CN108008764A - 电路板组合 - Google Patents

电路板组合 Download PDF

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Publication number
CN108008764A
CN108008764A CN201610939519.5A CN201610939519A CN108008764A CN 108008764 A CN108008764 A CN 108008764A CN 201610939519 A CN201610939519 A CN 201610939519A CN 108008764 A CN108008764 A CN 108008764A
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CN
China
Prior art keywords
circuit board
interface
edge
interface module
composition
Prior art date
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Pending
Application number
CN201610939519.5A
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English (en)
Inventor
洪文祥
顾纯宝
陈钦洲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shaoxing Jicheng Packaging Machinery Co ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Shaoxing Jicheng Packaging Machinery Co ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shaoxing Jicheng Packaging Machinery Co ltd, Hon Hai Precision Industry Co Ltd filed Critical Shaoxing Jicheng Packaging Machinery Co ltd
Priority to CN201610939519.5A priority Critical patent/CN108008764A/zh
Priority to US15/394,845 priority patent/US20180124918A1/en
Publication of CN108008764A publication Critical patent/CN108008764A/zh
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/117Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/184Mounting of motherboards
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/185Mounting of expansion boards
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/186Securing of expansion boards in correspondence to slots provided at the computer enclosure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09063Holes or slots in insulating substrate not used for electrical connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10189Non-printed connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

一种电路板组合,包括一电路板及一安装在所述电路板上的控制芯片,所述电路板具有第一边缘及与所述第一边缘相对的第二边缘,所述电路板靠近所述第一边缘位置装设一第一接口模组,所述电路板相对所述第一边缘的第二边缘位置装设一第二接口模组,所述控制芯片分别通过一第一电路板导线及一第二电路板导线与所述第一接口模组及所述第二接口模组电性连接,所述第一电路板导线长度等于所述第二电路板导线长度。

Description

电路板组合
技术领域
本发明涉及一种电路板组合。
背景技术
安装在机箱内的主板,是计算机中最基本的、最重要的部件之一。主板一般为矩形电路板,其上安装了组成计算机的主要电路系统,一般有BIOS芯片、I/O控制芯片、键盘和面板控制开关转接口、指示灯插接件、扩充插槽、主板及插卡的直流电源供电接插件等元件。
而在主板的前后两侧分别有若干接口与I/O控制芯片相连,然而由于机箱体积及主板尺寸的限制,使得I/O控制芯片与其中一侧或前后两侧的接口距离较远,从而不利于信号的传输。
发明内容
鉴于以上内容,有必要提供一种方便信号传输的电路板组合。
一种电路板组合,包括一电路板及一安装在所述电路板上的控制芯片,所述电路板具有第一边缘及与所述第一边缘相对的第二边缘,所述电路板靠近所述第一边缘位置装设一第一接口模组,所述电路板相对所述第一边缘的第二边缘位置装设一第二接口模组,所述控制芯片分别通过一第一电路板导线及一第二电路板导线与所述第一接口模组及所述第二接口模组电性连接,所述第一电路板导线长度等于所述第二电路板导线长度。
优选地,所述第一接口模组包括若干第一接口,所述第一接口用以电性连接其他电子设备。
优选地,所述第二接口模组包括若干第二接口,所述第二接口用以电性连接其他电子设备。
优选地,所述控制芯片为一南桥芯片。
优选地,所述第一接口及所述第二接口包括USB接口、HDMI接口、VGA接口、DVI接口中的任一种或多种的组合。
优选地,所述电路板四周设有若干固定孔,若干紧固件穿过所述固定孔而将所述电路板固定到一机箱中。
优选地,所述电路板上还设有若干第一插槽及若干第二插槽,所述第一插槽及所述第二插槽用以插接不同种类的扩充卡。
相较于现有技术,上述电路板组合通过调整所述第一接口模组及所述第二接口模组在所述电路板上的位置,从而使得连接所述控制芯片与所述第一接口模组之间的第一电路板导线的长度等于连接所述控制芯片与所述第二接口模组之间的第二电路板导线的长度,进而方便所述控制芯片与所述第一接口模组及所述第二接口模组之间的信号传输。
附图说明
图1是本发明电路板组合的一较佳实施方式的一立体组装图。
主要元件符号说明
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请参阅图1,本发明的一较佳实施方式中,一种电路板组合100包括一电路板10、若干安装在所述电路板10上的电子元件50及若干插接在所述电路板10上的扩充卡(图中未示)。在一实施例中,所述电路板10可以为一主板,所述电子元件50包括但不限于中央处理器、图形处理器、连接器等。
请继续参阅图1,所述电路板10包括有一第一边缘11及一与所述第一边缘11相对的第二边缘12。所述第一边缘11大致平行于所述第二边缘12。所述电路板10四周还设有若干固定孔13,若干紧固件(图中未示)能够穿过所述固定孔13而将所述电路板10固定到一机箱(图中未示)中。所述电路板10上还设有若干第一插槽21及若干第二插槽22,所述第一插槽21及所述第二插槽22用以插接不同种类的扩充卡。
所述电路板10在所述第一边缘11设有若干第一接口模组31,所述第一接口模组31包括若干第一接口32,所述第一接口32用以电性连接其他电子设备。所述电路板10在所述第二边缘12设有若干第二接口模组35,所述第二接口模组35包括若干第二接口36,所述第二接口36用以电性连接其他电子设备。在一实施例中,所述第一接口32及所述第二接口36包括USB接口、HDMI接口、VGA接口、DVI接口中的任一种或多种的组合,其他电子设备包括键盘、鼠标、耳机、外接硬盘等。
所述电子元件50包括一控制芯片55,所述控制芯片55能够接收及发射信号而控制所述第一接口模组31及所述第二接口模组35。所述控制芯片55与所述第一接口模组31之间通过一第一电路板导线41电性连接,所述控制芯片55 与所述第二接口模组32之间通过一第二电路板导线42电性连接。所述第一电路板导线41长度大致等于所述第二电路板导线42长度从而方便所述控制芯片55与所述第一接口模组31及所述第二接口模组36之间的信号传输。在一实施例中,所述第一电路板导线41及所述第二电路板导线42指的是在所述电路板10上布线设计,所述电性连接指的是走线连接方式。所述控制芯片55为一南桥芯片。
本发明所述电路板组合100通过调整所述第一接口模组31及所述第二接口模组35在所述电路板10上的位置,从而使得连接所述控制芯片55与所述第一接口模组31之间的第一电路板导线41的长度等于连接所述控制芯片55与所述第二接口模组35之间的第二电路板导线42的长度,进而方便所述控制芯片55与所述第一接口模组31及所述第二接口模组36之间的信号传输。
本技术领域的普通技术人员应当认识到,以上的实施方式仅是用来说明本发明,而并非用作为对本发明的限定,只要在本发明的实质精神范围之内,对以上实施例所作的适当改变和变化都落在本发明要求公开的范围之内。

Claims (7)

1.一种电路板组合,包括一电路板及一安装在所述电路板上的控制芯片,所述电路板具有第一边缘及与所述第一边缘相对的第二边缘,其特征在于:所述电路板靠近所述第一边缘位置装设一第一接口模组,所述电路板相对所述第一边缘的第二边缘位置装设一第二接口模组,所述控制芯片分别通过一第一电路板导线及一第二电路板导线与所述第一接口模组及所述第二接口模组电性连接,所述第一电路板导线长度等于所述第二电路板导线长度。
2.如权利要求1所述的电路板组合,其特征在于:所述第一接口模组包括若干第一接口,所述第一接口用以电性连接其他电子设备。
3.如权利要求1所述的电路板组合,其特征在于:所述第二接口模组包括若干第二接口,所述第二接口用以电性连接其他电子设备。
4.如权利要求1所述的电路板组合,其特征在于:所述控制芯片为一南桥芯片。
5.如权利要求1所述的电路板组合,其特征在于:所述第一接口及所述第二接口包括USB接口、HDMI接口、VGA接口、DVI接口中的任一种或多种的组合。
6.如权利要求1所述的电路板组合,其特征在于:所述电路板四周设有若干固定孔,若干紧固件穿过所述固定孔而将所述电路板固定到一机箱中。
7.如权利要求1所述的电路板组合,其特征在于:所述电路板上还设有若干第一插槽及若干第二插槽,所述第一插槽及所述第二插槽用以插接不同种类的扩充卡。
CN201610939519.5A 2016-10-31 2016-10-31 电路板组合 Pending CN108008764A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201610939519.5A CN108008764A (zh) 2016-10-31 2016-10-31 电路板组合
US15/394,845 US20180124918A1 (en) 2016-10-31 2016-12-30 Circuit board and circuit board combination

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Application Number Priority Date Filing Date Title
CN201610939519.5A CN108008764A (zh) 2016-10-31 2016-10-31 电路板组合

Publications (1)

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CN108008764A true CN108008764A (zh) 2018-05-08

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CN (1) CN108008764A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020019990A1 (zh) * 2018-07-23 2020-01-30 华为技术有限公司 电路板组合以及电子设备

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* Cited by examiner, † Cited by third party
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EP0813135A1 (en) * 1996-01-31 1997-12-17 Hsi-Kuang Ma Combination of computer mainframe housing, sound producing unit, and mainframe unit
US6147862A (en) * 1998-08-26 2000-11-14 Ho; Hsin Chien Quick-detachable computer housing
US20120002455A1 (en) * 2010-06-07 2012-01-05 Sullivan Jason A Miniturization techniques, systems, and apparatus relatng to power supplies, memory, interconnections, and leds
US20120170233A1 (en) * 2010-12-29 2012-07-05 Kang Ku Mainframe structure
US20130321362A1 (en) * 2012-06-05 2013-12-05 Shenzhen China Star Optoelectronics Technology Co. Ltd. Display Panel and Drive Method of Panel Display Device

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US6349038B1 (en) * 1999-09-21 2002-02-19 Dell Usa, L.P. EMC characteristics of a printed circuit board
CN100377032C (zh) * 2005-07-29 2008-03-26 鸿富锦精密工业(深圳)有限公司 笔记本电脑主板
JP5247509B2 (ja) * 2009-02-10 2013-07-24 キヤノン株式会社 電子機器
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CN103034283A (zh) * 2011-10-06 2013-04-10 鸿富锦精密工业(深圳)有限公司 安装有固态硬盘的主板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0813135A1 (en) * 1996-01-31 1997-12-17 Hsi-Kuang Ma Combination of computer mainframe housing, sound producing unit, and mainframe unit
US6147862A (en) * 1998-08-26 2000-11-14 Ho; Hsin Chien Quick-detachable computer housing
US20120002455A1 (en) * 2010-06-07 2012-01-05 Sullivan Jason A Miniturization techniques, systems, and apparatus relatng to power supplies, memory, interconnections, and leds
US20120170233A1 (en) * 2010-12-29 2012-07-05 Kang Ku Mainframe structure
US20130321362A1 (en) * 2012-06-05 2013-12-05 Shenzhen China Star Optoelectronics Technology Co. Ltd. Display Panel and Drive Method of Panel Display Device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020019990A1 (zh) * 2018-07-23 2020-01-30 华为技术有限公司 电路板组合以及电子设备
US11805592B2 (en) 2018-07-23 2023-10-31 Huawei Technologies Co., Ltd. Circuit board assembly and electronic device

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Application publication date: 20180508