CN107991596B - TO-252 packaged diode aging test fixture and test method thereof - Google Patents
TO-252 packaged diode aging test fixture and test method thereof Download PDFInfo
- Publication number
- CN107991596B CN107991596B CN201711322933.2A CN201711322933A CN107991596B CN 107991596 B CN107991596 B CN 107991596B CN 201711322933 A CN201711322933 A CN 201711322933A CN 107991596 B CN107991596 B CN 107991596B
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- CN
- China
- Prior art keywords
- aluminum block
- groove
- diode
- bottom plate
- test
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Links
- 230000032683 aging Effects 0.000 title claims abstract description 22
- 238000010998 test method Methods 0.000 title claims abstract description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 31
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 31
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 2
- 238000009434 installation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012216 screening Methods 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
- G01R31/2632—Circuits therefor for testing diodes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0425—Test clips, e.g. for IC's
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses a TO-252 packaged diode aging test fixture and a test method thereof, wherein the fixture comprises a bottom plate, the bottom plate is in a cuboid shape, a row of round holes are formed in the center of the back surface of the bottom plate, a groove is formed in the center of the front surface of the bottom plate, the groove is opposite TO the round holes, two ends of the bottom plate are respectively provided with an aluminum block I and an aluminum block II, and the aluminum block I and the aluminum block II are connected with the bottom plate through bolts. The diode burn-in test fixture is a non-cover plate, the base can be ventilated, a series mode diode burn-in test fixture is formed by pins of the device, the problem that the device is damaged or the burn-in test plate is burnt out due TO poor heat dissipation in a TO-252 packaged diode burn-in test is solved, and a good use effect is achieved.
Description
Technical Field
The invention relates TO a packaged diode aging test fixture, in particular TO a TO-252 packaged diode aging test fixture and a test method thereof, and belongs TO the technical field of electronic products.
Background
The TO-252 package family of diodes is not compatible with conventional package diode burn-in fixtures due TO the special package. The special aging test board designed and produced by the aging test equipment manufacturer is provided with a mounting fixture which is a conventional test fixture, namely, the mounting fixture consists of a base and a cover plate, and a test device is placed between the base and the cover plate. The mounting fixture has the advantages that the vent is reserved on the cover plate, and the heat dissipation effect is poor. The heat generated by the diode in the power aging process can not be timely emitted, and the heat accumulation can cause damage to the test device.
Disclosure of Invention
The invention aims to solve the technical problems that: the TO-252 packaged diode burn-in fixture is a diode burn-in fixture with a cover-free plate, a base capable of ventilating and a serial mode formed by pins of a device. The problem that a device is damaged or an aging test board is burnt out due TO poor heat dissipation in the TO-252 packaged diode aging test is solved.
The technical scheme of the invention is as follows: the TO-252 packaged diode aging test fixture comprises a bottom plate, wherein the bottom plate is in a cuboid shape, a row of round holes are formed in the center of the back surface of the bottom plate, a groove is formed in the center of the front surface of the bottom plate, the groove is opposite TO the round holes, an aluminum block I and an aluminum block II are respectively arranged at two ends of the bottom plate, and the aluminum block I and the aluminum block II are connected with the bottom plate through bolts.
The grooves are of a medium-shaped structure, the depth of the grooves is 70% of the thickness of the bottom plate, and the maximum width of the grooves is 0.1 mm larger than the width of the TO-252 packaged diode.
The distance between the round holes is 5mm, and the diameter of the round holes is equal to the bottom width of the grooves.
A bolt hole is formed in the middle of the first aluminum block, a screw is arranged on the bolt hole, and the screw is aligned to the center of the groove.
And the top end of the screw is fixedly connected with a spring.
A row of round holes are formed in the central line of the bottom plate and used for ventilation and heat dissipation in the test process.
The test method of the TO-252 packaged diode aging test fixture comprises the following steps: the TO-252 diode is arranged in the groove in a series connection mode, the first aluminum block and the second aluminum block are fixed by bolts after the diode is filled, and the aging test can be carried out after the adjusting bolts drive the springs TO enable the diode TO be in contact with each other.
The beneficial effects of the invention are as follows: compared with the prior art, the invention has reasonable structure, is convenient and practical, and when the TO-252 packaged diode is subjected TO aging test, the aluminum block at one end of the bakelite plate is taken down, and the diode is arranged in the groove in a serial connection mode. After the diode is filled, the aluminum block is fixed by bolts, and the diodes are in good contact with each other by adjusting the springs. Finally, the test circuit is connected to the aluminum blocks at the two ends by wires and connected to the test circuit. By adding the invention, the heat productivity of the shell of the TO-252 packaged diode is easier TO test and control during burn-in test, so that the damage or burning of devices caused by poor heat dissipation is reduced or even avoided, and the reliability of screening test is improved.
Drawings
FIG. 1 is a front view of the present invention;
FIG. 2 is a rear view of the present invention;
FIG. 3 is a side view of the invention without aluminum blocks;
fig. 4 is a side view of the present invention after installation of an aluminum block.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings of the present specification.
Example 1: as shown in the attached drawings 1-4, the TO-252 packaged diode aging test fixture comprises a bottom plate 1, wherein the bottom plate 1 is in a cuboid shape, a row of round holes 4 are formed in the center of the back surface of the bottom plate 1, a groove 2 is formed in the center of the front surface of the bottom plate 1, the groove 2 is opposite TO the round holes 4, two ends of the bottom plate 1 are respectively provided with an aluminum block I3-1 and an aluminum block II 3-2, and the aluminum block I3-1 and the aluminum block II 3-2 are connected with the bottom plate through bolts 7.
Further, the groove 2 is in a shape of a Chinese character 'zhong', the depth of the groove is 70% of the thickness of the bottom plate 1, and the maximum width a of the groove 2 is 0.1 mm larger than the width of the TO-252 packaged diode.
Further, the distance between the round holes 4 is 5mm, and the diameter of the round holes 4 is equal to the bottom width of the groove 2.
Further, a bolt hole is formed in the middle of the first aluminum block 3-1, a screw 6 is arranged on the bolt hole, and the screw 6 is aligned with the center of the groove 2.
Further, a spring 5 is fixedly connected to the top end of the screw 6.
Further, a row of round holes 4 are formed in the central line of the bottom plate 1 and used for ventilation and heat dissipation in the test process.
Further, the test method of the TO-252 packaged diode aging test fixture is as follows: the TO-252 diode is arranged in the groove 2 in a series connection mode, the first aluminum block 3-1 and the second aluminum block 3-2 are fixed by bolts 7 after the diode is filled, and the adjusting screw 6 drives the spring 5 TO enable the diode TO be in contact with each other, so that an aging test can be carried out.
The working principle of the invention is as follows: when the TO-252 packaged diode aging test fixture is adopted, diodes are installed in the grooves 2 in a serial mode, the installation mode is simple and easy TO implement, the aluminum block is fixed by the bolts 7 after the diodes are filled, and the adjusting screw 6 drives the springs 5 TO enable the diodes TO be in contact with each other. In the invention, the upper surface of the diode is provided with the gap, and the lower surface of the diode is provided with the round hole 4, and the heat productivity of the shell of the TO-252 packaged diode is easier to test and control during the aging test, thereby reducing or even avoiding the damage or burning of devices caused by poor heat dissipation, and greatly improving the reliability of the screening test.
The present invention is not described in detail in the present application, and is well known to those skilled in the art. Finally, it is noted that the above embodiments are only for illustrating the technical solution of the present invention and not for limiting the same, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made thereto without departing from the spirit and scope of the technical solution of the present invention, which is intended to be covered by the scope of the claims of the present invention.
Claims (1)
1. The test method based on the TO-252 packaged diode aging test fixture is characterized by comprising a base plate (1), wherein the base plate (1) is in a cuboid shape, a row of a plurality of round holes (4) are formed in the center of the back surface of the base plate (1), a groove (2) is formed in the center of the front surface of the base plate (1), the groove (2) is opposite TO the round holes (4), two ends of the base plate (1) are respectively provided with a first aluminum block (3-1) and a second aluminum block (3-2), and the first aluminum block (3-1) and the second aluminum block (3-2) are connected with the base plate through bolts (7); a bolt hole is formed in the middle of the first aluminum block (3-1), a screw (6) is arranged on the bolt hole, the screw (6) is aligned to the center of the groove (2), and a spring (5) is fixedly connected to the top end of the screw (6); the groove (2) is of a medium-shaped structure, the depth of the groove is 70% of the thickness of the bottom plate (1), and the maximum width of the groove (2) is 0.1mm larger than the width of the TO-252 packaged diode; the distance between the round holes (4) is 5mm, and the diameter of the round holes (4) is equal to the width of the bottom of the groove (2);
The test method of the TO-252 packaged diode aging test fixture comprises the following steps: the TO-252 diode is arranged in the groove (2) in a series connection mode, the first aluminum block (3-1) and the second aluminum block (3-2) are fixed by bolts (7) after the diode is filled, and the adjusting screw (6) drives the spring (5) TO enable the diodes TO be in contact with each other, so that an aging test can be carried out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711322933.2A CN107991596B (en) | 2017-12-12 | 2017-12-12 | TO-252 packaged diode aging test fixture and test method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711322933.2A CN107991596B (en) | 2017-12-12 | 2017-12-12 | TO-252 packaged diode aging test fixture and test method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107991596A CN107991596A (en) | 2018-05-04 |
| CN107991596B true CN107991596B (en) | 2024-06-07 |
Family
ID=62037366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711322933.2A Active CN107991596B (en) | 2017-12-12 | 2017-12-12 | TO-252 packaged diode aging test fixture and test method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107991596B (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06130122A (en) * | 1992-10-20 | 1994-05-13 | Toshiba Corp | Burn-in testing jig |
| CN202861578U (en) * | 2012-09-14 | 2013-04-10 | 天津力神电池股份有限公司 | Soldering connecting clamp between guide wires and nickels |
| CN203457431U (en) * | 2013-09-22 | 2014-02-26 | 王海浪 | A PCB clamp |
| CN203617264U (en) * | 2013-12-24 | 2014-05-28 | 苏州市奥普斯等离子体科技有限公司 | Improved chip clamping device |
| CN104020322A (en) * | 2014-06-12 | 2014-09-03 | 山东大学 | Manual lightning stroke simulating test fixture made of fiber reinforced composite material, and method |
| CN203849291U (en) * | 2014-05-19 | 2014-09-24 | 工业和信息化部电子第五研究所 | Aging test fixture |
| CN104483514A (en) * | 2014-12-11 | 2015-04-01 | 铜陵市启动电子制造有限责任公司 | Core test fixture for thin-film capacitors |
| CN204832374U (en) * | 2015-07-01 | 2015-12-02 | 河南中光学集团有限公司 | Appearance is smelted always in integrated screening of image intensifier matrix |
| CN106896244A (en) * | 2017-04-12 | 2017-06-27 | 江苏伊施德创新科技有限公司 | Ageing fixture and the method that contact condition and the test of ageing result are done using the fixture |
| CN107450006A (en) * | 2017-08-14 | 2017-12-08 | 杭州可靠性仪器厂 | A kind of metal-oxide-semiconductor, diode power batch run device |
| CN207528773U (en) * | 2017-12-12 | 2018-06-22 | 贵州航天计量测试技术研究所 | A kind of aging test device for TO-252 diode packages |
-
2017
- 2017-12-12 CN CN201711322933.2A patent/CN107991596B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06130122A (en) * | 1992-10-20 | 1994-05-13 | Toshiba Corp | Burn-in testing jig |
| CN202861578U (en) * | 2012-09-14 | 2013-04-10 | 天津力神电池股份有限公司 | Soldering connecting clamp between guide wires and nickels |
| CN203457431U (en) * | 2013-09-22 | 2014-02-26 | 王海浪 | A PCB clamp |
| CN203617264U (en) * | 2013-12-24 | 2014-05-28 | 苏州市奥普斯等离子体科技有限公司 | Improved chip clamping device |
| CN203849291U (en) * | 2014-05-19 | 2014-09-24 | 工业和信息化部电子第五研究所 | Aging test fixture |
| CN104020322A (en) * | 2014-06-12 | 2014-09-03 | 山东大学 | Manual lightning stroke simulating test fixture made of fiber reinforced composite material, and method |
| CN104483514A (en) * | 2014-12-11 | 2015-04-01 | 铜陵市启动电子制造有限责任公司 | Core test fixture for thin-film capacitors |
| CN204832374U (en) * | 2015-07-01 | 2015-12-02 | 河南中光学集团有限公司 | Appearance is smelted always in integrated screening of image intensifier matrix |
| CN106896244A (en) * | 2017-04-12 | 2017-06-27 | 江苏伊施德创新科技有限公司 | Ageing fixture and the method that contact condition and the test of ageing result are done using the fixture |
| CN107450006A (en) * | 2017-08-14 | 2017-12-08 | 杭州可靠性仪器厂 | A kind of metal-oxide-semiconductor, diode power batch run device |
| CN207528773U (en) * | 2017-12-12 | 2018-06-22 | 贵州航天计量测试技术研究所 | A kind of aging test device for TO-252 diode packages |
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| Publication number | Publication date |
|---|---|
| CN107991596A (en) | 2018-05-04 |
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