CN107948913B - Processing method of sound film assembly, sound film assembly and micro loudspeaker - Google Patents

Processing method of sound film assembly, sound film assembly and micro loudspeaker Download PDF

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Publication number
CN107948913B
CN107948913B CN201711419913.7A CN201711419913A CN107948913B CN 107948913 B CN107948913 B CN 107948913B CN 201711419913 A CN201711419913 A CN 201711419913A CN 107948913 B CN107948913 B CN 107948913B
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heat conducting
voice
voice coil
sound
mold
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CN107948913A (en
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姜鑫
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Xiamen Tuness Electronic Co ltd
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Xiamen Tuness Electronic Co ltd
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/003Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02Details
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06Loudspeakers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2231/00Details of apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor covered by H04R31/00, not provided for in its subgroups
    • H04R2231/001Moulding aspects of diaphragm or surround
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00Loudspeakers
    • H04R2400/11Aspects regarding the frame of loudspeaker transducers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

The invention provides a processing method of a sound film assembly, the sound film assembly and a micro loudspeaker. A processing method of a voice diaphragm assembly, the voice diaphragm assembly comprises a voice diaphragm and a voice coil arranged on the voice diaphragm, and the processing method is characterized by comprising the steps of arranging the voice coil on a heat conducting die; placing a voice film sheet above the voice coil, and heating a heat conducting mold to 90-110 ℃; applying air pressure to the upper surface of the voice film sheet to completely attach the voice coil and the heat conducting mold, and heating the heat conducting mold to 170-180 ℃; cooling the heat conducting mould to solidify the sound film sheet on the sound ring to form the sound film assembly; separating the voice diaphragm assembly from the heat conducting mold. The sound film is firmly attached to the sound ring in a thermoplastic mode and cannot be separated from the sound ring.

Description

Processing method of sound film assembly, sound film assembly and micro loudspeaker
Technical Field
The invention relates to the field of loudspeaker manufacturing, in particular to a processing method of a sound film assembly, the sound film assembly and a micro loudspeaker.
Background
The vibrating diaphragm of the existing micro loudspeaker adopts the mode that glue is adhered to the voice coil, and the voice coil is located below the voice diaphragm. Because voice coil loudspeaker voice coil and vibrating diaphragm are small and exquisite, bond exquisite, all need lean on the manual work to glue at present. Because the consistency of the glue is difficult to ensure, the serious failure state that the coil and the sound film fall off easily occurs after long-time work, which causes that the prior production method has low automation rate and high production cost and also causes the product of the micro-speaker to be unstable.
Disclosure of Invention
The invention aims to solve the problems that when a loudspeaker works for a long time, a product cannot work and the service life is reduced due to the fact that a voice coil and a sound film fall off.
A processing method of a sound film assembly, the sound film assembly and a micro-speaker are provided.
The invention is realized by the following steps:
a processing method of a voice diaphragm assembly comprises a voice diaphragm and a voice coil arranged on the voice diaphragm. The processing method comprises the following steps:
s1: the voice coil is configured on the heat conduction mold.
S2: a voice film sheet is placed over the voice coil and a thermally conductive mold is heated to 90 to 110 degrees celsius.
S3: applying air pressure to the upper surface of the voice film sheet to completely attach the voice coil and the heat conducting mold, and heating the heat conducting mold to 170-180 ℃.
S4: and cooling the heat conduction mould to solidify the sound film sheet on the sound ring to form the sound film assembly.
And S5, separating the voice film assembly from the heat conducting mold.
In a preferred embodiment of the present invention,
further, in step S3, a heat conducting mold is covered by a sealed air hood, and the sound diaphragm sheet is blown from the top of the sealed air hood and pressurized to 0.5 to 0.8 MPa.
Further, the time for blowing and pressurizing to 0.5-0.8 MPa is 2.5-4.5 minutes.
Further, be equipped with at least one first exhaust hole and at least one second exhaust hole on the heat conduction mould, first exhaust hole set up in the middle part of heat conduction mould, the second exhaust hole set up in the edge portion of heat conduction mould.
Further, in step S1, the voice coil is disposed on the heat conducting mold after the heat conducting mold is controlled to be preheated to 65-85 ℃.
Further, in step S1, the lead of the voice coil is placed next to the surface of the heat conductive mold.
Further, an annular groove for forming the diaphragm with the folded ring portion is formed on the surface of the heat conducting mold, and in step S1, the lead of the voice coil is placed close to the surface of the annular groove.
Further, in step S4, the heat conducting mold is cooled to 65-85 degrees celsius by using a cold water circulation.
The invention also provides a voice film component, which comprises a voice coil and a voice film, wherein the voice coil comprises a coil and a lead wire, and the lead wire is connected with the coil.
The sound film comprises an annular groove part, a central part and a folded ring part; the folded ring part is connected to the periphery of the central part, and the annular groove part is formed by mutually sinking the connecting part of the central part and the folded ring part.
The coil is embedded in the groove of the annular groove part and is in thermoplastic connection with the annular groove part.
The invention also provides a sound film assembly, which comprises the base frame, the magnetic circuit unit and the sound film assembly produced by the method.
The magnetic circuit unit is located in the base frame, the magnetic circuit unit comprises a magnet, a pole core supported on the upper surface of the magnet, and a magnetic yoke which is connected to the lower surface of the magnet and is provided with a magnetic gap with the outer peripheral surface of the pole core, the voice film assembly is arranged on the base frame, and the coil of the voice coil is located in the magnetic gap between the pole core and the magnetic yoke.
The invention has the beneficial effects that: the sound film component produced by the method has the advantages that the sound film is firmly attached to the sound ring and cannot be separated. And the temperature of the die is controlled, so that the sound film is uniformly distributed, the original thickness of the sound film sheet is not damaged, and the material quality is not influenced.
In the sound diaphragm assembly of the present invention, the annular groove portion of the sound diaphragm is formed by recessing the joint between the central portion and the folded ring portion. And the coil is embedded in the groove of the annular groove part and is in thermoplastic connection with the sound film of the annular groove part. Make and combine closely between voice coil loudspeaker voice coil and the sound membrane, even the product is long-time work, the condition that voice coil loudspeaker voice coil and sound membrane drop can not appear yet.
In the micro-speaker, the coil of the voice coil is arranged in the magnetic gap between the pole core and the magnetic yoke, so that the magnetic circuit unit and the voice coil are cooperated, and the voice coil is vibrated by Lorentz force to generate sound when being electrified so as to carry out pronunciation work. And because the method provided by the invention is used, the voice coil and the sound film are tightly combined, and the situation that the voice coil and the sound film fall off can not occur even if the product works for a long time.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural view of a processing mold of a processing method of a sound diaphragm assembly according to a first embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a diaphragm assembly according to a second embodiment of the present invention;
FIG. 3 is a schematic view of the sound diaphragm of FIG. 2;
FIG. 4 is a cross-sectional view of the diaphragm assembly of FIG. 3 taken along the line A-A;
FIG. 5 is a schematic diagram of the lead and coil of FIG. 2;
fig. 6 is a schematic structural diagram of a micro-speaker according to a first embodiment of the present invention;
fig. 7 is an exploded schematic view of the micro-speaker of fig. 6.
Icon:
the voice diaphragm assembly 1, the coil 10, the lead wire 20, the bent portion 21, the linear portion 22, the voice diaphragm 30, the annular groove portion 31, the center portion 32, the folded ring portion 33, the composite flat plate 40,
Pedestal 3, magnet 4, pole piece 5, yoke 6, heat conducting mold 7, annular groove 71, sealed gas hood 8, voice coil 9, sound diaphragm sheet 91.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings of the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the equipment or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the case of the example 1, the following examples are given,
a processing method of a sound film component.
The voice diaphragm assembly comprises a voice diaphragm and a voice coil 9 arranged on the voice diaphragm, and the processing method comprises the following steps:
s1: the heat conductive mold is preheated to 80 degrees centigrade, and then the voice coil 9 is arranged on the heat conductive mold and fixed.
Wherein, the preferred scope to the preheating temperature of heat conduction mould is 65 to 85 degrees centigrade, avoids heating temperature too high, and voice coil 9 contacts too high temperature suddenly and leads to splitting, and preheating temperature is crossed lowly, increases the time of stroke, additionally increases the time cost. In this embodiment, the selected preheating temperature is 80 ℃, the temperature is moderate, and the worker can not scald his hands due to the overhigh temperature in the next step, which is not beneficial to the continuous work of the worker.
S2: a voice film sheet 91 is placed over the voice coil 9, and the heat conducting mold is heated to 100 degrees celsius.
Referring to fig. 1, the heating of the heat conducting mold can soften the sound diaphragm sheet 91, and after the sound diaphragm sheet 91 is softened, the next process is conveniently performed to make the sound diaphragm sheet 91 plastic. Wherein, the preferable temperature range for heating the heat conduction mold is 90 to 110 ℃. In this temperature range, the sound diaphragm sheet 91 just softens to the extent necessary for deformation.
S3: applying air pressure to the upper surface of the voice diaphragm sheet 91 to completely attach the voice coil 9 to the heat conducting mold, and heating the heat conducting mold to 180 ℃.
The voice diaphragm sheet 91 is controlled by air pressure to change the shape, and the heat conducting mold is heated to 180 ℃, so that the voice diaphragm sheet 91 is fully contacted with the voice coil 9 and the surface of the heat conducting mold, and thermoplastic connection is performed. Thereby ensuring the bonding performance between the voice diaphragm sheet 91 and the voice coil 9.
It should be noted that the effect of increasing the air pressure and heating the heat conducting mold simultaneously is better. And the heat conducting mold is heated to the final threshold preferably in the range of 170 degrees to 180 degrees. At this temperature, the sound film is uniformly distributed in the thermoplastic process without damaging the original thickness of the sound film sheet 91.
As a method for further promoting the sound film to be uniformly distributed in the thermoplastic process, a heat conducting mold is covered by a closed air hood 8, and the sound film sheet 91 is blown from the top of the closed air hood 8 and pressurized to 0.5-0.8 MPa. The shape of the acoustic diaphragm sheet 91 is changed by an appropriate air pressure without destroying the shape.
In combination with the above, the time period for blowing and pressurizing to 0.5-0.8 MPa is 2.5-4.5 minutes. The reasonable pressure increases the strength, which is beneficial to the process of changing the shape of the sound membrane sheet 91 to be more orderly.
It should be noted that, in order to achieve sufficient contact between the voice coil 9 and the surface of the heat conducting mold and the sound diaphragm sheet 91, the middle portion may be blown first, and then the air may be blown outward.
In this embodiment, the effect of controlling the gas flow path is achieved by providing a first vent hole and a second vent hole on the heat conducting mold, wherein the first vent hole is provided in the middle of the heat conducting mold, i.e. in the voice coil 9. Air in the voice coil 9 can be discharged in the blowing process, and the sound film sheet 91 is completely attached to the surface of the heat conduction mold in the voice coil 9 to manufacture a proper sound film shape.
The second exhaust hole is arranged at the edge part of the heat conduction mould, namely outside the voice coil 9. Is favorable for proper exhaust and guides the direction of airflow.
S4: and cooling the heat conducting die to solidify the voice film sheet 91 on the voice coil 9 to form the voice film assembly.
In this embodiment, the heat conducting mold is cooled to 65-85 ℃ by a cold water circulation method. At this point, the diaphragm sheet 91 has been thermoformed into shape and the voice coil 9 is wrapped to form the diaphragm assembly. And cooling the heat conduction mold to 65-85 ℃ by utilizing cold water circulation, so that the time cost is reduced.
And S5, separating the voice film assembly from the heat conducting mold.
Typically, in a loudspeaker, the voice coil 9 is below the diaphragm. Therefore, the leads on the two sides of the voice coil 9 are in a suspended state, and when the loudspeaker works, along with the vibration of the sound film, the positions of the leads are relatively lifted, the state is changed, abnormal sound of a flapping stroke is easily generated, and the leads are broken when the abnormal sound is serious, so that the function of the loudspeaker is disabled, and the service life of the miniature loudspeaker is shortened.
To solve this problem, further, the surface of the heat conducting mold is provided with an annular groove 71 for molding the diaphragm with a folded ring portion, and in step S1, the lead wire of the voice coil 9 is placed next to the surface of the annular groove 71.
Through the step, the lead is attached to the bending ring part in a thermoplastic mode. When the loudspeaker works, the lead wire vibrates along with the sound film to carry out integral vibration, so that the phenomenon of breakage in vibration caused by suspension of the lead wire is avoided, and the service life of a product is prolonged.
In addition, the sound film component can be cut according to the requirement so as to be installed on the loudspeaker properly.
According to the needs, the sound membrane component can be pasted with a flat plate material, wherein the flat plate material is a composite flat plate 40, and the high-frequency performance is improved.
Please refer to fig. 6 and fig. 7. The invention also provides a micro loudspeaker with the sound film assembly manufactured by the method.
The micro-speaker includes a base frame 3, a magnetic circuit unit, and a voice diaphragm assembly produced as described above.
The magnetic circuit unit is located in the base frame, the magnetic circuit unit comprises a magnet 4, a pole core 5 supported on the upper surface of the magnet, and a magnetic yoke 6 connected to the lower surface of the magnet 4 and having a magnetic gap with the outer peripheral surface of the pole core 5, the voice coil 9 assembly is arranged on the base frame 3, and the coil of the voice coil 9 is located in the magnetic gap between the pole core 5 and the magnetic yoke 6.
In the micro-speaker of the present invention, the coil of the voice coil 9 is disposed in the magnetic gap between the pole piece 5 and the yoke 6, so that the magnetic circuit unit cooperates with the voice coil 9, and the voice coil 9 vibrates by the lorentz force when energized to generate sound, thereby performing sound generation. And because the method provided by the invention is used, the voice coil 9 and the sound film sheet 91 are tightly combined, and the situation that the voice coil 9 and the sound film fall off can not occur even if the product works for a long time.
Example 2
The device provided by the embodiment 2 of the invention has the same realization principle and the same technical effect as the sound film assembly produced by the method of the embodiment 1.
A voice diaphragm assembly comprises a voice coil and a voice diaphragm 30, wherein the voice coil comprises a coil 10 and a lead wire 20, and the lead wire 20 is connected with the coil 10.
The sound diaphragm 30 includes an annular groove portion 31, a center portion 32, and a folded ring portion 33; the folded ring part 33 is connected to the outer circumference of the central part 32, and the annular groove part 31 is formed by downwardly recessing the connection part of the central part 32 and the folded ring part 33.
The coil 10 is embedded in a groove provided in the annular groove portion 31, and is thermoplastic-bonded to the annular groove portion 31.
In the sound diaphragm 30 of the present invention, the annular groove portion 31 is formed by recessing downward the junction of the center portion 32 and the collar portion 33. And the coil 10 is embedded in the groove of the annular groove portion 31 and is thermoplastically connected with the sound film 30 of the annular groove portion 31. The coil 10 and the sound film 30 are tightly combined, and the voice coil and the sound film 30 can not fall off even if the product works for a long time.
Typically, in a loudspeaker, the voice coil is below the diaphragm. Therefore, the leads 20 on both sides of the voice coil are in a suspended state, and when the loudspeaker works, the position of the lead 20 is relatively lifted along with the vibration of the sound film 30, and the state is changed, so that abnormal flapping stroke sound is easily generated, and the wire breakage can be caused in serious conditions, so that the function of the loudspeaker is disabled, and the service life of the micro loudspeaker is shortened.
To solve this problem, in the present embodiment, the lead 20 is attached to the loop portion 33. When the loudspeaker works, the lead wire 20 vibrates along with the sound film 30 to perform integrated vibration, so that the phenomenon of breakage in vibration caused by suspension of the lead wire 20 is avoided, and the service life of the product is prolonged.
The lead 20 is attached to the folded ring portion 33 in various ways, for example, the lead 20 itself is a metal lead 20, and the lead 20 is attached to the folded ring portion 33 by setting the lead 20 to have a certain rigid passing shape; or the folded ring part 33 is provided with a clamping structure matched with the lead 20.
In the present embodiment, the folded ring part 33 is connected by a thermoplastic connection method, so that the lead 20 is attached to the folded ring part 33. It is easy to implement and has a close attachment relationship. So that the lead wire 20 is always kept integral with the sound diaphragm 30 during the vibration of the sound diaphragm 30.
The lead 20 of the present invention is attached to the loop portion 33. It is within the scope of the present invention that the main body of the lead 20 is attached to the folded portion instead of the small portion of the lead 20 being attached to the folded portion, so that the sound diaphragm 30 vibrates integrally with the main body.
In this embodiment, the folded ring part 33 is protruded upward.
In cooperation, the lead 20 includes a bent portion 21 and a linear portion, the bent portion 21 is connected to the coil 10, and the linear portion is connected to the bent portion 21; the bending portion 21 bends to the other side of the loop portion 33 along the protruding direction of the loop portion 33, and the linear portion is located at the other side of the loop portion 33.
In the present embodiment, the height of the voice coil body 10 is the same as the groove depth of the annular groove portion 31.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (9)

1. A method of manufacturing a voice diaphragm assembly including a voice diaphragm and a voice coil disposed on the voice diaphragm, the method comprising:
s1: disposing the voice coil on the heat conducting mold;
s2: placing a voice film sheet above the voice coil, and heating a heat conducting mold to 90-110 ℃;
s3: applying air pressure to the upper surface of the voice film sheet to completely attach the voice coil and the heat conducting mold, and heating the heat conducting mold to 170-180 ℃;
s4: cooling the heat conducting mould to solidify the sound film sheet on the sound ring to form the sound film assembly;
and S5, separating the voice film assembly from the heat conducting mold.
2. The process of claim 1, wherein in step S3, the heat conducting mold is covered by a closed air hood, and the sound film sheet is blown and pressurized to 0.5 to 0.8MPa from the top of the closed air hood.
3. The processing method according to claim 2, wherein the time period for the air-blowing pressurization to 0.5 to 0.8MPa is 2.5 to 4.5 minutes.
4. The processing method according to claim 2, wherein the heat conducting mold is provided with at least one first vent hole and at least one second vent hole, the first vent hole is disposed in a middle portion of the heat conducting mold, and the second vent hole is disposed in an edge portion of the heat conducting mold.
5. The processing method as claimed in claim 1, wherein in step S1, the voice coil is disposed on the heat conducting mold after controlling the heat conducting mold to preheat to 65-85 ℃.
6. The process of claim 1, wherein in step S1, the lead of the voice coil is placed proximate to the surface of the heat conducting mold.
7. The manufacturing method of claim 6, wherein the surface of the heat conducting mold is provided with an annular groove for molding the diaphragm with the folded ring portion, and in step S1, the lead wire of the voice coil is placed adjacent to the surface of the annular groove.
8. The process of claim 1, wherein in step S4, the heat conducting mold is cooled to 65-85 ℃ by a cold water circulation.
9. A micro-speaker comprising a base frame, a magnetic circuit unit, and a voice diaphragm assembly produced by the method of any one of claims 1 to 8;
the magnetic circuit unit is located in the base frame, the magnetic circuit unit comprises a magnet, a pole core supported on the upper surface of the magnet, and a magnetic yoke which is connected to the lower surface of the magnet and is provided with a magnetic gap with the outer peripheral surface of the pole core, the voice film assembly is arranged on the base frame, and the coil of the voice coil is located in the magnetic gap between the pole core and the magnetic yoke.
CN201711419913.7A 2017-12-25 2017-12-25 Processing method of sound film assembly, sound film assembly and micro loudspeaker Active CN107948913B (en)

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CN109348394A (en) * 2018-10-26 2019-02-15 江西联创宏声电子股份有限公司 Vibrating diaphragm component processing unit (plant) and processing method
CN112929810B (en) * 2021-01-27 2022-06-14 东莞市达润电子有限公司 High-temperature and high-pressure forming machine for PI sound film and forming operation method thereof

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Publication number Priority date Publication date Assignee Title
CN1835647A (en) * 2005-02-09 2006-09-20 株式会社西铁城电子 Speaker and method for manufacturing the speaker
CN105050012A (en) * 2015-08-24 2015-11-11 张扬 Loudspeaker and assembling method thereof

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Publication number Priority date Publication date Assignee Title
JP2007221763A (en) * 2006-01-17 2007-08-30 Victor Co Of Japan Ltd Electroacoustic transducer
JP4367515B2 (en) * 2007-04-12 2009-11-18 パナソニック株式会社 Manufacturing method of speaker diaphragm and speaker diaphragm, speaker and electronic device formed thereby

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1835647A (en) * 2005-02-09 2006-09-20 株式会社西铁城电子 Speaker and method for manufacturing the speaker
CN105050012A (en) * 2015-08-24 2015-11-11 张扬 Loudspeaker and assembling method thereof

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Denomination of invention: A processing method for sound film components, sound film components, and miniature speakers

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