CN107995773A - A kind of circuit board and test system - Google Patents
A kind of circuit board and test system Download PDFInfo
- Publication number
- CN107995773A CN107995773A CN201711192369.7A CN201711192369A CN107995773A CN 107995773 A CN107995773 A CN 107995773A CN 201711192369 A CN201711192369 A CN 201711192369A CN 107995773 A CN107995773 A CN 107995773A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- testing weld
- weld pad
- area
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
The invention discloses a kind of circuit board and test system, the circuit board to include：Circuit board body, the circuit connecting wire being laid in the circuit board body and at least one testing weld pad；Wherein, the circuit board body includes at least one first area divided according to array format；At least one testing weld pad is laid in the first setting position at least one first area.By using above-mentioned technical proposal, solve the limitation of the test equipment when testing different electronic products, improve the utilization rate of test equipment, save cost.
Description
Technical field
The present invention relates to circuit board design techniques field, more particularly to a kind of circuit board and test system.
Background technology
As the epoch develop rapidly, the popularity rate of electric consumers is higher and higher, the electronic product that people are pursued
The infrastructure device of change, also electron product with rapid changepl. never-ending changes and improvements, i.e. circuit board (PCB circuit boards, PCB) is occurring
Manufacturer brings opportunities and challenges.Wherein, the production process of the design of circuit board and its test of correlated performance in electronic product
In be particularly important.
At present, for most electronic products, need to test its performance indicator in process of production.It is specific to survey
Examination mode passes through the thimble of test equipment to lay corresponding testing weld pad on the circuit board of function module to be measured is provided with
After tooling device is connected with testing weld pad, you can complete the test to electronic product performance.
However, because according to the Position Design of testing weld pad on circuit board, i.e., the thimble position of existing test equipment is
The supporting circuit board of a product can only correspond to a set of test equipment, therefore, performance be carried out in the electronic product to different model
It is both needed to use corresponding test equipment during test, the utilization rate of test equipment is poor.Meanwhile with the increasing of product category
More, the quantity of test equipment also needs to increase therewith, causes the cost of corresponding test equipment, maintenance cost also constantly increasing
Add, virtually also increase the expenditure cost of product development, be unfavorable for the exploitation of product.
The content of the invention
In view of this, the purpose of the present invention is to propose to a kind of circuit board and test system, solve and produced to different electronics
The limitation of test equipment, improves the utilization rate of test equipment, saves cost when product are tested.
To achieve the above object, the present invention adopts the following technical scheme that：
In a first aspect, an embodiment of the present invention provides a kind of circuit board, including circuit board body, it is laid in the circuit board
Circuit connecting wire and at least one testing weld pad on body；Wherein,
The circuit board body includes at least one first area divided according to array format；
At least one testing weld pad is laid in the first setting position at least one first area.
Further, the distance between two testing weld pads of arbitrary neighborhood are equal.
Further, at least one testing weld pad is laid in the center of at least one first area.
Further, the shape of at least one testing weld pad is consistent.
Further, at least one testing weld pad is circular pad；
Correspondingly, the center of circle of the circular pad is laid and the first setting position at least one first area.
Further, a diameter of 1 millimeter of the circular pad.
Further, the array format is specially：Divided according to the distance that stepping is 2 millimeters.
Second aspect, an embodiment of the present invention provides a kind of test system, including tooling device, test equipment and the present invention
The circuit board that any embodiment is provided；Wherein,
The tooling device includes at least one second area divided according to the array format, for fixed at least one
A connecting hole；
The connecting hole is laid in the second setting position at least one second area, second setting position
It is corresponding with first setting position；
The test equipment includes thimble, and the thimble passes through at least one connecting hole and at least one test
Pad is connected, for testing the circuit board.
Further, the test system further includes WIFI chips；The WIFI chips by the circuit connecting wire with
The corresponding target detection pad of the WIFI is connected；
By the target detection pad, the connecting hole and the thimble, the WIFI chips are tested.
Further, the material of the tooling device is sub- Gree plate.
In technical solution provided in an embodiment of the present invention, circuit board includes circuit board body, is laid in circuit board body
Circuit connecting wire and at least one testing weld pad.Wherein, circuit board body is included according at least one of array format division
First area；At least one testing weld pad is laid in the first setting position at least one first area.By using above-mentioned
Technical solution so that testing weld pad ordered arrangement on circuit boards, correspondingly, in the testing weld pad using the circuit board to electronics
When product is tested, the tooling device being connected with the thimble of test equipment need to also be set according to the arranging rule of testing weld pad
Meter, and reserve the connecting hole with the corresponding fixed thimble of testing weld pad.Pass through the connecting hole thimble and circuit board
Testing weld pad is in contact and then can complete the test to electronic product.The testing weld pad provided relative to the prior art is random
Laying mode, circuit board provided in an embodiment of the present invention provide guarantee for the test of electronic product function.By using this hair
The circuit board that bright embodiment provides, different model, the electronic product of species can utilize same set of tooling device and test equipment into
Row test, not only improves the utilization rate of test equipment, while can also effectively avoid due to the quantity of test equipment and corresponding
Maintenance and increased cost.
Brief description of the drawings
Below will detailed description of the present invention exemplary embodiment by referring to accompanying drawing, make those of ordinary skill in the art
The above-mentioned and other feature and advantage of the present invention are become apparent from, in attached drawing：
Fig. 1 is a kind of structure diagram for circuit board that the embodiment of the present invention one provides；
Fig. 2 is a kind of structure diagram of test system provided by Embodiment 2 of the present invention；
Fig. 3 is the structure diagram of the connection relation of a kind of tooling device provided by Embodiment 2 of the present invention and circuit board.
Embodiment
Further illustrate technical scheme below with reference to the accompanying drawings and specific embodiments.It is appreciated that
It is that specific embodiment described herein is used only for explaining the present invention, rather than limitation of the invention.Further need exist for illustrating
, for the ease of description, part related to the present invention rather than entire infrastructure are illustrate only in attached drawing.In situation about not conflicting
Under, the feature in the embodiment of the present invention and embodiment can be mutually combined.
Embodiment one
Fig. 1 is a kind of structure diagram for circuit board that the embodiment of the present invention one provides.The circuit board can be used for different shaped
Number, the electronic product of species carry out functional test.As shown in Figure 1, the circuit board includes：Circuit board body 110, be laid in electricity
Circuit connecting wire (not shown), at least one testing weld pad 120 (being not entirely shown in figure) on the plate body of road.
Wherein, the circuit board body 110 includes at least one first area 111 divided according to array format, at least
One testing weld pad 120 is laid in the first setting position at least one first area 111.
Exemplary, array format is specially：Divided according to the distance that stepping is 2 millimeters.Specifically, can be left with circuit board
Inferior horn establishes rectangular coordinate system for origin, is to the right the positive direction of X-axis, is upwards the positive direction of Y-axis, the base and a left side of circuit board
Side is respectively in the X-axis and Y-axis of coordinate system.According to stepping it can be 2 millimeters by X-axis and Y-axis after rectangular coordinate system is established
Distance divided, and then circuit board is divided into multiple equally distributed regions.
Preferably, the distance between two testing weld pads of arbitrary neighborhood are equal, so set and may be such that testing weld pad exists
Uniformly arrange on circuit board, facility is provided with the design for tooling device corresponding with circuit board.Wherein, adjacent two tests
Pad can be the adjacent testing weld pad of horizontal direction, or in vertically adjacent testing weld pad.
Exemplary, the first setting position can be the position where the upper left corner, the upper right corner or center of first area.It is excellent
At least one testing weld pad is laid in the center of at least one first area by choosing.The advantages of this arrangement are as follows so that
The arrangement standardization of testing weld pad, avoids the different types of circuit board caused by the rambling arrangement of testing weld pad
With same tooling device and the unmatched phenomenon of test equipment.
Preferably, the shape of at least one testing weld pad is consistent, such as can be that circle can also be square.
Exemplary, if the shape of testing weld pad is circle, the center of circle of circular pad can be laid in at least one
The first setting position in one region, which is preferably center.
Further, the diameter of circular pad is preferably 1 millimeter.
A kind of circuit board is present embodiments provided, which includes circuit board body, is laid in circuit board body
Circuit connecting wire and at least one testing weld pad.Wherein, circuit board body includes at least one the according to array format division
One region；At least one testing weld pad is laid in the first setting position at least one first area.By using above-mentioned skill
Art scheme, can be that the test of electronic product function provides safeguard.Avoid due to the rambling arrangement of testing weld pad and cause
A kind of product present situation of the circuit board with only matching a set of test equipment.By using circuit provided in an embodiment of the present invention
Plate, different model, the electronic product of species can be tested using same set of tooling device and test equipment, not only improve survey
The utilization rate of equipment is tried, while also can effectively avoid the increasing of the cost caused by the quantity of test equipment and corresponding maintenance
Add.
Embodiment two
Fig. 2 is a kind of structure diagram of test system provided by Embodiment 2 of the present invention.As shown in Fig. 2, the test system
200 include：The circuit board 230 that tooling device 210, test equipment 220 and above-described embodiment are provided；Wherein,
The circuit board 230 includes circuit board body 231, the circuit connecting wire being laid in circuit board body (does not show in figure
Go out), at least one testing weld pad 232.Circuit board body 231 includes at least one first area divided according to array format,
At least one testing weld pad 232 is laid in the first setting position at least one first area.
Tooling device 210 includes at least one second area divided according to array format, for fixing at least one company
Connect hole 211.Connecting hole 211 is laid in the second setting position at least one second area, and the second setting position is set with first
Positioning is put corresponding.Test equipment 220 includes thimble 221, and thimble 221 passes through at least one connecting hole 211 and at least one survey
Test weld disk 232 is connected, for testing electronic product.
Preferably, first area is corresponding with second area, for example, the number of first area and second area can keep one
Cause, and the area equation of the second area of first area.
Preferably, the second setting position can also be the center of second area.
Further, on the premise of according to above-mentioned design method, tooling device is set, the size of working equipment is not done
Limitation, can be consistent with the size of circuit board, can also be incremented by according to integral multiple and then match various sizes of circuit board.
Exemplary, the material of tooling device is sub- Gree plate.
Exemplary, Fig. 3 is the knot of the connection relation of a kind of tooling device provided by Embodiment 2 of the present invention and circuit board
Structure schematic diagram.As shown in figure 3, tooling device 210 is divided at least one second area according to array format, the second area with
First area in circuit board body 231 corresponds to.The connecting hole 211 (two connecting holes are shown in Fig. 3) laid in second area
For fixing the thimble 221 (two thimbles being shown in Fig. 3, test equipment is not shown) of test equipment.Second setting position with
First setting position of testing weld pad 232 (two testing weld pads are shown in Fig. 3) is corresponding in circuit board body 231.For example,
Center with region can be set.The thimble 221 of test equipment is in contact by connecting hole 211 with testing weld pad 232,
For testing electronic product.As shown in figure 3, by tooling device is designed as dividing according to array format multiple the
Two regions, and the second setting position of the second area it is (corresponding with the first setting position) lay connecting hole, may be such that work
Install it is standby match with circuit board during being connected, avoid due to the random arrangement of testing weld pad on circuit board and lead
Apply in the no regularity of the connecting hole of fixed thimble so that same set of test equipment can by same set of tooling device with
Different circuit boards match, to lift the utilization rate of test equipment.
Exemplary, for most electronic products of in the market, WIFI (WIreless- are all carried substantially
Fidelity, Wireless Fidelity) function.When the WIFI function to electronic product is tested, WIFI chips can be passed through circuit
The target detection pad that the circuit connecting wire of plate is corresponding is connected, by the way that the thimble of test equipment is passed through connecting hole and target
Testing weld pad is in contact, and can complete the test to WIFI chip functions.In addition to the test of above-mentioned WIFI function, the present invention is implemented
It can also be used to carry out different electronic products such as positioning in the test system that example provides, show the test of other functions.
A kind of test system is present embodiments provided, electronic product is tested using the testing weld pad of the circuit board
When, the tooling device being connected with the thimble of test equipment is also designed according to the arranging rule of testing weld pad, and reserve with
The connecting hole of the corresponding fixed thimble of testing weld pad.It is in contact by the connecting hole thimble with the testing weld pad of circuit board
And then complete the test to electronic product.By using test system provided in an embodiment of the present invention, different model, the electricity of species
Sub- product can be tested using same set of tooling device and test equipment, not only improve the utilization rate of test equipment, at the same time
The increase of the cost caused by the quantity of test equipment and corresponding maintenance can also effectively be avoided.
Note that it above are only presently preferred embodiments of the present invention and institute's application technology principle.It will be appreciated by those skilled in the art that
The invention is not restricted to specific embodiment described here, can carry out for a person skilled in the art various obvious changes,
Readjust and substitute without departing from protection scope of the present invention.Therefore, although being carried out by above example to the present invention
It is described in further detail, but the present invention is not limited only to above example, without departing from the inventive concept, also
It can include other more equivalent embodiments, and the scope of the present invention is determined by scope of the appended claims.
Claims (10)
- A kind of 1. circuit board, it is characterised in that including：Circuit board body, the circuit being laid in circuit board body connection Line and at least one testing weld pad；Wherein,The circuit board body includes at least one first area divided according to array format；At least one testing weld pad is laid in the first setting position at least one first area.
- 2. circuit board according to claim 1, it is characterised in that including：The distance between two testing weld pads of arbitrary neighborhood are equal.
- 3. circuit board according to claim 1, it is characterised in thatAt least one testing weld pad is laid in the center of at least one first area.
- 4. circuit board according to claim 1, it is characterised in thatThe shape of at least one testing weld pad is consistent.
- 5. circuit board according to claim 4, it is characterised in thatAt least one testing weld pad is circular pad；Correspondingly, the center of circle of the circular pad is laid in the first setting position at least one first area.
- 6. circuit board according to claim 5, it is characterised in thatA diameter of 1 millimeter of the circular pad.
- 7. circuit board according to claim 1, it is characterised in that the array format is specially：It it is 2 millimeters according to stepping Distance division.
- 8. a kind of test system, it is characterised in that including tooling device, test equipment and as described in claim 1-7 is any Circuit board；Wherein,The tooling device includes at least one second area divided according to the array format, for laying at least one company Connect hole；The connecting hole is laid in the second setting position at least one second area, second setting position and institute It is corresponding to state the first setting position；The test equipment includes thimble, and the thimble passes through at least one connecting hole and at least one testing weld pad It is in contact, for testing electronic product.
- 9. test system according to claim 8, it is characterised in that further include WIFI chips；The WIFI chips are connected by circuit connecting wire target detection pad corresponding with the WIFI chips；By the target detection pad, the connecting hole and the thimble, the WIFI chips are tested.
- 10. test system according to claim 8, it is characterised in that the material of the tooling device is sub- Gree plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711192369.7A CN107995773A (en) | 2017-11-24 | 2017-11-24 | A kind of circuit board and test system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711192369.7A CN107995773A (en) | 2017-11-24 | 2017-11-24 | A kind of circuit board and test system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107995773A true CN107995773A (en) | 2018-05-04 |
Family
ID=62032960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711192369.7A Pending CN107995773A (en) | 2017-11-24 | 2017-11-24 | A kind of circuit board and test system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107995773A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101231322A (en) * | 2007-02-09 | 2008-07-30 | 段超毅 | Test connection method and apparatus for integrated circuit open circuit/ short-circuit |
| CN102867821A (en) * | 2007-09-12 | 2013-01-09 | 瑞萨电子株式会社 | Semiconductor device |
| CN106771405A (en) * | 2017-01-06 | 2017-05-31 | 中国船舶重工集团公司第七0九研究所 | A kind of spherical grid array integrated circuit interface adapter |
-
2017
- 2017-11-24 CN CN201711192369.7A patent/CN107995773A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101231322A (en) * | 2007-02-09 | 2008-07-30 | 段超毅 | Test connection method and apparatus for integrated circuit open circuit/ short-circuit |
| CN102867821A (en) * | 2007-09-12 | 2013-01-09 | 瑞萨电子株式会社 | Semiconductor device |
| CN106771405A (en) * | 2017-01-06 | 2017-05-31 | 中国船舶重工集团公司第七0九研究所 | A kind of spherical grid array integrated circuit interface adapter |
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180504 |
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| RJ01 | Rejection of invention patent application after publication |