CN107946221A - Wafer handling system and its operating method - Google Patents
Wafer handling system and its operating method Download PDFInfo
- Publication number
- CN107946221A CN107946221A CN201610889325.9A CN201610889325A CN107946221A CN 107946221 A CN107946221 A CN 107946221A CN 201610889325 A CN201610889325 A CN 201610889325A CN 107946221 A CN107946221 A CN 107946221A
- Authority
- CN
- China
- Prior art keywords
- wafer
- fixture
- handling system
- offset
- bearing seat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
Abstract
The present invention relates to a kind of wafer handling system and its operating method, the wafer handling system be used for will an at least wafer be sent on one of wafer cleaning device bearing seat and including：One wafer cassette, for a receiving at least wafer；One fixture, for clamping an at least wafer to a localizer station；One image sensing unit, for capturing at least one of wafer image；And a control unit, which is calculated according to the image, and the fixture controlled according to the offset at least a wafer is positioned on the bearing seat by this.The wafer handling system and its operating method can promote the cleaning performance of an at least wafer.
Description
Technical field
The present invention relates to wafer field, more particularly to a kind of wafer handling system and its operating method.
Background technology
Sui writes science and technology Jin steps, and the requirement more Come of Right Yu Jing Round thickness is thinner, it is therefore desirable to which the back side (does not have the table on Line roads
Face) Yan Mo System journeys.
Jin row Bei face Yan Mo System journeys Hous are, it is necessary to which Will Jing Round Pass are sent to Yi Jing Round Qing Xi Installed Zhi Jin row Qing Xi System journeys, Xi knows
In Ji Intraoperative, Will Jing Round Pass send Zhi Jing Round Qing Xi Installed the Right positions (alignment) for one of putting Time Shang Load (Huo Turn Disk) of Cheng bad, more
Say, Xi Zhi Jing Round Pass send Xi System are placed on Jing Round Qing Xi Installed with being unable to Will Jing Round Jing Indeed and put on Cheng Load seats, i.e. Jing Round Ming Indeed
Load center Hui You Wrong Cha , Jin of Zhong Xin With Cheng and the cleaning performance of shadow Ring Jing Round and it be easy to cause Jing Round fragmentations.
Therefore need to be placed on Jing Round Qing Xi Installed with being unable to Will Jing Round Jing Indeed in Needles Right Xi Zhi Ji Intraoperative and put on Cheng Load seats
Ask Questions Ti Chu Xie Decision methods.
The content of the invention
The object of the present invention is to provide a kind of wafer handling system and its operating method, and wafer can be precisely placed to by it
On the bearing seat of wafer cleaning device.
The wafer handling system of the present invention is used to that at least one of wafer cleaning device bearing seat will to be sent to by a wafer,
The wafer handling system includes：One wafer cassette, for a receiving at least wafer；One fixture, for by an at least wafer
Clamp to a localizer station；One image sensing unit, for capturing one of wafer image；And a control unit, according to the shadow
As calculating at least one of wafer offset, and control the fixture that an at least wafer is positioned over this according to the offset and hold
Carry on seat.
In a preferred embodiment, which further comprises an at least sensor, for sensing the wafer
Spacing between the quantity and adjacent wafers of wafer in box.
In a preferred embodiment, which should according to the spacing control between the quantity and adjacent wafers of wafer
Fixture grips the wafer.
In a preferred embodiment, which is the offset at the center and the center of the bearing seat of the wafer.
In a preferred embodiment, which is a charge coupled device.
In a preferred embodiment, after which controls the fixture to be moved to above the bearing seat, the fixture is controlled
The wafer is positioned on the bearing seat again after upset, after the wafer carries out manufacturing process for cleaning, which controls the fixture
Control the fixture to overturn after gripping the wafer on the bearing seat, then the wafer is gripped to the localizer station.
The operating method of the wafer handling system of the present invention be used for will an at least wafer be sent to a wafer cleaning device it
On one bearing seat, which includes a wafer cassette, a fixture, an image sensing unit and a control unit, should
The operating method of wafer handling system includes：The fixture is moved to the wafer cassette so that at least wafer in the wafer cassette to be clamped
To a localizer station；The image sensing unit captures one of wafer image；And the control unit calculates the crystalline substance according to the image
One of circle offset, and control the fixture to be moved to above the bearing seat according to the offset, which is positioned over the carrying
On seat.
In a preferred embodiment, which further comprises an at least sensor, is moved in the fixture
The wafer cassette is clamping at least wafer in the wafer cassette the step of localizer station before, the behaviour of the wafer handling system
Further comprise as method：Between an at least sensor is sensed between the quantity and adjacent wafers of the wafer in the wafer cassette
Away from.
In a preferred embodiment, which is the offset at the center and the center of the bearing seat of the wafer.
In a preferred embodiment, before the step that the wafer is positioned on the bearing seat, the wafer handling system
Operating method further comprise：The control unit controls the fixture to overturn.
In a preferred embodiment, after the step of control unit controls the fixture to overturn, the wafer handling system
Operating method further comprise：The fixture removes, which carries out a manufacturing process for cleaning to the wafer；The cleaning system
After the completion of journey, which controls the fixture to grip the wafer on the bearing seat；The control unit controls the fixture to overturn,
The wafer is gripped to the localizer station；The image sensing unit captures another image of the wafer；And the control unit according to
Another image calculates another offset of the wafer, and controls the fixture to be moved to another wafer according to another offset
Box, which is positioned in another wafer cassette.
In a preferred embodiment, which is the offset at the center and the center of another wafer cassette of the wafer
Amount.
In the wafer handling system and method for the present invention, crystalline substance is calculated by the image sensed through image sensing unit
Wafer can accurately be clamped to wafer cleaning device inside and accurately clamp wafer to another crystalline substance by the offset of circle, fixture
Circle box, therefore the cleaning performance of wafer can be promoted and the situation generation of wafer fragmentation can be reduced.
The above to allow the present invention can become apparent, preferred embodiment cited below particularly, and coordinate institute's accompanying drawings, make
Describe in detail as follows：
Brief description of the drawings
Fig. 1 shows the block diagram of the wafer handling system of an embodiment and a wafer cleaning device according to the present invention.
Fig. 2 shows the flow chart of the wafer handling system of an embodiment according to the present invention.
Embodiment
The explanation of following embodiment is with reference to additional schema, to illustrate the particular implementation that the present invention can be used to implementation
Example.
Referring to Fig. 1, Fig. 1 show an embodiment according to the present invention 1 and one wafer cleaning device 3 of wafer handling system it
Block diagram.
The wafer cleaning device 3 includes a bearing seat 30.The wafer handling system 1 includes a wafer cassette (wafer
Cassette) 10, one fixture (chuck), 12, one image sensing unit 14 and a control unit 16.
The wafer cassette 10 can accommodate more wafers 100, which further comprises an at least sensor
18, between which is used to sensing between the quantity and adjacent wafers 100 of the wafer 100 in the wafer cassette 10
Away from (pitch), which can be according to the spacing between the quantity and adjacent wafers 100 of wafer 100
(alignment) fixture (chuck) 12 is controlled to grip the wafer 100.
A image sensing unit 14 such as, but not limited to charge coupled device (Charge-Coupled Device,
CCD)。
The wafer cassette 10 is used to accommodate an at least wafer 100.The fixture 12 be used for be moved to the wafer cassette 10 with by this extremely
A few wafer 100 is clamped to a localizer station (alignment) 50.The image sensing unit 14 is arranged at the localizer station 50 and is used for
One of the wafer 100 image is captured, which is electrically coupled to the image sensing unit 14, and being calculated according to the image should
One of wafer offset, and control the fixture 12 to be moved to the top of bearing seat 30 according to the offset, which is placed
In on the bearing seat 30.The offset is such as, but not limited to the offset at the center of the wafer 100 and the center of the bearing seat 30
Amount.
Then the fixture 12 removes, which carries out a manufacturing process for cleaning to the wafer 100.The manufacturing process for cleaning
After the completion of, which controls the fixture 12 to grip the wafer 100 on the bearing seat 30 to the localizer station 50.The image
Sensing unit 14 is used for another image for capturing the wafer 100.The control unit 16 according to another image calculate the wafer it
Another offset, and control the fixture 12 to be moved to another wafer cassette according to another offset and (be used to accommodate the crystalline substance cleaned
Circle), which is positioned in another wafer cassette.Another offset is such as, but not limited to the center of the wafer 100
With the offset at the center of another wafer cassette.
In an embodiment, after which controls the fixture 12 to be moved to the top of bearing seat 30, the folder is controlled
The wafer 100 is positioned on the bearing seat 30 again after the upset of tool 12.After the fixture 12 upset so that the back side of the wafer 100
The surface of circuit (do not have) upward, so that follow-up manufacturing process for cleaning can clean the back side of the wafer 100.When the back of the body of the wafer 100
After the face surface of circuit (do not have) carries out manufacturing process for cleaning, which controls the fixture 12 to grip on the bearing seat 30 it
Control the fixture 12 to overturn after the wafer 100, then the wafer 100 is gripped to the localizer station 50.
The operation side of the wafer handling system 1 of an embodiment according to the present invention is shown please refer to Fig. 1 and Fig. 2, Fig. 2
Method flow chart.
In step S20, which senses the quantity and phase vincial faces of the wafer 100 in the wafer cassette 10
Spacing between circle 100.
In step S22, which is moved to the wafer cassette 10 so that at least a wafer 100 is clamped to a localizer station by this
50。
In an embodiment, which can be according between the quantity and adjacent wafers 100 of wafer 100
The wafer 100 is gripped away from the fixture is controlled.
In step S24, which captures one of the wafer 100 image.
In step S26, which calculates one of wafer offset according to the image, and according to the offset
The fixture 12 is controlled to be moved to the top of bearing seat 30.
The offset is such as, but not limited to the offset at the center of the wafer 100 and the center of the bearing seat 30.
In step S28, after which controls the fixture 12 upset, which is positioned over the bearing seat
On 30.
In the step, after the fixture 12 upset, the back side of the wafer 100 (surface for not having circuit) upward, for
Follow-up manufacturing process for cleaning can clean the back side of the wafer 100.The step is the step of (optional) may be selected.
In step S30, which removes, which carries out a manufacturing process for cleaning to the wafer 100.
In the step, which carries out manufacturing process for cleaning to the back side of the wafer 100.It is noted that should
Manufacturing process for cleaning is not added to repeat herein known to persond having ordinary knowledge in the technical field of the present invention.
In step S32, after the completion of the manufacturing process for cleaning, which controls the fixture 12 to grip on the bearing seat 30
The wafer 100.
In step S34, which controls the fixture 12 to overturn, which is gripped to the localizer station 50.
The step is the step of (optional) may be selected.
In step S36, which captures another image of the wafer 100.
In step S38, which calculates another offset of the wafer according to another image, and according to this
Another offset controls the fixture 12 to be moved to another wafer cassette (being used to accommodate the wafer cleaned), which is placed
In in another wafer cassette.
Another offset is such as, but not limited to the offset at the center of the wafer 100 and the center of another wafer cassette
Amount.
In the wafer handling system and method for the present invention, crystalline substance is calculated by the image sensed through image sensing unit
Wafer can accurately be clamped to wafer cleaning device inside and accurately clamp wafer to another crystalline substance by the offset of circle, fixture
Circle box, therefore the cleaning performance of wafer can be promoted and the situation generation of wafer fragmentation can be reduced.
In conclusion although the present invention is disclosed above with preferred embodiment, above preferred embodiment simultaneously is not used to limit
The system present invention, those of ordinary skill in the art, without departing from the spirit and scope of the present invention, can make various changes and profit
Decorations, therefore protection scope of the present invention is subject to the scope that claim defines.
Claims (12)
1. a kind of wafer handling system, for that at least will be sent to one of wafer cleaning device bearing seat by a wafer, it is special
Sign is that the wafer handling system includes：
One wafer cassette, for a receiving at least wafer；
One fixture, for clamping an at least wafer to a localizer station；
One image sensing unit, for capturing one of wafer image；And
One control unit, at least one of wafer offset is calculated according to the image, and controls the fixture according to the offset
By this, at least a wafer is positioned on the bearing seat.
2. wafer handling system according to claim 1, it is characterised in that further comprise an at least sensor, be used for
Sense the spacing between the quantity and adjacent wafers of the wafer in the wafer cassette.
3. wafer handling system according to claim 2, it is characterised in that the control unit according to the quantity of wafer and
Spacing between adjacent wafers controls the fixture to grip the wafer.
4. wafer handling system according to claim 1, it is characterised in that the offset is held for the center of the wafer with this
Carry the offset at the center of seat.
5. wafer handling system according to claim 1, it is characterised in that the image sensing unit fills for a Charged Couple
Put.
6. wafer handling system according to claim 1, it is characterised in that the control unit controls the fixture to be moved to this
After above bearing seat, control the fixture that the wafer is positioned on the bearing seat again after overturning, when the wafer carries out manufacturing process for cleaning
Afterwards, which controls the fixture to control the fixture to overturn after gripping the wafer on the bearing seat, then the wafer is gripped
To the localizer station.
A kind of 7. operating method of wafer handling system, for an at least wafer to be sent to the carrying of one of wafer cleaning device
On seat, which includes a wafer cassette, a fixture, an image sensing unit and a control unit, its feature exists
In the operating method of the wafer handling system includes：
The fixture is moved to the wafer cassette clamping at least wafer in the wafer cassette to a localizer station；
The image sensing unit captures one of wafer image；And
The control unit calculates one of wafer offset according to the image, and controls the fixture to be moved to this according to the offset
Above bearing seat, which is positioned on the bearing seat.
8. the operating method of wafer handling system according to claim 7, it is characterised in that the wafer handling system is into one
Step includes an at least sensor, is moved to the wafer cassette in the fixture clamping at least wafer in the wafer cassette to certain
Before the step of position station, the operating method of the wafer handling system further comprises：
An at least sensor senses the spacing between the quantity and adjacent wafers of the wafer in the wafer cassette.
9. the operating method of wafer handling system according to claim 7, it is characterised in that the offset for the wafer it
The offset at center and the center of the bearing seat.
10. the operating method of wafer handling system according to claim 7, it is characterised in that be positioned over by the wafer
Before step on the bearing seat, the operating method of the wafer handling system further comprises：
The control unit controls the fixture to overturn.
11. the operating method of wafer handling system according to claim 10, it is characterised in that controlled in the control unit
After the step of fixture is overturn, the operating method of the wafer handling system further comprises：
The fixture removes, which carries out a manufacturing process for cleaning to the wafer；
After the completion of the manufacturing process for cleaning, which controls the fixture to grip the wafer on the bearing seat；
The control unit controls the fixture to overturn, which is gripped to the localizer station；
The image sensing unit captures another image of the wafer；And
The control unit calculates another offset of the wafer according to another image, and controls the folder according to another offset
Tool is moved to another wafer cassette, which is positioned in another wafer cassette.
12. the operating method of wafer handling system according to claim 11, it is characterised in that another offset is should
The offset at the center of wafer and the center of another wafer cassette.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610889325.9A CN107946221A (en) | 2016-10-12 | 2016-10-12 | Wafer handling system and its operating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610889325.9A CN107946221A (en) | 2016-10-12 | 2016-10-12 | Wafer handling system and its operating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107946221A true CN107946221A (en) | 2018-04-20 |
Family
ID=61928250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610889325.9A Pending CN107946221A (en) | 2016-10-12 | 2016-10-12 | Wafer handling system and its operating method |
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| Country | Link |
|---|---|
| CN (1) | CN107946221A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI748723B (en) * | 2020-11-02 | 2021-12-01 | 鴻海精密工業股份有限公司 | Object location method, apparatus, and storage medium thereof |
| CN115139217A (en) * | 2022-07-05 | 2022-10-04 | 北京日扬弘创科技有限公司 | Intelligent feeding system suitable for wafer double-side polishing and grinding equipment |
| US11776249B2 (en) | 2020-11-02 | 2023-10-03 | Hon Hai Precision Industry Co., Ltd. | Method for identifying non-inspectable objects in packaging, and apparatus and storage medium applying method |
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|---|---|---|---|---|
| US6144926A (en) * | 1997-04-24 | 2000-11-07 | Tokyo Electron Limited | Method of sensing access positions of arm |
| JP2009054933A (en) * | 2007-08-29 | 2009-03-12 | Ryusyo Industrial Co Ltd | Wafer transfer system |
| CN102412177A (en) * | 2010-06-21 | 2012-04-11 | 泰尼克斯有限公司 | Wafer transfer system and transfer method |
-
2016
- 2016-10-12 CN CN201610889325.9A patent/CN107946221A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6144926A (en) * | 1997-04-24 | 2000-11-07 | Tokyo Electron Limited | Method of sensing access positions of arm |
| JP2009054933A (en) * | 2007-08-29 | 2009-03-12 | Ryusyo Industrial Co Ltd | Wafer transfer system |
| CN102412177A (en) * | 2010-06-21 | 2012-04-11 | 泰尼克斯有限公司 | Wafer transfer system and transfer method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI748723B (en) * | 2020-11-02 | 2021-12-01 | 鴻海精密工業股份有限公司 | Object location method, apparatus, and storage medium thereof |
| US11776249B2 (en) | 2020-11-02 | 2023-10-03 | Hon Hai Precision Industry Co., Ltd. | Method for identifying non-inspectable objects in packaging, and apparatus and storage medium applying method |
| CN115139217A (en) * | 2022-07-05 | 2022-10-04 | 北京日扬弘创科技有限公司 | Intelligent feeding system suitable for wafer double-side polishing and grinding equipment |
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Application publication date: 20180420 |