CN108011033A - A kind of encapsulating structure and method for packing of SQUID planar gradiometers chip - Google Patents
A kind of encapsulating structure and method for packing of SQUID planar gradiometers chip Download PDFInfo
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- CN108011033A CN108011033A CN201711401031.8A CN201711401031A CN108011033A CN 108011033 A CN108011033 A CN 108011033A CN 201711401031 A CN201711401031 A CN 201711401031A CN 108011033 A CN108011033 A CN 108011033A
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- 241000238366 Cephalopoda Species 0.000 title claims abstract description 135
- 238000000034 method Methods 0.000 title claims abstract description 27
- 238000012856 packing Methods 0.000 title claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 110
- 238000005538 encapsulation Methods 0.000 claims abstract description 32
- 238000000605 extraction Methods 0.000 claims abstract description 7
- 238000010276 construction Methods 0.000 claims description 76
- 239000003292 glue Substances 0.000 claims description 35
- 239000010410 layer Substances 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 23
- 239000004033 plastic Substances 0.000 claims description 18
- 239000012790 adhesive layer Substances 0.000 claims description 12
- 239000003822 epoxy resin Substances 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- 230000003139 buffering effect Effects 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 230000008447 perception Effects 0.000 claims description 6
- 239000010453 quartz Substances 0.000 claims description 6
- 239000010980 sapphire Substances 0.000 claims description 6
- 229910052594 sapphire Inorganic materials 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 230000005291 magnetic effect Effects 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000005481 NMR spectroscopy Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009415 formwork Methods 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/035—Measuring direction or magnitude of magnetic fields or magnetic flux using superconductive devices
- G01R33/0354—SQUIDS
- G01R33/0358—SQUIDS coupling the flux to the SQUID
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/80—Constructional details
- H10N60/81—Containers; Mountings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N69/00—Integrated devices, or assemblies of multiple devices, comprising at least one superconducting element covered by group H10N60/00
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Containers, Films, And Cooling For Superconductive Devices (AREA)
Abstract
The present invention provides a kind of encapsulating structure and method for packing of SQUID planar gradiometers chip, and the method for packing includes：One SQUID planar gradiometer chips are provided；In the lower section of the SQUID planar gradiometers chip, at least one layer of cushion is set；In the lower section of the cushion, one substrate is set, and in the extraction electrode made on the substrate and the electrode of the SQUID planar gradiometers chip is electrically connected；And in setting an encapsulation cover plate on the substrate, wherein, the SQUID planar gradiometers chip and the cushion are packaged in the encapsulation cover plate.By the encapsulating structure and method for packing of SQUID planar gradiometers chip provided by the invention, solve the problems, such as that the degree of unbalancedness index of existing SQUID planar gradiometers chip-packaging structure is poor.
Description
Technical field
The present invention relates to superconducting quantum interference device, more particularly to a kind of encapsulation knot of SQUID planar gradiometers chip
Structure and method for packing.
Background technology
(Superconducting QUantum Interference Device, write a Chinese character in simplified form work to superconducting quantum interference device
SQUID) it is a kind of extremely sensitive magnetic flux transducer, can be used for detecting magnetic field, magnetic gradient, electric current, voltage etc. that all can be with
The physical quantity of magnetic flux is converted into, therefore is detected in limit weak magnetics such as biological magnetic detection, extremely low field nuclear magnetic resonance, geophysical explorations
Field has obtained to apply extensive.
SQUID planar gradiometers are a kind of gradient sensor structures that SQUID is collectively formed with integrated planar gradient coil,
Only magnetic field gradient is responded in theory, therefore effectively uniform field or the interference of low order gradient fields can be suppressed.In general,
SQUID planar gradiometers are to utilize integrated planar technique, are machined on full wafer Silicon Wafer, therefore the baseline length of gradiometer
Limited be subject to wafer size.At present, planar gradiometer baseline length is additionally, since processing technology usually in several cm ranges
Precision is higher, an important indicator --- the degree of unbalancedness of SQUID planar gradiometers, 2 numbers lower than winding by hand axial gradiometers
It is more than magnitude.But chip is fixed and protected since SQUID planar gradiometers need to encapsulate, so as to gradiometer not
The degree of balance also results in deterioration.
Due to the extreme sensitivity characteristics of SQUID, its encapsulation needs to use non-magnetic material, usually selects epoxide resin material.
In addition, needing to freeze when SQUID works, common practices is directly immersed in liquid helium, so due to chip (silicon
Piece) and epoxy resin thermal coefficient of expansion difference, deformation can be caused to chip.For planar gradiometer, due to core itself
Chip size is larger, and this deformation will be more obvious, answers this degree of unbalancedness to sharply increase.
In consideration of it, be necessary to design encapsulating structure and the method for packing of a kind of new SQUID planar gradiometer chips to
Solve above-mentioned technical problem.
The content of the invention
In view of the foregoing deficiencies of prior art, it is an object of the invention to provide a kind of SQUID planar gradiometers core
The encapsulating structure and method for packing of piece, for solving the degree of unbalancedness index of existing SQUID planar gradiometers chip-packaging structure
The problem of poor.
In order to achieve the above objects and other related objects, the present invention provides a kind of encapsulation of SQUID planar gradiometers chip
Method, the method for packing include：
One SQUID planar gradiometer chips are provided；
In the lower section of the SQUID planar gradiometers chip, at least one layer of cushion is set；
In the lower section of the cushion, one substrate is set, and in making on the substrate and the SQUID planar gradiometers
The extraction electrode that the electrode of chip is electrically connected；And
In setting an encapsulation cover plate on the substrate, wherein, the SQUID planar gradiometers chip and the cushion are equal
It is packaged in the encapsulation cover plate.
Preferably, the SQUID planar gradiometers chip includes：
Substrate；
The SQUID structures being formed on the substrate, wherein, the SQUID structures include SQUID and with the SQUID
The electrode of electric connection；And
The gradient antenna for being formed on the substrate and being connected by inductance with SQUID perception.
Preferably, the structure of the cushion is identical with the structure of the substrate, and the material of the cushion with it is described
The material of substrate is identical.
Preferably, the method for packing further includes：Using dispensing mode in the SQUID planar gradiometers chip and described
The first glued construction is formed between cushion；Second glued construction is formed between the cushion using dispensing mode；Using
Dispensing mode or coating method form the 3rd glued construction between the cushion and the substrate；Using coating method in institute
State the 4th glued construction of formation between encapsulation cover plate and the substrate.
Preferably, first glued construction is single-point plastic structure, and second glued construction is two point plastic structure, described
3rd glued construction is two point plastic structure or structural adhesive layer, and the 4th glued construction is structural adhesive layer.
Preferably, first glued construction, second glued construction, the 3rd glued construction and the described 4th glue
Structure is closed to be formed by low temperature glue, wherein, the thermal coefficient of expansion of the low temperature glue and the thermal coefficient of expansion phase of the substrate
Together.
Preferably, the quantity of the cushion is 1 layer or 2 layers.
Preferably, the material of the encapsulation cover plate includes epoxy resin, quartz or sapphire.
Present invention also offers a kind of encapsulating structure of SQUID planar gradiometers chip, the encapsulating structure includes：
SQUID planar gradiometer chips；
It is arranged at least one layer of cushion of the SQUID planar gradiometers beneath chips；
The substrate being arranged at below the cushion；
The extraction electrode for being formed on the substrate and being electrically connected with the electrode of the SQUID planar gradiometers chip；
And
The encapsulation cover plate being arranged on the substrate, wherein, the SQUID planar gradiometers chip and the cushion are equal
It is packaged in the encapsulation cover plate.
Preferably, the SQUID planar gradiometers chip includes：
Substrate；
The SQUID structures being formed on the substrate, wherein, the SQUID structures include SQUID and with the SQUID
The electrode of electric connection；And
The gradient antenna for being formed on the substrate and being connected by inductance with SQUID perception.
Preferably, the structure of the cushion is identical with the structure of the substrate, and the material of the cushion with it is described
The material of substrate is identical.
Preferably, the encapsulating structure further includes：Be formed at the SQUID planar gradiometers chip and the cushion it
Between the first glued construction；The second glued construction being formed between the cushion, is formed at the cushion and the base
The 3rd glued construction between plate, the 4th glued construction being formed between the encapsulation cover plate and the substrate.
Preferably, first glued construction is single-point plastic structure, and second glued construction is two point plastic structure, described
3rd glued construction is two point plastic structure or structural adhesive layer, and the 4th glued construction is structural adhesive layer.
Preferably, first glued construction, second glued construction, the 3rd glued construction and the described 4th
Glued construction is formed by low temperature glue, wherein, the thermal coefficient of expansion of the low temperature glue and the thermal coefficient of expansion of the substrate
It is identical.
Preferably, the quantity of the cushion is 1 layer or 2 layers.
Preferably, the material of the encapsulation cover plate includes epoxy resin, quartz or sapphire.
As described above, the encapsulating structure and method for packing of a kind of SQUID planar gradiometers chip of the present invention, have following
Beneficial effect：
The present invention is made by adding at least one layer of cushion between SQUID planar gradiometers chip and the substrate
Obtain cushion has identical structure and material with substrate, to reduce SQUID planar gradiometers chip with substrate because of thermal expansion system
Number it is different and caused by deformation, so as to reduce the influence of the degree of unbalancedness to SQUID planar gradiometer chips, improve anti-interference energy
Power.
The present invention forms difference between SQUID planar gradiometers chip, cushion, substrate by different dispensing modes
The glued construction of dosage, and by selecting the low temperature glue identical with substrate and cushion thermal coefficient of expansion, further to reduce
The deformation of SQUID planar gradiometer chips, so as to further reduce the shadow of the degree of unbalancedness to SQUID planar gradiometer chips
Ring.
Brief description of the drawings
Fig. 1 is shown as the flow chart of method for packing described in the embodiment of the present invention one.
Fig. 2 is shown as the structure diagram of encapsulating structure described in the embodiment of the present invention two.
Fig. 3 is shown as the schematic diagram of SQUID structures described in the embodiment of the present invention two.
Component label instructions
10 SQUID planar gradiometer chips
11 substrates
12 SQUID structures
121 SQUID
122 electrodes
13 gradient antennas
20 cushions
30 substrates
40 extraction electrodes
50 first glued constructions
60 the 3rd glued constructions
Embodiment
Illustrate embodiments of the present invention below by way of specific instantiation, those skilled in the art can be by this specification
Disclosed content understands other advantages and effect of the present invention easily.The present invention can also pass through in addition different specific realities
The mode of applying is embodied or practiced, the various details in this specification can also be based on different viewpoints with application, without departing from
Various modifications or alterations are carried out under the spirit of the present invention.
Please refer to Fig.1 to Fig.3.It should be noted that the diagram provided in the present embodiment only illustrates this in a schematic way
The basic conception of invention, then only the display component related with the present invention rather than package count during according to actual implementation in schema
Mesh, shape and size are drawn, and kenel, quantity and the ratio of each component can be a kind of random change during its actual implementation, and its
Assembly layout kenel may also be increasingly complex.
Embodiment one
As shown in Figure 1 to Figure 3, the present embodiment provides a kind of method for packing of SQUID planar gradiometers chip, the encapsulation
Method includes：
One SQUID planar gradiometers chip 10 is provided；
At least one layer of cushion 20 is set in the lower section of the SQUID planar gradiometers chip 10, to reduce the SQUID
Because of thermal coefficient of expansion is different and produces deformation between planar gradiometer chip 10 and the substrate 30；
In the lower section of the cushion 20, one substrate 30 is set, and in making on the substrate 30 and the SQUID planes
The extraction electrode 40 that the electrode of gradiometer chip 10 is electrically connected, to carry out the control of signal；And
In setting an encapsulation cover plate (not shown in Fig. 2) on the substrate 30, wherein, the SQUID planar gradiometers core
Piece 10 and the cushion 20 are packaged in the encapsulation cover plate.
As an example, as shown in Figures 2 and 3, the SQUID planar gradiometers chip 10 includes：
Substrate 11；
The SQUID structures 12 being formed on the substrate 11, wherein, the SQUID structures 12 include SQUID121 and with
The electrode 122 that the SQUID121 is electrically connected；And
The gradient antenna 13 for being formed on the substrate 11 and being connected by inductance M with SQUID121 perception.
It should be noted that the structure of the SQUID planar gradiometers chip is existing any SQUID planar gradiometers
Chip structure, is not limited only to structure shown in Fig. 2.
As an example, the structure of the cushion 20 is identical with the structure of the substrate 11, and the material of the cushion 20
Matter is identical with the material of the substrate 11, with further reduce the SQUID planar gradiometers chip 10 and the substrate 30 it
Between because thermal coefficient of expansion is different and caused by deformation.
It should be noted that the cushion is identical with the structure of the substrate to specifically refer to the cushion and the lining
Shape, length, width and the thickness all same at bottom.
Preferably, in the present embodiment, the cushion 20 and the substrate 11 are rectangular parallelepiped structure, and the buffering
Length, width and the thickness all same of layer 20 and the substrate 11；Wherein, the cushion 20 is silicon chip, and the substrate 11 is
Silicon substrate.
As an example, as shown in Fig. 2, using dispensing mode in the SQUID planar gradiometers chip 10 and the buffering
The first glued construction 50 is formed between layer 20.Preferably, in the present embodiment, first glued construction 50 is cementing for single-point
Structure, and first glued construction 50 is formed by low temperature glue；Wherein, the thermal coefficient of expansion of the low temperature glue and the substrate
And the thermal coefficient of expansion of the cushion is identical, with realize the SQUID planar gradiometers chip 10 and the cushion 20 it
Between effectively bonding while, reduce the influence of first glued construction to the SQUID planar gradiometers chip degree of unbalancedness.
It is further preferred that in the present embodiment, the model VGE-7031 of the low temperature glue.
As an example, the quantity of the cushion 20 is 1 layer or 2 layers；Preferably, in the present embodiment, the cushion
20 quantity is 1 layer.
Specifically, when the quantity of the cushion 20 is more than 1, formed using dispensing mode between the cushion 20
Second glued construction (not shown in Fig. 2).Preferably, in the present embodiment, second glued construction is two point plastic structure, and
Second glued construction is formed by low temperature glue；Wherein, the thermal coefficient of expansion of the low temperature glue and the substrate and described
The thermal coefficient of expansion of cushion is identical, to realize effective bonding between the cushion 20.It is further preferred that in this implementation
In example, the model VGE-7031 of the low temperature glue.
As an example, the 3rd is formed between the cushion 20 and the substrate 30 using dispensing mode or coating method
Glued construction 60.Preferably, the 3rd glued construction 60 is two point plastic structure or structural adhesive layer, and the 3rd glued construction
Formed by low temperature glue, wherein, the thermal expansion system of the thermal coefficient of expansion and the substrate and the cushion of the low temperature glue
Number is identical, to realize effective bonding between the cushion and the substrate.It is further preferred that in the present embodiment, institute
It is two point plastic structure to state the 3rd glued construction 60, and the model VGE-7031 of the low temperature glue.
Preferably, in the present embodiment, the material of the substrate 30 is epoxy resin, and the length and width of the substrate 30
Degree is all higher than the length and width of the substrate 11 and the cushion 20.
As an example, the 4th glued construction is formed between the encapsulation cover plate and the substrate 30 using coating method
(not shown in Fig. 2).Preferably, in the present embodiment, the 4th glued construction is structural adhesive layer, and the 4th bonding is tied
Structure is formed by low temperature glue, wherein, the thermal expansion of the thermal coefficient of expansion and the substrate and the cushion of the low temperature glue
Coefficient is identical, while to realize effective bonding between the encapsulation cover plate and the substrate, realizes sealing.Further preferably
Ground, in the present embodiment, the model VGE-7031 of the low temperature glue.
As an example, the material of the encapsulation cover plate includes epoxy resin, quartz or sapphire, to be put down to the SQUID
Face gradiometer chip 10 carries out isolating seal protection, while eliminates the influence of SQUID planar gradiometers chip 10 described in pole pair.
Embodiment two
As shown in Fig. 2, the present embodiment provides a kind of encapsulating structure of SQUID planar gradiometers chip, the encapsulating structure
Including：
SQUID planar gradiometers chip 10；
At least one layer of cushion 20 of the lower section of SQUID planar gradiometers chip 10 is arranged at, to reduce the SQUID
Because of thermal coefficient of expansion is different and produces deformation between planar gradiometer chip 10 and the substrate 30；
It is arranged at the substrate 30 of the lower section of cushion 20；
It is formed on the substrate 30 and draws with what the electrode 122 of the SQUID planar gradiometers chip 10 was electrically connected
Go out electrode 40, to carry out the control of signal；And
The encapsulation cover plate (not shown in Fig. 2) being arranged on the substrate 30, wherein, the SQUID planar gradiometers core
Piece 10 and the cushion 20 are packaged in the encapsulation cover plate.
As an example, as shown in Figures 2 and 3, the SQUID planar gradiometers chip 10 includes：
Substrate 11；
The SQUID structures 12 being formed on the substrate 11, wherein, the SQUID structures 12 include SQUID121 and with
The electrode 122 that the SQUID121 is electrically connected；And
The gradient antenna 13 for being formed on the substrate 11 and being connected by inductance M with by SQUID121 perception.
It should be noted that the structure of the SQUID planar gradiometers chip is existing any SQUID planar gradiometers
Chip structure, is not limited only to structure shown in Fig. 2.
As an example, the structure of the cushion 20 is identical with the structure of the substrate 11, and the material of the cushion 20
Matter is identical with the material of the substrate 11, with further reduce the SQUID planar gradiometers chip 10 and the substrate 30 it
Between because thermal coefficient of expansion is different and caused by deformation.
It should be noted that the cushion is identical with the structure of the substrate to specifically refer to the cushion and the lining
Shape, length, width and the thickness all same at bottom.
Preferably, in the present embodiment, the cushion 20 and the substrate 11 are rectangular parallelepiped structure, and the buffering
Length, width and the thickness all same of layer 20 and the substrate 11；Wherein, the cushion 20 is silicon chip, and the substrate 11 is
Silicon substrate.
As an example, as shown in Fig. 2, the encapsulating structure further includes：It is formed at the SQUID planar gradiometers chip 10
And the first glued construction 50 between the cushion 20.Preferably, in the present embodiment, first glued construction 50 is single
Point plastic structure, and first glued construction 50 is formed by low temperature glue；Wherein, the thermal coefficient of expansion of the low temperature glue and institute
It is identical to state the thermal coefficient of expansion of substrate and the cushion, to realize the SQUID planar gradiometers chip 10 and the buffering
While effectively bonding between layer 20, first glued construction is reduced to the SQUID planar gradiometers chip degree of unbalancedness
Influence.It is further preferred that in the present embodiment, the model VGE-7031 of the low temperature glue.
As an example, the quantity of the cushion 20 is 1 layer or 2 layers；Preferably, in the present embodiment, the cushion
20 quantity is 1 layer.
Specifically, when the quantity of the cushion 20 is more than 1, the encapsulating structure further includes：It is formed at the buffering
The second glued construction between layer 20 (not shown in Fig. 2).Preferably, in the present embodiment, second glued construction is double
Point plastic structure, and second glued construction is formed by low temperature glue；Wherein, the thermal coefficient of expansion of the low temperature glue with it is described
The thermal coefficient of expansion of substrate and the cushion is identical, to realize effective bonding between the cushion 20.Further preferably
Ground, in the present embodiment, the model VGE-7031 of the low temperature glue.
As an example, the encapsulating structure further includes：The 3rd be formed between the cushion 20 and the substrate 30
Glued construction.Preferably, the 3rd glued construction 60 is two point plastic structure or structural adhesive layer, and the 3rd glued construction by
Low temperature glue is formed, wherein, thermal coefficient of expansion and the substrate and the thermal coefficient of expansion of the cushion of the low temperature glue
It is identical, to realize effective bonding between the cushion and the substrate.It is further preferred that in the present embodiment, it is described
3rd glued construction 60 is two point plastic structure, and the model VGE-7031 of the low temperature glue.
Preferably, in the present embodiment, the material of the substrate 30 is epoxy resin, and the length and width of the substrate 30
Degree is all higher than the length and width of the substrate 11 and the cushion 20.
As an example, the encapsulating structure further includes：The 4th be formed between the encapsulation cover plate and the substrate 30
Glued construction (not shown in Fig. 2).Preferably, in the present embodiment, the 4th glued construction is structural adhesive layer, and described
Four glued constructions are formed by low temperature glue, wherein, thermal coefficient of expansion and the substrate and the cushion of the low temperature glue
Thermal coefficient of expansion it is identical, while to realize effective bonding between the encapsulation cover plate and the substrate, realize sealing.Into
One step preferably, in the present embodiment, the model VGE-7031 of the low temperature glue.
As an example, the material of the encapsulation cover plate includes epoxy resin, quartz or sapphire, to be put down to the SQUID
Face gradiometer chip 10 carries out isolating seal protection, while eliminates the influence of SQUID planar gradiometers chip 10 described in pole pair.
In conclusion the encapsulating structure and method for packing of a kind of SQUID planar gradiometers chip of the present invention, have following
Beneficial effect：
The present invention is made by adding at least one layer of cushion between SQUID planar gradiometers chip and the substrate
Obtain cushion has identical structure and material with substrate, to reduce SQUID planar gradiometers chip with substrate because of thermal expansion system
Number it is different and caused by deformation, so as to reduce the influence of the degree of unbalancedness to SQUID planar gradiometer chips, improve anti-interference energy
Power.
The present invention forms difference between SQUID planar gradiometers chip, cushion, substrate by different dispensing modes
The glued construction of dosage, and by selecting the low temperature glue identical with substrate and cushion thermal coefficient of expansion, further to reduce
The deformation of SQUID planar gradiometer chips, so as to further reduce the shadow of the degree of unbalancedness to SQUID planar gradiometer chips
Ring.
So the present invention effectively overcomes various shortcoming of the prior art and has high industrial utilization.
The above-described embodiments merely illustrate the principles and effects of the present invention, not for the limitation present invention.It is any ripe
Know the personage of this technology all can carry out modifications and changes under the spirit and scope without prejudice to the present invention to above-described embodiment.Cause
This, those of ordinary skill in the art is complete without departing from disclosed spirit and institute under technological thought such as
Into all equivalent modifications or change, should by the present invention claim be covered.
Claims (16)
1. a kind of method for packing of SQUID planar gradiometers chip, it is characterised in that the method for packing includes：
One SQUID planar gradiometer chips are provided；
In the lower section of the SQUID planar gradiometers chip, at least one layer of cushion is set；
In the lower section of the cushion, one substrate is set, and in making on the substrate and the SQUID planar gradiometers chip
Electrode be electrically connected extraction electrode；And
In setting an encapsulation cover plate on the substrate, wherein, the SQUID planar gradiometers chip and the cushion encapsulate
In in the encapsulation cover plate.
2. the method for packing of SQUID planar gradiometers chip according to claim 1, it is characterised in that the SQUID is put down
Face gradiometer chip includes：
Substrate；
The SQUID structures being formed on the substrate, wherein, the SQUID structures include SQUID and electrical with the SQUID
The electrode of connection；And
The gradient antenna for being formed on the substrate and being connected by inductance with SQUID perception.
3. the method for packing of SQUID planar gradiometers chip according to claim 2, it is characterised in that the cushion
Structure it is identical with the structure of the substrate, and the material of the cushion is identical with the material of the substrate.
4. the method for packing of SQUID planar gradiometers chip according to claim 3, it is characterised in that the encapsulation side
Method further includes：The first bonding knot is formed between the SQUID planar gradiometers chip and the cushion using dispensing mode
Structure；Second glued construction is formed between the cushion using dispensing mode；Using dispensing mode or coating method in described
The 3rd glued construction is formed between cushion and the substrate；Using coating method between the encapsulation cover plate and the substrate
Form the 4th glued construction.
5. the method for packing of SQUID planar gradiometers chip according to claim 4, it is characterised in that described first is viscous
Conjunction structure is single-point plastic structure, and second glued construction is two point plastic structure, and the 3rd glued construction is two point plastic structure
Or structural adhesive layer, the 4th glued construction are structural adhesive layer.
6. the method for packing of SQUID planar gradiometers chip according to claim 4 or 5, it is characterised in that described first
Glued construction, second glued construction, the 3rd glued construction and the 4th glued construction are formed by low temperature glue,
Wherein, the thermal coefficient of expansion of the low temperature glue is identical with the thermal coefficient of expansion of the substrate.
7. the method for packing of SQUID planar gradiometers chip according to claim 1, it is characterised in that the cushion
Quantity be 1 layer or 2 layers.
8. the method for packing of SQUID planar gradiometers chip according to claim 1, it is characterised in that the cap
The material of plate includes epoxy resin, quartz or sapphire.
9. a kind of encapsulating structure of SQUID planar gradiometers chip, it is characterised in that the encapsulating structure includes：
SQUID planar gradiometer chips；
It is arranged at least one layer of cushion of the SQUID planar gradiometers beneath chips；
The substrate being arranged at below the cushion；
The extraction electrode for being formed on the substrate and being electrically connected with the electrode of the SQUID planar gradiometers chip；And
The encapsulation cover plate being arranged on the substrate, wherein, the SQUID planar gradiometers chip and the cushion encapsulate
In in the encapsulation cover plate.
10. the encapsulating structure of SQUID planar gradiometers chip according to claim 9, it is characterised in that the SQUID
Planar gradiometer chip includes：
Substrate；
The SQUID structures being formed on the substrate, wherein, the SQUID structures include SQUID and electrical with the SQUID
The electrode of connection；And
The gradient antenna for being formed on the substrate and being connected by inductance with SQUID perception.
11. the encapsulating structure of SQUID planar gradiometers chip according to claim 10, it is characterised in that the buffering
The structure of layer is identical with the structure of the substrate, and the material of the cushion is identical with the material of the substrate.
12. the encapsulating structure of SQUID planar gradiometers chip according to claim 11, it is characterised in that the encapsulation
Structure further includes：The first glued construction being formed between the SQUID planar gradiometers chip and the cushion；It is formed at
The second glued construction between the cushion, the 3rd glued construction being formed between the cushion and the substrate, shape
The 4th glued construction between encapsulation cover plate described in Cheng Yu and the substrate.
13. the encapsulating structure of SQUID planar gradiometers chip according to claim 12, it is characterised in that described first
Glued construction is single-point plastic structure, and second glued construction is two point plastic structure, and the 3rd glued construction is cementing for two point
Structure or structural adhesive layer, the 4th glued construction are structural adhesive layer.
14. the encapsulating structure of the SQUID planar gradiometer chips according to claim 12 or 13, it is characterised in that described
First glued construction, second glued construction, the 3rd glued construction and the 4th glued construction are by low temperature glue
Formed, wherein, the thermal coefficient of expansion of the low temperature glue is identical with the thermal coefficient of expansion of the substrate.
15. the encapsulating structure of SQUID planar gradiometers chip according to claim 9, it is characterised in that the cushion
Quantity be 1 layer or 2 layers.
16. the encapsulating structure of SQUID planar gradiometers chip according to claim 9, it is characterised in that the cap
The material of plate includes epoxy resin, quartz or sapphire.
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| CN113421961A (en) * | 2021-05-27 | 2021-09-21 | 宁波大学 | SQUID chip packaging structure device and packaging method |
| CN113793894A (en) * | 2021-08-20 | 2021-12-14 | 宁波大学 | SQUID chip pressure welding device and pressure welding method |
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| CN113421961B (en) * | 2021-05-27 | 2022-08-09 | 宁波大学 | SQUID chip packaging structure device and packaging method |
| CN113793894A (en) * | 2021-08-20 | 2021-12-14 | 宁波大学 | SQUID chip pressure welding device and pressure welding method |
| CN113793894B (en) * | 2021-08-20 | 2024-03-29 | 宁波大学 | SQUID chip pressure welding device and pressure welding method |
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