materials in the ultraviolet light absorbing layer 102, just
The intensity modulation that splicing exposure area 10a carries out uv transmittance can be directed to.Based on this, as shown in Figure 4, exposed in splicing
In the process of light, treat exposure base 40 using groups of multiple mask plates 10 and be exposed, so that the plurality of mask plate 10
Splicing exposure area 10a is realized by that can reach the 100% of light intensity after multiexposure, multiple exposure by multiple not exclusively exposure
The complete exposure of 100% light intensity so can effectively avoid the boundary in splicing exposure area 10a because of repeatedly exposure completely
Splicing seams caused by and are broken, and are included horizontal and vertical splicing effect so as to improve all directions, while are also ensured light
In the case of micro- offset splicing part mutually in succession, so as to improve the fault-tolerant ability of stitching portion.
In this example embodiment, the ultraviolet light absorbing layer 102 can include chromium oxide coating, and the ultraviolet light is inhaled
Chromium oxide can be included by receiving material.As shown in figure 5, being specially hexavalent chromium under alkaline environment due to chromium oxide near purple
Outer light has good assimilation effect, therefore the transmitance of the i.e. controllable black light of content by adjusting chromium oxide, so as to
Realize the intensity modulation of black light.
Wherein, as shown in fig. 6, the content of chromium oxide can be according in splicing exposure area 10a in the chromium oxide coating
It is changed linearly with the distance of splicing seams, so that can also be with the distance with splicing seams through the UV energy of mask plate 10
Linear conversion can specifically be changed linearly along preset direction from one end to the other end for splicing exposure area 10a, to adopt
With multiple mask plates 10 can easily carry out the control of light intensity during splicing exposure so that by the more of multiple mask plates 10
It can reach complete exposure intensity i.e. the 100% of ultraviolet light light intensity after secondary exposure.
Certainly, in the chromium oxide coating chromium oxide content can also according to splicing exposure area 10a in splicing seams
Distance in nonlinear change, as long as can ensure that after the multiexposure, multiple exposure by multiple mask plates 10 complete exposure can be reached
Intensity, it is other not make mandatory restriction.
In actual production, the mercury lamp used at present can make photoresist generate photosensitization, mainly be risen in spectrum photosensitive
Effect is the spectrum of tri- kinds of wavelength of g, h, i.Since photoresist is for the light sensitive of specific wavelength, this characteristic is utilized
Film layer, that is, chromium oxide coating that there is absorption to tri- kinds of light waves of g, h, i is made, you can reach and change through light-wave energy
Purpose.Wherein, the corresponding wavelength of g, h, i is 436nm, 405nm, 365nm.As can be seen from FIG. 5, using chromium oxide, that is, chromium from
The absorption spectrum of son can cover the wavelength of the scope, so as to fulfill the purpose changed through light intensity.
In a kind of this exemplary embodiment, the content of chromium oxide can pass through chromium oxide in the chromium oxide coating
Concentration is controlled, i.e.,：The concentration of chromium oxide can be along preset direction alternation in the chromium oxide coating.
Wherein, along the preset direction, the concentration of chromium oxide can be with consecutive variations, so that ultraviolet light in the chromium oxide coating
Transmitance can be by 0 consecutive variations to 100%.In the case, when multiple such as two mask plates 10 of use carry out splicing exposure
Light time only need to make the preset direction of two mask plates 10 on the contrary, so that in the same direction by one of mask plate 10
Uv transmittance can be by 0 consecutive variations to 100%, and can be by by the uv transmittance of another mask plate 10
100% consecutive variations, so can be by the way that not exclusively exposure once exposes completely to realize twice to 0.
Alternatively, along the preset direction, in the chromium oxide coating concentration of chromium oxide can also Discrete Change so that ultraviolet
Light transmission rate discontinuous can be changed to 100% by 0；Wherein, the splicing exposure area 10a can include multiple uptake zones,
And the concentration of chromium oxide corresponds to multiple concentration values of alternation respectively in the chromium oxide coating of each uptake zone, so that UV light permeability
Rate corresponds to multiple transmitances of alternation in 0~100% respectively.In the case, when using multiple such as two mask plates 10 into
During row splicing exposure, only it need to make the preset direction of two mask plates 10 on the contrary, so as to being covered in the same direction by one of them
The uv transmittance of template 10 can be changed to 100%, such as the corresponding uv transmittance point in each uptake zone by 0 interruption
Not Wei 0,30%, 60% and 100%, and can be changed by the uv transmittance of another mask plate 10 by 100% interruption
To 0, such as the corresponding uv transmittance in each uptake zone is respectively 100%, 70%, 40% and 0, and two mask plates 10
Each uptake zone position it is corresponding, so can by twice not exclusively exposure and realize once completely exposure.
But, it is contemplated that the oxidation chromium concn of consecutive variations can obtain the uv transmittance of consecutive variations, so have
Beneficial to the uniform excessive of guarantee splicing exposure area 10a, so as to effectively reduce the generation of splicing mura, therefore this example
Embodiment preferably uses the former scheme.
In this exemplary another embodiment, the content of chromium oxide can be applied by chromium oxide in the chromium oxide coating
The thickness of layer is controlled, i.e.,：The thickness of the chromium oxide coating can be along preset direction alternation.
Wherein, along the preset direction, the thickness of the chromium oxide coating can be with consecutive variations, so that uv transmittance energy
Enough by 0 consecutive variations to 100%.In the case, when carrying out splicing exposure using multiple such as two mask plates 10, only need
Make the preset direction of two mask plates 10 on the contrary, so that in the same direction by the UV light permeability of one of mask plate 10
Rate can be by 0 consecutive variations to 100%, and can continuously be become by 100% by the uv transmittance of another mask plate 10
Change to 0, it so can be by not exclusively exposure twice and realization once exposure completely.
Alternatively, along the preset direction, the thickness of the chromium oxide coating can also Discrete Change so that uv transmittance
Discontinuous 100% can be changed to by 0；Wherein, the splicing exposure area 10a can include multiple uptake zones, and each suction
The thickness for receiving the chromium oxide coating in area correspond to multiple thickness values of alternation respectively so that uv transmittance respectively corresponding 0~
Multiple transmitances of alternation in 100%.In the case, when carrying out splicing exposure using multiple such as two mask plates 10,
The preset direction of two mask plates 10 only need to be made on the contrary, so that in the same direction by the ultraviolet light of one of mask plate 10
Transmitance can be changed to 100% by 0 interruption, for example, the corresponding uv transmittance in each uptake zone is respectively 0,30%,
60% and 100%, and 0 can be changed to by 100% interruption by the uv transmittance of another mask plate 10, for example (,) it is each
The corresponding uv transmittance in uptake zone is respectively 100%, 70%, 40% and 0, and each uptake zone of two mask plates 10
Position it is corresponding, so can by twice not exclusively exposure and realize once completely exposure.
But, it is contemplated that the chromium oxide coating thickness of consecutive variations can obtain the uv transmittance of consecutive variations, this
Sample advantageously ensures that splicing exposure area 10a's is uniform excessive, so as to effectively reduce the generation of splicing mura, therefore this
Example embodiment preferably uses the former scheme.
Based on above-mentioned mask plate 10, this example embodiment additionally provides a kind of preparation method of mask plate, the mask
The preparation method of plate can include：
Ultraviolet light absorbing layer 102, the ultraviolet light absorbing layer are formed in the splicing exposure area 10a of mask plate body 101
The content of UV light absorbing materials is for example incremented by or successively decreases along preset direction alternation in exposure area 10a is spliced in 102, with
Make for example to be incremented by or successively decrease through the uv transmittance of splicing exposure area 10a along preset direction alternation.
Wherein, the UV light absorbing materials can be used for the black light that absorbing wavelength is 350~450nm, different content
UV light absorbing materials correspond to different ultraviolet light light transmittances.
The preparation method for the mask plate 10 that disclosure illustrative embodiments are provided, by mask plate body 101
Splicing exposure area 10a forms ultraviolet light absorbing layer 102 and controls containing for UV light absorbing materials in the ultraviolet light absorbing layer 102
Gradual change is measured, the intensity modulation that splicing exposure area 10a carries out uv transmittance can be directed to.Based on this, exposed in splicing
In the process of light, treat exposure base using groups of multiple mask plates 10 and be exposed, so that the spelling of the plurality of mask plate 10
Exposure area 10a is met by the 100% of light intensity can be reached after multiexposure, multiple exposure, i.e., is realized by repeatedly incomplete exposure
The complete exposure of 100% light intensity so can effectively avoid the boundary in splicing exposure area 10a because of repeatedly exposure completely
Splicing seams caused by and are broken, and are included horizontal and vertical splicing effect so as to improve all directions, while are also ensured light
In the case of micro- offset splicing part mutually in succession, so as to improve the fault-tolerant ability of stitching portion.
This example embodiment, the forming method of the ultraviolet light absorbing layer 103 can for example include：Using chromium chloride water
Solution, which generates hydrated chromium oxide and passes through spraying process, forms chromium oxide coating.
Wherein, when using chromium chloride Hydrolyze method generation hydrated chromium oxide, can be controlled by the pH value of chromium chloride solution
Hydrolysis rate processed；When the cladding rate of deposition surface is suitable with the hydrolysis rate of chromium ion, the chromium oxide coating deposited is i.e.
The continuous film layer of flat smooth can be achieved.In addition, the stir speed (S.S.) by controlling film forming solvent, moreover it is possible to control the growth speed of nucleus
Degree.On this basis, quartz glass can be used in substrate for film deposition, the characteristic with glass in itself, therefore when need to only control reaction
Between i.e. controllable film forming thickness and film layer it is uniform excessively.
Specifically, as shown in fig. 7, the formation equipment of the chromium oxide coating is as follows：The technique stream sprayed using nozzle-type
Journey, on the one hand by controlling the spraying rate of nozzle 700, on the other hand by controlling the oblique sliding speed of mask plate 10 for example
Hundreds of nano level mobile accuracy controls are realized using " Michelson's interferometer ", you can realize the control of hydrolysis time,
So as to reach the accurate control of film forming thickness.
This example embodiment additionally provides a kind of mask plate exposure system, including above-mentioned mask plate 10.Wherein, adopting
When carrying out splicing exposure with multiple such as two mask plates 10, the preset direction of same group of mask plate 10 should be on the contrary, so that not
It is in the graded of opposite direction for the absorption of ultraviolet light with mask plate 10.For example, the first of a mask plate 10 is pre-
Set direction is that from top to bottom, uv transmittance in first preset direction is changed from 0 to 100%, and another mask plate
10 the second preset direction is that from bottom to top, uv transmittance is also to be changed from 0 to 100% in second preset direction,
But in the first preset direction changed from 100% to 0.
So, during exposure is spliced, treat exposure base 40 using groups of multiple mask plates 10 and carry out
Exposure, so that the splicing exposure area 10a of the plurality of mask plate 10 can reach the 100% of light intensity afterwards by multiexposure, multiple exposure,
The complete exposure of 100% light intensity is realized by repeatedly not exclusively exposing, so can effectively avoid in splicing exposure region
The boundary of domain 10a splicing seams caused by due to repeatedly exposure completely are broken, and are included so as to improve all directions horizontal and vertical
Splicing effect, while also ensure in the case of slight shift splicing part mutually in succession, so as to improve stitching portion
Fault-tolerant ability.
This example embodiment additionally provides a kind of splicing exposure method, as shown in figure 8, the splicing exposure method can wrap
It includes：
S1, one group of above-mentioned mask plate 10 is provided, this group of mask plate has common splicing exposure area；
S2, exposure base 40 is treated using this group of mask plate it is exposed, so that a mask plate 10 is in splicing exposure area
UV light permeability amount be incremented by according to reference direction, another mask plate 10 splicing exposure area uv transmittance according to ginseng
Direction is examined to successively decrease.
Wherein, the reference direction is the splicing exposure directions of this group of mask plate and presetting for a corresponding wherein mask plate 10
Direction, this group of mask plate reach complete exposure intensity in splicing exposure area by the exposure intensity of multiexposure, multiple exposure.
The splicing exposure method that disclosure illustrative embodiments are provided, it is right using groups of multiple aforementioned mask plates 10
Substrate to be exposed is exposed, so that the splicing exposure area 10a of the plurality of mask plate 10 after multiexposure, multiple exposure by that can reach
To the 100% of light intensity, i.e., realize the complete exposure of 100% light intensity by repeatedly not exclusively exposing, so can effectively keep away
Exempt from splicing seams caused by when splicing the boundary of exposure area 10a because repeatedly exposure completely to be broken, so as to improve all directions
Including horizontal and vertical splicing effect, at the same also ensure in the case of slight shift splicing part mutually in succession, from
And improve the fault-tolerant ability of stitching portion.
This example embodiment additionally provides a kind of splicing exposure product, using above-mentioned splicing exposure method preparation
.In this example embodiment, splicing exposure product for example can be array substrate or color membrane substrates, and the array base
Plate and the color membrane substrates can be used for forming display device.Wherein, the display device for example can include mobile phone, tablet computer,
Any product or component with display function such as television set, laptop, Digital Frame, navigator.
Those skilled in the art will readily occur to the disclosure its after considering specification and putting into practice invention disclosed herein
Its embodiment.This application is intended to cover any variations, uses, or adaptations of the disclosure, these modifications, purposes or
Person's adaptive change follows the general principle of the disclosure and including the undocumented common knowledge in the art of the disclosure
Or conventional techniques.Description and embodiments are considered only as illustratively, and the true scope and spirit of the disclosure are by appended
Claim is pointed out.
It should be appreciated that the present disclosure is not limited to the precise structures that have been described above and shown in the drawings, and
And various modifications and changes may be made without departing from the scope thereof.The scope of the present disclosure is only limited by appended claim.
Claims (14)
- A kind of 1. mask plate, which is characterized in that the splicing exposure region including mask plate body and positioned at the mask plate body The ultraviolet light absorbing layer in domain；In the ultraviolet light absorbing layer content of UV light absorbing materials in the splicing exposure area along preset direction alternation, So that through the splicing exposure area uv transmittance along the preset direction alternation；Wherein, the UV light absorbing materials of different content correspond to different ultraviolet light light transmittances.
- 2. mask plate according to claim 1, which is characterized in that the ultraviolet light absorbing layer includes chromium oxide coating, institute Stating UV light absorbing materials includes chromium oxide.
- 3. mask plate according to claim 2, which is characterized in that the content of chromium oxide is according to institute in the chromium oxide coating The distance in splicing exposure area with splicing seams is stated to change linearly.
- 4. the mask plate according to Claims 2 or 3, which is characterized in that the concentration edge of chromium oxide in the chromium oxide coating The preset direction alternation.
- 5. mask plate according to claim 4, which is characterized in that along the preset direction, oxygen in the chromium oxide coating Change the concentration consecutive variations of chromium, so that the uv transmittance is by 0 consecutive variations to 100%.
- 6. mask plate according to claim 4, which is characterized in that along the preset direction, oxygen in the chromium oxide coating Change the concentration Discrete Change of chromium；Wherein, the splicing exposure area includes multiple uptake zones, chromium oxide in the chromium oxide coating of each uptake zone Concentration corresponds to multiple concentration values of alternation respectively, so that the uv transmittance corresponds to multiple transmissions in 0~100% respectively Rate.
- 7. the mask plate according to Claims 2 or 3, which is characterized in that the thickness of the chromium oxide coating is preset along described Direction alternation.
- 8. mask plate according to claim 7, which is characterized in that along the preset direction, the thickness of the chromium oxide coating Consecutive variations are spent, so that the uv transmittance is by 0 consecutive variations to 100%.
- 9. mask plate according to claim 7, which is characterized in that along the preset direction, the thickness of the chromium oxide coating Spend Discrete Change；Wherein, the splicing exposure area includes multiple uptake zones, and the thickness of the chromium oxide coating of each uptake zone is distinguished Corresponding incremental multiple thickness values, so that the uv transmittance corresponds to multiple transmitances in 0~100% respectively.
- 10. mask plate according to claim 1, which is characterized in that the UV light absorbing materials are for absorbing wavelength The black light of 350~450nm.
- 11. a kind of preparation method of mask plate, which is characterized in that including：The UV Absorption material in the splicing exposure area of mask plate body formation ultraviolet light absorbing layer, the ultraviolet light absorbing layer The content of material it is described splicing exposure area in along preset direction alternation so that through it is described splicing exposure area ultraviolet light it is saturating Rate is crossed along the preset direction alternation；Wherein, the UV light absorbing materials of different content correspond to different ultraviolet light light transmittances.
- 12. preparation method according to claim 11, which is characterized in that the formation ultraviolet light absorbing layer includes：It generates hydrated chromium oxide using chromium chloride Hydrolyze method and passes through spraying process and form chromium oxide coating.
- 13. a kind of mask plate exposure system, which is characterized in that including claim 1-10 any one of them mask plates.
- 14. a kind of splicing exposure method, which is characterized in that including：One group of such as claim 1-10 any one of them mask plate is provided, this group of mask plate has common splicing exposure region Domain；Exposure base is treated using this group of mask plate to be exposed, so that purple of the mask plate in the splicing exposure area Outer smooth transit dose is incremented by according to reference direction, another mask plate the splicing exposure area uv transmittance according to Reference direction is successively decreased；Wherein, the reference direction is the splicing exposure directions of this group of mask plate and the default side of corresponding wherein one mask plate To.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201810004543.9A CN108051980B (en) | 2018-01-03 | 2018-01-03 | Mask plate and preparation method thereof, mask plate exposure system and splicing exposure method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810004543.9A CN108051980B (en) | 2018-01-03 | 2018-01-03 | Mask plate and preparation method thereof, mask plate exposure system and splicing exposure method |
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| CN108051980A true CN108051980A (en) | 2018-05-18 |
| CN108051980B CN108051980B (en) | 2020-11-27 |
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| CN201974632U (en) * | 2011-04-12 | 2011-09-14 | 京东方科技集团股份有限公司 | Masking film plate and masking film plate module |
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|---|---|
| CN108051980B (en) | 2020-11-27 |
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