CN1080004C - 具有引线的电子部件 - Google Patents

具有引线的电子部件 Download PDF

Info

Publication number
CN1080004C
CN1080004C CN95108511A CN95108511A CN1080004C CN 1080004 C CN1080004 C CN 1080004C CN 95108511 A CN95108511 A CN 95108511A CN 95108511 A CN95108511 A CN 95108511A CN 1080004 C CN1080004 C CN 1080004C
Authority
CN
China
Prior art keywords
loosening
lead
knot
lead wire
remote control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN95108511A
Other languages
English (en)
Chinese (zh)
Other versions
CN1121280A (zh
Inventor
原田善夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of CN1121280A publication Critical patent/CN1121280A/zh
Application granted granted Critical
Publication of CN1080004C publication Critical patent/CN1080004C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
    • H01J5/02—Vessels; Containers; Shields associated therewith; Vacuum locks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/04—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for forming connections by deformation, e.g. crimping tool
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/04—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for forming connections by deformation, e.g. crimping tool
    • H01R43/042—Hand tools for crimping
    • H01R43/0424—Hand tools for crimping with more than two radially actuated mandrels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S72/00—Metal deforming
    • Y10S72/712—Electrical terminal crimper
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y10T29/4914—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y10T29/4914—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal
    • Y10T29/49142—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal including metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49151—Assembling terminal to base by deforming or shaping
    • Y10T29/49153—Assembling terminal to base by deforming or shaping with shaping or forcing terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49174—Assembling terminal to elongated conductor
    • Y10T29/49181—Assembling terminal to elongated conductor by deforming
    • Y10T29/49183—Assembling terminal to elongated conductor by deforming of ferrule about conductor and terminal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49218—Contact or terminal manufacturing by assembling plural parts with deforming

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Light Receiving Elements (AREA)
  • Selective Calling Equipment (AREA)
  • Optical Communication System (AREA)
CN95108511A 1994-06-10 1995-06-09 具有引线的电子部件 Expired - Fee Related CN1080004C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP15258494 1994-06-10
JP152584/94 1994-06-10

Publications (2)

Publication Number Publication Date
CN1121280A CN1121280A (zh) 1996-04-24
CN1080004C true CN1080004C (zh) 2002-02-27

Family

ID=15543662

Family Applications (1)

Application Number Title Priority Date Filing Date
CN95108511A Expired - Fee Related CN1080004C (zh) 1994-06-10 1995-06-09 具有引线的电子部件

Country Status (4)

Country Link
US (2) US5901442A (enExample)
KR (1) KR960003162A (enExample)
CN (1) CN1080004C (enExample)
TW (1) TW303427B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4486591B2 (ja) * 2005-12-19 2010-06-23 シャープ株式会社 リード端子導出型電子部品
CN102959699B (zh) * 2010-08-06 2015-12-09 松下电器产业株式会社 电路基板及其制造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4246627A (en) * 1978-03-23 1981-01-20 Stettner & Co. Electrical circuit element with multiple conection pins for solder plug-in connection

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3230612A (en) * 1955-07-07 1966-01-25 Amp Inc Method of applying components to circuitry boards
US2994057A (en) * 1957-08-14 1961-07-25 Sprague Electric Co Arrowhead lead for wiring board
GB966149A (en) * 1962-11-02 1964-08-06 Gen Precision Inc Combination of printed circuit board and weldable wire attachment device
US3203078A (en) * 1963-01-04 1965-08-31 Buchanan Electrical Prod Corp Method of making an electrical connection
US3686625A (en) * 1969-12-10 1972-08-22 Molex Products Co Solder resist
US3638305A (en) * 1970-05-07 1972-02-01 Philips Corp Method for forming the vacuumtight closure of a through-connection
DE2812767B2 (de) * 1978-03-23 1980-10-23 Stettner & Co, 8560 Lauf Elektrisches Bauelement mit Anschlußdrähten zum Einstecken in Bohrungen der Platte einer gedruckten Schaltung
US4214120A (en) * 1978-10-27 1980-07-22 Western Electric Company, Inc. Electronic device package having solder leads and methods of assembling the package
IT1181254B (it) * 1984-11-20 1987-09-23 Arcotronics Italia Spa Apparecchiatura per l'inserimento automatico dei reofori di componenti elettrici e/o elettr.ci in corrispondenti fori passanti di un circuito stampato
US4704790A (en) * 1985-12-06 1987-11-10 Universal Instruments Corp. Method and apparatus for attaching components to substrates
US4691971A (en) * 1986-09-17 1987-09-08 E. I. Du Pont De Nemours And Company Connector with compliant retainer
JPS63129652A (ja) * 1986-11-20 1988-06-02 Toshiba Corp 半導体装置
US5038467A (en) * 1989-11-09 1991-08-13 Advanced Interconnections Corporation Apparatus and method for installation of multi-pin components on circuit boards

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4246627A (en) * 1978-03-23 1981-01-20 Stettner & Co. Electrical circuit element with multiple conection pins for solder plug-in connection

Also Published As

Publication number Publication date
TW303427B (enExample) 1997-04-21
US6444977B1 (en) 2002-09-03
KR960003162A (ko) 1996-01-26
CN1121280A (zh) 1996-04-24
US5901442A (en) 1999-05-11

Similar Documents

Publication Publication Date Title
CN1118097C (zh) 半导体器件
CN101339285B (zh) 相机模块封装
US7177155B2 (en) Semiconductor package with heat sink
US6472761B2 (en) Solid-state image pickup apparatus and manufacturing method thereof
US20030173500A1 (en) Semiconductor device module
US8077248B2 (en) Optical device and production method thereof
US7151251B2 (en) Connector and image sensor module using the same
EP0126664A2 (en) Wire bonding method for producing a semiconductor device and semiconductor device produced by this method
CN1192041A (zh) 半导体器件的制造方法
US11502434B2 (en) Power semiconductor module
CN1287700A (zh) 光模块及其制造方法
KR20040093360A (ko) 고체 촬상 장치 및 그 제조 방법
CN100380924C (zh) 照相机模块,供照相机模块中使用的固定器,照相机系统以及制造照相机模块的方法
EP1096559A2 (en) Method and apparatus for underfilling semiconductor devices
US8466009B2 (en) Method of fabricating a semiconductor package with mold lock opening
CN1080004C (zh) 具有引线的电子部件
CN1314600A (zh) 摄像装置
CN101056358A (zh) 相机模块
JP2966591B2 (ja) 光半導体装置
CN1126399A (zh) 光传感器
CN1761065A (zh) 光学器件
CN1462474A (zh) 半导体器件的制造方法
CN1423342A (zh) 固态成像设备及其制造方法
US7242538B2 (en) Optical device
CN1407360A (zh) 光学接插件和光学元件

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee