CN107946430A - 具有低色温、高色域的led封装结构 - Google Patents
具有低色温、高色域的led封装结构 Download PDFInfo
- Publication number
- CN107946430A CN107946430A CN201711104106.6A CN201711104106A CN107946430A CN 107946430 A CN107946430 A CN 107946430A CN 201711104106 A CN201711104106 A CN 201711104106A CN 107946430 A CN107946430 A CN 107946430A
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- led
- led chip
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 239000000843 powder Substances 0.000 claims abstract description 38
- 239000002184 metal Substances 0.000 claims abstract description 36
- 229910052751 metal Inorganic materials 0.000 claims abstract description 36
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000003292 glue Substances 0.000 claims description 25
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 230000005284 excitation Effects 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims 1
- 238000009877 rendering Methods 0.000 abstract description 13
- 230000000694 effects Effects 0.000 abstract description 10
- 230000035939 shock Effects 0.000 abstract description 3
- 230000000007 visual effect Effects 0.000 abstract description 3
- 230000009467 reduction Effects 0.000 abstract description 2
- 238000005286 illumination Methods 0.000 description 11
- 230000008901 benefit Effects 0.000 description 4
- 230000035807 sensation Effects 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 2
- 229910002114 biscuit porcelain Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000004456 color vision Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711104106.6A CN107946430B (zh) | 2017-11-10 | 2017-11-10 | 具有低色温、高色域的led封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711104106.6A CN107946430B (zh) | 2017-11-10 | 2017-11-10 | 具有低色温、高色域的led封装结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN107946430A true CN107946430A (zh) | 2018-04-20 |
CN107946430B CN107946430B (zh) | 2023-12-26 |
Family
ID=61933785
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711104106.6A Active CN107946430B (zh) | 2017-11-10 | 2017-11-10 | 具有低色温、高色域的led封装结构 |
Country Status (1)
Country | Link |
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CN (1) | CN107946430B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109686834A (zh) * | 2018-12-25 | 2019-04-26 | 江苏罗化新材料有限公司 | 一种色温可调的led光源及led台灯 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007295007A (ja) * | 2005-09-20 | 2007-11-08 | Matsushita Electric Works Ltd | Led照明器具 |
CN202275828U (zh) * | 2011-09-30 | 2012-06-13 | 深圳市灏天光电有限公司 | 一种可调色温的白光led集成封装结构 |
US20120268929A1 (en) * | 2011-04-22 | 2012-10-25 | Paragon Semiconductor Lighting Technology Co., Ltd | Light-emitting module |
CN102800794A (zh) * | 2012-08-17 | 2012-11-28 | 南通脉锐光电科技有限公司 | 一种光学波长转换器件以及在白光发光器件的应用 |
CN203910860U (zh) * | 2014-06-10 | 2014-10-29 | 深圳市晶台股份有限公司 | 一种高亮度的可调色温cob封装结构 |
CN105805608A (zh) * | 2014-12-31 | 2016-07-27 | 四川新力光源股份有限公司 | 一种可调光的led光源 |
CN207458988U (zh) * | 2017-11-10 | 2018-06-05 | 江西新月光电有限公司 | 具有低色温、高色域的led封装结构 |
-
2017
- 2017-11-10 CN CN201711104106.6A patent/CN107946430B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007295007A (ja) * | 2005-09-20 | 2007-11-08 | Matsushita Electric Works Ltd | Led照明器具 |
US20120268929A1 (en) * | 2011-04-22 | 2012-10-25 | Paragon Semiconductor Lighting Technology Co., Ltd | Light-emitting module |
CN202275828U (zh) * | 2011-09-30 | 2012-06-13 | 深圳市灏天光电有限公司 | 一种可调色温的白光led集成封装结构 |
CN102800794A (zh) * | 2012-08-17 | 2012-11-28 | 南通脉锐光电科技有限公司 | 一种光学波长转换器件以及在白光发光器件的应用 |
CN203910860U (zh) * | 2014-06-10 | 2014-10-29 | 深圳市晶台股份有限公司 | 一种高亮度的可调色温cob封装结构 |
CN105805608A (zh) * | 2014-12-31 | 2016-07-27 | 四川新力光源股份有限公司 | 一种可调光的led光源 |
CN207458988U (zh) * | 2017-11-10 | 2018-06-05 | 江西新月光电有限公司 | 具有低色温、高色域的led封装结构 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109686834A (zh) * | 2018-12-25 | 2019-04-26 | 江苏罗化新材料有限公司 | 一种色温可调的led光源及led台灯 |
Also Published As
Publication number | Publication date |
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CN107946430B (zh) | 2023-12-26 |
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Effective date of registration: 20180816 Address after: 518107 12 buildings of Shek Guan Industrial Park, Gongming village, Guangming New District, Shenzhen, Guangdong Applicant after: CRESCENT OPTOELECTRONIC (SHENZHEN) CO.,LTD. Address before: 343100 Fenghuang Park, Ji'an hi tech Zone, Ji'an, Ji'an, Jiangxi Applicant before: JIANGXI CRESCENT ELECTRONICS CO.,LTD. |
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TA01 | Transfer of patent application right |
Effective date of registration: 20231114 Address after: 430070 5A / F, future mansion, 378 Wuluo Road, Hongshan District, Wuhan City, Hubei Province Applicant after: Wuhan yizhiniao Technology Co.,Ltd. Address before: 518107 12 buildings of Shek Guan Industrial Park, Gongming village, Guangming New District, Shenzhen, Guangdong Applicant before: CRESCENT OPTOELECTRONIC (SHENZHEN) CO.,LTD. |
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Effective date of registration: 20231130 Address after: 710000, Room 701, Century Future Center, Huijing International Plaza, southeast corner of Fengcheng 3rd Road and Taihua North Road, Weiyang District, Xi'an City, Shaanxi Province Applicant after: Shaanxi Baichuang Electrical Technology Co.,Ltd. Address before: 430070 5A / F, future mansion, 378 Wuluo Road, Hongshan District, Wuhan City, Hubei Province Applicant before: Wuhan yizhiniao Technology Co.,Ltd. |
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