CN108008797A - Microelectronics heat exchanger and its manufacture method based on Rice Leaf microcosmic surface - Google Patents
Microelectronics heat exchanger and its manufacture method based on Rice Leaf microcosmic surface Download PDFInfo
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- CN108008797A CN108008797A CN201810007091.XA CN201810007091A CN108008797A CN 108008797 A CN108008797 A CN 108008797A CN 201810007091 A CN201810007091 A CN 201810007091A CN 108008797 A CN108008797 A CN 108008797A
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- heat exchanger
- heat
- rice leaf
- exchanger fin
- microelectronics
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- 238000000034 method Methods 0.000 title claims abstract description 36
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
- 238000004377 microelectronic Methods 0.000 title claims abstract description 32
- 239000011664 nicotinic acid Substances 0.000 claims abstract description 15
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 15
- 238000007639 printing Methods 0.000 claims description 8
- 230000008859 change Effects 0.000 claims description 6
- 238000013461 design Methods 0.000 claims description 4
- 238000012360 testing method Methods 0.000 claims description 3
- 238000012546 transfer Methods 0.000 abstract description 13
- 238000010146 3D printing Methods 0.000 abstract description 6
- 238000005516 engineering process Methods 0.000 abstract description 6
- 238000007493 shaping process Methods 0.000 abstract description 4
- 238000000465 moulding Methods 0.000 abstract description 3
- 235000001968 nicotinic acid Nutrition 0.000 abstract description 3
- 241000196324 Embryophyta Species 0.000 abstract description 2
- 241001465754 Metazoa Species 0.000 abstract description 2
- 241000209094 Oryza Species 0.000 description 7
- 235000007164 Oryza sativa Nutrition 0.000 description 7
- 235000009566 rice Nutrition 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000012795 verification Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000003416 augmentation Effects 0.000 description 1
- 230000003592 biomimetic effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003278 mimic effect Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 239000002510 pyrogen Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
Abstract
The present invention discloses a kind of microelectronics heat exchanger and its manufacture method based on Rice Leaf microcosmic surface, based on bionics principle, nature animals and plants microscopic surface texture is applied on micro heat exchanger by Reverse engineering technology, the heat exchanger fin of Rice Leaf surface microstructure microelectronics heat exchanger is prepared using 3D printing technique, can effective one-pass molding, especially in the complicated micro-structure of the space of closing shaping.Manufacture method is simple, is suitable for the production of bionic surface structure product.The heat exchanger fin surface manufactured by this method has the stronger coefficient of heat transfer, realizes that the heat exchanger fin prepared compared with classical production process has stronger heat exchange property.The surface of heat exchanger fin adds imitative Rice Leaf surface microstructure, can strengthen the generation of the bubble on surface and depart from frequency.
Description
Technical field
The present invention relates to heat transfer enhancement technology field, and in particular to a kind of microelectronics heat exchange based on Rice Leaf microcosmic surface
Device and its manufacture method.
Background technology
At present, most of in the heat exchanger of in the market is the heat exchanger fin for adopting the smooth surface being made of aluminum or copper, this to change
Hot device is advantageous in that the Thermal conductivity using aluminium or copper product, and heat exchanger is attached on mainboard, and the heat of mainboard is passed
Lead on heat exchanger fin, under the drive of the flowing of fan formation gas on heat exchangers, the heat on heat exchanger fin be discharged to the external world,
Play the role of cooling.But with modern computer constantly bring forth new ideas and the running memory of computer software constantly increases, it is micro-
Electronics CPU accordingly runs power and also increases, and the heat of generation is consequently increased, the rate of heat transfer and conductivity of heat of traditional heat exchanger fin
It can far can not meet that the cooling of CPU require that, propose the requirement of higher to microelectronics heat exchanger in this case.It is micro-
The increase of electronic power, heat production increase therewith, are continuing with traditional heat exchanger, cannot exchanging heat in time for traditional heat exchanger fin, leads
Pyrogenicity amount constantly accumulates on cpu motherboard, just occurs problems, such as the excessive computer crash, again of causing of temperature of CPU
Open, blue screen, or even burn out mainboard.The heat exchange property of CPU has been increasingly becoming an important factor for restriction development of computer.In order to solve
This problem, the heat exchange wall surface of heat exchanging device are strengthened, and strengthen its heat exchange property, improve the heat-exchange performance of microelectronics heat exchanger
It can be of great significance.
In addition, reinforcing in the world to enhanced heat exchange surface at present prepares growing, many researchers study one after another
Various physics and chemical manufacturing method, such as photoetching process, interferometric method, fold method and electrical spinning method change original smooth surface or
Person's mimic biology surface microstructure manufactures.Have that process velocity is fast, and material is applied widely existing for these methods a little, and easily
In shaping.But there is stress variation involved in manufacturing process, being aligned of mould, standby maintenance expense height etc. for part in these methods to lack
Point, and be the requirement that required precision cannot reach biological surface microstructure there are a crucial factor, preparing biology
High to the size class of biological surface during microcosmic surface, microscopic surface texture is there are reasons such as irregular shapes, with these traditional sides
The bionic surface that method prepares.The feature of biosurface structure is not embodied preferably, thus, prepared product cannot
Bionic function is showed well.
The content of the invention
The present invention provides a kind of microelectronics heat exchanger and its manufacture method based on Rice Leaf microcosmic surface, passes through this 3D
The manufacture method of printing technique, the product obtained can greatly improve the possibility of bionics techniques, can specifically solve tradition and change
The insufficient problem that hot device heat exchange efficiency is not high and microelectronics heat exchanger method is brought.
To solve the above problems, the present invention is achieved by the following technical solutions：
Microelectronics heat exchanger based on Rice Leaf microcosmic surface, including heat exchange pedestal, heat exchanging body and heat exchange catheter；Heat exchanging body
The heat exchanger fin being arranged side by side by multi-disc is formed；Every heat exchanger fin is sheet, and the surface of every heat exchanger fin is provided with some
Convex heat exchange rib；Every heat exchange rib is in strip, and the section for the rib that exchanges heat is rectangle；All heat exchange ribs exist
The surface of heat exchanger fin is set in parallel interval between each other；Heat exchange catheter is inverted U shape；One end of heat exchange catheter passes across heat exchange base
Seat；The other end of heat exchange catheter passes across heat exchanging body, and all heat exchanger fins for forming heat exchanging body are worn together, and all changes
Backing is set in parallel interval between each other.
In such scheme, heat exchange rib extends on the surface of heat exchanger fin along perpendicular to horizontal plane direction.
In such scheme, heat exchanging body is positioned at the surface of heat exchange pedestal.
In such scheme, heat exchange pedestal is made of base and multi-disc thermally conductive sheet；Wherein base is the cube carried out；Heat conduction
Piece is sheet, and erects and be fixed on susceptor surface.
In such scheme, thermally conductive sheet is fixed on the upper surface of base.
In such scheme, the both ends of heat exchange catheter are opening-like, and are communicated with heat transferring medium.
The manufacture method of microelectronics heat exchanger based on Rice Leaf microcosmic surface, includes the manufacture of heat exchanger fin, its feature exists
In：It is as follows that the manufacture of the heat exchanger fin specifically includes step：
Step 1, with reverse engineering software Surfacer to Rice Leaf microcosmic surface carry out 3-D scanning handle, from
The characteristic point cloud of middle extraction Rice Leaf microscopic surface texture；
The characteristic point cloud of the Rice Leaf microscopic surface texture extracted, is embedded into given design space seat by step 2
In mark, vector parameter set is obtained；
Step 3, from vector parameter set randomly select indicatrix to build bionic curved surface；
Step 4, carry out slickness, continuity and error-detecting to bionic curved surface；When the testing result of bionic curved surface meets
It is required that when, then create heat exchanger fin threedimensional model；Otherwise, return to step 3；
Step 5, import the threedimensional model for creating heat exchanger fin in 3D printer system, and generates the stl file of heat exchanger fin；
Step 6, generate control print parameters according to the stl file of heat exchanger fin, and completes to be based on the microcosmic table of Rice Leaf accordingly
The heat exchanger fin printing of the microelectronics heat exchanger in face.
Compared with prior art, a kind of heat exchanger of the present invention based on the manufacture of rice microcosmic surface institutional framework, it exchanges heat
The surface of piece adds imitative Rice Leaf surface microstructure, can strengthen the generation of the bubble on surface and depart from frequency.This is bionical
Its surface of the heat exchanger fin of structure is opposite, and its area adds 12%-25% with the heat exchanger of smooth surface structure, is changed by increase
Thermal element increases heat exchange area to improve the heat exchange efficiency of heat exchanger, so as to have stronger heat exchange property, so as to quickly will
Heat on cpu motherboard is transmitted to rapidly on each heat exchanger fin, enhances the heat transfer effect of heat exchanger, reduces heat on mainboard
Accumulation, effectively prevent computer blue screen, crash, extend service life of mainboard.The present invention has heat-exchange performance stronger, and structure is simple
It is single, the tremendous development of the CPU constantly increased suitable for modern power.In addition, the present invention is based on bionics principle, pass through reverse
Engineering technology applies to nature animals and plants microscopic surface texture on micro heat exchanger, and rice is prepared using 3D printing technique
The heat exchanger fin of leaf surface microstructure microelectronics heat exchanger, can effective one-pass molding, especially in the space of closing, shaping is complicated micro-
Small structure.Manufacture method is simple, is suitable for the production of bionic surface structure product.The heat exchanger fin surface manufactured by this method
With the stronger coefficient of heat transfer, realize that the heat exchanger fin prepared compared with classical production process has stronger heat exchange property.
Brief description of the drawings
Fig. 1 is the structure diagram of the microelectronics heat exchanger based on Rice Leaf microcosmic surface.
Fig. 2 is the structure diagram of heat exchanger fin.
Fig. 3 is enlarged diagram at A in Fig. 2.
Fig. 4 is the manufacture method flow chart of the microelectronics heat exchanger based on Rice Leaf microcosmic surface.
Figure label：1st, heat exchange catheter；2nd, exchange heat pedestal；2-1, base；2-2, thermally conductive sheet；3rd, heat exchanging body；3-1, heat exchange
Piece；3-2, heat exchange rib.
Embodiment
For the object, technical solutions and advantages of the present invention are more clearly understood, below in conjunction with instantiation, and with reference to attached
Figure, the present invention is described in more detail.It should be noted that the direction term mentioned in example, such as " on ", " under ",
" in ", " left side " " right side ", "front", "rear" etc., be only refer to the attached drawing direction.Therefore, the direction used is intended merely to explanation
For limiting the scope of the invention.
A kind of microelectronics heat exchanger based on Rice Leaf microcosmic surface, as shown in Figure 1, including heat exchange pedestal 2, heat exchanging body 3
With heat exchange catheter 1.Heat exchange catheter 1 is inverted U shape.The both ends of heat exchange catheter 1 both can be in closed form, can also be opening-like.For
Heat exchange efficiency can be improved, in a preferred embodiment of the invention, the both ends of the heat exchange catheter 1 are opening-like, change at this time
Thermal medium flows to the other end by one end of heat exchange catheter 1.The heat transferring medium can be the heat transferring mediums such as air or freon.Change
One end of heat pipe 1 passes across heat exchange pedestal 2, and the other end of heat exchange catheter 1 passes across heat exchanging body 3.Heat exchanging body 3 by multi-disc side by side
The heat exchanger fin 3-1 of setting is formed, these heat exchanger fins 3-1 is worn together by heat exchange catheter 1, and causes all heat exchanger fin 3-1 phases
Set between mutually in parallel interval, heat exchanger channels are formed between every 2 heat exchanger fin 3-1.In the preferred embodiment of the present invention, heat exchange is logical
The width in road is 2mm, and it is the contact area for increasing heat exchanger fin 3-1 and air that it, which is acted on,.Heat exchanging body 3 is being located at heat exchange pedestal 2 just
Top.
Heat exchange pedestal 2 is made of base 2-1 and multi-disc thermally conductive sheet 2-2.Base 2-1 is the cube carried out, base 2-1's
Centre is embedded with silicon.Thermally conductive sheet 2-2 is sheet, and erects and be fixed on base 2-1 surfaces.In the present invention, thermally conductive sheet 2-2 can be set
On six surfaces of base 2-1, but consider cost and thermal conductivity, in a preferred embodiment of the invention, thermally conductive sheet 2-2 is only solid
It is scheduled on the upper surface of base 2-1.The thermally conductive sheet 2-2 can be smooth surface, or non-smooth surface.It is excellent in the present invention
Select in embodiment, the thermally conductive sheet 2-2 can also be provided with imitative Rice Leaf micro-structure table on its surface as heat exchanger fin 3-1
The rib in face.Referring to Fig. 1.
Every heat exchanger fin 3-1 is sheet, and the surface of every heat exchanger fin 3-1 is provided with some convex heat exchange ribs
3-2.In a preferred embodiment of the invention, the thickness of every heat exchanger fin 3-1 is 3mm, a length of 50mm, width 30mm.Every heat exchange
Rib 3-2 is in strip, and the section for the rib 3-2 that exchanges heat is rectangle.Exchanging heat rib 3-2 can on the surface of heat exchanger fin 3-1
To extend along perpendicular to horizontal plane direction, can also extend along level in horizontal plane direction, it might even be possible to along inclined direction extend.
In a preferred embodiment of the invention, in order to allow condensed water effectively to discharge, to improve heat exchange efficiency, the heat exchange rib 3-2
Extend on the surface of heat exchanger fin 3-1 along perpendicular to horizontal plane direction.All heat exchange rib 3-2 are mutual on the surface of heat exchanger fin 3-1
Between set in parallel interval, form groove between every 2 heat exchange rib 3-2.In a preferred embodiment of the invention, groove is wide
The microstructure groove of 0.3mm and high 0.2mm.Heat exchanger fin 3-1 surfaces are manufactured according to imitative Rice Leaf microcosmic surface, are that one kind has
The bionic surface of good hydrophobic structure, has large-sized groove optical grating construction on Rice Leaf surface, and possesses and water
The identical wellability of rice leaf surface, can strengthen the boiling heat transfer on heat exchanger fin 3-1 surfaces, increase the bubble production on surface and take off
From frequency.The heat exchanger heat exchanger channels wall of this structure-reinforced imitative Rice Leaf microcosmic surface of the invention, strengthens the coefficient of heat transfer,
It must conduct heat so as to effective.Referring to Fig. 2 and Fig. 3.
Heat exchange pedestal 2 is the heat transfer for connecting CPU, and the heat of CPU increases and heat exchanger fin 3- after the structure conduction
1 contact area.When CPU work produces substantial amounts of heat, the base 2-1 for the heat exchange substrate being attached on CPU has good heat conduction
Property, the heat in CPU small areas is transmitted on the heat exchanger fin 3-1 of heat exchanging body 3 by thermally conductive sheet 2-2 and heat exchange catheter 1.It is bionical
Its surface of the heat exchanger fin 3-1 of structure is opposite, and its area adds 12%-25% with the heat exchanger of smooth surface structure, passes through increase
Heat exchange element increases heat exchange area to improve the heat exchange efficiency of heat exchanger, quickly heat is transmitted in heat exchanger channels, in passage
Gas the flowing of the gas to be formed rotated in fan be discharged in the external world, it is better than traditional heat exchangers heat exchange property to realize, extensively
It is general to be applied in all kinds of microelectronics.
The present invention is based on Rice Leaf microscale surface features, this feature is bionical on micro heat exchanger heat exchanger fin 3-1 surfaces,
To increase the heat transfer area of heat exchanger, so as to reach augmentation of heat transfer feature, this bionic surface micro heat exchanger is in same heat exchange
In the case of amount, the volume of heat exchanger can be effectively reduced, reduces manufacture cost.
Due to Rice Leaf surface microstructure size requirement in 0.1mm.It is and each in Rice Leaf surface microstructure
The anisotropy requirement large scale groove is in high 0.2mm or so, wide 0.3mm or so.In order to reach this required precision, and
The heat exchanger fin 3-1 for preferably imitating Rice Leaf surface microscopic is prepared with this realize, strengthens the heat exchange property of microelectronics heat exchanger,
It is of crucial importance to find a kind of preparation method for meeting that this is required.3D printing technique preparation method required precision is on 0.1mm, its energy
Enough meet the required precision of its surface texture, the high 0.2mm wide 0.3mm groove structures on heat exchanger fin 3-1 surfaces can be by rice leaf table
The structured data in face must be reappeared on heat exchanger fin 3-1 in high precision.Imitative rice microcosmic surface parameter is carried by Reverse Engineering Technology
Out, bionical micromodel then is established with three-dimensional software, manufacture method is by laser sintered SLS technologies 3D printing technique
A kind of wetability heat exchanger fin 3-1 surfaces with Rice Leaf surface texture are prepared, the heat exchanger fin 3-1 of this structure is to be based on rice
What the microcosmic surface data of leaf were established, the size that the manufacture method printing precision has met imitative Rice Leaf surface texture will
Ask, this preparation method provides possibility for Rice Leaf microstructure is applied on heat exchanger fin 3-1.
Specifically, the manufacture method of the above-mentioned microelectronics heat exchanger based on Rice Leaf microcosmic surface, including heat exchanger fin 3-1
Manufacture, the manufacture of the heat exchanger fin 3-1 is as shown in figure 4, to specifically include step as follows：
Step 1, with reverse engineering software Surfacer to Rice Leaf microcosmic surface carry out 3-D scanning handle, from
The characteristic point cloud of middle extraction Rice Leaf microscopic surface texture；
The characteristic point cloud of the Rice Leaf microscopic surface texture extracted, is embedded into given design space seat by step 2
In mark, vector parameter set is obtained；
Step 3, from vector parameter set randomly select indicatrix to build bionic curved surface；
Step 4, carry out slickness, continuity and error-detecting to bionic curved surface；When the testing result of bionic curved surface meets
It is required that when, then create the threedimensional model of heat exchanger fin 3-1；Otherwise, return to step 3；
Step 5, import the threedimensional model for creating heat exchanger fin 3-1 in 3D printer system, and generates heat exchanger fin 3-1's
Stl file；
Step 6, generate control print parameters according to the stl file of heat exchanger fin 3-1, and completes accordingly microcosmic based on Rice Leaf
The heat exchanger fin 3-1 printings of the micro heat exchanger on surface.
In the present invention, 3D printing technique manufacture method can prepare changing for heat exchanger using aluminum metal powder as raw material
Backing 3-1.The heat exchanger fin 3-1 of Rice Leaf surface microstructure microelectronics heat exchanger is prepared using 3D printing technique, can be effective
One-pass molding, especially in the complicated micro-structure of the space of closing shaping.The heat exchanger fin 3-1 surfaces manufactured by this method have
The stronger coefficient of heat transfer, realizes that the heat exchanger fin 3-1 prepared compared with classical production process has stronger heat exchange property.
Heat exchanger fin 3-1 models for a kind of Rice Leaf surface texture microelectronics heat exchanger established before manufacture, the model
The data on surface are identical with the Rice Leaf surface data that extraction acquires, and model preservation is saved in into STL forms and is input to
In 3D printer, designed parameter value should reach the manufacture method required precision.By patent requirements, after importing model,
The parameter value that need to be printed, is 0.1mm by the precision setting of printing, and then heat exchanger fin 3-1 carries out slicing treatment, sets printing
Level filling rate, supporting rack, floor height etc., complete also to carry out the speed and temperature of nozzle after these.These parameters
Design influences whether Forming Quality, is even more important for the surface quality of heat exchanger fin 3-1.
Contrast verification surface, by measuring instrument after amplification, whether the surface quality for contrasting finished product meets what is designed at first
Data, if do not met, it is necessary to readjusting parameter carries out printing verification, also need to contact water droplet on its surface after structure verification
Whether angle size and wetability are with being tested as Rice Leaf surface, the final heat exchanger fin 3-1 for obtaining biomimetic features.
Microelectronics heat exchanger fin 3-1 of the present invention is based on the basis with good hydrophobic Rice Leaf surface microstructure
On, its surface texture data is extracted by reverse-engineering, obtains the two dimensional character figure on rice surface, is carried out according to its data three-dimensional
Modeling.The heat exchanger fin 3-1 is the groove structure for having Rice Leaf surface identical, equally with identical wellability.This is imitative
The heat exchanger fin 3-1 of Rice Leaf surface texture shows the static hydrophobicity almost identical with Rice Leaf, and enhances heat exchanger fin
The boiling on 3-1 surfaces, good boiling can strengthen the bubble formation on surface and depart from frequency, enhance heat exchange surface
The coefficient of heat transfer.The heat exchange property of microelectronics heat exchanger heat exchanger fin 3-1 is further enhanced, improves the biography between mainboard and heat exchanger
Thermal effect, effectively optimizes the heat transfer effect of traditional heat exchangers.
It should be noted that although embodiment of the present invention is illustrative above, but it is to the present invention that this, which is not,
Limitation, therefore the invention is not limited in above-mentioned embodiment.Without departing from the principles of the present invention, it is every
The other embodiment that those skilled in the art obtain under the enlightenment of the present invention, is accordingly to be regarded as within the protection of the present invention.
Claims (7)
1. the microelectronics heat exchanger based on Rice Leaf microcosmic surface, it is characterized in that, including heat exchange pedestal (2), heat exchanging body (3) and change
Heat pipe (1)；
The heat exchanger fin (3-1) that heat exchanging body (3) is arranged side by side by multi-disc is formed；Every heat exchanger fin (3-1) is sheet, and every is changed
The surface of backing (3-1) is provided with some convex heat exchange ribs (3-2)；Every heat exchange rib (3-2) is in strip, and
The section of heat exchange rib (3-2) is rectangle；All heat exchange ribs (3-2) are on the surface of heat exchanger fin (3-1) between each other in flat
Between-line spacing is set；
Heat exchange catheter (1) is inverted U shape；One end of heat exchange catheter (1) passes across heat exchange pedestal (2)；The other end of heat exchange catheter (1)
Heat exchanging body (3) is passed across, and all heat exchanger fins (3-1) for forming heat exchanging body (3) are worn together, and all heat exchanger fin (3-
1) set between each other in parallel interval.
2. the microelectronics heat exchanger according to claim 1 based on Rice Leaf microcosmic surface, it is characterized in that, exchange heat rib
(3-2) extends on the surface of heat exchanger fin (3-1) along perpendicular to horizontal plane direction.
3. the microelectronics heat exchanger based on Rice Leaf microcosmic surface according to claim 1 or 3, it is characterized in that, heat exchanging body
(3) positioned at the surface of heat exchange pedestal (2).
4. the microelectronics heat exchanger according to claim 1 based on Rice Leaf microcosmic surface, it is characterized in that, exchange heat pedestal
(2) it is made of base (2-1) and multi-disc thermally conductive sheet (2-2)；Wherein base (2-1) is the cube carried out；Thermally conductive sheet (2-2) is
Sheet, and erect and be fixed on base (2-1) surface.
5. the microelectronics heat exchanger according to claim 4 based on Rice Leaf microcosmic surface, thermally conductive sheet (2-2) are fixed on bottom
The upper surface of seat (2-1).
6. the microelectronics heat exchanger according to claim 1 based on Rice Leaf microcosmic surface, it is characterized in that, heat exchange catheter
(1) both ends are opening-like, and are communicated with heat transferring medium.
7. realize the manufacture method of the microelectronics heat exchanger based on Rice Leaf microcosmic surface described in claim 1, including heat exchanger fin
The manufacture of (3-1), it is characterised in that：It is as follows that the manufacture of the heat exchanger fin (3-1) specifically includes step：
Step 1, with reverse engineering software Surfacer to Rice Leaf microcosmic surface carry out 3-D scanning handle, Cong Zhongti
Take the characteristic point cloud of Rice Leaf microscopic surface texture；
The characteristic point cloud of the Rice Leaf microscopic surface texture extracted, be embedded into given design space coordinate by step 2,
Obtain vector parameter set；
Step 3, from vector parameter set randomly select indicatrix to build bionic curved surface；
Step 4, carry out slickness, continuity and error-detecting to bionic curved surface；When the testing result of bionic curved surface meets the requirements
When, then create heat exchanger fin (3-1) threedimensional model；Otherwise, return to step 3；
Step 5, the threedimensional model that will create heat exchanger fin (3-1) are imported in 3D printer system, and generate heat exchanger fin (3-1)
Stl file；
Step 6, generate control print parameters according to the stl file of heat exchanger fin (3-1), and completes to be based on the microcosmic table of Rice Leaf accordingly
Heat exchanger fin (3-1) printing of the microelectronics heat exchanger in face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810007091.XA CN108008797A (en) | 2018-01-04 | 2018-01-04 | Microelectronics heat exchanger and its manufacture method based on Rice Leaf microcosmic surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810007091.XA CN108008797A (en) | 2018-01-04 | 2018-01-04 | Microelectronics heat exchanger and its manufacture method based on Rice Leaf microcosmic surface |
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|---|---|
| CN108008797A true CN108008797A (en) | 2018-05-08 |
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| CN201810007091.XA Pending CN108008797A (en) | 2018-01-04 | 2018-01-04 | Microelectronics heat exchanger and its manufacture method based on Rice Leaf microcosmic surface |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2655327Y (en) * | 2003-08-07 | 2004-11-10 | 珍通科技股份有限公司 | Radiating structure for central processor |
| CN101005751A (en) * | 2006-01-18 | 2007-07-25 | 富准精密工业(深圳)有限公司 | Heat sink |
| CN201638805U (en) * | 2010-04-23 | 2010-11-17 | 锘威科技(深圳)有限公司 | Radiator fin set and radiator using the same |
| CN102969287A (en) * | 2011-08-31 | 2013-03-13 | 英业达股份有限公司 | Radiator |
| CN105750545A (en) * | 2016-03-29 | 2016-07-13 | 上海卫星工程研究所 | Method using 3D printing to manufacture heat exchanger |
-
2018
- 2018-01-04 CN CN201810007091.XA patent/CN108008797A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2655327Y (en) * | 2003-08-07 | 2004-11-10 | 珍通科技股份有限公司 | Radiating structure for central processor |
| CN101005751A (en) * | 2006-01-18 | 2007-07-25 | 富准精密工业(深圳)有限公司 | Heat sink |
| CN201638805U (en) * | 2010-04-23 | 2010-11-17 | 锘威科技(深圳)有限公司 | Radiator fin set and radiator using the same |
| CN102969287A (en) * | 2011-08-31 | 2013-03-13 | 英业达股份有限公司 | Radiator |
| CN105750545A (en) * | 2016-03-29 | 2016-07-13 | 上海卫星工程研究所 | Method using 3D printing to manufacture heat exchanger |
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