CN107958874A - Multilayer insulation, the press device and preparation method for being used to prepare multilayer insulation - Google Patents
Multilayer insulation, the press device and preparation method for being used to prepare multilayer insulation Download PDFInfo
- Publication number
- CN107958874A CN107958874A CN201711218600.5A CN201711218600A CN107958874A CN 107958874 A CN107958874 A CN 107958874A CN 201711218600 A CN201711218600 A CN 201711218600A CN 107958874 A CN107958874 A CN 107958874A
- Authority
- CN
- China
- Prior art keywords
- mold cavity
- charging aperture
- glass
- base
- scraping wings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009413 insulation Methods 0.000 title claims abstract description 22
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 239000012212 insulator Substances 0.000 claims abstract description 22
- 239000000919 ceramic Substances 0.000 claims abstract description 19
- 239000011521 glass Substances 0.000 claims abstract description 19
- 239000000843 powder Substances 0.000 claims description 26
- 238000007790 scraping Methods 0.000 claims description 24
- 239000011241 protective layer Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 7
- 239000000428 dust Substances 0.000 claims description 7
- 239000002184 metal Substances 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 6
- 229910010293 ceramic material Inorganic materials 0.000 abstract description 3
- 238000007789 sealing Methods 0.000 abstract description 3
- 238000005336 cracking Methods 0.000 abstract description 2
- 238000004100 electronic packaging Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000000275 quality assurance Methods 0.000 description 1
- 238000012163 sequencing technique Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
- H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Press-Shaping Or Shaping Using Conveyers (AREA)
Abstract
The present invention relates to metal shell for electronic packaging field, a kind of multilayer insulation is provided, is used to prepare the press device and preparation method of multilayer insulation, prepare the insulator for forming two layers be made of ceramic material and glass material or multilayer, the ceramic layer on surface can improve insulator surface intensity, reduce or avoid cracking insulator surface because being acted on by external force, basic unit still uses glass, ensures insulator sealing performance.
Description
Technical field
The present invention relates to air-tightness technical field of electronic encapsulation, and in particular to a kind of multilayer insulation, be used to prepare multilayer
The press device and preparation method of insulator.
Background technology
In Electronic Packaging field, metal shell is the coat of electronic component, and leakproofness is one of its most basic technical indicator.When
The leakproofness of device is bad, and steam, oxygen etc. enter device inside, destroys the critical components such as chip, circuit, causes insulated electro
The deterioration of the performances such as resistance, leakage current, breakdown voltage, so as to influence the normal operation of electronic instrument or equipment, or even breaks down,
Cause equipment malfunction.The air-tightness of device is by metal shell guarantee, and the air-tightness of metal shell is to pass through insulator
Sealing-in quality assurance.Glass is one of common insulating materials of metal shell, but the shell after burning till by external force because being acted on
And cause glass insulator surface occasional to crack, cause device air tightness bad.For the problem, except from shell knot
Outside structure optimization design, can also be designed by optimization of material reduces the cracked tendency of metal shell insulator, generally use
The ceramic insulator of intensity higher substitutes glass insulator.But some situations must use glass insulator, not have also on the market
There is the product by glass insulator and ceramic insulator combination.Also, the production after combining glass insulator and ceramic insulator
Product preparation flow can also vary widely.
The content of the invention
The present invention provides a kind of multilayer insulation, is used to prepare the press device and preparation method of multilayer insulation, prepares
Go out the insulator that glass material and ceramic material can be combined.
In order to solve the above technical problems, the present invention adopts the following technical scheme that：
A kind of multilayer insulation, including glass-base, and it is compressed on the ceramics protection of glass-base upper surface and/or lower surface
Layer, the program can be formed two layers or the insulator of three-decker.
A kind of press device for being used to prepare multilayer insulation, including the compacting tool set with mold cavity, it is set in pressure
Molding jig upper end and the flitch being flush with it, and the scraping wings for covering mold cavity, can be moved back and forth on flitch,
The first charging aperture and second charging aperture for feeding alumina powder and glass dust respectively are offered on the scraping wings.
Further, the compacting tool set includes the cavity plate formed with mold cavity, is placed in the core bar at mold cavity center,
And the punch that is set on core bar, can be moved up and down along core bar direction in mold cavity.
Preferably, the compacting tool set further includes the press for being placed in punch lower end.
Preferably, the line direction of the first charging aperture and second charging aperture is conllinear with the direction of motion of scraping wings.
Preferably, the diameter of the first charging aperture and second charging aperture is less than the diameter of mold cavity.
A kind of sub- preparation method of multilayer insulation using above-mentioned press device, the multilayer insulation attached bag include glass-base,
And it is compressed on the first ceramic protective layer of glass-base lower surface and the second ceramic protective layer of upper surface, the preparation method
Include the following steps：
1）Alumina powder and glass dust are fed by the first charging aperture on scraping wings and second charging aperture respectively, wherein first
Feed inlet is set close to mold cavity；
2）Scraping wings is moved along covering mold cavity direction, successively part flows into the powder of first charging aperture and second charging aperture
Into mold cavity, and form the first ceramic protective layer and glass-base；
3）Scraping wings is returned and covers mold cavity, the powder of second charging aperture and first charging aperture is successively flowed into for the second time
In mold cavity and fill up, the second ceramic protective layer is formed on glass-base；
4）Press applies pressure to the powder in mold cavity, is pressed into multilayer base substrate；
5）By pusher sheet reset, press punch moves upwards, by powder idiosome ejection die cavity, is being suppressed base next time
During body, scraping wings releases base substrate, carries out follow-up dumping vitreous processing.
From above technical scheme, the surface of multilayer insulation of the present invention is ceramic material, and it is strong to improve insulator surface
Degree, reduces or avoids cracking insulator surface because being acted on by external force, and basic unit still uses glass, ensures that insulator is close
Sealing property.
The press device of the present invention uses two feed inlets, and alumina powder and glass dust are filled out in the reciprocating motion of scraping wings
Be charged to inside mold cavity, repressed formation multilayer base substrate, can consecutive production, production efficiency is high, and cost is low, has practical
Meaning.
The present invention provides brand-new green compact preparation process path for multilayer insulation, is designed by press structure, wraps
Feed gap dimension, quantity and the design of position are included, the powder of unlike material is entered in mold cavity, accurately controls different powders
The sequencing and quantity of entrance, and powder base substrate is disposably suppressed, then by processes such as dumping vitreous, form multilayer insulation
Son.
Brief description of the drawings
Fig. 1 is the structure diagram of multilayer insulation of the present invention；
Fig. 2 is the structure diagram of press device of the present invention；
Fig. 3-6 is the view of the three-layer insulated sub- preparation method of the present invention.
Embodiment
A kind of preferred embodiment of the present invention is described in detail below in conjunction with the accompanying drawings.
As shown in Fig. 2, being used to prepare the press device 10 of multilayer insulation, it includes the pressing die with mold cavity 21
Tool 20, the flitch 11 for being set in compacting tool set upper end and being flush with it, and for covering mold cavity, can going forward in flitch
The scraping wings 12 moved afterwards, the first charging aperture 121 that feeds alumina powder and glass dust respectively and the are offered on the scraping wings
Two feed inlets 122.
The line direction of the first charging aperture 121 and second charging aperture 122 is conllinear with the direction of motion of scraping wings, and the
One feed inlet and the diameter of second charging aperture are less than the diameter of mold cavity 21, easy to which the powder in feed inlet is put into mould type
Intracavitary.Scraping wings 12 is fitted closely with flitch 11, its movement line is fixed, due to compacting tool set upper end and the surface of flitch
Flush, therefore scraping wings can carry out mold cavity covering sealing, and certain pressure can be provided, meet pressing blank
When supporting role.
The compacting tool set 20 includes the cavity plate 22 formed with mold cavity, is placed in the core bar 23 at mold cavity center, with
And be set on core bar, can be along the punch 24 that core bar direction moves up and down in mold cavity.Core bar is in order to exhausted in multilayer
Through hole, the installation for complexed metal shell are formed among edge.The power of punch is carried by being arranged on the press of its lower end
Supply, press is conventional mechanical press structure, is to show in figure.
Multilayer insulation can be two layers, including glass basis and the ceramic protective layer for suppressing surface on it, also may be used
To be three layers or more than three layers, how three-layer insulated son and four layers of insulator and preparation method thereof are described individually below.
As shown in Figure 1, three-layer insulated attached bag includes glass-base 31, and it is compressed on the first ceramics of glass-base lower surface
Protective layer 32 and the second ceramic protective layer 33 of upper surface.
Three-layer insulated sub preparation method includes the following steps：
1）Alumina powder and glass dust are fed by the first charging aperture 121 on scraping wings and second charging aperture 122 respectively, its
Middle first charging aperture is set close to mold cavity 21, with reference to Fig. 2；
2）Scraping wings 12 is moved along covering mold cavity direction, the powder of first charging aperture and second charging aperture successively flow by part
Enter into mold cavity, and form the first ceramic protective layer 32 and glass-base 31, with reference to Fig. 3；
3）Scraping wings is returned and covers mold cavity, the powder of second charging aperture and first charging aperture is successively flowed into for the second time
In mold cavity and fill up, the second ceramic protective layer 33 is formed on glass-base, with reference to Fig. 4；
4）Press applies pressure to the powder in mold cavity, is pressed into multilayer base substrate 50, with reference to Fig. 5；
5）By pusher sheet reset, the punch 24 of press moves upwards, and powder idiosome ejection die cavity is pressed next time
During base body, scraping wings 12 releases base substrate, with reference to Fig. 6, then carries out follow-up dumping vitreous processing.
The present invention designs the size of control Glass body by high-precision mold, and base substrate is controlled by adjusting feed inlet quantity
In the unlike material powder quantity that includes, pass through feed inlet size and press pressing speed adjust the inflow mould type of different powders
Chamber quantity, controls the height and ratio of unlike material powder in multilayer base substrate, passes through the control multilayer base of the volume of mold cavity
The volume of body.
Embodiment described above is only that the preferred embodiment of the present invention is described, not to the model of the present invention
Enclose and be defined, on the premise of design spirit of the present invention is not departed from, technical side of the those of ordinary skill in the art to the present invention
The various modifications and improvement that case is made, should all fall into the protection domain that claims of the present invention determines.
Claims (7)
- A kind of 1. multilayer insulation, it is characterised in that including glass-base, and be compressed on glass-base upper surface and/or under The ceramic protective layer on surface.
- A kind of 2. press device for being used to prepare multilayer insulation, it is characterised in that including the compacting tool set with mold cavity, Compacting tool set upper end and the flitch being flush with it are set in, and for covering mold cavity, being moved back and forth on flitch Scraping wings, the first charging aperture and second charging aperture for feeding alumina powder and glass dust respectively are offered on the scraping wings.
- 3. press device according to claim 2, it is characterised in that the compacting tool set is included formed with mold cavity Cavity plate, the core bar for being placed in mold cavity center, and be set on core bar, can along core bar direction in mold cavity on move down Dynamic punch.
- 4. press device according to claim 3, it is characterised in that the compacting tool set, which further includes, is placed in punch lower end Press.
- 5. press device according to claim 2, it is characterised in that the line of the first charging aperture and second charging aperture Direction is conllinear with the direction of motion of scraping wings.
- 6. press device according to claim 2, it is characterised in that the diameter of the first charging aperture and second charging aperture Less than the diameter of mold cavity.
- 7. a kind of usage right requires the sub- preparation method of multilayer insulation of press device described in 2-6, it is characterised in that the multilayer Insulator includes glass-base, and is compressed on the first ceramic protective layer of glass-base lower surface and the second ceramics of upper surface Protective layer, the preparation method include the following steps：1）Alumina powder and glass dust are fed by the first charging aperture on scraping wings and second charging aperture respectively, wherein first Feed inlet is set close to mold cavity；2）Scraping wings is moved along covering mold cavity direction, successively part flows into the powder of first charging aperture and second charging aperture Into mold cavity, and form the first ceramic protective layer and glass-base；3）Scraping wings is returned and covers mold cavity, the powder of second charging aperture and first charging aperture is successively flowed into for the second time In mold cavity and fill up, the second ceramic protective layer is formed on glass-base；4）Press applies pressure to the powder in mold cavity, is pressed into multilayer base substrate；5）By pusher sheet reset, press punch moves upwards, by powder idiosome ejection die cavity, is being suppressed base next time During body, scraping wings releases base substrate, carries out follow-up dumping vitreous processing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711218600.5A CN107958874A (en) | 2017-11-28 | 2017-11-28 | Multilayer insulation, the press device and preparation method for being used to prepare multilayer insulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711218600.5A CN107958874A (en) | 2017-11-28 | 2017-11-28 | Multilayer insulation, the press device and preparation method for being used to prepare multilayer insulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107958874A true CN107958874A (en) | 2018-04-24 |
Family
ID=61962309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711218600.5A Pending CN107958874A (en) | 2017-11-28 | 2017-11-28 | Multilayer insulation, the press device and preparation method for being used to prepare multilayer insulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107958874A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111128486A (en) * | 2019-12-18 | 2020-05-08 | 合肥圣达电子科技实业有限公司 | Roundness control method for pressed glass insulator |
| CN114823928A (en) * | 2022-04-26 | 2022-07-29 | 中国电子科技集团公司第四十三研究所 | Photoelectric packaging shell and manufacturing process thereof |
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|---|---|---|---|---|
| JPS4949200A (en) * | 1972-09-19 | 1974-05-13 | ||
| JPH04101808A (en) * | 1990-08-21 | 1992-04-03 | Goto Tekkosho:Kk | Feeding device of powdered feedstock of multilayer tile |
| JPH06116422A (en) * | 1992-10-06 | 1994-04-26 | Daifuku Seishi Kk | Glass fiber-reinforced resin composite material and production of laminate |
| CN200977696Y (en) * | 2006-08-15 | 2007-11-21 | 上海材料研究所 | Automatic pressing and forming die for electric insulating ceramic member |
| CN102024534A (en) * | 2009-09-09 | 2011-04-20 | 刘铁林 | Insulator with diamond protective layer and production method thereof |
| CN201910304U (en) * | 2010-12-03 | 2011-07-27 | 贵州建新南海科技股份有限公司 | Mould pressing device for porcelain insulator blanks |
| CN102189702A (en) * | 2011-02-25 | 2011-09-21 | 聂忠海 | Material compressor and material compression method |
| CN103802351A (en) * | 2014-03-03 | 2014-05-21 | 吉林大学 | Automatic pressing machine |
| CN205621525U (en) * | 2016-04-29 | 2016-10-05 | 济南市半导体元件实验所 | Compound insulator of glass -ceramic encapsulation shell |
| CN205920835U (en) * | 2016-08-31 | 2017-02-01 | 广州华荣中天模具有限公司 | Lightning -proof insulator column type die mould |
| CN106660293A (en) * | 2014-05-05 | 2017-05-10 | 吉凯恩粉末冶金工程有限公司 | Apparatus for producing a blank, also a method for this purpose and a blank |
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2017
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Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4949200A (en) * | 1972-09-19 | 1974-05-13 | ||
| JPH04101808A (en) * | 1990-08-21 | 1992-04-03 | Goto Tekkosho:Kk | Feeding device of powdered feedstock of multilayer tile |
| JPH06116422A (en) * | 1992-10-06 | 1994-04-26 | Daifuku Seishi Kk | Glass fiber-reinforced resin composite material and production of laminate |
| CN200977696Y (en) * | 2006-08-15 | 2007-11-21 | 上海材料研究所 | Automatic pressing and forming die for electric insulating ceramic member |
| CN102024534A (en) * | 2009-09-09 | 2011-04-20 | 刘铁林 | Insulator with diamond protective layer and production method thereof |
| CN201910304U (en) * | 2010-12-03 | 2011-07-27 | 贵州建新南海科技股份有限公司 | Mould pressing device for porcelain insulator blanks |
| CN102189702A (en) * | 2011-02-25 | 2011-09-21 | 聂忠海 | Material compressor and material compression method |
| CN103802351A (en) * | 2014-03-03 | 2014-05-21 | 吉林大学 | Automatic pressing machine |
| CN106660293A (en) * | 2014-05-05 | 2017-05-10 | 吉凯恩粉末冶金工程有限公司 | Apparatus for producing a blank, also a method for this purpose and a blank |
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| CN205920835U (en) * | 2016-08-31 | 2017-02-01 | 广州华荣中天模具有限公司 | Lightning -proof insulator column type die mould |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111128486A (en) * | 2019-12-18 | 2020-05-08 | 合肥圣达电子科技实业有限公司 | Roundness control method for pressed glass insulator |
| CN111128486B (en) * | 2019-12-18 | 2021-12-17 | 合肥圣达电子科技实业有限公司 | Roundness control method for pressed glass insulator |
| CN114823928A (en) * | 2022-04-26 | 2022-07-29 | 中国电子科技集团公司第四十三研究所 | Photoelectric packaging shell and manufacturing process thereof |
| CN114823928B (en) * | 2022-04-26 | 2024-02-20 | 中国电子科技集团公司第四十三研究所 | Photoelectric packaging shell and manufacturing process thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180424 |