CN107999996A - It is a kind of to be used for aluminium and its tin base leadless soldering-flux alloy of alloy solder - Google Patents
It is a kind of to be used for aluminium and its tin base leadless soldering-flux alloy of alloy solder Download PDFInfo
- Publication number
- CN107999996A CN107999996A CN201711323580.8A CN201711323580A CN107999996A CN 107999996 A CN107999996 A CN 107999996A CN 201711323580 A CN201711323580 A CN 201711323580A CN 107999996 A CN107999996 A CN 107999996A
- Authority
- CN
- China
- Prior art keywords
- alloy
- solder
- aluminium
- content
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention belongs to brazing material field, disclose a kind of for aluminium and its tin base leadless soldering-flux alloy of alloy solder.By mass percentage, aluminium content is 0.8%~1.0% to each component in the tin base leadless soldering-flux alloy, and Zn content is 3%~4%, and copper content is 1.5%~3.5%, and Ti content is 0.05%~0.1%, remaining as tin.The brazing filler metal alloy that the present invention adds suitable alloy element Al in metallic tin, Zn, Cu and Ti are formed, the meltage of mother metal is reduced in soldering, and solder has good wet spreadability and inoxidizability, and brazed aluminum alloy connector has good corrosion resistance.
Description
Technical field
The invention belongs to brazing material field, and in particular to a kind of to be used for aluminium and its tin base leadless soldering-flux of alloy solder
Alloy.
Background technology
Aluminium and aluminium alloy have specific strength high, and corrosion resistance and good, electrical and thermal conductivity is good, and machining property is good, valency
The advantages that lattice relative moderate, be widely used in the fields such as automobile, electronics, aerospace.Soldering is weight in aluminium alloy connection mode
The one kind wanted, heating temperature is low, and welding thermal deformation is small, and the dimensional accuracy of weldment is high.With European Union's RoHS and WEEE instruction
Implementation, it is unleaded be globalization trend.The application of aluminum alloy leadless solder needs have good soldering processes
The lead-free solder of performance and soldered fitting reliability.
But the tin-base lead-free soft solder research such as the existing common Sn-Cu systems of in the market, Sn-Ag-Cu systems, Sn-Zn systems is main
It is based on soldering Cu substrates, forms CuSn or CuZn intermetallic compounds, boundary in soldering interface during Sn base solder brazing copper bases
Face is well combined.And when being brazed Al substrates, Sn and Al do not form intermetallic compound, and interface binding power is weaker, and tin and aluminium
Difference in Electrode Potential is excessive, and the corrosion resistance of soldered fitting is poor, for aluminium and the tin base leadless soldering-flux alloy formula of aluminium alloy brazing
Need to improve, to solve the problems, such as some existing for brazed aluminum and aluminium alloy.Nowadays be used for the tinbase of aluminium and aluminium alloy brazing without
The research of lead soft solder is as follows：
1.Sn-Ag-Cu brazing filler metals brazed aluminum and aluminium alloy
Some researches show that：Sn-Ag-Cu can be inclined to solder side in soldering interface and form intermetallic compound Ag2Al, Ag contain
Measure higher (0.5%-3.5%wt), intermetallic compounds layer is thinner, continuous, apart from interface closer to the corrosion resistant of soldered fitting
Corrosion is better, and intensity is higher.The research of Ma Xin shows Ag contents more than 3.5%wt, and the wetting and spreading of solder is deteriorated, and Ag belongs to
In noble metal, the solder containing Ag it is of high cost.The Sn-0.7Cu solder brazing aluminium alloys interface of low content of Cu is not formed between metal
Compound, influence that the solder brazing aluminium and aluminium alloy of high Cu contents form interface metal key compound is rare to have research to report
Road.
2.Sn-Zn brazing filler metals brazed aluminum and aluminium alloy
The research of Sn-Zn brazing filler metals brazed aluminum and aluminium alloy is relatively more because the intensity of Sn-Zn solder brazing aluminium alloys compared with
Height, Sn-Zn solders form Al-Zn-Sn solid solution and Al the substrates bur into solder in some interface points with Al alloy interfaces
Needle-shaped Al-Sn-Zn solid solution whisker is grown, so as to enhance the combination of pin material and mother metal.But Sn-Zn solders pole at high temperature
Oxidizable, inoxidizability is poor, and the corrosion resistance of soldered fitting is also poor, and the Sn-Zn solder brazing aluminium alloys of high Zn content can also
Cause the corrosion problem of mother metal.Research at this stage mostly be to be based on Sn-9Zn eutectic solders, the Zn contents in solder it is very high (>
4%).Low Zn contents (<4%), high Cu contents (>1.0%), high Al content (>0.8%) and brazing filler metal alloy containing trace Ti is ground
Study carefully and have no and have been reported that.
The content of the invention
For more than in place of shortcoming and defect existing in the prior art, it is an object of the invention to provide one kind be used for aluminium and
The tin base leadless soldering-flux alloy of its alloy solder.The difference in Electrode Potential of the brazing filler metal alloy and aluminium is small, and solder is attached with parent material interface
Near to form intermetallic compound, the corrosion resistance of connector improves, and the interface cohesion of soldered fitting is good, soldering joint strength compared with
Height, the meltage of mother metal is low during soldering, and the cost of solder is low.
The object of the invention is achieved through the following technical solutions：
It is a kind of to be used for aluminium and its tin base leadless soldering-flux alloy of alloy solder, it is made of Sn, Al, Zn, Cu, Ti.
Preferably, in the tin base leadless soldering-flux alloy each component by mass percentage, aluminium content for 0.8%~
1.0%, Zn content is 3%~4%, and copper content is 1.5%~3.5%, and Ti content is 0.05%~0.1%, remaining as tin.
Preferably, in the tin base leadless soldering-flux alloy each component by mass percentage, aluminium content 1%, Zn content
For 4%, copper content 2.5%, Ti content 0.1%, remaining as tin.
Preferably, by mass percentage, aluminium content 0.8%, zinc contains each component in the tin base leadless soldering-flux alloy
Measure as 3%, copper content 3.5%, Ti content 0.05%, remaining as tin.
Preferably, by mass percentage, aluminium content 0.8%, zinc contains each component in the tin base leadless soldering-flux alloy
Measure as 4%, copper content 1.5%, Ti content 0.1%, remaining as tin.
The principle of the present invention is：
Al：The eutectic point of Sn-Al bianry alloys is Sn-0.6Al, adds Al alloying elements, mother metal when can reduce soldering
Meltage, and Al alloying elements can reduce the electrode potential of solder, so as to reduce the difference in Electrode Potential of solder and mother metal, improve
The corrosion resistance of aluminium and aluminium alloy brazing connector.But excessive Al content can reduce the wetting and spreading of solder, rich Al phases are thick
Change.Preferably aluminium content of the invention is 0.8%-1.0%.
Zn：The eutectic point of Sn-Zn bianry alloys is that the solid solubility of Sn-9Zn, Zn and Al are big, and solder containing Zn is in soldering interface
Al-Zn-Sn solid solution is formed, solder is well combined with Al basal body interfaces, improves the intensity of soldered fitting.But high Zn content
Sn-Zn inoxidizability is poor, there is thick needle-shaped richness Zn phases in solder, and rich Zn phases corrosion resistance is poor, and then reduces soldered fitting
Corrosion resistance, should control the Zn contents in solder.Preferably Zn contents of the invention are 3%-4%.
Cu：Cu is added in solder, AlCu intermetallic compounds can be formed with the Al alloying elements in solder, are changed between metal
Compound can improve the mechanical property of solder as hardening constituent, when soldering can be formed in the solder side of soldering interface one layer it is discontinuous
Al2Cu intermetallic compounds, intermetallic compound can hinder the flowing of electronics in electrochemical corrosion course, so as to improve
The corrosion resistance of solder.Cu alloying elements can reduce in solder Al and Zn in the enrichment degree on solder surface, improve the anti-of solder
Oxidisability and wetting and spreading.But excessive Cu alloying elements can cause the melting range of solder excessive, the spreadability of solder declines,
Al in solder2Cu intermetallic compound contents are excessive, and the hardness of solder becomes larger, and solder is become fragile, and are unfavorable for the processing of solder.This
Preferred Cu contents are invented as 1.5%~3.5%.
Ti：A small amount of Ti alloying elements do not form intermetallic compound with Sn, can but improve the inoxidizability of solder, Ti
The microscopic structure of solder can be refined, improves the mechanical property of solder.Excessive Ti contents can cause the fusing point of solder to rise, and melt
Cheng Zeng great, the wetting and spreading of solder decline on the contrary.Preferably Ti contents of the invention are 0.05%~0.1%.
The tin base leadless soldering-flux alloy of the present invention has the following advantages that and beneficial effect：
(1) meltage of the solder of the invention mother metal in soldering is small, and soldering interface can form Al2Cu intermetallics
Thing, soldered fitting have higher corrosion resistance.
(2) interface cohesion of solder of the invention and mother metal is firm, and soldering joint strength is higher.
(3) solder of the invention in brazed aluminum and aluminium alloy with good wetting and spreading.
(4) element without precious metal in solder of the invention, the cost of solder are low.
(5) solder of the invention is suitable for being brazed each line aluminium alloy, and brazing filler metal alloy can be prepared into bar-shaped, strip, Filamentous, cream
The forms such as shape, available for the various method for welding such as gas brazing, furnace brazing, Reflow Soldering, dip brazing.
Brief description of the drawings
Fig. 1 is the scanning electron microscope schematic diagram of the combination interface of solder and mother metal obtained by comparative example.
Fig. 2 is the scanning electron microscope schematic diagram of the combination interface of 1 gained solder of embodiment and mother metal.
Embodiment
With reference to embodiment, the present invention is described in further detail, but the implementation of the present invention is not limited to this.
Comparative example
A kind of tin base leadless soldering-flux alloy of this comparative example, by mass percentage, copper content 4.0%, remains each component
Yu Weixi.Its preparation method is：
Raw material is used as pure Sn (99.95%), Cu (99.95%), brazing filler metal alloy 500g is configured by 1 component of table, is placed on
In crucible, electro-smelting, using LiCl and KCl eutectic salts as coverture, 700 DEG C of heating-up temperature, after keeping the temperature 30min, is poured into a mould
To die for molding, the tin base leadless soldering-flux alloy of this comparative example is obtained.
Embodiment 1
A kind of tin base leadless soldering-flux alloy of the present embodiment, each component by mass percentage, aluminium content 1.0%, zinc
Content is 4.0%, copper content 2.5%, Ti content 0.1%, remaining as tin.Its preparation method is：
Use raw material for pure Sn (99.95%), Al (99.9%), Zn (99.99%), Cu (99.95%), Sn-1Ti among
Alloy, configures brazing filler metal alloy 500g by 1 component of table, is placed in crucible, electro-smelting, using LiCl and KCl eutectic salts conducts
Coverture, 700 DEG C of heating-up temperature, keeps the temperature 30min, wherein every 10min stirrings once, being poured into die for molding, obtains this
The tin base leadless soldering-flux alloy of embodiment.
Embodiment 2
A kind of tin base leadless soldering-flux alloy of the present embodiment, each component by mass percentage, aluminium content 0.8%, zinc
Content is 3.0%, copper content 3.5%, Ti content 0.05%, remaining as tin.Its preparation method is：
Use raw material for pure Sn (99.95%), Al (99.9%), Zn (99.99%), Cu (99.95%), Sn-1Ti among
Alloy, configures brazing filler metal alloy 500g by 1 component of table, is placed in crucible, electro-smelting, using LiCl and KCl eutectic salts conducts
Coverture, 700 DEG C of heating-up temperature, keeps the temperature 30min, wherein every 10min stirrings once, being poured into die for molding, obtains this
The tin base leadless soldering-flux alloy of embodiment.
Embodiment 3
A kind of tin base leadless soldering-flux alloy of the present embodiment, each component by mass percentage, aluminium content 0.8%, zinc
Content is 4.0%, copper content 1.5%, Ti content 0.1%, remaining as tin.Its preparation method is：
Use raw material for pure Sn (99.95%), Al (99.9%), Zn (99.99%), Cu (99.95%), Sn-1Ti among
Alloy, configures brazing filler metal alloy 500g by 1 component of table, is placed in crucible, electro-smelting, using LiCl and KCl eutectic salts conducts
Coverture, 700 DEG C of heating-up temperature, keeps the temperature 30min, wherein every 10min stirrings once, being poured into die for molding, obtains this
The tin base leadless soldering-flux alloy of embodiment.
1 lead-free solder alloy chemical composition (wt.%) of table
The brazing property test of gained tin base leadless soldering-flux alloy of the invention：
(1) soldering interface is tested：On 300 DEG C of warm table, 1060 aluminium are brazed using the special scaling powder of aluminium.Fig. 1 and Fig. 2
The solder and the scanning electron microscope schematic diagram of the combination interface of mother metal that respectively comparative example and embodiment 1 obtain.
As can be seen that can be on soldering circle using the solder in the Sn-4Cu and embodiment of comparative example from Fig. 1 and Fig. 2
The solder side in face forms Al2Cu intermetallic compounds, but Al during Sn-4Cu 1060 aluminium of solder brazing2Cu intermetallic object distances
60~70 μm from soldering interface, the performance influence on soldered fitting is very small, and the solder pricker in the present invention from soldering interface too far
Al when welding 1060 aluminium2Cu intermetallic compounds are apart from only 10 μm or so of soldering interface, and distance greatly reduces, so as to effectively improve pricker
The corrosion resistance at plumb joint interface, improves the corrosion resistance of soldered fitting.
(2) spreading area is tested：Solder is prepared into the small bulk of 0.2g, 1060 aluminum substrates use 10% after polishing
NaOH immersions 15s removes surface film oxide, then uses 5%HNO3Neutralize, then with alcohol drying in air after ultrasonic cleaning.On aluminum substrate
The small block solders of 0.2g are placed, certain commercial aluminium soldering scaling powder is dripped, 60s on 300 DEG C of warm table is placed in, using software meter
Spreading area is calculated, the results are shown in Table 2.
(3) soldered fitting corrosion resistance is tested：The 1060Al pieces joint welding that soldered fitting is 3 × 3 × 1mm 20 × 20 ×
The 1060Al on pieces of 1mm.The pre-welding treatment of 1060 aluminum substrates is identical with spreading area experiment, using 0.08g solders, at 300 DEG C
Connector, is immersed in the NaCl solution of 3.5wt.% by soldering after soldering, until joint breaking fails, records rupture time, knot
Fruit is shown in Table 2.
(4) fusing point of brazing filler metal alloy is surveyed using differential scanning calorimeter and melts silicon carbide, experiment is used sample 20mg, adopted
With pure In calibration instruments temperature, when measurement, leads to Ar gas shieldeds, and heating rate 10k/min, the results are shown in Table 2.
2 lead-free solder alloy performance of table
The brazing filler metal alloy of present component has more preferable wetting and spreading than Sn-4Cu it can be seen from 2 result of table, profit
Wet spreading area improves 9.7%~23.8%.Because the Cu contents in solder reduce, with the addition of Zn reduces the thawing of solder
Temperature, adds the inoxidizability that a small amount of Ti improves solder.
In addition, during Sn-4Cu solder brazings, Al is formed in solder2In solder of the amount of Cu intermetallic compounds than the present invention
Intermetallic compound it is more very much, show that mother metal 1060Al is largely dissolved into solder during soldering, 2 mother metal of table dissolving Reducing thickness
Data are also provable.And during the solder brazing 1060Al of present component, it is effective in the intermetallic compound that near interface is formed
The further diffusion dissolution for hindering mother metal, effectively reduce solder brazing when mother metal meltage.
Above-described embodiment is the preferable embodiment of the present invention, but embodiments of the present invention and from above-described embodiment
Limitation, other any Spirit Essences without departing from the present invention with made under principle change, modification, replacement, combine, simplification,
Equivalent substitute mode is should be, is included within protection scope of the present invention.
Claims (5)
1. a kind of be used for aluminium and its tin base leadless soldering-flux alloy of alloy solder, it is characterised in that：The tin base leadless soldering-flux
Alloy is made of Sn, Al, Zn, Cu, Ti.
2. a kind of tin base leadless soldering-flux alloy for aluminium and its alloy solder according to claim 1, its feature exist
In：By mass percentage, aluminium content is 0.8%~1.0% to each component in the tin base leadless soldering-flux alloy, and Zn content is
3%~4%, copper content is 1.5%~3.5%, and Ti content is 0.05%~0.1%, remaining as tin.
3. a kind of tin base leadless soldering-flux alloy for aluminium and its alloy solder according to claim 1, its feature exist
In：By mass percentage, aluminium content 1.0%, Zn content 4%, copper contains each component in the tin base leadless soldering-flux alloy
Measure as 2.5%, Ti content 0.1%, remaining as tin.
4. a kind of tin base leadless soldering-flux alloy for aluminium and its alloy solder according to claim 1, its feature exist
In：By mass percentage, aluminium content 0.8%, Zn content 3%, copper contains each component in the tin base leadless soldering-flux alloy
Measure as 3.5%, Ti content 0.05%, remaining as tin.
5. a kind of tin base leadless soldering-flux alloy for aluminium and its alloy solder according to claim 1, its feature exist
In：By mass percentage, aluminium content 0.8%, Zn content 4%, copper contains each component in the tin base leadless soldering-flux alloy
Measure as 1.5%, Ti content 0.1%, remaining as tin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711323580.8A CN107999996B (en) | 2017-12-13 | 2017-12-13 | tin-base lead-free solder alloy for soft soldering of aluminum and aluminum alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711323580.8A CN107999996B (en) | 2017-12-13 | 2017-12-13 | tin-base lead-free solder alloy for soft soldering of aluminum and aluminum alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107999996A true CN107999996A (en) | 2018-05-08 |
| CN107999996B CN107999996B (en) | 2019-12-10 |
Family
ID=62058411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711323580.8A Active CN107999996B (en) | 2017-12-13 | 2017-12-13 | tin-base lead-free solder alloy for soft soldering of aluminum and aluminum alloy |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107999996B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000141078A (en) * | 1998-09-08 | 2000-05-23 | Nippon Sheet Glass Co Ltd | Leadless solder |
| CN1304344A (en) * | 1999-03-16 | 2001-07-18 | 日本板硝子株式会社 | Leadless solder |
| CN1313802A (en) * | 1999-06-11 | 2001-09-19 | 日本板硝子株式会社 | Lead-free solder |
| CN101007374A (en) * | 2007-01-18 | 2007-08-01 | 广州有色金属研究院 | Lead-free welding flux alloy suitable for dissimilar metals soldering flux of aluminum and copper |
| CN102814595A (en) * | 2012-05-05 | 2012-12-12 | 大连理工大学 | Sn-Zn based near-eutectic lead-free solder alloy for aluminum-bronze soft soldering and preparation method |
| CN103038020A (en) * | 2010-06-28 | 2013-04-10 | 住友金属矿山股份有限公司 | Pb-free solder alloy |
| US20130323530A1 (en) * | 2011-07-27 | 2013-12-05 | National Yunlin University Of Science And Technology | Active solder |
| WO2015004467A2 (en) * | 2013-07-10 | 2015-01-15 | Cambridge Enterprise Limited | Materials and methods for soldering, and soldered products |
-
2017
- 2017-12-13 CN CN201711323580.8A patent/CN107999996B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000141078A (en) * | 1998-09-08 | 2000-05-23 | Nippon Sheet Glass Co Ltd | Leadless solder |
| CN1304344A (en) * | 1999-03-16 | 2001-07-18 | 日本板硝子株式会社 | Leadless solder |
| CN1313802A (en) * | 1999-06-11 | 2001-09-19 | 日本板硝子株式会社 | Lead-free solder |
| CN101007374A (en) * | 2007-01-18 | 2007-08-01 | 广州有色金属研究院 | Lead-free welding flux alloy suitable for dissimilar metals soldering flux of aluminum and copper |
| CN103038020A (en) * | 2010-06-28 | 2013-04-10 | 住友金属矿山股份有限公司 | Pb-free solder alloy |
| US20130323530A1 (en) * | 2011-07-27 | 2013-12-05 | National Yunlin University Of Science And Technology | Active solder |
| CN102814595A (en) * | 2012-05-05 | 2012-12-12 | 大连理工大学 | Sn-Zn based near-eutectic lead-free solder alloy for aluminum-bronze soft soldering and preparation method |
| WO2015004467A2 (en) * | 2013-07-10 | 2015-01-15 | Cambridge Enterprise Limited | Materials and methods for soldering, and soldered products |
Non-Patent Citations (1)
| Title |
|---|
| 李继超等: "Sn-Zn-Cu-Al无铅钎料的组织及性能分析", 《重庆理工大学学报(自然科学)》 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107999996B (en) | 2019-12-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7135171B2 (en) | solder composition | |
| JP6842500B2 (en) | Lead-free solder paste and its manufacturing method | |
| US20190255662A1 (en) | High impact solder toughness alloy | |
| EP2868423B1 (en) | Solder alloy, solder paste, and electronic circuit board | |
| EP2868424B1 (en) | Solder alloy, solder paste, and electronic circuit board | |
| TWI457192B (en) | Solder connector | |
| JP4831069B2 (en) | Lead-free low-temperature solder | |
| JP4770733B2 (en) | Solder and mounted products using it | |
| EP2617516A1 (en) | Nickel-based hydrochloric acid corrosion resistant alloy for soldering | |
| CN102642099A (en) | Sn-Zn-based lead-free solder alloy for aluminum bronze soldering and method for preparing same | |
| Hu et al. | Effects of In addition on the wettability, interfacial characterization and properties of ternary Sn–Cu–Ni solders | |
| JP3081230B2 (en) | Copper alloy used as brazing filler metal | |
| CN105397329B (en) | A kind of Sn Ag Cu low silver leadless solders containing Nd, Re, In | |
| JP2011031253A (en) | Lead-free solder alloy | |
| CN107999996A (en) | It is a kind of to be used for aluminium and its tin base leadless soldering-flux alloy of alloy solder | |
| JP2012121047A (en) | Lead-free solder alloy | |
| JP5051633B2 (en) | Solder alloy | |
| TWI821211B (en) | Cost-effective lead-free solder alloy for electronic applications | |
| EP3707286B1 (en) | High reliability lead-free solder alloy for electronic applications in extreme environments | |
| CN108213764A (en) | A kind of tin base leadless soldering-flux alloy for effectively reducing base material meltage | |
| KR20050094535A (en) | Lead-free alloys of low temperature | |
| JP2004330259A (en) | LEAD-FREE SnCu SOLDER ALLOY | |
| Tian et al. | Interfacial Morphology Studies of Sn-3.8 Ag-0.7 Cu Alloy on Different Substrates | |
| JPS6178591A (en) | Silver solder material | |
| Materials Science International Team MSIT® info@ msiwp. com http://www. matport. com | Ag-In-Sn (Silver-Indium-Tin) Non-Ferrous Metal Ternary Systems. Selected Soldering and Brazing Systems: Phase Diagrams, Crystallographic and Thermodynamic Data |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |