CN107949185A - The small-sized reflow soldering furnace of intelligent control - Google Patents
The small-sized reflow soldering furnace of intelligent control Download PDFInfo
- Publication number
- CN107949185A CN107949185A CN201711192176.1A CN201711192176A CN107949185A CN 107949185 A CN107949185 A CN 107949185A CN 201711192176 A CN201711192176 A CN 201711192176A CN 107949185 A CN107949185 A CN 107949185A
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- China
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- module
- reflow soldering
- control module
- control
- small
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A kind of small-sized reflow soldering furnace of intelligent control, belongs to reflow soldering furnace field, it is characterised in that:Including control module, temperature detecting module, Signal-regulated kinase, power driver module, heating unit, display module, wind turbine drive module, air circulation device, air exhausting device, cooling device, system power supply and keyboard;The keyboard is electrically connected with control module;The display module is electrically connected with control module;The temperature detecting module is connected after Signal-regulated kinase with control module;The control module is connected after power driver module with heating unit;The wind turbine drive module is connected with control module;The system power supply is connected with control module.Ensure the speed of reflow soldering temperature rising and the stability of temperature value by small-sized reflow soldering, the real-time effectively control to reflow soldering process is realized, so as to efficiently solve the problems, such as SMT Reflow Soldering product quality defects.
Description
Technical field
The invention belongs to the small-sized reflow soldering furnace in reflow soldering furnace field, more particularly to a kind of intelligent control.
Background technology
With the rapid development of electronic industry, high integration, high reliability have become the new trend of industry.It is this become
Under the promotion of gesture, SMT(Surface mounting technology)Further popularization and development are obtained.Nowadays the company of electronics industry is producing
With SMT techniques and Surface Mount Component are largely applied in research and development(SMC/SMD).Therefore, welding process is also with regard to nothing
What method avoided largely uses reflow machine.
The content of the invention
A kind of the present invention is intended to provide small-sized reflow soldering furnace for the intelligent control saved cost, shorten the production cycle.
The small-sized reflow soldering furnace of intelligent control of the present invention, including control module, temperature detecting module, signal tune
Manage module, power driver module, heating unit, display module, wind turbine drive module, air circulation device, air exhausting device, cooling
Device, system power supply and keyboard;The keyboard is electrically connected with control module;The display module is mutually electrically connected with control module
Connect;The temperature detecting module is connected after Signal-regulated kinase with control module;The control module is through power drive mould
It is connected after block with heating unit;The wind turbine drive module is connected with control module;The wind turbine drive module respectively with
Air circulation module, air exhausting device go device to be connected with cold;The system power supply is connected with control module.
The small-sized reflow soldering furnace of intelligent control of the present invention, the display module are dot matrix LCD display.
The small-sized reflow soldering furnace of intelligent control of the present invention, the display are ST7920.
The small-sized reflow soldering furnace of intelligent control of the present invention, the control module are STC12C5A60S2 monolithics
Machine.
The small-sized reflow soldering furnace for the intelligent control that the present invention states, the heating unit use infrared heating.
The small-sized reflow soldering furnace for the intelligent control that the present invention states, is ensured in reflow soldering temperature by small-sized reflow soldering
The speed and the stability of temperature value risen, realizes the real-time effectively control to reflow soldering process, is returned so as to efficiently solve SMT
Fluid welding product quality defect problem.Effectively reduce SMT processing in caused by reflow soldering equipment is bad mass defect.
Embodiment
The small-sized reflow soldering furnace of intelligent control of the present invention, including control module, temperature detecting module, signal tune
Manage module, power driver module, heating unit, display module, wind turbine drive module, air circulation device, air exhausting device, cooling
Device, system power supply and keyboard;The keyboard is electrically connected with control module;The display module is mutually electrically connected with control module
Connect;The temperature detecting module is connected after Signal-regulated kinase with control module;The control module is through power drive mould
It is connected after block with heating unit;The wind turbine drive module is connected with control module;The wind turbine drive module respectively with
Air circulation module, air exhausting device go device to be connected with cold;The system power supply is connected with control module.
The small-sized reflow soldering furnace of intelligent control of the present invention, the display module are dot matrix LCD display.It is described
Display is ST7920.The control module is STC12C5A60S2 microcontrollers.The heating unit uses infrared heating.Reflux
Brazier is in order to ensure in-furnace temperature with welding the suiting, it is necessary in due course detection in-furnace temperature and drive heating unit to improve of curve
Temperature or pass through cooling device, cooling device cool down.The whole process of measurement in to(for) temperature, compare and to perform composition complete
Closed-loop system.Therefore PID control method is used during control, the actual value of controlled variable-temperature in furnace chamber is carried out
Measurement, and compared with the temperature curve setting value for welding the moment, the response of control system is corrected with this deviation, performs tune
Section control.PID controller is by proportional unit(P), integral unit(I)And differentiation element(D)Composition.
The extraneous various disturbances for in-furnace temperature constantly produce, and are kept to reach control system for certain moment temperature value
Constant purpose, control system must constantly carry out temperature survey and gradient of temperature.When external disturbance so that temperature value occurs
Change, detector unit are sent to microcontroller after just slight change is gathered through signal conditioning circuit, and microcontroller is controlled as PID
Core processed, deviation is obtained by detected value compared with predetermined temperature value, and adjuster is by this deviation and pre- with us
The setting parameter control law first set sends control signal, goes to change the aperture of adjuster, is allowed to increase or decrease, that is, drives
Heating unit improves temperature or is cooled down by cooling device, cooling device.So that the temperature value in furnace chamber changes, and
It is intended to set-point, so as to reach control purpose.In short, the essence of PID is exactly that ratio, integration, differential fortune are carried out to deviation
Calculate, the process of execution unit is controlled according to operation result.Temperature sensor can be adopted by respective algorithms inside microcontroller
As current input, then and setting value carries out subtracting each other to obtain deviation, then PID arithmetic is carried out to deviation and produces output knot for sample input
Fruit, the time of last control timer and then control heater.In order to facilitate change pid control parameter, accelerate tuning parameter
Efficiency, after closed-loop control is entered, carries out parameter state setting by matrix press-key, temporarily exits closed-loop control at this time;Then lead to
Cross button and set the parameters such as KP, TI, TD respectively, after the completion of new parameter setting, program is again introduced into closed loop states work.It is single
Piece machine minimum system selects macrocrystalline(STC)Company's STC12C5A60S2 microcontrollers integrate MAX810 as core, the chip internal
Special reset circuit, 2 road PWM, 8 road 10-bit high speed A/D conversion, controls, strong jamming occasion for motor.Due to the single chip microcomputer
ADC is inside carried, pwm circuit, enormously simplify the design of whole system circuit.Single-chip minimum system include microcontroller, power supply,
Reset circuit (being resetted containing electrification reset and button) and clock circuit.Crystal oscillator selects 12MHz when design is implemented, and reset uses button
Reset mode, easy to use and debugging.In addition, be connected to keyboard in basic hardware system, LCD, the external equipment such as ISP interfaces,
While reflow soldering furnace basic function is ensured, system work efficiency is improved by Optimization Design of Electronic Circuits.
Accuracy, the real-time of the adjusting of temperature are a reflow soldering quality criticals, this partial circuit includes furnace chamber liter
Heater circuit necessary to temperature and the air circulation needed for cooling and cooling circuit.Influenced by mesa structure, in heating side
Face the design reflow soldering is respectively had some infrared using infrared heating and the cooperative mode of hot air convection in upper and lower heating zone
Heating tube and the high-speed rotating impeller of a motor driving, produce the blowing force of air, after the heated pipe heating of air, from porous plate
In be blown out on pcb board.Motor rotary speed is faster, and wind-force is bigger, and heat-exchange capacity is stronger.Pcb board will enter after reflow soldering
Cooling zone is cooled down, and so can just obtain good welding effect.The structure of cooling zone is the heat exchanger of a water circulation.
After hot gas is blown to Heat Exchanger in Circulating Water System by cooling fan, the gas through cooling is blown on pcb board again.Heat warp in heat exchanger
Recirculated water is taken away, and recirculated water flows back to heat exchanger again after cooling.Display circuit selects 12864 dot matrix of ST7920 control cores
LCD display.The Design of Communication Interface of LCD and MCU can use direct or indirect access mode.Microcontroller passes through I/O mouthfuls
It is connected in parallel with STC12C5A60S2.
Claims (5)
- A kind of 1. small-sized reflow soldering furnace of intelligent control, it is characterised in that:Including control module, temperature detecting module, signal It is conditioning module, power driver module, heating unit, display module, wind turbine drive module, air circulation device, air exhausting device, cold But device, system power supply and keyboard;The keyboard is electrically connected with control module;The display module is mutually electrically connected with control module Connect;The temperature detecting module is connected after Signal-regulated kinase with control module;The control module is through power drive mould It is connected after block with heating unit;The wind turbine drive module is connected with control module;The wind turbine drive module respectively with Air circulation module, air exhausting device go device to be connected with cold;The system power supply is connected with control module.
- 2. the small-sized reflow soldering furnace of intelligent control according to claim 1, it is characterised in that:The display module is point Battle array LCD display.
- 3. the small-sized reflow soldering furnace of intelligent control according to claim 2, it is characterised in that:The display is ST7920。
- 4. the small-sized reflow soldering furnace of intelligent control according to claim 3, it is characterised in that:The control module is STC12C5A60S2 microcontrollers.
- 5. the small-sized reflow soldering furnace for the intelligent control stated according to claim 4, it is characterised in that:The heating unit is using red External heat.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201711192176.1A CN107949185A (en) | 2017-11-24 | 2017-11-24 | The small-sized reflow soldering furnace of intelligent control |
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Application Number | Priority Date | Filing Date | Title |
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CN201711192176.1A CN107949185A (en) | 2017-11-24 | 2017-11-24 | The small-sized reflow soldering furnace of intelligent control |
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Publication Number | Publication Date |
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CN107949185A true CN107949185A (en) | 2018-04-20 |
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CN201711192176.1A Withdrawn CN107949185A (en) | 2017-11-24 | 2017-11-24 | The small-sized reflow soldering furnace of intelligent control |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117577562A (en) * | 2024-01-15 | 2024-02-20 | 北京仝志伟业科技有限公司 | Vacuum device for chip packaging |
-
2017
- 2017-11-24 CN CN201711192176.1A patent/CN107949185A/en not_active Withdrawn
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117577562A (en) * | 2024-01-15 | 2024-02-20 | 北京仝志伟业科技有限公司 | Vacuum device for chip packaging |
CN117577562B (en) * | 2024-01-15 | 2024-04-16 | 北京仝志伟业科技有限公司 | Vacuum device for chip packaging |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180420 |
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WW01 | Invention patent application withdrawn after publication |