CN107979921A - Circuit board and method for manufacturing the same - Google Patents
Circuit board and method for manufacturing the same Download PDFInfo
- Publication number
- CN107979921A CN107979921A CN201611015886.2A CN201611015886A CN107979921A CN 107979921 A CN107979921 A CN 107979921A CN 201611015886 A CN201611015886 A CN 201611015886A CN 107979921 A CN107979921 A CN 107979921A
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- those
- opening
- openings
- conductive
- conductive components
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 title claims description 67
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 238000009713 electroplating Methods 0.000 claims description 9
- 239000010410 layer Substances 0.000 description 179
- 239000013078 crystal Substances 0.000 description 26
- 238000012545 processing Methods 0.000 description 15
- 238000005530 etching Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000003973 paint Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000013461 design Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- 230000000873 masking effect Effects 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 239000012141 concentrate Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention provides a circuit board, which comprises a substrate. The plurality of first conductive blocks are arranged on the substrate at intervals, wherein the first conductive blocks comprise first conductive blocks with openings in dense areas and first conductive blocks with openings in loose areas. A first insulating layer is arranged on the substrate and provided with a plurality of first openings to form an opening dense area and a plurality of second openings to form an opening loose area. A plurality of conductive members are arranged at intervals on the first insulating layer, the conductive members including: the first openings are correspondingly filled with the first conductive parts to be electrically connected with the first conductive blocks in the dense opening areas, and the second openings are correspondingly filled with the second conductive parts to be electrically connected with the first conductive blocks in the loose opening areas. The conductive member has a uniform thickness. The invention also provides a manufacturing method of the circuit board.
Description
Technical field
The present invention is related to a kind of circuit board and its manufacture method, particularly with regard to a kind of conductive layer with uniform thickness
Circuit board and its manufacture method.
Background technology
Printed circuit board (PCB) (printed circuit board, PCB) is according to circuit design, will connect leading for circuit component
Electrical wiring draws wiring pattern, then again in a manner of machinery and chemical process, surface treatment etc., is formed electrically lead on insulator
The circuit board of body.Foregoing circuit pattern is the distribution that precision is formed using technologies such as printing, lithographic, etching and plating, as branch
Support the assembly platform that circuit is connected with each other between electronic component and part.
Most of support plate conductive layer is still formed with plating mode at present, however, because of product functionality design factor, interlayer is led
The design of via count is more and more and concentrates on plant crystalline region region so that interlayer conduction hole count skewness.Because skewness
Influence, highly dense hole count area scattered current is caused in electroplating process, and low intensive hole count area concentrates electric current, causes hole count intensive
Area produces the phenomenon of conductive layer thickness inequality with hole count puffs after plating, influences product resistance value, impedance, also influences follow-up system
The stability of tin ball/print tin cream is planted when journey is as encapsulated.
Figure 1A shows the top view of prior art circuits plate, including plants crystalline region A and non-plant crystalline region B.Figure 1B shows existing skill
The profile of art circuit board.It is conductive that circuit board includes a substrate 100, more first conducting blocks 200, one first insulating layer 210, first
Layer 250, more second conducting blocks 300, one second insulating layer 310 and the second conductive layer 350.Crystalline region A it can be seen that, is being planted by Figure 1B
In the first conductive layer 250, the thinner thickness of the second conductive layer 350 positioned at the top of opening compact district 202,302, and it is non-plant it is brilliant
Positioned at the situation that the first conductive layer 250, the thickness of the second conductive layer 350 of the top of opening puffs 204,304 are thicker in area B.
As described above, the phenomenon of this conductive layer thickness inequality, can influence product resistance value, impedance, the coefficient of stabilization of follow-up process is also influenced.
Therefore, there is an urgent need for develop a kind of circuit board and its manufacture method of the conductive layer with uniform thickness at present.
The content of the invention
According to an embodiment, the present invention provides a kind of circuit board, including：One substrate, have an opposite first surface and
One second surface；Multiple first conducting blocks, are spaced on the first surface of substrate, are open wherein the first conducting block includes one
First conducting block of compact district and the first conducting block of an opening puffs；One first insulating layer, is arranged at the first table of substrate
On face, and the first insulating layer has the multiple first openings and is dredged with forming opening compact district and multiple second openings with forming opening
Loose area, exposes the first conducting block of opening compact district and the first conducting block of the puffs that are open respectively；And multiple conductions
Component, is spaced on the first insulating layer, conductive component includes：Multiple first conductive components, correspondence insert the first opening, with
It is electrically connected the first conducting block of opening compact district；And multiple second conductive components, correspondence inserts the second opening, electrically to connect
Connect the first conducting block of opening puffs；Wherein conductive component has a uniform thickness.
According to another embodiment, the present invention provides a kind of manufacture method of circuit board, including：In one first table of a substrate
Spaced multiple first conducting blocks are formed on face, wherein the first conducting block include one opening compact district the first conducting block and
First conducting block of one opening puffs；One first insulating layer is formed on the first surface of substrate；The shape in the first insulating layer
Into the multiple first openings to form opening compact district and multiple second openings to form opening puffs, it is close that opening is exposed respectively
The first conducting block of Ji Qu and the first conducting block of the puffs that are open；It is dry that one patterned first is formed on the first insulating layer
Film, exposes the first opening and the second opening；An electroplating process is carried out to form one first conductive layer；Place one first fixture in
On patterned first dry film, wherein the first fixture is located at least in above opening compact district, and it is not bonded with the first conductive layer；Into
One etch process of row, removes the first conductive layer of part so that the first conductive layer has a uniform thickness；Remove the first fixture；
And patterned first dry film is removed, to form spaced multiple conductive components on the first insulating layer.
According to another embodiment, the present invention provides a kind of manufacture method of circuit board, including：In one first table of a substrate
Spaced multiple first conducting blocks are formed on face, wherein the first conducting block include one opening compact district the first conducting block and
First conducting block of one opening puffs；One first insulating layer is formed on the first surface of substrate；The shape in the first insulating layer
Into the multiple first openings to form opening compact district and multiple second openings to form opening puffs, it is close that opening is exposed respectively
The first conducting block of Ji Qu and the first conducting block of the puffs that are open；It is dry that one patterned first is formed on the first insulating layer
Film, exposes the first opening and the second opening；An electroplating process is carried out to form one first conductive layer；In the first conductive layer and figure
One first photopolymer layer is formed on first dry film of case, wherein the first photopolymer layer is located at least in above opening compact district and with first
Conductive layer is bonded；An etch process is carried out, removes the first conductive layer of part so that the first conductive layer has a uniform thickness；
And the first photopolymer layer and patterned first dry film are removed, to form spaced multiple conductive parts on the first insulating layer
Part.
For allow the present invention above and other purpose, feature and advantage can become apparent, it is cited below particularly go out preferable implementation
Example, and attached drawing appended by cooperation, are described in detail below：
Brief description of the drawings
The top view of Figure 1A display circuit boards；
Figure 1B is shown with the diagrammatic cross-section of the circuit board of prior art manufacture；
Fig. 2~7 are the diagrammatic cross-section according to the manufacture method interstage of some embodiments of the invention display circuit board；
An embodiment shows that Fig. 4 paints the enlarged diagram of circled to Fig. 8 A according to the present invention；
Fig. 8 B~8D show that Fig. 4 paints the enlarged diagram of circled after etching according to some embodiments of the invention；
An embodiment shows that Fig. 6 paints the enlarged diagram of circled to Fig. 9 A according to the present invention；And
Fig. 9 B~9D show that Fig. 6 paints the enlarged diagram of circled after etching according to some embodiments of the invention.
【Symbol description】
100~substrate
102~first surface
104~second surface
200~the first conducting blocks
202nd, 302~opening compact district
204th, 304~opening puffs
210~the first insulating layers
220~the first openings
222~the second openings
230~the first crystal seed layers
240~patterned first dry film
250~the first conductive layers
260~the first fixtures
270~the first photopolymer layers
280th, 380~conductive component
281st, 291~the first conductive component
282nd, 291~the second conductive component
300~the second conducting blocks
310~the second insulating layers
320~the 3rd opening
322~the 4th opening
330~the second crystal seed layers
340~patterned second dry film
350~the second conductive layers
360~the second fixtures
370~the second photopolymer layers
381st, the 391~the 3rd conductive component
382nd, the 392~the 4th conductive component
A~plant crystalline region
B~non-plant crystalline region
H, H1, H2, H3, H ', H ' 1, H ' 2,3~differences of H '
Embodiment
Illustrate the circuit board and its manufacture method of the embodiment of the present invention below.However, it can will readily appreciate that provided by the present invention
Embodiment be merely to illustrate with ad hoc approach make and using the present invention, and be not used to limitation the scope of the present invention.Furthermore
Make to be denoted by the same reference numerals in the attached drawing and description of the embodiment of the present invention and represent the same or similar component.
Fig. 5 is refer to, it shows the diagrammatic cross-section of the circuit board of one embodiment of the invention.In the present embodiment, circuit
Plate includes a substrate 100, more first conducting blocks 200, one first insulating layer 210, more first conductive components 280, more second conductions
Block 300, one second insulating layer 310 and multiple second conductive components 380.Substrate 100 have an opposite first surface 102 and
One second surface 104.In the present embodiment, substrate 100 can be made of resin material.In the present embodiment, the first insulating layer
210th, the second insulating layer 310 can be made of ABF (Ajinomoto Build-up Film) or PP (Prepreg) material.
First conducting block 200 is spaced on the first surface 102 of substrate 100.First conducting block 200 includes an opening
First conducting block 200 of compact district 202 and the first conducting block 200 of an opening puffs 204.First insulating layer 210 is arranged at
On the first surface 102 of first conducting block 200 and substrate 100, and first it is open with the multiple first openings 220 and by those
The 220 opening compact districts 202 formed, and the opening formed with the multiple second openings 222 and by those second openings 222
Puffs 204 (are shown in Fig. 2), wherein, multiple first openings 220 expose the first conducting block 200 of opening compact district 202,
And multiple second openings 222 expose the first conducting block 200 of opening puffs 204.Conductive component 280 is spaced in first
On insulating layer 210.Conductive component 280 includes：Multiple first conductive components 281, correspondence inserts the first opening 220, electrically to connect
Connect the first conducting block 200 of opening compact district 202；And multiple second conductive components 282, correspondence insert the second opening 222, with
It is electrically connected the first conducting block 200 of opening puffs 204.Conductive component 280 has a uniform thickness.In the present embodiment
In, a upper surface of second conductive component 282 at the first conductive component 281 is a smooth interface.
In the present embodiment, the thickness of the thickness of the second conductive component 282 and the first conductive component 281 in conductive component 280
The difference of degree can be -50~the 100% of the thickness of the first conductive component 281.For example, in one embodiment, the second conductive component
282 thickness can be more than the thickness of the first conductive component 281, at this time, the thickness and the first conductive component of the second conductive component 282
The difference of 281 thickness can between the 0% to 100% of the thickness of the first conductive component 281, such as：1%~99% or
10%~50%.Alternatively, in another embodiment, the thickness of the second conductive component 282 is approximately equal to the thickness of the first conductive component 281
Degree, at this time, the difference of the thickness of the thickness of the second conductive component 282 and the first conductive component 281 is approximately equal to the first conductive component
The 0% of 281 thickness, such as：- 5%~5% or -1%~1%.Or in another embodiment, the second conductive component
282 thickness is smaller than the thickness of the first conductive component 281, at this time, the thickness and the first conductive component of the second conductive component 282
The difference of 281 thickness can between the 0% to -50% of the thickness of the first conductive component 281, such as：- 1%~-49%
Or -10%~-25%.
Similarly, multiple second conducting blocks 300, are spaced on the second surface 104 of substrate 100.Second conducting block
300 include the second conducting block 300 of an opening compact district 302 and the second conducting block 300 of an opening puffs 304.Second is exhausted
Edge layer 310 is arranged on the second surface 104 of the second conducting block 300 and substrate 100, and with multiple three opening 320 and by
The opening compact district 302 that those the 3rd openings 320 are formed, and with multiple four openings 322 and by those the 4th openings 322
The opening puffs 304 (being shown in Fig. 2) formed, wherein, multiple three openings 320 expose the of opening compact district 302
Two conducting blocks 300, and multiple 4th openings 322 expose the second conducting block 300 of opening puffs 304.Between conductive component 380
Every being arranged on the second insulating layer 310.Conductive component 380 includes：Multiple 3rd conductive components 381, it is corresponding to insert the 3rd opening
320, to be electrically connected the second conducting block 300 of opening compact district 302；And multiple 4th conductive components 382, it is corresponding to insert the
Four openings 322, to be electrically connected the second conducting block 300 of opening puffs 304.Conductive component 380 has a uniform thickness.
In the present embodiment, a upper surface of the 4th conductive component 382 at the 3rd conductive component 381 is a smooth interface.
In the present embodiment, the thickness of the 4th conductive component 382 and the thickness of the 3rd conductive component 381 in conductive component 380
The difference of degree can be -50~the 100% of the thickness of the 3rd conductive component 381.The thickness of 4th conductive component 382 and the 3rd conduction
The difference relationship of the thickness of component 381 can refer to the thickness and first conductive component 281 above for the second conductive component 282
The narration of the difference relationship of thickness, does not repeat herein.
Fig. 7 is refer to, it shows the diagrammatic cross-section of the circuit board of another embodiment of the present invention, wherein being same as Fig. 5's
Element uses identical label.In the present embodiment, the structure of circuit board is similar to the embodiment of Fig. 5, and difference is the
A upper surface of two conductive components 292 at the first conductive component 291 is a vertical interface, and the 4th conductive component 392 is adjacent
A upper surface at nearly 3rd conductive component 391 is a vertical interface.
Herein, when describing the thickness of the first conductive component, it is intended that the thickness of minimum part in the first conductive component,
Similarly, when describing the thickness of the second conductive component, it is intended that the thickness of minimum part in the second conductive component.It should be noted that
It is, although in embodiments of the present invention, the thickness of the second conductive component can have different differences from the thickness of the first conductive component
Value, but monolithic conductive component still has a uniform thickness, compared to the previously described prior art, is formed in the present invention
Circuit board in, the difference between the thickness of the thickness of the second conductive component and the first conductive component substantially reduces, and reaches overall and leads
The purpose of electrical components uniformity lifting.In addition, in some embodiments of the invention, when the thickness of the second conductive component is more than first
During the thickness of conductive component, in addition to achieving the purpose that the lifting of monolithic conductive parts uniformity, it more can further accomplish filament
Road, micromation, reach control resistance value or the demand of impedance.
Fig. 2~5 are the diagrammatic cross-section in the method for manufacturing circuit board interstage shown according to one embodiment of the invention.
It refer to Fig. 2, there is provided a substrate 100, it is with opposite a first surface 102 and a second surface 104.At this
In embodiment, substrate 100 can be made of resin material.On the first surface 102 and second surface 104 of substrate 100 respectively
A conductive layer (not illustrating) is formed, and passes through lithographic and etch process, patterned conductive layer, with first surface 102 and second
Spaced more first conducting blocks 200 and more second conducting blocks 300 are formed on surface 104 respectively.In the present embodiment, first
Conducting block 200 includes the first conducting block 200 of an opening compact district 202 and the first conducting block 200 of an opening puffs 204,
Second conducting block 300 includes the second conducting block 300 of an opening compact district 302 and the second conducting block of an opening puffs 304
300.Then, a pressure programming is carried out, it is exhausted to form one first respectively on the first surface 102 and second surface 104 of substrate 100
210 and 1 second insulating layer 310 of edge layer, to be covered each by the first conducting block 200 and the second conducting block 300.In the present embodiment,
First insulating layer 210 or the second insulating layer 310 can be made of ABF or PP materials.Then, a laser drill processing procedure is can pass through,
More first openings 220 and multiple second openings 222 are formed in the first insulating layer 210 to form opening compact district 202 and expose
First conducting block 200 of opening compact district 202 and composition opening puffs 204 simultaneously expose the first of opening puffs 204
Conducting block 200, and form more 3rd openings 320 on the second insulating layer 310 and multiple 4th openings 322 are intensive to form opening
Area 302 and expose opening compact district 302 the second conducting block 300 and form opening puffs 304 and expose opening dredge
Second conducting block 300 in loose area 304.After laser drill processing procedure is carried out, the step of glue residue can be removed, to remove laser drilling
Residue (not illustrating) behind hole in the 320, the 4th opening 322 of the first the 222, the 3rd opening of the 220, second opening of opening.
Fig. 3 is refer to, it is exhausted in the first insulating layer 210 and second through a deposition manufacture process (for example, electroless copper deposition processing procedure)
One first crystal seed (seed) layer 230 and one second crystal seed layer 330 are formed in edge layer 310 respectively, and extends respectively to the first opening
220th, in the 320, the 4th 322 (being shown in Fig. 2) of opening of the second 222 (being shown in Fig. 2) of opening and the 3rd opening.Then, first
One first dry film and one second dry film are formed on 230 and second crystal seed layer 330 of crystal seed layer.Then, through exposed and developed processing procedure,
Patterned first dry film 240 and patterned second dry film 340 are formed, and exposes the first crystal seed layer 230 of part respectively
And second crystal seed layer 330.Then, an electroplating process is carried out on the first crystal seed layer 230 and the second crystal seed layer 330 exposed,
To form one first conductive layer 250 and one second conductive layer 350 respectively on the first insulating layer 210 and the second insulating layer 310.
Then, Fig. 4 is refer to, places one first fixture 260 and one second fixture 360 respectively in patterned first dry film
240 and patterned second dry film 340 on.In the present embodiment, the first fixture 260 is located at least in 202 top of opening compact district,
And be not bonded with the first conductive layer 250, and the second fixture 360 is located at least in 302 top of opening compact district, and it is not conductive with second
Layer 350 is bonded.In one embodiment, the first fixture 260 can be more than or equal to the scope of opening compact district 202, and the second fixture 360
The scope of opening compact district 302 can be more than or equal to.Then, through etch process, the part do not covered by the first fixture 260 is removed
First conductive layer 250 and the second conductive layer of part 350 not covered by the second fixture 360, so that the first conductive layer 250 and second
Conductive layer 350 has a uniform thickness.
In the present embodiment, the first conductive layer 250 and the second conductive layer 350 can be controlled not by adjusting etching solution dosage
By the etch quantity of 360 shaded portions of the first fixture 260 and the second fixture.It should be noted that in the present embodiment, the first conductive layer
250 and second conductive layer 350 in addition to it can be removed by the first fixture 260 and 360 shaded portions of the second fixture, by first
The part of 260 and second fixture 360 of fixture masking can also be removed on a small quantity so that the first conductive layer 250 and the second conductive layer 350
In shielded area (corresponding roughly to opening compact district 202,302) and non-shielded area (corresponding roughly to opening puffs 204,304)
Between form a smooth interface.This is because to be only individually positioned in patterned first dry for the first fixture 260 and the second fixture 360
Without being bonded with the first conductive layer 250 and the second conductive layer 350 on film 240 and patterned second dry film 340, therefore, on a small quantity
The gap that can still penetrate into respectively between the first fixture 260 and the first conductive layer 250 of etching solution and the second fixture 360 and second lead
Gap between electric layer 350, and then a small amount of first conductive layer, 250 and second conductive layer 350 is removed by the first fixture 260 and second
The part that fixture 360 covers.
For example, Fig. 8 A~8D are refer to, it is etched that it shows that Fig. 4 paints circled according to some embodiments of the invention
Front and rear enlarged diagram, the first conductive layer 250 are denoted as a by the part that the first fixture 260 covers, not by the first fixture 260
The part of masking is denoted as b.It is etched before processing procedure, the thickness of non-shielded area b is more than the thickness of shielded area a, both differences
For H, as shown in Figure 8 A.It is etched after processing procedure, the thickness of non-shielded area b significantly reduces, the thickness of non-shielded area b and masking
The difference of the thickness of area a can have a case that it is different, as shown in Fig. 8 B~8D.In one embodiment, as shown in Figure 8 B, do not cover
Thickness of the thickness of area b still greater than shielded area a, both differences are H1.In another embodiment, as shown in Figure 8 C, non-shielded area b
Thickness close to the thickness of shielded area a, both differences are H2.In another embodiment, as in fig. 8d, non-shielded area b
Thickness is less than the thickness of shielded area a, both differences are H3.With the increase of etching solution dosage, the thickness of non-shielded area b and shielded area
The difference of the thickness of a reduces therewith so that H>H1>H2, wherein H>0、H1>0th, H2 >=0, and the dosage of etching solution can also increase to
So that the thickness of non-shielded area b is less than the thickness of shielded area a.It might be noted that as described above, be etched processing procedure it
Afterwards, the first conductive layer 250 (corresponds roughly to be open in shielded area a (corresponding roughly to opening compact district 202) with non-shielded area b
Puffs 204) between there is a smooth interface.However, it may be appreciated that specific structure is only used for depicted in Fig. 8 B~8D
It is bright, it is of the invention not for limiting.
After processing procedure is etched, the first fixture 260 and the second fixture 360 are then removed, and remove patterned first
Dry film 240 and patterned second dry film 340, and expose part the first crystal seed layer 230 and the second crystal seed layer 330 of lower section.
Then, through etch process, the first crystal seed layer 230 and the second crystal seed layer 330 exposed is removed, with the first insulating layer 210
And second form spaced multiple conductive components 280 and multiple conductive components 380 on insulating layer 310 respectively.Multiple conductions
Component 280 includes multiple first conductive components 281 and multiple second conductive components 282, respectively it is corresponding insert the first opening 220 and
In second opening 222, to be electrically connected the first of the first conducting block 200 of opening compact district 202 and opening puffs 204
Conducting block 200.Multiple conductive components 380 include multiple 3rd conductive components 381 and multiple 4th conductive components 382, right respectively
Should insert the 3rd opening 320 and the 4th opening 322 in, be electrically connected opening compact district 302 the second conducting block 300 and
Second conducting block 300 of opening puffs 304, as shown in Figure 5.
So far, the circuit board of one embodiment of the invention has been completed, by Fig. 5 it can be seen that, monolithic conductive component 280 and conductive part
Part 380 has a uniform thickness respectively, compared to the previously described prior art (as shown in Figure 1B), in the electricity of the present embodiment
In the plate of road, difference and the 4th conductive component between the thickness of the thickness of the second conductive component 282 and the first conductive component 281
Difference between the thickness of 382 thickness and the 3rd conductive component 381 substantially reduces, and reaches the lifting of monolithic conductive parts uniformity
Purpose.
Fig. 2~3, the section in 6~7 method of manufacturing circuit board interstage to be shown according to another embodiment of the present invention show
It is intended to.
It refer to Fig. 2, there is provided a substrate 100, it is with opposite a first surface 102 and a second surface 104.At this
In embodiment, substrate 100 can be made of resin material.On the first surface 102 and second surface 104 of substrate 100 respectively
A conductive layer (not illustrating) is formed, and passes through lithographic and etch process, patterned conductive layer, with first surface 102 and second
Spaced more first conducting blocks 200 and more second conducting blocks 300 are formed on surface 104 respectively.In the present embodiment, first
Conducting block 200 includes the first conducting block 200 of an opening compact district 202 and the first conducting block 200 of an opening puffs 204,
Second conducting block 300 includes the second conducting block 300 of an opening compact district 302 and the second conducting block of an opening puffs 304
300.Then, a pressure programming is carried out, it is exhausted to form one first respectively on the first surface 102 and second surface 104 of substrate 100
210 and 1 second insulating layer 310 of edge layer, to be covered each by the first conducting block 200 and the second conducting block 300.In the present embodiment,
First insulating layer 210 or the second insulating layer 310 can be made of ABF or PP materials.Then, a laser drill processing procedure is can pass through,
More first openings 220 and multiple second openings 222 are formed in the first insulating layer 210 to form opening compact district 202 and expose
First conducting block 200 of opening compact district and composition opening puffs 204 and the first conduction for exposing opening puffs 204
Block 200, and more 3rd openings 320 and multiple 4th openings 322 are formed to form opening compact district on the second insulating layer 310
302 and expose opening compact district 302 the second conducting block 300 and form opening puffs 304 and expose opening it is loose
Second conducting block 300 in area 304.After laser drill processing procedure is carried out, the step of glue residue can be removed, to remove laser drill
Residue (not illustrating) in the 320, the 4th opening 322 of first the 222, the 3rd opening of the 220, second opening of opening afterwards.
Fig. 3 is refer to, it is exhausted in the first insulating layer 210 and second through a deposition manufacture process (for example, electroless copper deposition processing procedure)
One first crystal seed (seed) layer 230 and one second crystal seed layer 330 are formed in edge layer 310 respectively, and extends respectively to the first opening
220th, in the 320, the 4th 322 (being shown in Fig. 2) of opening of the second 222 (being shown in Fig. 2) of opening and the 3rd opening.Then, first
One first dry film and one second dry film are formed on 230 and second crystal seed layer 330 of crystal seed layer.Then, through exposed and developed processing procedure,
Patterned first dry film 240 and patterned second dry film 340 are formed, and exposes the first crystal seed layer 230 of part respectively
And second crystal seed layer 330.Then, an electroplating process is carried out on the first crystal seed layer 230 and the second crystal seed layer 330 exposed,
To form one first conductive layer 250 and one second conductive layer 350 respectively on the first insulating layer 210 and the second insulating layer 310.
Then, Fig. 6 is refer to, one first photopolymer layer is formed on the first conductive layer 250 and patterned first dry film 240
270, and one second photopolymer layer 370 is formed on the second conductive layer 350 and patterned second dry film 340.In the present embodiment,
First photopolymer layer 270 is located at least in opening compact district 202 top and is bonded with the first conductive layer 250, and the second photopolymer layer 370 to
It is bonded less above opening compact district 302 and with the second conductive layer 350.Then, through etch process, remove not dry by first
The first conductive layer of part 250 that film layer 270 is covered and the second conductive layer of part 350 not covered by the second photopolymer layer 370, so that
First conductive layer 250 and the second conductive layer 350 have a uniform thickness.
In the present embodiment, the first conductive layer 250 and the second conductive layer 350 can be controlled not by adjusting etching solution dosage
By the etch quantity of 370 shaded portions of the first photopolymer layer 270 and the second photopolymer layer.It should be noted that in the present embodiment, first leads
250 and second conductive layer 350 of electric layer only can not gone by the part that the first photopolymer layer 270 and the second photopolymer layer 370 cover
Remove so that the first conductive layer 250 and the second conductive layer 350 are shielded area (corresponding roughly to opening compact district 202,302) and not
A vertical interface is formed between shielded area (corresponding roughly to opening puffs 204,304).This is because the first photopolymer layer 270 and
Second photopolymer layer 370 can fit closely the first conductive layer 250 and the second conductive layer 350, and therefore, etching solution does not penetrate into first and leads
The part that 250 and second conductive layer 350 of electric layer is covered by the first photopolymer layer 270 and the second photopolymer layer 370.Also therefore, this implementation
Example more accurately can control and estimate that the first conductive layer 250 and the second conductive layer 350 (correspond roughly to opening compact district in shielded area
202nd, the 302) thickness difference between non-shielded area (correspond roughly to opening puffs 204,304).
For example, Fig. 9 A~9D are refer to, it is etched that it shows that Fig. 6 paints circled according to some embodiments of the invention
Front and rear enlarged diagram, the first conductive layer 250 is denoted as a by the part that the first photopolymer layer 270 covers, not by the first photopolymer layer
The part of 270 maskings is denoted as b.It is etched before processing procedure, the thickness of non-shielded area b is more than the thickness of shielded area a, both are poor
It is worth for H ', as shown in Figure 9 A.Be etched after processing procedure, the thickness of non-shielded area b significantly reduces, the thickness of non-shielded area b with
The difference of the thickness of shielded area a can have a case that it is different, as shown in Fig. 9 B~9D.In one embodiment, as shown in Figure 9 B, not
Thickness of the thickness of shielded area b still greater than shielded area a, both differences are H ' 1.In another embodiment, as shown in Figure 9 C, do not hide
The thickness of area b is covered close to the thickness of shielded area a, both differences are H ' 2.In another embodiment, as shown in fig. 9d, do not cover
The thickness of area b is less than the thickness of shielded area a, both differences are H ' 3.With etching solution dosage increase, the thickness of non-shielded area b with
The difference of the thickness of shielded area a reduces therewith so that H '>H’1>H ' 2, wherein H '>0、H’1>0th, H ' 2 >=0, and the use of etching solution
Amount can also increase to so that the thickness of non-shielded area b is less than the thickness of shielded area a.It might be noted that as described above, carry out
After etch process, the first conductive layer 250 is in shielded area a (corresponding roughly to opening compact district 202) and non-shielded area b is (substantially
Corresponding to opening puffs 204) between there is a vertical interface.However, it may be appreciated that specifically tied depicted in Fig. 9 B~9D
Structure is merely to illustrate, of the invention not for limiting.
After processing procedure is etched, the first photopolymer layer 270 and the second photopolymer layer 370 are then removed, and remove patterned
First dry film 240 and patterned second dry film 340, and expose part the first crystal seed layer 230 and the second crystal seed layer of lower section
330.Then, through etch process, the first crystal seed layer 230 and the second crystal seed layer 330 exposed is removed, with the first insulating layer
210 and second spaced multiple conductive components 290 and multiple conductive components 390 are formed respectively on insulating layer 310.It is multiple to lead
Electrical components 290 includes multiple first conductive components 291 and multiple second conductive components 292, and correspondence inserts the first opening 220 respectively
And second in opening 222, to be electrically connected the of the first conducting block 200 of opening compact district 202 and opening puffs 204
One conducting block 200.Multiple conductive components 390 include multiple 3rd conductive components 391 and multiple 4th conductive components 392, respectively
It is corresponding to insert in the 3rd opening 320 and the 4th opening 322, the second conducting block 300 of opening compact district 302 is electrically connected
And the second conducting block 300 of opening puffs 304, as shown in Figure 7.
So far, the circuit board of another embodiment of the present invention has been completed, by Fig. 7 it can be seen that, monolithic conductive component 290 and conduction
Component 390 has a uniform thickness respectively, compared to the previously described prior art (as shown in Figure 1B), in the present embodiment
In circuit board, difference and the 4th conductive component between the thickness of the thickness of the second conductive component 292 and the first conductive component 291
Difference between the thickness of 392 thickness and the 3rd conductive component 391 substantially reduces, and reaches the lifting of monolithic conductive parts uniformity
Purpose.
Because of product functionality design factor, the design of interlayer conduction hole count is more and more and concentrates on plant crystalline region region, makes
Interlayer conduction hole count skewness is obtained, and then causes hole count compact district to produce conductive layer thickness after plating not with hole count puffs
Equal phenomenon.Method of manufacturing circuit board provided by the invention will be led by using fixture and photopolymer layer collocation image transfer mode
Regional etching is covered or carried out after covering in electric layer thickness lower region, and hole count compact district can be greatly reduced and led with hole count puffs
The drop of electric layer thickness, lifts the uniformity of conductive layer integral thickness.In the case of conductive layer thickness is uniform, follow-up line is carried out
When road is molded etch process, stable line width can be maintained, avoids line width unstable or has the situation of residue.It is conductive
After layer thickness homogeneity lifting, the stability of follow-up process such as encapsulation procedure also can be further lifted.In addition, carried through the present invention
The method of manufacturing circuit board of confession also can effectively control conductive layer thickness difference, and then accomplish fine rule road, micromation, reach control resistance
Value or the demand of impedance.
Embodiment presented below illustrates the difference of prior art circuits plate and circuit board provided by the invention：
The display of table 1 is manufactured using the circuit board of the manufacture of the prior art shown in Figure 1B and using method shown in Fig. 2~7 of the present invention
Difference of the circuit board on conductive layer (copper) thickness.As shown in Table 1, whether in CO sides or SO sides, compared to profit
The circuit board that the prior art shown in Figure 1B manufactures, the circuit board manufactured using method shown in Fig. 2~7 of the present invention, its entirety are led
The thickness difference of electric layer (copper) reduces, and the uniformity of conductive layer (copper) thickness is greatly improved.
Table 1
Although the present invention is disclosed above with several preferred embodiments, so it is not limited to the present invention, any affiliated
Have usually intellectual in technical field, without departing from the spirit and scope of the present invention, when can arbitrarily change and retouch,
Therefore protection scope of the present invention is when subject to appended claims institute defender.
Claims (18)
1. a kind of circuit board, including：
One substrate, has opposite a first surface and a second surface；
Multiple first conducting blocks, are spaced on the first surface of the substrate, wherein those first conducting blocks are opened including one
First conducting block of mouth compact district and the first conducting block of an opening puffs；
One first insulating layer, is arranged on the first surface of the substrate, and first insulating layer have multiple first opening and
The opening compact district and multiple second being made of those first openings are open and are somebody's turn to do by what those second openings were formed
Be open puffs, those first openings expose those first conducting blocks of the opening compact district and those second openings expose
Those first conducting blocks of the opening puffs；And
Multiple conductive components, are spaced on first insulating layer, those conductive components include：
Multiple first conductive components, corresponding to insert those the first openings, those to be electrically connected the opening compact district first are led
Electric block；And
Multiple second conductive components, corresponding to insert those the second openings, those to be electrically connected the opening puffs first are led
Electric block；
Wherein those conductive components have a uniform thickness.
2. circuit board as claimed in claim 1, the wherein thickness of those the second conductive components and those the first conductive components
The difference of thickness is -50~the 100% of the thickness of those the first conductive components.
3. circuit board as claimed in claim 1, wherein those second conductive components at those first conductive components one
Upper surface is a smooth interface or a vertical interface.
4. circuit board as claimed in claim 1, further includes：
Multiple second conducting blocks, are spaced on the second surface of the substrate, wherein those second conducting blocks are opened including one
Second conducting block of mouth compact district and the second conducting block of an opening puffs；
One second insulating layer, is arranged on the second surface of the substrate, and second insulating layer have multiple three opening and
The opening compact district and the multiple 4th being made of those the 3rd openings are open and are somebody's turn to do by what those the 4th openings were formed
Be open puffs, those the 3rd openings expose those second conducting blocks of the opening compact district and those the 4th openings expose
Those second conducting blocks of the opening puffs；And
Other multiple conductive components, are spaced on second insulating layer, which includes：
Multiple 3rd conductive components, corresponding to insert those the 3rd openings, those to be electrically connected the opening compact district second are led
Electric block；And
Multiple 4th conductive components, corresponding to insert those the 4th openings, those to be electrically connected the opening puffs second are led
Electric block；
Wherein other conductive components have a uniform thickness.
5. circuit board as claimed in claim 4, the wherein thickness of those the 4th conductive components and those the 3rd conductive components
The difference of thickness is -50~the 100% of the thickness of those the 3rd conductive components.
6. circuit board as claimed in claim 4, wherein those the 4th conductive components at those the 3rd conductive components one
Upper surface is a smooth interface or a vertical interface.
7. a kind of manufacture method of circuit board, including：
Spaced multiple first conducting blocks are formed on a first surface of a substrate, wherein those first conducting blocks include
First conducting block of one opening compact district and the first conducting block of an opening puffs；
One first insulating layer is formed on the first surface of the substrate；
Multiple first openings are formed in first insulating layer and form this to form the opening compact district and multiple second openings
Be open puffs, those first openings expose those first conducting blocks of the opening compact district and those second openings expose
Those first conducting blocks of the opening puffs；
Patterned first dry film is formed on first insulating layer, exposes those first openings and those second openings；
An electroplating process is carried out to form one first conductive layer；
One first fixture is placed on patterned first dry film, wherein first fixture is located at least in above the compact district,
And it is not bonded with first conductive layer；
An etch process is carried out, removes first conductive layer of part so that first conductive layer has a uniform thickness；
Remove first fixture；And
Patterned first dry film is removed, to form spaced multiple conductive components on first insulating layer.
8. the manufacture method of circuit board as claimed in claim 7, wherein those conductive components include：
Multiple first conductive components, corresponding to insert those the first openings, those to be electrically connected the opening compact district first are led
Electric block；And
Multiple second conductive components, corresponding to insert those the second openings, those to be electrically connected the opening puffs first are led
Electric block.
9. the manufacture method of circuit board as claimed in claim 8, the wherein thickness of those the second conductive components with those first
The difference of the thickness of conductive component is -50~the 100% of the thickness of those the first conductive components.
10. the manufacture method of circuit board as claimed in claim 7, further includes：
Spaced multiple second conducting blocks are formed on a second surface of the substrate relative to the first surface, wherein should
A little second conducting blocks include the second conducting block of an opening compact district and the second conducting block of an opening puffs；
One second insulating layer is formed on the second surface of the substrate；
Multiple 3rd openings are formed in second insulating layer and form this to form the opening compact district and multiple 4th openings
Be open puffs, those the 3rd openings expose those second conducting blocks of the opening compact district and those the 4th openings expose
Those second conducting blocks of the opening puffs；
Patterned second dry film is formed on second insulating layer, exposes those the 3rd openings and those the 4th openings；
An electroplating process is carried out to form one second conductive layer；
One second fixture is placed on patterned second dry film, wherein second fixture is located at least in above the compact district,
And it is not bonded with second conductive layer；
An etch process is carried out, removes second conductive layer of part so that second conductive layer has a uniform thickness；
Remove second fixture；And
Patterned second dry film is removed, to form other spaced multiple conductive parts on second insulating layer
Part.
11. the manufacture method of circuit board as claimed in claim 10, wherein other conductive components include：
Multiple 3rd conductive components, corresponding to insert those the 3rd openings, those to be electrically connected the opening compact district second are led
Electric block；And
Multiple 4th conductive components, corresponding to insert those the 4th openings, those to be electrically connected the opening puffs second are led
Electric block.
12. the manufacture method of circuit board as claimed in claim 11, the wherein thickness of those the 4th conductive components with those the
The difference of the thickness of three conductive components is -50~the 100% of the thickness of those the 3rd conductive components.
13. a kind of manufacture method of circuit board, including：
Spaced multiple first conducting blocks are formed on a first surface of a substrate, wherein those first conducting blocks include
First conducting block of one opening compact district and the first conducting block of an opening puffs；
One first insulating layer is formed on the first surface of the substrate；
Multiple first openings are formed in first insulating layer and form this to form the opening compact district and multiple second openings
Be open puffs, those first openings expose those first conducting blocks of the opening compact district and those second openings expose
Those first conducting blocks of the opening puffs；
Patterned first dry film is formed on first insulating layer, exposes those first openings and those second openings；
An electroplating process is carried out to form one first conductive layer；
One first photopolymer layer, wherein first photopolymer layer are formed on first conductive layer and patterned first dry film at least
It is bonded above the compact district and with first conductive layer；
An etch process is carried out, removes first conductive layer of part so that first conductive layer has a uniform thickness；With
And
First photopolymer layer and patterned first dry film are removed, it is spaced multiple to be formed on first insulating layer
Conductive component.
14. the manufacture method of circuit board as claimed in claim 13, wherein those conductive components include：
Multiple first conductive components, corresponding to insert those the first openings, those to be electrically connected the opening compact district first are led
Electric block；And
Multiple second conductive components, corresponding to insert those the second openings, those to be electrically connected the opening puffs first are led
Electric block.
15. the manufacture method of circuit board as claimed in claim 14, the wherein thickness of those the second conductive components with those the
The difference of the thickness of one conductive component is -50~the 100% of the thickness of those the first conductive components.
16. the manufacture method of circuit board as claimed in claim 13, further includes：
Spaced multiple second conducting blocks are formed on a second surface of the substrate relative to the first surface, wherein should
A little second conducting blocks include the second conducting block of an opening compact district and the second conducting block of an opening puffs；
One second insulating layer is formed on the second surface of the substrate；
Multiple 3rd openings are formed in second insulating layer and form this to form the opening compact district and multiple 4th openings
Be open puffs, those the 3rd openings expose those second conducting blocks of the opening compact district and those the 4th openings expose
Those second conducting blocks of the opening puffs；
Patterned second dry film is formed on second insulating layer, exposes those the 3rd openings and those the 4th openings；
An electroplating process is carried out to form one second conductive layer；
One second photopolymer layer, wherein second photopolymer layer are formed on second conductive layer and patterned second dry film at least
It is bonded above the compact district and with second conductive layer；
An etch process is carried out, removes second conductive layer of part so that second conductive layer has a uniform thickness；With
And
Second photopolymer layer and patterned second dry film are removed, it is spaced another to be formed on second insulating layer
A little multiple conductive components.
17. the manufacture method of circuit board as claimed in claim 16, wherein other conductive components include：
Multiple 3rd conductive components, corresponding to insert those the 3rd openings, those to be electrically connected the opening compact district second are led
Electric block；And
Multiple 4th conductive components, corresponding to insert those the 4th openings, those to be electrically connected the opening puffs second are led
Electric block.
18. the manufacture method of circuit board as claimed in claim 17, the wherein thickness of those the 4th conductive components with those the
The difference of the thickness of three conductive components is -50~the 100% of the thickness of those the 3rd conductive components.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105133996 | 2016-10-21 | ||
| TW105133996A TWI621379B (en) | 2016-10-21 | 2016-10-21 | Printed circuit board and methods for forming the same |
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| Publication Number | Publication Date |
|---|---|
| CN107979921A true CN107979921A (en) | 2018-05-01 |
| CN107979921B CN107979921B (en) | 2020-05-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611015886.2A Active CN107979921B (en) | 2016-10-21 | 2016-11-18 | Circuit board and method for manufacturing the same |
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| Country | Link |
|---|---|
| JP (1) | JP6494716B2 (en) |
| CN (1) | CN107979921B (en) |
| TW (1) | TWI621379B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1098268A (en) * | 1996-09-24 | 1998-04-14 | Oki Electric Ind Co Ltd | Method for plating columnar conductor and multi-layered printed wiring board obtained by it |
| JP2008088522A (en) * | 2006-10-04 | 2008-04-17 | Matsushita Electric Ind Co Ltd | Pattern-plating method |
| JP2008258483A (en) * | 2007-04-06 | 2008-10-23 | Hitachi Cable Ltd | Production method of printed wiring board |
| CN102986311A (en) * | 2010-07-08 | 2013-03-20 | Lg伊诺特有限公司 | The printed circuit board and the method for manufacturing the same |
| CN105791133A (en) * | 2014-12-17 | 2016-07-20 | 乐视致新电子科技（天津）有限公司 | Intelligent router and heat dissipation method of intelligent router |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW517502B (en) * | 1998-09-14 | 2003-01-11 | Ibiden Co Ltd | Printed circuit board and its manufacturing method |
| JP4056492B2 (en) * | 2004-04-23 | 2008-03-05 | 日本メクトロン株式会社 | Circuit board manufacturing method |
| JP2008135570A (en) * | 2006-11-28 | 2008-06-12 | Shinko Electric Ind Co Ltd | Method of manufacturing wiring board |
| JP2011124396A (en) * | 2009-12-11 | 2011-06-23 | Mitsubishi Paper Mills Ltd | Etching device and etching method |
| JP2015028986A (en) * | 2013-07-30 | 2015-02-12 | イビデン株式会社 | Printed wiring board and printed wiring board manufacturing method |
| JP2016171190A (en) * | 2015-03-12 | 2016-09-23 | イビデン株式会社 | Printed-wiring board for package-on-package |
-
2016
- 2016-10-21 TW TW105133996A patent/TWI621379B/en active
- 2016-11-18 CN CN201611015886.2A patent/CN107979921B/en active Active
-
2017
- 2017-09-26 JP JP2017184982A patent/JP6494716B2/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1098268A (en) * | 1996-09-24 | 1998-04-14 | Oki Electric Ind Co Ltd | Method for plating columnar conductor and multi-layered printed wiring board obtained by it |
| JP2008088522A (en) * | 2006-10-04 | 2008-04-17 | Matsushita Electric Ind Co Ltd | Pattern-plating method |
| JP2008258483A (en) * | 2007-04-06 | 2008-10-23 | Hitachi Cable Ltd | Production method of printed wiring board |
| CN102986311A (en) * | 2010-07-08 | 2013-03-20 | Lg伊诺特有限公司 | The printed circuit board and the method for manufacturing the same |
| CN105791133A (en) * | 2014-12-17 | 2016-07-20 | 乐视致新电子科技（天津）有限公司 | Intelligent router and heat dissipation method of intelligent router |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2018067706A (en) | 2018-04-26 |
| JP6494716B2 (en) | 2019-04-03 |
| CN107979921B (en) | 2020-05-08 |
| TW201817290A (en) | 2018-05-01 |
| TWI621379B (en) | 2018-04-11 |
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