CN107986787B - 一种低温烧结陶瓷型金刚石磨头的配方和制备方法 - Google Patents

一种低温烧结陶瓷型金刚石磨头的配方和制备方法 Download PDF

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CN107986787B
CN107986787B CN201711273712.0A CN201711273712A CN107986787B CN 107986787 B CN107986787 B CN 107986787B CN 201711273712 A CN201711273712 A CN 201711273712A CN 107986787 B CN107986787 B CN 107986787B
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吴伟东
王坤
王红静
顾盼
邢宇
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AECC Shenyang Liming Aero Engine Co Ltd
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Abstract

一种低温烧结陶瓷型金刚石磨头的配方和制备方法，属于机械切削制造领域。该低温烧结陶瓷型金刚石磨头的配方包括的各个组分及各个组分的重量份数为：陶瓷结合剂：9.5～10.5份，糊精粉：9.5～10.5份，核桃壳粉：19～21份，金刚石粉：95～150份。其制备方法为加入水将原料混合均匀，搅拌得到糊状物料，加压成型，烘干，得到陶瓷型金刚石磨头坯；将陶瓷型金刚石磨头坯，在500～600℃进行烧结，烧结时间为≥6h，得到低温烧结陶瓷型金刚石磨头。采用本配方和方法制备的低温烧结陶瓷型金刚石磨头，耐磨性高，磨头切削磨损小，几何尺寸在加工过程中稳定，可以满足SiC陶瓷复合材料精密切削要求。

Description

一种低温烧结陶瓷型金刚石磨头的配方和制备方法
技术领域
本发明涉及机械切削制造领域，具体涉及一种低温烧结陶瓷型金刚石磨头的配方和制备方法。
背景技术
在航空航天和能源等工业领域，对高温结构材料有更高性能要求。高温结构陶瓷因其耐高温的特性受到了研究者的关注。SiC陶瓷具有良好的高温强度、高温稳定性和高温抗氧化能力等，但是单独的SiC陶瓷在塑性变形能力较差，经过多年的研究，SiC陶瓷复合材料能满足各个领域的功能要求。
SiC陶瓷复合材料是应用在发动机结构件新的一种新材料。材料中SiC莫式硬度9.5，介于刚玉和金刚石硬度之间，所以SiC陶瓷复合材料切削加工难度极大。SiC陶瓷复合材料成品硬度高，如果在加工SiC陶瓷复合材料时，采用普通磨头进行切削时，普通磨头磨耗快，采用电镀金刚石磨头对SiC陶瓷复合材料进行切削时，金刚石颗粒在切削热的作用下，很容易脱落。
为了增加金刚石颗粒与磨头的结合性，需采用陶瓷型的金刚石磨头。陶瓷烧结温度一般在1200℃～1500℃，在此高温条件下，金刚石硬度将有很大程度的降低，从而造成磨头磨削性能降低，如果采用高温烧结的金刚石磨头进行SiC陶瓷复合材料切削时，磨耗快，达不到高精加工要求。
发明内容
本发明的目的是提供一种低温烧结陶瓷型金刚石磨头的配方和制备方法。该低温烧结陶瓷型金刚石磨头，最高烧结温度为600℃，低温烧结的磨头，耐磨性高，磨头切削磨损小，几何尺寸在加工过程中稳定，可以满足SiC陶瓷复合材料精密切削要求。
本发明的一种低温烧结陶瓷型金刚石磨头的配方，包括的各个组分及各个组分的重量份数为：
陶瓷结合剂：9.5～10.5份
糊精粉：9.5～10.5份
核桃壳粉：19～21份
金刚石粉：95～150份
所述的陶瓷结合剂，包含的各个组分及各个组分的质量百分比为：
二氧化硅：45～55％
三氧化二铝：25～35％
碳酸锶：10～12％
三氧化二硼：8～10％
所述的糊精粉的粒度为≤400目，所述的核桃壳粉的粒度为≤400目，所述的金刚石粉的粒度根据加工需求进行选择，一般根据加工表面粗糙度值选择。
所述的低温烧结陶瓷型金刚石磨头的配方，包括的各个组分及各个组分的重量份数优选为：陶瓷结合剂：10份；糊精粉：10份；核桃壳粉：20份；金刚石粉：100份。
所述的陶瓷结合剂，包含的各个组分及其各个组分的质量百分比优选为：二氧化硅：55％；三氧化二铝：25％；碳酸锶：10％；三氧化二硼：10％。
本发明的一种低温烧结陶瓷型金刚石磨头的制备方法，包括以下步骤：
步骤1，混料
按低温烧结陶瓷型金刚石磨头的配方进行称料，加入水，将原料混合均匀，搅拌得到糊状物料；
步骤2，成型
将糊状物料加入磨头模具中，加压成型，烘干，得到陶瓷型金刚石磨头坯；
步骤3，低温烧结
将陶瓷型金刚石磨头坯，在500～600℃进行烧结，烧结时间为≥6h，得到低温烧结陶瓷型金刚石磨头。
所述的步骤1中，所述的加入水的量为0.03～0.06ml/g，水温为室温；
所述的步骤2中，所述的加压成型的压力为10±0.5MPa。
所述的步骤2中，所述的烘干，烘干温度为100～150℃，烘干时间为1～12h。
所述的步骤3中，在烧结前，取陶瓷型金刚石磨头坯物料进行差热-热重分析，从得到的差热-热重分析图确定烧结过程不同温度区间的失重情况，在失重较大的温度区间应缓慢升温，防止材料的收缩率过大，影响性能。所述的缓慢升温的升温速率为1～5℃/min。
本发明的一种低温烧结陶瓷型金刚石磨头的配方和制备方法，相比于现有技术，其有益效果为：
1.采用本发明的低温烧结陶瓷型金刚石磨头的配方后，烧结后得到的陶瓷型金刚石磨头可满足高硬SiC陶瓷复合材料成品的切削需求，切削时，磨头磨耗小，加工的零件可以保证尺寸公差为0.03的几何精度，可实现SiC陶瓷复合材料小余量高效精密切削。
2.低温烧结的陶瓷型金刚石磨头，其金刚石的性能没有降低，磨削性能比高温烧结的金刚石磨头高，耐磨性好，磨头的几何尺寸保持性好，可满足高精尺寸公差的零件加工要求。
3.本发明的低温烧结陶瓷型金刚石磨头，与国外同类磨头相比，成本仅是进口磨头的三分之一，制作周期是国外的四分之一，而磨头的耐用度及寿命与进口产品相当。因此其加工成本要明显优越于进口磨头。
4.随着新一代发动机上陶瓷复合材料应用比例的提高，复合材料加工任务将越来越多，SiC陶瓷复合材料的半成品和成品均采用金刚石磨头进行切削和加工，因此这种高耐磨高效切割的磨头的需求会成倍增加。
附图说明
图1为本发明实施例1中低温烧结陶瓷型金刚石磨头的烧结曲线。
具体实施方式
下面结合实施例对本发明作进一步的详细说明。
以下实施例除特征说明，采用的原料和设备均为市购。
实施例1
一种低温烧结陶瓷型金刚石磨头的配方，包括的各个组分及各个组分的重量份数为：
陶瓷结合剂：10份
糊精粉：10份
核桃壳粉：20份
金刚石粉：100份
所述的陶瓷结合剂，包含的各个组分及各个组分的质量百分比为：
二氧化硅：55％
三氧化二铝：25％
碳酸锶：10％
三氧化二硼：10％
所述的糊精粉的粒度为400目，所述的核桃壳粉的粒度为400目，所述的金刚石粉的粒度根据加工需求进行选择，一般根据加工表面粗糙度值选择。本实施例采用加工表面粗糙度为1.6，金刚石粉粒度为120目。
一种低温烧结陶瓷型金刚石磨头的制备方法，包括以下步骤：
步骤1，混料
按低温烧结陶瓷型金刚石磨头的配方进行称料，加入水，将原料混合均匀，搅拌得到糊状物料；其中，水的量占低温烧结陶瓷型金刚石磨头的配方的原料总质量为0.04ml/g，水温为室温；
步骤2，成型
将糊状物料加入磨头模具中，加压成型，在100℃烘干2h，得到陶瓷型金刚石磨头坯；
本实施例中，所述的加压成型的压力是通过加压成型设备参数控制的，具体为10MPa，偏差范围控制在±0.2MPa。
步骤3，低温烧结
将陶瓷型金刚石磨头坯，进行梯度升温，在最高温度600℃进行烧结，烧结时间为6h，随炉冷却至室温，得到低温烧结陶瓷型金刚石磨头。
本实施例中，烧结曲线见图1，从烧结曲线上可知，采用梯度升温保温的方法，先以100℃/h的升温速率，缓慢升温至100℃，保温1h后，采用200℃/h的升温速率，缓慢升温至300℃保温2h，以300℃/h的升温速率，升温至最高烧结温度600℃，保温6h后，随炉冷却至室温，得到低温烧结陶瓷型金刚石磨头。
用本实施例得到的低温烧结陶瓷型金刚石磨头切割SiC陶瓷复合材料，切削时，磨头磨耗小，加工的零件可以保证尺寸公差为0.03的几何精度。
实施例2
一种低温烧结陶瓷型金刚石磨头的配方，包括的各个组分及各个组分的重量份数为：
陶瓷结合剂：9.5份
糊精粉：10.5份
核桃壳粉：19份
金刚石粉：105份
所述的陶瓷结合剂，包含的各个组分及各个组分的质量百分比为：
二氧化硅：45％
三氧化二铝：35％
碳酸锶：12％
三氧化二硼：8％
所述的糊精粉的粒度为400目，所述的核桃壳粉的粒度为400目，所述的金刚石粉的粒度根据加工需求进行选择，一般根据加工表面粗糙度值选择。本实施例采用加工表面粗糙度为1.6，金刚石粉粒度为120目。
一种低温烧结陶瓷型金刚石磨头的制备方法，包括以下步骤：
步骤1，混料
按低温烧结陶瓷型金刚石磨头的配方进行称料，加入水，将原料混合均匀，搅拌得到糊状物料；其中，水的量占低温烧结陶瓷型金刚石磨头的配方的原料总质量为0.06ml/g，水温为室温；
步骤2，成型
将糊状物料加入磨头模具中，加压成型，在150℃烘干1h，得到陶瓷型金刚石磨头坯；
本实施例中，所述的加压成型的压力是通过加压成型设备参数控制的，具体为10MPa，偏差范围控制在±0.2MPa。
步骤3，低温烧结
将陶瓷型金刚石磨头坯，进行梯度升温，在500℃进行烧结，烧结时间为12h，随炉冷却至室温，得到低温烧结陶瓷型金刚石磨头。
实施例3
一种低温烧结陶瓷型金刚石磨头的配方，包括的各个组分及各个组分的重量份数为：
陶瓷结合剂：10.5份
糊精粉：9.5份
核桃壳粉：21份
金刚石粉：95份
所述的陶瓷结合剂，包含的各个组分及各个组分的质量百分比为：
二氧化硅：40％
三氧化二铝：30％
碳酸锶：10％
三氧化二硼：10％
所述的糊精粉的粒度为400目，所述的核桃壳粉的粒度为400目，所述的金刚石粉的粒度根据加工需求进行选择，一般根据加工表面粗糙度值选择。本实施例采用加工表面粗糙度为1.6，金刚石粉粒度为120目。
一种低温烧结陶瓷型金刚石磨头的制备方法，包括以下步骤：
步骤1，混料
按低温烧结陶瓷型金刚石磨头的配方进行称料，加入水，将原料混合均匀，搅拌得到糊状物料；其中，水的量占低温烧结陶瓷型金刚石磨头的配方的原料总质量为0.03ml/g，水温为室温；
步骤2，成型
将糊状物料加入磨头模具中，加压成型，在120℃烘干2h，得到陶瓷型金刚石磨头坯；
本实施例中，所述的加压成型的压力是通过加压成型设备参数控制的，具体为10MPa，偏差范围控制在±0.2MPa。
步骤3，低温烧结
将陶瓷型金刚石磨头坯，进行梯度升温，在最高温度600℃进行烧结，烧结时间为6h，随炉冷却至室温，得到低温烧结陶瓷型金刚石磨头。

Claims (7)

1.一种低温烧结陶瓷型金刚石磨头的制备方法，其特征在于，包括以下步骤：
步骤1，混料
按低温烧结陶瓷型金刚石磨头的配方进行称料，加入水，将原料混合均匀，搅拌得到糊状物料；
其中，低温烧结陶瓷型金刚石磨头的配方，由以下组分组成，各个组分及各个组分的重量份数为：
陶瓷结合剂：9.5~10.5份，
糊精粉：9.5~10.5份，
核桃壳粉：19~21份，
金刚石粉：95~150份；
其中，所述的陶瓷结合剂，由以下组分组成，各个组分的质量百分比为：
二氧化硅：45~55%，
三氧化二铝：25~35%，
碳酸锶：10~12%，
三氧化二硼：8~10%；
步骤2，成型
将糊状物料加入磨头模具中，加压成型，烘干，得到陶瓷型金刚石磨头坯；
步骤3，低温烧结
将陶瓷型金刚石磨头坯，烧结为梯度升温烧结，升温的升温速率为1~5℃/min，在500~600℃进行烧结，烧结时间为≥6h，得到低温烧结陶瓷型金刚石磨头；
所述的梯度升温烧结为，先以100℃/h的升温速率，缓慢升温至100℃，保温1h后，采用200℃/h的升温速率，缓慢升温至300℃保温2h，以300℃/h的升温速率，升温至最高烧结温度烧结；
制得的低温烧结陶瓷型金刚石磨头切割SiC陶瓷复合材料，切削时，加工的零件可以保证尺寸公差为0.03的几何精度。
2.如权利要求1所述的低温烧结陶瓷型金刚石磨头的制备方法，其特征在于，所述的糊精粉的粒度为≤400目，所述的核桃壳粉的粒度为≤400目。
3.如权利要求1所述的低温烧结陶瓷型金刚石磨头的制备方法，其特征在于，所述的低温烧结陶瓷型金刚石磨头的配方，由以下各个组分组成，各个组分的重量份数为：陶瓷结合剂：10份；糊精粉：10份；核桃壳粉：20份；金刚石粉：100份。
4.如权利要求1所述的低温烧结陶瓷型金刚石磨头的制备方法，其特征在于，所述的陶瓷结合剂，由以下各个组分组成，各个组分的质量百分比为：二氧化硅：55%；三氧化二铝：25%；碳酸锶：10%；三氧化二硼：10%。
5.如权利要求1所述的低温烧结陶瓷型金刚石磨头的制备方法，其特征在于，所述的步骤1中，所述的加入水的量为0.03~0.06mL/g，水温为室温。
6.如权利要求1所述的低温烧结陶瓷型金刚石磨头的制备方法，其特征在于，所述的步骤2中，所述的加压成型的压力为10±0.5MPa。
7.如权利要求1所述的低温烧结陶瓷型金刚石磨头的制备方法，其特征在于，所述的步骤2中，所述的烘干，烘干温度为100~150℃，烘干时间为1~12h。
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