CN108004571B - The reinforced structure and plate electroplating mold of plate electroplating mold plating window - Google Patents
The reinforced structure and plate electroplating mold of plate electroplating mold plating window Download PDFInfo
- Publication number
- CN108004571B CN108004571B CN201711191927.8A CN201711191927A CN108004571B CN 108004571 B CN108004571 B CN 108004571B CN 201711191927 A CN201711191927 A CN 201711191927A CN 108004571 B CN108004571 B CN 108004571B
- Authority
- CN
- China
- Prior art keywords
- window
- plating
- plate
- plating window
- electroplating mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
Abstract
This application provides the reinforced structures and plate electroplating mold of plate electroplating mold plating window, the plate electroplating mold includes die ontology, the die ontology is equipped with several plating windows, support portion is equipped in the plating window, the support portion includes the support plate in plating window and the support leg set on support plate two sides and along the extension of plating length of window direction and with die ontology integrally connected, length of the support plate along plating window width direction is longer than support leg along the length in plating window width direction, the support plate and support leg are set to the middle part of plating window, plating window linear array arrangement on die ontology.Plate electroplating mold, the reinforced structure including plate electroplating mold as described above plating window.After increasing support portion in plating window, it can effectively prevent electroplated product from sinking down into plating window, avoiding influences electroplating activity because electroplated product sinks, and product rejection rate is effectively reduced.
Description
[technical field]
The reinforced structure of window is electroplated this application involves electroplating mold technical field more particularly to plate electroplating mold and puts down
Plate electroplating mold.
[background technique]
In existing plate electroplating technology, in order to reduce die cost, the plate electroplating mould when liquid medicine ejiction opening is consistent
If tool can design the consistent plating window of stem structure, electroplated product is placed on plating window and carries out electroplating activity.But it is electroplated
When carrying out electroplating activity on being placed in plating window, since existing plating window is hollow structure, plating produces product
Product are easy to sink down into plating window, so that electroplating activity cannot be carried out normally, cause scrap, seriously affect production effect
Rate.
[summary of the invention]
In order to improve the production efficiency, product rejection rate is reduced, prevents electroplated product from sinking down into plating window in electroplating activity
In mouthful, this application provides the reinforced structures and plate electroplating mold of plate electroplating mold plating window.
The application is implemented by the following technical solutions:
The reinforced structure of window, including die ontology is electroplated in plate electroplating mold, and the die ontology is equipped with several
Window is electroplated, is equipped with support portion in the plating window.
The support portion includes set on the support plate being electroplated in window and set on the support plate two sides and along the plating
Length of window direction extends and the support leg with the die ontology integrally connected.
It is wide along the plating window that length of the support plate along the plating window width direction is longer than the support leg
Spend the length in direction.
The support plate and the support leg are set to the middle part of the plating window.
The plating window linear array arrangement on the die ontology.
The plating window is square window, and four angles of the plating window are arc angling.
Present invention also provides plate electroplating mold, the reinforcement knot including plate electroplating mold as described above plating window
Structure.
Compared with prior art, the application has the following advantages:
After the application adds in plating window and is used to support the support portion of electroplated product, electroplated product can be effectively prevented
It sinks down into plating window, avoiding influences electroplating activity because electroplated product sinks, to be effectively reduced die debugging
Time reduces product rejection rate, improves the production efficiency of electroplated product.
[Detailed description of the invention]
In order to more clearly explain the technical solutions in the embodiments of the present application, make required in being described below to embodiment
Attached drawing is briefly described.
Fig. 1 is the reinforced structure schematic diagram of plate electroplating mold plating window；
Fig. 2 is the portion the A enlarged diagram of Fig. 1.
[specific embodiment]
The reinforced structure of plate electroplating mold plating window as depicted in figs. 1 and 2, including die ontology 1, the mold
Ontology 1 is equipped with several plating windows 2, is equipped with support portion 3 in the plating window 2.By adding use in plating window
It after the support portion of support electroplated product, can effectively prevent electroplated product from sinking down into plating window, avoid because plating produces
Product sink and influence electroplating activity, to be effectively reduced the die debugging time, reduce product rejection rate, improve product
Yields and electroplated product production efficiency, yields can reach 97.19%.
The support portion 3 includes set on the support plate 31 being electroplated in window 2 and set on 31 two sides of support plate and along institute
State the extension of plating 2 length direction of window and the support leg 32 with 1 integrally connected of die ontology, support plate 31 and support leg 32
The supporting structure extended along plating 2 length direction of window is collectively formed in plating window 2, effectively electroplated product can be risen
To supporting role, prevent electroplated product from sinking down into plating window 2.
The support plate 31 is longer than the support leg 32 along the plating window along the length of plating 2 width direction of window
The length of 2 width directions of mouth, the width of support plate 31 are wider than the width of support leg 32, can guarantee that support portion is good to electroplated product
Support effect under the premise of, and support portion area shared in plating window 2 can be reduced, electroplating activity is made to carry out more suitable
Freely, to can be further improved the production efficiency of electroplating activity, the support plate 31 and the support leg 32 are set to the electricity
Plate the middle part of window 2.Set on plating window in the middle part of support portion can be most strong support electroplated product.
In order to meet needs of production, the production efficiency of plating production is improved, the plating window 2 is in the mold sheet
Linear array arrangement on body 1, the plating window 2 is square window, and four angles of the plating window 2 are fallen for arc
Angle.
The present embodiment additionally provides plate electroplating mold, the reinforcement including plate electroplating mold as described above plating window
Structure.
The present embodiment working principle is as follows:
After adding in plating window and being used to support the support portion of electroplated product, can effectively it prevent under electroplated product
It is sink in plating window, avoiding influences electroplating activity because electroplated product sinks, thus when being effectively reduced die debugging
Between, product rejection rate is reduced, the production efficiency of electroplated product is improved.
It is a kind of embodiment provided in conjunction with particular content as described above, does not assert the specific implementation office of the application
It is limited to these explanations.It is all approximate with the present processes, structure etc., identical, if or for being made under the application concept thereof
Dry technology deduction or replace, all should be considered as the protection scope of the application.
Claims (6)
1. the reinforced structure of window, including die ontology (1) is electroplated in plate electroplating mold, the die ontology (1) is if be equipped with
Dry plating window (2), which is characterized in that be equipped with support portion (3) in the plating window (2), the support portion (3) includes setting
In the support plate (31) in plating window (2) and set on the support plate (31) two sides and along plating window (2) the length side
Support leg (32) to extending and with the die ontology (1) integrally connected.
2. the reinforced structure of plate electroplating mold plating window according to claim 1, which is characterized in that the support plate
(31) length along described plating window (2) width direction is longer than the support leg (32) along plating window (2) the width side
To length.
3. the reinforced structure of plate electroplating mold plating window according to claim 2, which is characterized in that the support plate
(31) and the support leg (32) is set to the middle part that window (2) are electroplated.
4. the reinforced structure of plate electroplating mold plating window according to claim 1, which is characterized in that the plating window
Mouth (2) linear array arrangement on the die ontology (1).
5. the reinforced structure of plate electroplating mold plating window according to claim 1, which is characterized in that the plating window
Mouth (2) is square window, and four angles of plating window (2) are arc angling.
6. plate electroplating mold, which is characterized in that including the described in any item plate electroplating mold plating of such as claim 1-5
The reinforced structure of window.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711191927.8A CN108004571B (en) | 2017-11-24 | 2017-11-24 | The reinforced structure and plate electroplating mold of plate electroplating mold plating window |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711191927.8A CN108004571B (en) | 2017-11-24 | 2017-11-24 | The reinforced structure and plate electroplating mold of plate electroplating mold plating window |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108004571A CN108004571A (en) | 2018-05-08 |
| CN108004571B true CN108004571B (en) | 2019-03-26 |
Family
ID=62053930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711191927.8A Active CN108004571B (en) | 2017-11-24 | 2017-11-24 | The reinforced structure and plate electroplating mold of plate electroplating mold plating window |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108004571B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111435764B (en) * | 2020-03-20 | 2022-04-15 | 上海阿莱德实业股份有限公司 | Preparation method of 5G base station antenna housing integrating antenna radiation unit and prepared antenna housing |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11100692A (en) * | 1997-09-26 | 1999-04-13 | Dainippon Printing Co Ltd | Partial plating apparatus of lead frame and partial plating method |
| JPH11124699A (en) * | 1997-10-22 | 1999-05-11 | Dainippon Printing Co Ltd | Plating leakage peeling device and partial plating device for lead frame |
| US6921551B2 (en) * | 2000-08-10 | 2005-07-26 | Asm Nutool, Inc. | Plating method and apparatus for controlling deposition on predetermined portions of a workpiece |
| CN201758142U (en) * | 2010-05-07 | 2011-03-09 | 厦门永红科技有限公司 | LED lead frame and electroplating device thereof |
| CN202865360U (en) * | 2012-09-20 | 2013-04-10 | 中山复盛机电有限公司 | Plating mould |
| CN203653723U (en) * | 2013-12-24 | 2014-06-18 | 昆山一鼎电镀设备有限公司 | Pressing plate die for chip-type selective electroplating |
| CN204138798U (en) * | 2014-10-11 | 2015-02-04 | 昆山一鼎电镀设备有限公司 | A kind of selective electroplating bar plating mould |
-
2017
- 2017-11-24 CN CN201711191927.8A patent/CN108004571B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN108004571A (en) | 2018-05-08 |
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| TR01 | Transfer of patent right |
Effective date of registration: 20190717 Address after: 529100 New Wealth Environmental Protection Electroplating Base, Yamen Town, Xinhui District, Jiangmen City, Guangdong Province Patentee after: Jiangmen Fusheng Mechanical and Electrical Co., Ltd. Address before: 528437 No. 12 Torch Road, Zhongshan Torch Development Zone, Guangdong Province Patentee before: ZHONGSHAN FUSHENG ELECTROMECHANICAL CO., LTD. |
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| TR01 | Transfer of patent right |