CN101690268A - Method of producing diaphragm and speaker and electronic device using the diaphragm - Google Patents
Method of producing diaphragm and speaker and electronic device using the diaphragm Download PDFInfo
- Publication number
- CN101690268A CN101690268A CN200780052540A CN200780052540A CN101690268A CN 101690268 A CN101690268 A CN 101690268A CN 200780052540 A CN200780052540 A CN 200780052540A CN 200780052540 A CN200780052540 A CN 200780052540A CN 101690268 A CN101690268 A CN 101690268A
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- Prior art keywords
- mould
- resin molding
- oscillating plate
- face
- manufacture method
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension
Abstract
A diaphragm being in a definite shape provided with a convex part and a concave part located in the opposite side to the convex part, which has a first face having the convex part and a second face having the concave part and being located in the opposite side to the first face. A first mold has a face which is provided with a molding die having a concave part for forming the convex part and beingin a definite shape. A second mold has a face which is provided with a projection part matching to the concave part of the first mold and a duct for jetting air. A resin film is provided between thefirst and second molds in the state where the first and second molds are located apart from each other. Then, the first and second molds are brought into contact with the resin film. By jetting air from the duct, the resin film is closely pressed against the face of the first mold due to the air pressure. Thus, a diaphragm is obtained. According to this production method, diaphragms can be produced at a high productivity.
Description
Technical field
The present invention relates to the manufacture method of the oscillating plate that constitutes by resin molding and use the loud speaker and the electronic equipment of this oscillating plate.
Background technology
In recent years, the increase along with the demand of mobile phone, notebook computer also requires high efficiency for its employed loud speaker.For the such market demand of correspondence, on the manufacture method that is used in the oscillating plate on the loud speaker, mainly adopt the empty forming mode of pressure of low cost excellence.
Fig. 6 is recorded in cutaway view in the patent documentation 1, that use the existing manufacturing installation 501 of the oscillating plate of pressing empty forming mode.
Desired shape has dark recess, and it is corresponding to the recess 1A that is arranged at mould 1.When making resin molding 3 along the recess 1A of mould 1, resin molding 3 is stretched to heavens and ruined situation happens occasionally.
In order to prevent the destruction to resin molding 3, the pressure of the air of being supplied with by conduit 4 wants interim to be increased, little by little stretching resin film 3 little by little.But, use this method, the shaping of resin molding 3 needs the long period, so the productivity ratio of oscillating plate is lower.
Patent documentation 1: Japanese kokai publication hei 3-133616 communique
Summary of the invention
Oscillating plate has and possesses convex portions and in the shape of the regulation of the concave part of convex portions opposition side, has the 1st of possessing convex portions, possesses concave part and the 2nd of the 1st opposition side.The 1st mould has the face that is provided with finishing die, and described finishing die has the recess of shaping convex portions, has the shape of regulation.The 2nd mould has the face that is provided with protuberance and conduit, and described protuberance is relative with the recess of the 1st mould, conduit ejection air.Under the state of the 1st and the 2nd mold separation, between the 1st and the 2nd mould, dispose resin molding.Make the 1st to contact with resin molding with the 2nd mould.From conduit ejection air, utilize the pressure of air to make the resin molding driving fit on the face of the 1st mould, obtain oscillating plate thus.
By this manufacture method, can make oscillating plate in high production rate ground.
Description of drawings
Fig. 1 is the profile of the oscillating plate of example of the present invention.
Fig. 2 is the profile of manufacturing installation of the oscillating plate of example of the present invention.
Fig. 3 is the profile of the manufacturing installation of example.
Fig. 4 is the profile of the manufacturing installation of example.
Fig. 5 is the part sectioned view of the electronic equipment of example.
Fig. 6 is the profile of the manufacturing installation of existing oscillating plate.
The explanation of symbol
5 the 1st moulds
6 protuberances
7 the 2nd moulds
8 finishing dies
9 resin moldings
10 recesses
13 conduits
15 chambers
51 the 1st heaters
52 the 2nd heaters
101 oscillating plates
The 101C convex portions
The 101D concave part
102 magnetic gaps
103 magnetic circuits
104 voice coil loudspeaker voice coils
301 electronic equipments
302 frameworks
401 loud speakers
Embodiment
Fig. 1 is the profile of the oscillating plate of example of the present invention.Oscillating plate 101 is formed by resin molding, has the shape of regulation, and the shape of this regulation has the face 101B of the opposition side of face 101A and face 101A.The face 101A of oscillating plate 101 has outstanding convex portions 101C.On the face 101B of oscillating plate 101, be formed with the concave part 101D of the opposition side of convex portions 101C.
Fig. 2 is the profile of the manufacturing installation 1001 of oscillating plate of the present invention.Manufacturing installation 1001 comprises: have the 1st mould 5 and the mould 7 with face 7A of face 5A, face 7A is relative with the face 5A of the 1st mould 5.The face 5A of the 1st mould 5 is provided with the finishing die 8 of the regulation shape with oscillating plate 101.The 2nd mould 7 has the outstanding protuberance 6 from face 7A.The face 5A of the 1st mould 5 is that finishing die 8 is provided with recess 10, also is provided with the hole 11 that connects the 1st mould 5 from recess 10.The face 5A of the 1st mould 5 is provided with around recess 10 and outstanding the 1st outline portion (outer Guo portion) 12.Face 5B at the opposition side of the face 5A of the 1st mould 5 is provided with the 1st heater 51, in order to heat the 1st mould 5.
The protuberance 6 of the 2nd mould 7 is relative with the recess 10 of the 1st mould 5.Protuberance 6 has the conduit 13 that sprays gases such as air.The face 7A of the 2nd mould 7 is provided with the 2nd outline portion around protuberance 6 (outer Guo portion) 14.The face 7B of the opposition side of the face 7A of the 2nd mould 7 is provided with the 2nd heater 52, in order to heat the 2nd mould 7.
Below, the manufacture method of the oscillating plate 101 of example is described.
At first, as shown in Figure 2, utilize heater 51,52 respectively the 1st mould 5 and the 2nd mould 7 to be heated to temperature more than the vitrification point of resin molding 9.In the example, resin molding 9 is formed by Polyetherimide (PEI), and heater 51,52 is heated to the 1st mould 5 and the 2nd mould 7 than 230 ℃ of 220 ℃ of higher temperature of ripple temperature of PEI.Then, under the 1st mould 5 and state that the 2nd mould 7 separates, between the 1st mould 5 and the 2nd mould 7, place and supporting resin molding 9.At this moment, make the formation position consistency of the oscillating plate 101 of finishing die 8 and resin molding 9.
Secondly, as shown in Figure 3, make the 1st mould 5 and the 2nd mould 7 with respect to resin molding 9 near and contact.At this moment, resin molding 9 contacts with the protuberance 6 of the 2nd mould 7, owing to the heat of the 1st mould 5 and the 2nd mould 7 begins to soften.And by the 11 attraction air from the hole, making softening resin molding 9 is on the finishing die 8 attached to the face 5A of the 1st mould 5.At this moment, on resin molding 9, produce the stress towards the protuberance 6 that contacts with resin molding 9, therefore, resin molding 9 is drawn into to inside from the outside of chamber 15.Then, the 1st outline portion 12 is contacted with the 2nd outline portion 14 with resin molding 9, be formed on airtight chamber 15 between the 1st mould 5 and the 2nd mould 7.
Then, as shown in Figure 4, utilize the 2nd outline portion 14 that resin molding 9 relatively is pressed on the face 5A of the 1st mould 5.At this moment, between resin molding 9 and protuberance 6, be formed with gap 6A.When hole 11 attracts air, in chamber 15, spray air by the conduit on the protuberance 6 that is arranged on the 2nd mould 7 13 by gap 6A, utilizing the pressure of air to make resin molding 9 driving fits is on the finishing die 8 at the face 5A of the 1st mould 5.Thus, resin molding 9 has duplicated the shape of finishing die 8.At this moment, produce on resin molding 9 towards the stress of the conduit 13 of ejection air, therefore, Liang resin molding 9 is drawn into to inside from the outside of chamber 15 to a certain degree.
Secondly, make the temperature of mould 5,7 and resin molding 9 drop to the ripple temperature following after, the 1st mould 5 and the 2nd mould 7 are separated from each other.After this, 11 ejection air make the resin molding 9 of the shape of having duplicated finishing die 8 peel off from the 1st mould 5 from the hole, obtain having the oscillating plate 101 of regulation shape.
In the manufacturing installation 1001 of example, utilizing before the 2nd outline portion 14 is pressed into resin molding 9 on the face 5A of the 1st mould 5, as shown in Figure 3, protuberance 6 moves in the recess 10, thereby resin molding 9 is pulled in the recess 10.Thus, when make resin molding 9 driving fits when finishing die 8 is particularly on the recess 10 from conduit 13 ejection air, can prevent that resin molding 9 from excessively stretching.Therefore, there is no need to adopt existing manufacturing installation 501 shown in Figure 6 to utilize air stretching resin film 3 for a long time, the manufacturing installation 1001 of example can be made oscillating plate 101 with high production efficiency.
The protuberance 6 relative with the recess 10 of the 1st mould 5 is provided with the conduit 13 of ejection air.Driving fit is on the recess 10 relative with protuberance 6 equably to make resin molding 9 by the air by conduit 13 ejection, and the shape of recess 10 can be duplicated reliably to resin molding 9.By from being arranged on the conduit 13 ejection air on the protuberance 6, make the stress that produces on the resin molding 9 towards protuberance 6, can draw in resin molding 9 to inside from the outside of chamber 15.Therefore, can reduce, guarantee the quality of oscillating plate 101 because of the resin molding damaged possibility that excessively stretched.And, be used to spray the conduit 13 of air, even be arranged on protuberance 6 position in addition of the face 7A of the 2nd mould 7, also can obtain the effect that protuberance shown in Figure 36 is drawn in resin molding 9.
In the manufacturing installation 1001 of example, at the 1st mould 5 and the 2nd mould 7 with before resin molding 9 contacts, the 1st mould 5 and the 2nd mould 7 are heated to the above temperature of ripple temperature of resin molding 9, so resin molding 9 softens along with the approaching of the 1st mould 5 and the 2nd mould 7.As shown in Figure 4, when resin molding 9 contacted with the finishing die 8 of the face 5A of the 1st mould 5, resin molding 9 had the above temperature of ripple temperature.As shown in Figure 4, the 1st mould 5 and the 2nd mould 7 are pushed mutually, more further from conduit 13 ejection air, thus can with the short period with the shape copying of finishing die 8 to resin molding 9, can make oscillating plate 101 with high production efficiency.
The 1st mould 5 and the 2nd mould 7 are heated respectively by the heater 51,52 of the face 7B of face 5B that is arranged on the 1st mould 5 and the 2nd mould 7.As shown in Figure 3 and Figure 4, mould 5,7 to resin molding 9 near the time, mould 5,7 separates with heater 51,52 and moves to resin molding 9.Because mould 5,7 separates with heater 51,52 respectively; therefore the temperature of mould 5,7 reduces gradually; but, thereby clamping resin molding 9 as shown in Figure 4 when the shape copying of finishing die 8 is on resin molding 9, the temperature maintenance of mould 5,7 is more than the vitrification point of resin molding 9.For the shape copying with finishing die 8 makes the temperature of mould 5,7 and resin molding 9 be reduced to fast below the ripple temperature of resin molding 9 at the air from conduit 13 ejections on the resin molding 9, resin molding 9 hardens under the state of the shape of having duplicated finishing die 8.Therefore, the manufacturing installation 1001 of example does not need to cool off the device of resin molding 9, can make oscillating plate 101 with low cost and high production rate.
In the manufacturing installation 1001 of example, the air that is sprayed owing to conduit 13 is applied to pressure on the resin molding 9 more than 0.8MPa, less than the pressure that makes resin molding 9 breakages.This pressure can make resin molding 9 driving fit more firmly on finishing die 8, recess 10.Thus, even finishing die 8 has complicated shape, also shaping resin film 9 accurately can suppress the generation of oscillating plate 101 unfavorable conditions, can make oscillating plate 101 in high production rate ground.
Fig. 5 is the part sectioned view of the electronic equipment 301 of example.Electronic equipment 301 is portable equipments such as mobile phone, comprises framework 302 and the loud speaker 401 that is installed on framework 302.Loud speaker 401 has by the oscillating plate 101 of manufacturing installation 1001 manufacturings, has the magnetic circuit 103 of magnetic gap 102, the voice coil loudspeaker voice coil 104 that is connected with oscillating plate 101.Voice coil loudspeaker voice coil 104 is disposed on the magnetic coil 102, the displacement corresponding to the electric current that flows through, thus oscillating plate 101 vibrations are sounded.Because oscillating plate 101 can exceedingly do not stretched, can high production efficiency make, it is low therefore to have bigger intensity and higher performance and a cost.Therefore, loud speaker 401 has higher performance, can obtain the electronic equipment 301 of high-quality and low price.
The possibility of utilizing on the industry
Use manufacture method of the present invention, can make oscillating plate with high production efficiency, be specially adapted to small-sized having The manufacturing of the oscillating plate of complicated shape.
Claims (9)
1. the manufacture method of an oscillating plate, described oscillating plate has and possesses convex portions and in the shape of the regulation of the concave part of the opposition side of described convex portions, and have the 1st of possessing described convex portions, possess described concave part and the 2nd of described the 1st opposition side
It is characterized in that the manufacture method of described oscillating plate comprises:
Prepare the step of the 1st mould, described the 1st mould has the face that is provided with finishing die, and described finishing die has the recess of the described convex portions that is shaped, and has the shape of described regulation;
Prepare the step of the 2nd mould, described the 2nd mould has the face that is provided with protuberance and conduit, and described protuberance is relative with the described recess of described the 1st mould, described conduit ejection air;
Under the state of described the 1st mould and described the 2nd mold separation, the step of configuration resin molding between described the 1st mould and the 2nd mould;
The step that described the 1st mould and described the 2nd mould are contacted with described resin molding;
From described conduit ejection air, utilize the pressure of described air to make the step of described resin molding driving fit on described of described the 1st mould.
2. the manufacture method of oscillating plate as claimed in claim 1 is characterized in that,
Described conduit is arranged on described protuberance.
3. the manufacture method of oscillating plate as claimed in claim 1.It is characterized in that,
Make described the 1st mould and described the 2nd mould and the step that described resin molding contacts, comprising:
Between described the 1st mould and described the 2nd mould, form the step of airtight chamber;
The step of described chamber is drawn in described resin molding by the described pressure that described air produced of described conduit ejection in utilization.
4. the manufacture method of oscillating plate as claimed in claim 1 is characterized in that,
Also be included between described the 1st mould and described the 2nd mould before the step of configuration resin molding,, make described the 1st mould and described the 2nd mould reach the step of the above temperature of the ripple temperature of described resin molding described the 1st mould and described the 2nd mold heated.
5. the manufacture method of oscillating plate as claimed in claim 4 is characterized in that,
Step to described the 1st mould and described the 2nd mold heated comprises:
The step that the 1st heater of the face of described opposition side by being arranged at described the 1st mould heats described the 1st mould;
The step that the 2nd heater of the face of described opposition side by being arranged at described the 2nd mould heats described the 2nd mould;
Make described the 1st mould and described the 2nd mould and the step that described resin molding contacts, comprising:
Make described the 1st mould leave the step that described the 1st heater moves to described resin molding;
Make described the 2nd mould leave the step that described the 2nd heater moves to described resin molding;
6. the manufacture method of oscillating plate as claimed in claim 1 is characterized in that,
The described pressure of described air is more than 0.8MPa.
7. the oscillating plate of any described manufacture method manufacturing among utilization such as the claim 1-6.
8. a loud speaker is characterized in that, comprising:
The described oscillating plate of claim 7;
Magnetic circuit with magnetic gap;
Be connected with described oscillating plate, and be disposed at the voice coil loudspeaker voice coil of described magnetic gap.
9. an electronic equipment is characterized in that, comprising:
The described loud speaker of claim 8;
The framework of described loud speaker is installed.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007104774A JP4367515B2 (en) | 2007-04-12 | 2007-04-12 | Manufacturing method of speaker diaphragm and speaker diaphragm, speaker and electronic device formed thereby |
| JP104774/2007 | 2007-04-12 | ||
| PCT/JP2007/068036 WO2008129695A1 (en) | 2007-04-12 | 2007-09-18 | Method of producing diaphragm and speaker and electronic device using the diaphragm |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101690268A true CN101690268A (en) | 2010-03-31 |
Family
ID=39875236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200780052540A Pending CN101690268A (en) | 2007-04-12 | 2007-09-18 | Method of producing diaphragm and speaker and electronic device using the diaphragm |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP2124484A1 (en) |
| JP (1) | JP4367515B2 (en) |
| CN (1) | CN101690268A (en) |
| WO (1) | WO2008129695A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105681998A (en) * | 2016-01-12 | 2016-06-15 | 常州阿木奇声学科技有限公司 | Vibration film production technology of moving iron unit |
| CN107948913A (en) * | 2017-12-25 | 2018-04-20 | 厦门东声电子有限公司 | A kind of processing method of sound membrane module, sound membrane module and Microspeaker |
| CN109040915A (en) * | 2018-07-04 | 2018-12-18 | 歌尔股份有限公司 | A kind of vibrating diaphragm molding die and vibrating diaphragm forming method |
| CN110996245A (en) * | 2019-11-11 | 2020-04-10 | 歌尔股份有限公司 | Vibrating diaphragm forming die and vibrating diaphragm forming method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5109959B2 (en) * | 2008-12-18 | 2012-12-26 | パナソニック株式会社 | Manufacturing method of speaker parts |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6033799A (en) * | 1983-08-04 | 1985-02-21 | Onkyo Corp | Plastic diaphragm and its manufacture |
| JPH03133616A (en) | 1989-10-20 | 1991-06-06 | Hitachi Ltd | Injection mold |
-
2007
- 2007-04-12 JP JP2007104774A patent/JP4367515B2/en not_active Expired - Fee Related
- 2007-09-18 WO PCT/JP2007/068036 patent/WO2008129695A1/en active Application Filing
- 2007-09-18 EP EP07828237A patent/EP2124484A1/en not_active Withdrawn
- 2007-09-18 CN CN200780052540A patent/CN101690268A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105681998A (en) * | 2016-01-12 | 2016-06-15 | 常州阿木奇声学科技有限公司 | Vibration film production technology of moving iron unit |
| CN105681998B (en) * | 2016-01-12 | 2019-03-29 | 常州阿木奇声学科技有限公司 | A kind of vibrating diaphragm manufacture craft of moving iron unit |
| CN107948913A (en) * | 2017-12-25 | 2018-04-20 | 厦门东声电子有限公司 | A kind of processing method of sound membrane module, sound membrane module and Microspeaker |
| CN109040915A (en) * | 2018-07-04 | 2018-12-18 | 歌尔股份有限公司 | A kind of vibrating diaphragm molding die and vibrating diaphragm forming method |
| CN109040915B (en) * | 2018-07-04 | 2020-07-24 | 歌尔股份有限公司 | Vibrating diaphragm forming die and vibrating diaphragm forming method |
| CN110996245A (en) * | 2019-11-11 | 2020-04-10 | 歌尔股份有限公司 | Vibrating diaphragm forming die and vibrating diaphragm forming method |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008129695A1 (en) | 2008-10-30 |
| EP2124484A1 (en) | 2009-11-25 |
| JP2008263416A (en) | 2008-10-30 |
| JP4367515B2 (en) | 2009-11-18 |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20100331 |