CN108034946B - Spray etching system - Google Patents
Spray etching system Download PDFInfo
- Publication number
- CN108034946B CN108034946B CN201711153828.0A CN201711153828A CN108034946B CN 108034946 B CN108034946 B CN 108034946B CN 201711153828 A CN201711153828 A CN 201711153828A CN 108034946 B CN108034946 B CN 108034946B
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- Prior art keywords
- etching
- spray
- substrate
- injection apparatus
- liquid injection
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Weting (AREA)
Abstract
A kind of spray etching system, system include the equipment such as motor, etching case, etching liquid injection apparatus, oscillating guidebar mechanism, pressure gauge, flowmeter, plastic pump, etching solution collecting box, ORP redox meter, the temperature control system that is made of heating rod and cooling pipe.Etching solution is flowed into etching case under the driving of plastic pump by etching collecting box, it is ejected into etching substrate with certain pressure from the injection apparatus nozzle of polygon, to etch the exposed matrix between photoresist, period motor band kinetoplast makees plane motion, pendulum guide rod band kinetoplast rotates, temperature control system controls the temperature of etching solution, and ORP redox meter monitors the chemical reaction ability of etching solution.The present invention can control spray etching system and realize efficient controllability etching under different pressure, flow, temperature, spray equipment and matrix spacing, be conducive to study influence of each factor to pattern after etching quality and etching；Etching substrate and spray equipment are distributed at polygon, are conducive to make full use of etching box space, are improved etching efficiency to realize muti-piece matrix while etch；Etching substrate helps to realize the uniformity of etching under the drive of motor and oscillating guidebar mechanism.
Description
Technical field:
The invention belongs to mechanical micrometer-nanometer processing technology field, in particular to one kind can be used for preparing printed circuit sheet heat exchanger
Spray etching system.
Background technique:
Micrometer-nanometer processing technology is the appearance with micro mechanical technology and the novel modernization manufacturing technology of one kind generated.It
The machining and assembly within the scope of miniature scale are realized, wherein photochemical etching technique is easy to operate with its, machining accuracy
High, at low cost, etching process without mechanical stress there are the advantages that be widely used in printing plate circuit, metal surface decorative pattern and fine
Processing and other fields.
Measure the whether successful main standard of etch process first is that control ability to etching quality and surface topography, and
The factor for influencing etching quality and surface topography is numerous, how to control the influence of each factor to realize that efficiently controllable etching becomes
Difficult point.
Summary of the invention:
The purpose of the present invention is to provide a kind of spray etching system, spraying device for etching is polygonized structure, etches base
Plate is in polygonal array, can increase the plate number of etching of substrates while etching；By utilizing motor, pendulum guide rod, improvement injection
The methods of device increases the bearing capacity of spray system and improves the uniformity etc. of etching, and the matter of substrate etch can be improved
Amount；Substrate can be more accurately controlled in larger ranges works such as different pressures, flow, temperature, spray equipment and matrix spacing
Spray etching is carried out under condition, to analyze influence of each factor to etching speed, etch uniformity, lateral erosion and roughness in spray
Situation finds the optimal etching condition of spray etching, to realize the efficient controllable processing of substrate topography.
In order to achieve the above objectives, the present invention adopts the following technical scheme that:
A kind of spray etching system includes motor, etching case, etching liquid injection apparatus, oscillating guidebar mechanism, pressure gauge, stream
Meter, plastic pump, etching solution collecting box, ORP redox meter, the temperature control system being made of heating rod and cooling pipe etc. are set
It is standby, it is characterised in that: etching liquid injection apparatus be arranged in etching case and have by multiple planes form in regular polygon
The shape of cylinder, the two sides of etching liquid injection apparatus are respectively arranged with a clamping plate, have on clamping plate in regular polygon distribution
Substrate mounting hole array, etching substrate are fixed in the substrate mounting hole of substrate mounting hole array of clamping plate；Etching solution is from etching
Multiple planes of liquid jetting device are vertically sprayed to the erosion in polygon space distribution driven by motor and oscillating guidebar mechanism
It carves on substrate.
The etching substrate is in etching case in polygon and nozzle vertical distribution.
The substrate mounting hole array is multiple, and the distance difference at each substrate mounting hole array to clamping plate center makes
Etching substrate and the spacing of etching liquid injection apparatus are adjustable.
Multiple nozzles are disposed in each plane of the etching liquid injection apparatus, nozzle is taper or sector.
The spray etching system is controlled by motor level, pass through motor contact connecting cleat and default running track with
Drive etching substrate translation.
The spray etching system is controlled by oscillating guidebar mechanism and is rotated, and oscillating guidebar mechanism drives the rotation of circle distribution
Guide rod control clamping plate rotation circles etching substrate around etching liquid injection apparatus.
The temperature control system is made of heating rod, cooling pipe and temperature controller, and heating rod and cooling pipe control etching solution
Heating and cooling, with control etching solution temperature stablize within a certain range.
The ORP redox meter is arranged in etching solution collecting box, can monitor the redox ability of etching solution in real time.
The etching case connects etching solution collecting box, close net is disposed at etching solution collecting box connection plastic pump, with filtering
Residue after etching solution impurity and etching, can prevent spray equipment blocking.
Compared with the existing technology, the present invention has the advantage that
A kind of spray etching system of the present invention, the system are vertically sprayed from all directions to each side using Polygonal spray injection device
To adjustable berth away from etching substrate, increase matrix while etch quantity, be advantageously implemented the mass production of matrix.By using
The injection apparatus that etching solution is entered polygon injection body by two directions of left and right and sprayed from multiple nozzles, improves injection apparatus
Bearing capacity and be conducive to etching solution and uniformly spray.Etching case two sides have the fixation hole array different apart from clamping plate center to block
Etching substrate, be adjusted etching substrate between nozzle at a distance to provide different spray area and impulse force.Utilize motor control
Etching substrate movement velocity planar, pendulum guide rod control etching of substrates are circled around spray equipment, to overcome weight
The influence of power, same direction spray pressure unevenness, to increase the uniformity of etching.Utilize ORP meter, temperature control system, pressure gauge, stream
The equipment such as meter can more be accurately controlled substrate and be sprayed under the larger ranges operating condition such as different pressures, flow, temperature
Etching facilitates the influence for solving how to control each factor to realize the difficult point of a large amount of efficiently controllable etchings.
Detailed description of the invention
Fig. 1 is spray etching system construction drawing of the invention.
Fig. 2 is etching case spray equipment schematic diagram of the invention.
Fig. 3 is two sides cleat plate EDS maps schematic diagram in etching case.
Number in attached drawing:
1 is motor, and 2 be etching case, and 3 be etching substrate, and 4 be etching liquid injection apparatus, and 5 be oscillating guidebar mechanism, and 6 be folder
Plate, 7 be pressure gauge, and 8 be flowmeter, and 9 be slide bar, and 10 be plastic pump, and 11 be plastic valve, and 12 be etching solution collecting box, and 13 be ORP
Meter, 14 be temperature controller, and 15 be heating rod, and 16 be cooling pipe, and 17 be filter screen, and 18 be several rotating guide-bars of circle distribution,
19 motor contacts, 20 be spray equipment etching solution inlet port, and 21 be injection body, and 22 be nozzle, and 23 fix for etching of substrates
Hole.
Specific embodiment
Below in conjunction with attached drawing, the present invention is described in further detail.
Fig. 1 is spray etching system construction drawing of the invention.
As shown in Figure 1, a kind of spray etching system, including motor 1, etching case 2, etching liquid injection apparatus 4, pendulum guide rod
Mechanism 5, pressure gauge 7, flowmeter 8, plastic pump 10, etching solution collecting box 12, ORP count 13, by heating rod 15 and cooling pipe 16
The equipment such as the temperature control system of composition.It is characterized by: the setting of etching liquid injection apparatus 4 is in etching case 2 and has by multiple
The shape in regular polygon cylinder of plane composition, the two sides of etching liquid injection apparatus 4 are respectively arranged with a clamping plate 6, clamping plate 6
The upper substrate mounting hole array with the distribution in regular polygon, etching substrate 3 are fixed on the substrate mounting hole array of clamping plate 6
In substrate mounting hole 23；Etching solution is vertically sprayed from multiple planes of etching liquid injection apparatus 4 to by motor 1 and pendulum guide rod machine
In the etching substrate 3 in polygon space distribution that structure 5 drives.
The motor 1 in left side and the slide bar 9 on right side can control etching substrate 3 horizontal direction all around movement velocity with
Help the uniformity of etching.
Oscillating guidebar mechanism 5 can drive etching 2 middle clamp plate 6 of case control etching substrate 3 to make circumference fortune around spray etching device 4
It is dynamic, Lai Zengjia etching substrate while etch quantity suitable to help 3 etching condition of all directions etching substrate, and it is equal to improve etching
Even property.
Temperature control system is made of thermocouple, heating rod, cooling pipe and the temperature controller in etching solution collecting box 12, heating rod
15 and cooling pipe 16 control etching solution heating and cooling, with control etching solution temperature stablize within a certain range.
ORP meter 13 in etching solution collecting box 12 can monitor the redox ability of etching solution in real time in time to etching solution
Middle addition reagent.
Pressure gauge 7, flowmeter 8 in etch system are adjusted and control etching operating condition can all lose in favor of studying each factor
Carve the influence of quality.
Etching case 2 connects etching solution collecting box 12, etching solution collecting box 12 connects and is disposed with close net at plastic pump 10, with mistake
Residue after filtering etching solution itself and etching is to prevent spray equipment blocking.
Fig. 2 is etching case spray equipment schematic diagram of the invention.
As shown in Fig. 2, etching liquid injection apparatus 4 is using polygon injection body 21 and arranges multiple nozzles 22, etching solution
Enter 21 by gengon the right and left 20, to improve the bearing capacity of injection apparatus, is conducive to etching solution and uniformly sprays, nozzle root
Taper or fan nozzle are selected according to etch profile.
Etching solution vertically sprays the substrate number for increasing while etching to all directions etching substrate 3 by all directions nozzle 22.
Etching substrate 3 is fixed by the clamping plate 6 of two sides, and guide rod of rolling to each side drives the rotation of several circle distributions on clamping plate 6
Guide rod 18 controls etching substrate 3 and circles around spray etching device 4, under the action of considering gravity, improves while etching
Matrix uniformity.
Fig. 3 is two sides cleat plate EDS maps schematic diagram in etching case.
As shown in figure 3, being dispersed with the rotating guide-bar 18 of several circle distributions on polygon clamping plate 6 turn etching of substrates
It is dynamic.Etching of substrates is inserted into the different etching of substrates fixation hole 23 in 6 center of clamping plate, be adjusted etching substrate with
The spacing of nozzle is to change the intensity and area of etching.Pendulum guide rod 5 drives the rotating guide-bar 18 of several circle distributions to control erosion
It carves substrate to rotate, motor contact 19 connects polygon clamping plate 6 and etching substrate is driven to be translatable, to increase etching area, increase
The uniformity etched by force.
In short, spray etching system proposed by the present invention increases the area of etching, improves the matter of substrate etch
Amount and efficiency, and increase etch uniformity, be conducive to etch on a large scale.System is by being added by groups such as heating rod and cooling pipes
At the equipment such as temperature-controlling system, pressure gauge, flowmeter, realize substrate between different pressures, flow, temperature and spray equipment
Away from etc. controllability spray etching is carried out under larger ranges operating condition, be conducive to the etch profile of control base board to find spray etching most
Excellent etching condition, the efficient controllable processing of Lai Shixian substrate topography.
It should be understood that being somebody's turn to do, examples are only for illustrating the present invention and not for limiting the scope of the present invention.In addition, should also manage
Solution, after reading the content taught by the present invention, those skilled in the art can make various changes or be repaired to the present invention
Change, however, these equivalent forms also fall within the scope of the appended claims of the present application.
Claims (9)
1. a kind of spray etching system, including motor (1), etching case (2), etching liquid injection apparatus (4), oscillating guidebar mechanism
(5), pressure gauge (7), flowmeter (8), plastic pump (10), etching solution collecting box (12), ORP redox meter (13) and by adding
The temperature control system of hot pin (15) and cooling pipe (16) composition, it is characterised in that: etching liquid injection apparatus (4) setting is in etching case
(2) in and there is the shape in regular polygon cylinder being made of multiple planes, the two sides difference of etching liquid injection apparatus (4)
It is provided with a clamping plate (6), there is the substrate mounting hole array in regular polygon distribution on clamping plate (6), etching substrate (3) is fixed
In the substrate mounting hole (23) of the substrate mounting hole array of clamping plate (6)；Etching solution is put down from the multiple of etching liquid injection apparatus (4)
Face is vertically sprayed onto the etching substrate (3) in polygon space distribution driven by motor (1) and oscillating guidebar mechanism (5).
2. spray etching system according to claim 1, it is characterised in that: the etching substrate (3) is in etching case (2)
Interior is in polygon and nozzle (22) vertical distribution.
3. spray etching system according to claim 1, it is characterised in that: the substrate mounting hole array is multiple, and
And the distance difference at each substrate mounting hole array to clamping plate (6) center makes etching substrate (3) and etching liquid injection apparatus (4)
Spacing is adjustable.
4. spray etching system according to claim 1, it is characterised in that: the etching liquid injection apparatus (4) it is each
It is disposed in plane multiple nozzles (22), nozzle (22) is taper or sector.
5. spray etching system according to claim 1, it is characterised in that: the etching liquid injection apparatus (4) is by motor
(1) horizontal control, by motor contact (19) connecting cleat (6) and default running track is to drive etching substrate (3) to be translatable.
6. spray etching system according to claim 1, it is characterised in that: the etching liquid injection apparatus (4) is by swinging
Guide-bar mechanism (5) control rotation, oscillating guidebar mechanism (5) drive rotating guide-bar (18) control clamping plate (6) rotation of circle distribution
Circle etching substrate (3) around etching liquid injection apparatus (4).
7. spray etching system according to claim 1, it is characterised in that: the temperature control system is by heating rod (15), cold
But pipeline (16) and temperature controller (14) composition, the heating and cooling of heating rod (15) and cooling pipe (16) control etching solution, with
Etching solution temperature is controlled to stablize within a certain range.
8. spray etching system according to claim 1, it is characterised in that: ORP redox meter (13) setting exists
In etching solution collecting box (12), the redox ability of etching solution can be monitored in real time.
9. spray etching system according to claim 1, it is characterised in that: etching case (2) the connection etching solution is collected
Case (12), etching solution collecting box (12) connect and are disposed with close net at plastic pump (10), after filtered etch liquid impurity and etching
Residue can prevent spray equipment blocking.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711153828.0A CN108034946B (en) | 2017-11-20 | 2017-11-20 | Spray etching system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711153828.0A CN108034946B (en) | 2017-11-20 | 2017-11-20 | Spray etching system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108034946A CN108034946A (en) | 2018-05-15 |
| CN108034946B true CN108034946B (en) | 2019-04-02 |
Family
ID=62092824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711153828.0A Active CN108034946B (en) | 2017-11-20 | 2017-11-20 | Spray etching system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108034946B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111901979B (en) * | 2020-08-13 | 2021-09-07 | 西安交通大学 | Multi-parameter automatic regulation and control efficient rotary spraying etching system |
| CN111970838B (en) * | 2020-08-24 | 2021-09-21 | 泉州市创智工业设计服务有限公司 | Etching machine for producing circuit board |
| CN112477388B (en) * | 2020-11-13 | 2023-03-31 | 上海新倬壮印刷科技有限公司 | Inclined-net non-net-knot screen printing plate and manufacturing method thereof |
| CN112750738B (en) * | 2021-01-18 | 2024-02-23 | 中国电子科技集团公司第四十八研究所 | Ion beam etching equipment and etching method thereof |
| CN112730146B (en) * | 2021-03-30 | 2021-08-17 | 武汉大学 | Etching rate testing device and method for etching solution |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101476125A (en) * | 2008-11-12 | 2009-07-08 | 长沙精达印刷制版有限公司 | Method for etching gravure printing roller by spraying copper chloride |
| CN104641456A (en) * | 2012-09-21 | 2015-05-20 | 应用材料公司 | Radical chemistry modulation and control using multiple flow pathways |
| CN205741219U (en) * | 2016-06-14 | 2016-11-30 | 深圳市百诣良科技发展有限公司 | A kind of two-way scouring type spraying device for etching |
| CN206521524U (en) * | 2017-01-19 | 2017-09-26 | 东莞美维电路有限公司 | PCB spraying device for etching |
-
2017
- 2017-11-20 CN CN201711153828.0A patent/CN108034946B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101476125A (en) * | 2008-11-12 | 2009-07-08 | 长沙精达印刷制版有限公司 | Method for etching gravure printing roller by spraying copper chloride |
| CN104641456A (en) * | 2012-09-21 | 2015-05-20 | 应用材料公司 | Radical chemistry modulation and control using multiple flow pathways |
| CN205741219U (en) * | 2016-06-14 | 2016-11-30 | 深圳市百诣良科技发展有限公司 | A kind of two-way scouring type spraying device for etching |
| CN206521524U (en) * | 2017-01-19 | 2017-09-26 | 东莞美维电路有限公司 | PCB spraying device for etching |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108034946A (en) | 2018-05-15 |
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