CN108047986A - Solid conductive hot-melt silver adhesive - Google Patents
Solid conductive hot-melt silver adhesive Download PDFInfo
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- CN108047986A CN108047986A CN201711419760.6A CN201711419760A CN108047986A CN 108047986 A CN108047986 A CN 108047986A CN 201711419760 A CN201711419760 A CN 201711419760A CN 108047986 A CN108047986 A CN 108047986A
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- elargol
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/06—Polyurethanes from polyesters
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0806—Silver
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
Abstract
A solid conductive hot-melt silver adhesive. The silver paste comprises a conductive silver paste matrix, micron silver powder and nanometer silver powder, and is characterized in that the conductive silver paste matrix accounts for 10-50 parts by weight, the micron silver powder accounts for 1-40 parts by weight, and the nanometer silver powder accounts for 10-60 parts by weight. The invention is used for the solid conductive hot-melt silver adhesive.
Description
Technical field：
The present invention relates to a kind of type solid-state conductives to heat elargol.
Background technology：
Conductive silver glue is widely used in industries such as electronics, information, plating, the conductive adhesive being mainly used between object.Conductive silver
Glue is widely used in electromagnetic shielding, the plating base materials such as precoated shet and flexible PCB (PEI, PI), forms the fields such as conducting wire.
Matrix resin of the existing conductive silver glue generally use epoxy resin as conductive silver glue, addition rubber etc. is flexible big
Molecule, the brittleness for improving epoxy resin by the use of long-chain Flexible Amine as curing agent obtain the conductive silver glue of soft elastic, this conduction
Elargol is in a liquid state.There are harsh transport and storage request, it usually needs needed behind Cord blood and Kaifeng within the extremely short time
It uses, is easy to cause to waste in normal production；Spot gluing equipment is needed in production, adds up-front investment and production cost.
The performances such as liquid elargol adhesive force after hardening and electrical property are all good, but silver layer quick-boiled tripe, cracking, film layer are complete after weld formation
Full failure.
Due to more than, existing market is there is an urgent need to a kind of transport easy to maintain, and simple production process, bond effect is good to lead
Electric elargol.
The content of the invention：
The object of the present invention is to provide a kind of transport easy to maintain, simple production process, a kind of good type solid-state conductives of bond effect
Heat elargol.
Above-mentioned purpose is realized by following technical scheme：
A kind of type solid-state conductive heats elargol, and composition includes:Conductive silver glue matrix, micro-silver powder, nano-silver powder, described leads
The parts by weight of electric elargol matrix are 10~50 parts, and the parts by weight of the micro-silver powder are 1~40 part, the nano silver
The parts by weight of powder are 10~60 parts.
A kind of type solid-state conductive hot melt elargol, the parts by weight of the conductive silver glue matrix are 10 parts, described
Micro-silver powder parts by weight for 1 part, the parts by weight of the nano-silver powder are 10 parts.
A kind of type solid-state conductive hot melt elargol, the parts by weight of the conductive silver glue matrix are 50 parts, described
Micro-silver powder parts by weight for 40 parts, the parts by weight of the nano-silver powder are 60 parts.
A kind of described type solid-state conductive hot melt elargol, the shape of the micro-silver powder are sheet or spherical, grain
Footpath is 1~5 × 103nm；The shape of the nano-silver powder is flaky nanometer silver powder or spherical nano-silver powder.
A kind of type solid-state conductive hot melt elargol, the length of the flaky nanometer silver powder is 2~8 × 103 Nm, institute
The grain size for the spherical nano-silver powder stated is 1~5nm.
A kind of preparation method of type solid-state conductive hot melt elargol, the thermostatted water of the first step of this preparation method at 80~90 DEG C
Under bath, by flexible additive add in dispersant in heating stirring to being completely dissolved, finally again by curing agent, coupling agent and epoxy
Resin slowly adds in, and is heated with stirring to and is completely dissolved, and conductive silver glue matrix is obtained after cooling；Second step is by micro-silver powder and receives
Rice silver powder is mixed to get mixing silver powder according to parts by weight, and mixing silver powder with conductive silver glue matrix is mixed, is rolled after grinding distribution
Paste object is made to get to conductive silver glue.
A kind of preparation method of type solid-state conductive hot melt elargol, the conductive silver glue matrix is by following component
It reacts：The content of polyester polyol is 30-50Wt%, diphenyl methane -4,4- diisocyanate（MDI）Content be 25-
35 Wt%, toluene di-isocyanate(TDI)（MDI）Content for 5-10 Wt%, 1,4- butanediols（1,4-BDO) content of chain extender is
2-7 Wt%, the content of aromatic diamine chain stretching agent are 10-20 Wt%, the content of additive is 0.1-2 Wt%；The additive
One or several kinds in titanium dioxide, zinc stearate, gas phase of white carbon black, the aromatic diamine chain stretching agent are 2,4- diaminos
Base -3,5- dimethyl sulphur-based toluene or 2,6- diamino -3,5- dimethyl sulphur-based toluene or the mixture of the two；Wherein each component summation
For 100wt%；The wherein described polyester polyol is by the one or more in ethylene glycol, 1,4-butanediol, 1,6- hexylene glycols
Mixture is reacted with adipic acid, and number-average molecular weight is 2000~2200 g/mol；The number of the polyurethane hot melt is equal
Molecular weight is 50000-100000 g/mol.
A kind of preparation method of described type solid-state conductive hot melt elargol, the polyester polyols in the conductive silver glue matrix
Alcohol is to be prepared in the following way：By one or more kinds of mixing in ethylene glycol, 1,4-butanediol, 1,6- hexylene glycols
Object is mixed with adipic acid according to molar ratio of alcohol to acid example 1: 1.25, in the presence of catalyst Ti acid butyl ester, in 140~220
Carried out at DEG C reaction 7~10 it is small when, then vacuumize, the reaction was continued 3~5 it is small when, so as to prepare polyester polyol.
A kind of preparation method of described type solid-state conductive hot melt elargol, the polyurethane heat in the conductive silver glue matrix
The number-average molecular weight of melten gel is 85000-95000g/mol.
A kind of preparation method of described type solid-state conductive hot melt elargol, the shape of the micro-silver powder for sheet or
Spherical, grain size is 1~5 × 103nm；The nano-silver powder be flaky nanometer silver powder or spherical nano-silver powder, the piece
The length of shape nano-silver powder is 2~8 × 103Nm, the grain size of the spherical nano-silver powder is 1~5nm.
Advantageous effect：
1. present invention incorporates the advantages of conventional solid-state hot melt adhesive glue and conventional conductive elargol, a kind of polyurethane hot melt has been manufactured
The silver powder of certain particle size distribution and granule-morphology is added, finished product is solid-state, heats solidify afterwards；The molecular weight of polyurethane hot melt
For 95000~115000, there is low bonding temperature, rapid crystallization, easily stored and process operation.
Silver layer after the present invention cures can obtain relatively low resistivity, and improve production efficiency and product quality, drop
The use of low client and production cost.
The numbers such as relative molecular mass, mechanical property, melt viscosity, the adhesive strength of solid-state conductive hot melt elargol of the present invention
Value stabilization can be stored at normal temperatures.
The hot melt adhesive of the present invention has higher adhesive strength after SMT Reflow Solderings.
The solid-state conductive glue resistivity of the present invention can reach 3.5 × 10-5 Ω cm, far above domestic common conductive elargol
2 × 10-4 Ω cm.
The present invention had both solved the inconvenience of existing liquid conducting resinl storage transport, in turn simplifies the technological process of production, cancels
Dispensing link；And colloid again with very high caking property, there is very high economic value in itself.
Specific embodiment：
Embodiment 1：
A kind of type solid-state conductive heats elargol, and composition includes:Conductive silver glue matrix, micro-silver powder, nano-silver powder, described leads
The parts by weight of electric elargol matrix are 10~50 parts, and the parts by weight of the micro-silver powder are 1~40 part, the nano silver
The parts by weight of powder are 10~60 parts.
Embodiment 2：
A kind of type solid-state conductive hot melt elargol described in embodiment 1, the parts by weight of the conductive silver glue matrix are 10 parts, institute
The parts by weight for the micro-silver powder stated are 1 part, and the parts by weight of the nano-silver powder are 10 parts.
Embodiment 3：
A kind of type solid-state conductive hot melt elargol described in embodiment 1, the parts by weight of the conductive silver glue matrix are 50 parts, institute
The parts by weight for the micro-silver powder stated are 40 parts, and the parts by weight of the nano-silver powder are 60 parts.
Embodiment 4：
A kind of type solid-state conductive hot melt elargol described in embodiment 1, the parts by weight of the conductive silver glue matrix are 30 parts, institute
The parts by weight for the micro-silver powder stated are 30 parts, and the parts by weight of the nano-silver powder are 30 parts.
Embodiment 5：
A kind of type solid-state conductive hot melt elargol described in embodiment 1, the parts by weight of the conductive silver glue matrix are 40 parts, institute
The parts by weight for the micro-silver powder stated are 20 parts, and the parts by weight of the nano-silver powder are 50 parts.
Embodiment 6：
A kind of type solid-state conductive hot melt elargol described in embodiment 1 or 2 or 3 or 4 or 5, the shape of the micro-silver powder is piece
Shape is spherical, and grain size is 1~5 × 103nm；The shape of the nano-silver powder is flaky nanometer silver powder or spherical nanometer
Silver powder.
Embodiment 7：
A kind of type solid-state conductive hot melt elargol described in embodiment 6, the length of the flaky nanometer silver powder is 2~8 × 103
Nm, the grain size of the spherical nano-silver powder is 1~5nm.
Embodiment 8：
A kind of preparation method of type solid-state conductive hot melt elargol, the water bath with thermostatic control of the first step of this preparation method at 80~90 DEG C
Under, by flexible additive add in dispersant in heating stirring to being completely dissolved, finally again by curing agent, coupling agent and asphalt mixtures modified by epoxy resin
Fat slowly adds in, and is heated with stirring to and is completely dissolved, and conductive silver glue matrix is obtained after cooling；Second step is by micro-silver powder and nanometer
Silver powder is mixed to get mixing silver powder according to parts by weight, and mixing silver powder with conductive silver glue matrix is mixed, is rolled after grinding distribution
Into uniform paste object to get to conductive silver glue.Flexible additive is the third glue of second, and dispersant is calgon or trimerization phosphorus
Sour sodium, curing agent are crosslinking agent XR-500, and coupling agent is triatomic silanol.
Embodiment 9：
A kind of preparation method of type solid-state conductive hot melt elargol described in embodiment 8, the first step of this preparation method is at 80 DEG C
Under water bath with thermostatic control, by flexible additive add in dispersant in heating stirring to being completely dissolved, finally again by curing agent, coupling agent with
And epoxy resin slowly adds in, and is heated with stirring to and is completely dissolved, and conductive silver glue matrix is obtained after cooling；Second step is silver-colored by micron
Powder and nano-silver powder are mixed to get mixing silver powder according to parts by weight, mixing silver powder are mixed with conductive silver glue matrix, grinding point
Uniform paste object is rolled into after dissipating to get to conductive silver glue.
Embodiment 10：
A kind of preparation method of type solid-state conductive hot melt elargol described in embodiment 8, the first step of this preparation method is at 90 DEG C
Under water bath with thermostatic control, by flexible additive add in dispersant in heating stirring to being completely dissolved, finally again by curing agent, coupling agent with
And epoxy resin slowly adds in, and is heated with stirring to and is completely dissolved, and conductive silver glue matrix is obtained after cooling；Second step is silver-colored by micron
Powder and nano-silver powder are mixed to get mixing silver powder according to parts by weight, mixing silver powder are mixed with conductive silver glue matrix, grinding point
Uniform paste object is rolled into after dissipating to get to conductive silver glue.
Embodiment 11：
A kind of preparation method of type solid-state conductive hot melt elargol described in embodiment 8, the first step of this preparation method is at 85 DEG C
Under water bath with thermostatic control, by flexible additive add in dispersant in heating stirring to being completely dissolved, finally again by curing agent, coupling agent with
And epoxy resin slowly adds in, and is heated with stirring to and is completely dissolved, and conductive silver glue matrix is obtained after cooling；Second step is silver-colored by micron
Powder and nano-silver powder are mixed to get mixing silver powder according to parts by weight, mixing silver powder are mixed with conductive silver glue matrix, grinding point
Uniform paste object is rolled into after dissipating to get to conductive silver glue.
Embodiment 12：
A kind of preparation method of type solid-state conductive hot melt elargol described in embodiment 6, the conductive silver glue matrix is by as follows
Component reaction forms：The content of polyester polyol is 30-50Wt%, diphenyl methane -4,4- diisocyanate（MDI）Content
For 25-35 Wt%, toluene di-isocyanate(TDI)（MDI）Content for 5-10 Wt%, 1,4- butanediols（1,4-BDO) chain extender contains
The content measured as 2-7 Wt%, aromatic diamine chain stretching agent is 10-20 Wt%, the content of additive is 0.1-2 Wt%；Described adds
Add one or several kinds of the agent in titanium dioxide, zinc stearate, gas phase of white carbon black, the aromatic diamine chain stretching agent is 2,4-
Diamino -3,5- dimethyl sulphur-based toluene or 2,6- diamino -3,5- dimethyl sulphur-based toluene or the mixture of the two；Wherein each component
Summation is 100wt%；The wherein described polyester polyol is by one kind or more in ethylene glycol, 1,4-butanediol, 1,6- hexylene glycols
The mixture of kind is reacted with adipic acid, and number-average molecular weight is 2000~2200 g/mol；The polyurethane hot melt
Number-average molecular weight is 50000-100000 g/mol.
Embodiment 13：
A kind of preparation method of type solid-state conductive hot melt elargol described in embodiment 12, the conductive silver glue matrix is by as follows
Component reaction forms：The content of polyester polyol is 30Wt%, diphenyl methane -4,4- diisocyanate（MDI）Content be 25
Wt%, toluene di-isocyanate(TDI)（MDI）Content be 5 Wt%, 1,4- butanediols（1,4-BDO) content of chain extender for 2 Wt%,
The content of aromatic diamine chain stretching agent is 10 Wt%, the content of additive is 0.1 Wt%；The additive is selected from titanium dioxide, hard
One or several kinds in ester acid zinc, gas phase of white carbon black, the aromatic diamine chain stretching agent are 2,4- diamino -3,5- dimethyl sulfide
Base toluene or 2,6- diamino -3,5- dimethyl sulphur-based toluene or the mixture of the two；Wherein each component summation is 100wt%；Its
Described in polyester polyol by one or more mixtures in ethylene glycol, 1,4-butanediol, 1,6- hexylene glycols with oneself two
Acid reacts, number-average molecular weight 2000g/mol；The number-average molecular weight of the polyurethane hot melt is 50000 g/mol.
Embodiment 14：
A kind of preparation method of type solid-state conductive hot melt elargol described in embodiment 12, the conductive silver glue matrix is by as follows
Component reaction forms：The content of polyester polyol is 50Wt%, diphenyl methane -4,4- diisocyanate（MDI）Content be 35
Wt%, toluene di-isocyanate(TDI)（MDI）Content be 10 Wt%, 1,4- butanediols（1,4-BDO) content of chain extender for 7 Wt%,
The content of aromatic diamine chain stretching agent is 20 Wt%, the content of additive is 2 Wt%；The additive is selected from titanium dioxide, hard ester
One or several kinds in sour zinc, gas phase of white carbon black, the aromatic diamine chain stretching agent are 2,4- diamino -3,5- dimethyl sulphur-baseds
Toluene or 2,6- diamino -3,5- dimethyl sulphur-based toluene or the mixture of the two；Wherein each component summation is 100wt%；Wherein
The polyester polyol is by one or more mixtures and adipic acid in ethylene glycol, 1,4-butanediol, 1,6- hexylene glycols
It reacts, number-average molecular weight is 2200 g/mol；The number-average molecular weight of the polyurethane hot melt is 100000 g/mol.
Embodiment 15：
The preparation method of a kind of type solid-state conductive hot melt elargol described in embodiment 6 or 12, in the conductive silver glue matrix
Polyester polyol is to be prepared in the following way：It will be a kind of or more in ethylene glycol, 1,4-butanediol, 1,6- hexylene glycols
The mixture of kind is mixed with adipic acid according to molar ratio of alcohol to acid example 1: 1.25, in the presence of catalyst Ti acid butyl ester, in
Carried out at 140~220 DEG C reaction 7~10 it is small when, then vacuumize, the reaction was continued 3~5 it is small when, so as to prepare polyester polyols
Alcohol.
Embodiment 16：
The preparation method of a kind of type solid-state conductive hot melt elargol described in embodiment 15 or 12, in the conductive silver glue matrix
Polyester polyol is to be prepared in the following way：It will be a kind of or more in ethylene glycol, 1,4-butanediol, 1,6- hexylene glycols
The mixture of kind is mixed with adipic acid according to molar ratio of alcohol to acid example 1: 1.25, in the presence of catalyst Ti acid butyl ester, in
Carried out at 140 DEG C reaction 7 it is small when, then vacuumize, the reaction was continued 3 it is small when, so as to prepare polyester polyol.
Embodiment 17：
The preparation method of a kind of type solid-state conductive hot melt elargol described in embodiment 15 or 12, in the conductive silver glue matrix
Polyester polyol is to be prepared in the following way：It will be a kind of or more in ethylene glycol, 1,4-butanediol, 1,6- hexylene glycols
The mixture of kind is mixed with adipic acid according to molar ratio of alcohol to acid example 1: 1.25, in the presence of catalyst Ti acid butyl ester, in
Carried out at 220 DEG C reaction 10 it is small when, then vacuumize, the reaction was continued 5 it is small when, so as to prepare polyester polyol.
Embodiment 18：
A kind of preparation method of type solid-state conductive hot melt elargol described in embodiment 17, the poly- ammonia in the conductive silver glue matrix
The number-average molecular weight of ester hot melt adhesive is 85000-95000g/mol.
Embodiment 19：
A kind of preparation method of type solid-state conductive hot melt elargol described in embodiment 18, the poly- ammonia in the conductive silver glue matrix
The number-average molecular weight of ester hot melt adhesive is 85000g/mol.
Embodiment 20：
A kind of preparation method of type solid-state conductive hot melt elargol described in embodiment 18, the poly- ammonia in the conductive silver glue matrix
The number-average molecular weight of ester hot melt adhesive is 95000g/mol.
Embodiment 21：
A kind of preparation method of type solid-state conductive hot melt elargol described in embodiment 8, the shape of the micro-silver powder is sheet
Or it is spherical, grain size is 1~5 × 103 nm；The nano-silver powder be flaky nanometer silver powder or spherical nano-silver powder, it is described
Flaky nanometer silver powder length be 2~8 × 103 Nm, the grain size of the spherical nano-silver powder is 1~5nm.
Embodiment 22：
A kind of preparation method of type solid-state conductive hot melt elargol described in embodiment 21, the shape of the micro-silver powder is sheet
Or it is spherical, grain size is 1 × 103 nm；The nano-silver powder be flaky nanometer silver powder or spherical nano-silver powder, the piece
The length of shape nano-silver powder is 2 × 103 Nm, the grain size of the spherical nano-silver powder is 1nm.
Embodiment 23：
A kind of preparation method of type solid-state conductive hot melt elargol described in embodiment 21, the shape of the micro-silver powder is sheet
Or it is spherical, grain size is 5 × 103nm；The nano-silver powder be flaky nanometer silver powder or spherical nano-silver powder, it is described
The length of flaky nanometer silver powder is 8 × 103 Nm, the grain size of the spherical nano-silver powder is 5nm.
Claims (10)
1. a kind of type solid-state conductive heats elargol, composition includes:Conductive silver glue matrix, micro-silver powder, nano-silver powder, feature
It is:The parts by weight of the conductive silver glue matrix are 10~50 parts, and the parts by weight of the micro-silver powder are 1~40 part,
The parts by weight of the nano-silver powder are 10~60 parts.
2. a kind of type solid-state conductive hot melt elargol according to claim 1, it is characterized in that:The conductive silver glue matrix
Parts by weight for 10 parts, the parts by weight of the micro-silver powder are 1 part, and the parts by weight of the nano-silver powder are 10
Part.
3. a kind of type solid-state conductive hot melt elargol according to claim 1, it is characterized in that:The conductive silver glue matrix
Parts by weight for 50 parts, the parts by weight of the micro-silver powder are 40 parts, and the parts by weight of the nano-silver powder are 60
Part.
4. a kind of type solid-state conductive hot melt elargol according to claim 1 or 2 or 3, it is characterized in that:The micro-silver powder
Shape for sheet or spherical, grain size is 1~5 × 103nm；The shape of the nano-silver powder is flaky nanometer silver powder
Or spherical nano-silver powder.
5. a kind of type solid-state conductive hot melt elargol according to claim 4, it is characterized in that:The flaky nanometer silver powder
Length is 2~8 × 103Nm, the grain size of the spherical nano-silver powder is 1~5nm.
6. a kind of preparation method of type solid-state conductive hot melt elargol, it is characterized in that:The first step of this preparation method is at 80~90 DEG C
Water bath with thermostatic control under, by flexible additive add in dispersant in heating stirring to being completely dissolved, finally again by curing agent, coupling agent
And epoxy resin slowly adds in, and is heated with stirring to and is completely dissolved, and conductive silver glue matrix is obtained after cooling；Second step is by micron
Silver powder and nano-silver powder are mixed to get mixing silver powder according to parts by weight, and mixing silver powder with conductive silver glue matrix is mixed, is ground
Paste object is rolled into after scattered to get to conductive silver glue.
7. a kind of preparation method of type solid-state conductive hot melt elargol according to claim 6, it is characterized in that:The conduction
Elargol matrix is formed by following component reaction：The content of polyester polyol is 30-50Wt%, two isocyanides of diphenyl methane -4,4-
Acid esters（MDI）Content for 25-35 Wt%, toluene di-isocyanate(TDI)（MDI）Content for 5-10 Wt%, 1,4- butanediols（1,
4-BDO) content of chain extender is 2-7 Wt%, the content of aromatic diamine chain stretching agent is 10-20 Wt%, the content of additive is
0.1-2 Wt%；One or several kinds of the additive in titanium dioxide, zinc stearate, gas phase of white carbon black, the virtue
Fragrant diamine chain stretching agent is 2,4- diamino -3,5- dimethyl sulphur-based toluene or 2,6- diamino -3,5- dimethyl sulphur-based toluene or the two
Mixture；Wherein each component summation is 100wt%；The wherein described polyester polyol is by ethylene glycol, 1,4-butanediol, 1,6-
One or more mixtures in hexylene glycol are reacted with adipic acid, and number-average molecular weight is 2000~2200 g/mol；Institute
The number-average molecular weight for the polyurethane hot melt stated is 50000-100000 g/mol.
8. a kind of preparation method of type solid-state conductive hot melt elargol according to claim 6 or 7, it is characterized in that:Described
Polyester polyol in conductive silver glue matrix is to be prepared in the following way：By ethylene glycol, 1,4-butanediol, 1,6- oneself two
One or more kinds of mixtures in alcohol are mixed with adipic acid according to molar ratio of alcohol to acid example 1: 1.25, in catalyst metatitanic acid
In the presence of butyl ester, carried out at 140~220 DEG C reaction 7~10 it is small when, then vacuumize, the reaction was continued 3~5 it is small when, so as to
Prepare polyester polyol.
9. a kind of preparation method of type solid-state conductive hot melt elargol according to claim 8, it is characterized in that:Described leads
The number-average molecular weight of polyurethane hot melt in electric elargol matrix is 85000-95000g/mol.
10. a kind of preparation method of type solid-state conductive hot melt elargol according to claim 6, it is characterized in that:Described is micro-
The shape of rice silver powder is sheet or spherical, and grain size is 1~5 × 103nm；The nano-silver powder is flaky nanometer silver powder
Or spherical nano-silver powder, the length of the flaky nanometer silver powder is 2~8 × 103 Nm, the grain size of the spherical nano-silver powder
For 1~5nm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711419760.6A CN108047986A (en) | 2017-12-25 | 2017-12-25 | Solid conductive hot-melt silver adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711419760.6A CN108047986A (en) | 2017-12-25 | 2017-12-25 | Solid conductive hot-melt silver adhesive |
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| Publication Number | Publication Date |
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| CN108047986A true CN108047986A (en) | 2018-05-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201711419760.6A Pending CN108047986A (en) | 2017-12-25 | 2017-12-25 | Solid conductive hot-melt silver adhesive |
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| CN (1) | CN108047986A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109251690A (en) * | 2018-09-14 | 2019-01-22 | 安徽明诚塑业有限公司 | A kind of double-layer composite hot melt adhesive film of metal and plastic bonding |
| WO2022188504A1 (en) * | 2021-03-11 | 2022-09-15 | 无锡帝科电子材料股份有限公司 | Heat-cured conductive adhesive and preparation method therefor |
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| US20130056689A1 (en) * | 2011-02-23 | 2013-03-07 | Georgia Tech Research Corporation | Highly conductive electrically conductive adhesives |
| CN104962226A (en) * | 2015-08-06 | 2015-10-07 | 中国振华集团云科电子有限公司 | Conductive silver adhesive, and preparation method and application thereof |
| CN106960693A (en) * | 2016-01-09 | 2017-07-18 | 湖南利德电子浆料股份有限公司 | A kind of touch-screen electrocondution slurry |
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| CN101570676A (en) * | 2009-06-04 | 2009-11-04 | 长兴三伟热熔胶有限公司 | Polyurethane hot melt adhesive for high-grade lining cloth and preparation method thereof |
| US20130056689A1 (en) * | 2011-02-23 | 2013-03-07 | Georgia Tech Research Corporation | Highly conductive electrically conductive adhesives |
| CN104962226A (en) * | 2015-08-06 | 2015-10-07 | 中国振华集团云科电子有限公司 | Conductive silver adhesive, and preparation method and application thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109251690A (en) * | 2018-09-14 | 2019-01-22 | 安徽明诚塑业有限公司 | A kind of double-layer composite hot melt adhesive film of metal and plastic bonding |
| WO2022188504A1 (en) * | 2021-03-11 | 2022-09-15 | 无锡帝科电子材料股份有限公司 | Heat-cured conductive adhesive and preparation method therefor |
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