CN107942594B - Display substrate, manufacturing method thereof and display device - Google Patents
Display substrate, manufacturing method thereof and display device Download PDFInfo
- Publication number
- CN107942594B CN107942594B CN201711122688.0A CN201711122688A CN107942594B CN 107942594 B CN107942594 B CN 107942594B CN 201711122688 A CN201711122688 A CN 201711122688A CN 107942594 B CN107942594 B CN 107942594B
- Authority
- CN
- China
- Prior art keywords
- via hole
- conductive pattern
- flexible
- conductive
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136227—Through-hole connection of the pixel electrode to the active element through an insulation layer
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides a display substrate, a manufacturing method thereof and a display device, wherein the manufacturing method of the display substrate comprises the following steps: forming an insulating film layer on a substrate, and forming a via hole penetrating through the insulating film layer; and forming a conductive pattern, wherein the conductive pattern comprises a first conductive pattern at least covering the via hole and the edge of the via hole, and the first conductive pattern is formed by adopting a flexible conductive material. In the embodiment of the invention, the flexible conductive material is adopted to replace the traditional rigid conductive material to form the first conductive pattern at least covering the via hole and the edge of the via hole, and the first conductive pattern formed by the flexible conductive material has higher flexibility, is not easy to break at the via hole and improves the reliability of the display substrate.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display substrate, a manufacturing method thereof and a display device.
Background
In the existing Thin Film Transistor liquid crystal Display (Thin Film Transistor-liquid crystal Display, abbreviated as TFT-LCD) product, in order to ensure the charging rate of the product, the thickness of the Passivation (PVX) layer is increased to reduce the storage capacitance, but this also causes the related problem, i.e. the step difference at the edge of the via hole on the passivation layer is larger, and the conductive pattern for connection is easy to break (Open) at the edge of the via hole, causing the abnormal resistance at the via hole, thereby causing the undesirable problems of pixel Display dark spot, etc.
With the development of TFT-LCD technology, the variety of the via holes is more and more abundant, and for the problem that the conductive pattern at the edge of the via hole is easy to break, the main focus is on the design or process control of the conductive pattern, such as appropriately increasing the area of the conductive pattern overlap, or improving through Repair (Repair), but the occurrence of the conductive pattern break cannot be really prevented.
Disclosure of Invention
In view of the above, the present invention provides a display substrate, a manufacturing method thereof and a display device, which are used to solve the problem that a conductive pattern at a via hole of the display substrate is easy to break.
In order to solve the above technical problems, the present invention provides a method for manufacturing a display substrate, including:
forming an insulating film layer on a substrate, and forming a via hole penetrating through the insulating film layer;
and forming a conductive pattern, wherein the conductive pattern comprises a first conductive pattern at least covering the via hole and the edge of the via hole, and the first conductive pattern is formed by adopting a flexible conductive material.
Preferably, the flexible conductive material is a flexible braid composite material formed of a flexible braid material and conductive particles wrapping a surface of the flexible braid material.
Preferably, the step of forming a first conductive pattern covering at least the via and an edge of the via comprises:
forming a catalyst layer covering at least the via hole and an edge of the via hole;
the display substrate is placed in a reaction chamber, mixed raw materials for preparing the flexible braided body composite material are arranged in the reaction chamber, the mixed raw materials comprise a first raw material for preparing the flexible braided body material and a second raw material for preparing the conductive particles, the first raw material is decomposed within a certain temperature range, the flexible braided body material grows on the surface of the catalyst layer, the second raw material is decomposed in the process of growing the flexible braided body material, and the conductive particles formed by decomposition are deposited on the surface of the flexible braided body material, so that the flexible braided body composite material is generated, and the first conductive pattern is formed.
Preferably, the step of forming an insulating film layer and forming a via hole penetrating through the insulating film layer includes:
forming an insulating film layer and a photoresist layer covering the insulating film layer;
exposing and developing the photoresist layer by adopting a half-tone or gray-tone mask plate to form a photoresist layer full-reserved area, a photoresist layer semi-reserved area and a photoresist layer removing area, wherein the photoresist layer removing area corresponds to an area where the via holes are located, and the photoresist layer semi-reserved area at least corresponds to an area where the edges of the via holes are located;
etching the insulating film layer in the photoresist layer removing area to form a via hole penetrating through the insulating film layer;
removing the photoresist layer of the photoresist layer semi-reserved area to expose the edge of the via hole;
the step of forming a catalyst layer covering at least the via hole and an edge of the via hole includes:
forming a catalyst layer covering the via hole and the edge of the via hole by taking the photoresist layer of the photoresist layer full-reserved area as a mask;
and removing the photoresist layer.
Preferably, the flexible braided body material is carbon nanotubes, carbon fibers or polyaniline, and the conductive particles are conductive particles formed by transparent metal oxide conductive materials.
Preferably, the conductive pattern further includes a second conductive pattern, and an orthographic projection area of the second conductive pattern and the orthographic projection area of the first conductive pattern on the substrate base plate do not overlap.
Preferably, the second conductive pattern is formed using a flexible conductive material, or a transparent metal oxide conductive material.
Preferably, the insulating film layer includes a passivation layer, and the conductive pattern is a pixel electrode layer pattern or a common electrode layer pattern.
The invention also provides a display substrate formed by the manufacturing method, and the display substrate comprises:
the substrate comprises a substrate base plate, an insulating film layer and a conductive pattern, wherein the insulating film layer and the conductive pattern are arranged on the substrate base plate, a through hole penetrating through the insulating film layer is formed in the insulating film layer, the conductive pattern comprises a first conductive pattern at least covering the through hole and the edge of the through hole, and the first conductive pattern is formed by adopting a flexible conductive material.
Preferably, the flexible conductive material is a flexible braid composite material formed of a flexible braid material and conductive particles wrapping a surface of the flexible braid material.
The invention also provides a display device comprising the display substrate.
The technical scheme of the invention has the following beneficial effects:
the flexible conductive material is adopted to replace the traditional rigid conductive material to form the first conductive pattern at least covering the via hole and the edge of the via hole, the first conductive pattern formed by the flexible conductive material has higher flexibility, the via hole is not easy to break, and the reliability of the display substrate is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.
FIG. 1 is a schematic flow chart illustrating a method for fabricating a display substrate according to an embodiment of the present invention;
FIG. 2 is a schematic view of a flexible braid composite material in accordance with one embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a display substrate according to an embodiment of the invention;
fig. 4 is a schematic structural diagram of a display substrate according to another embodiment of the invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention, are within the scope of the invention.
Referring to fig. 1, fig. 1 is a schematic flow chart illustrating a manufacturing method of a display substrate according to an embodiment of the present invention, the manufacturing method including:
step 11: forming an insulating film layer on a substrate, and forming a via hole penetrating through the insulating film layer;
step 12: and forming a conductive pattern, wherein the conductive pattern comprises a first conductive pattern at least covering the via hole and the edge of the via hole, and the first conductive pattern is formed by adopting a flexible conductive material.
In the embodiment of the invention, the flexible conductive material is adopted to replace the traditional rigid conductive material to form the first conductive pattern at least covering the via hole and the edge of the via hole, and the first conductive pattern formed by the flexible conductive material has higher flexibility, is not easy to break at the via hole and improves the reliability of the display substrate.
In the embodiment of the present invention, the insulating film layer may be a single insulating film layer, or may include at least two insulating film layers.
In the embodiment of the present invention, the flexible conductive material may be any conductive and flexible conductive material.
In some preferred embodiments, the flexible conductive material is a flexible braid composite material formed of a flexible braid material and conductive particles wrapping a surface of the flexible braid material. The flexible braid composite may be as shown in figure 2.
The flexible woven material may be, for example, a material having a woven structure, such as carbon nanotubes, carbon fibers, or polyaniline, and being electrically conductive.
The conductive particles may be conductive particles formed of a transparent metal oxide conductive material, such as ITO conductive particles or IZO conductive particles. The conductive particles are typically nano-sized particles.
The flexible braided body composite material is a core-shell structure composite material, and has the advantages of high flexibility and low resistivity.
In the embodiment of the present invention, the first conductive pattern may be formed in various manners, for example, by an in-situ chemical deposition method, or by a solution method.
In some preferred embodiments of the present invention, the first conductive pattern is formed using an in-situ chemical deposition method.
The in-situ chemical deposition method is briefly described below.
In some embodiments, the step of forming a first conductive pattern covering at least the via and an edge of the via may include:
step 21: forming a catalyst layer covering at least the via hole and an edge of the via hole;
step 22: the display substrate is placed in a reaction chamber, mixed raw materials for preparing the flexible braided body composite material are arranged in the reaction chamber, the mixed raw materials comprise a first raw material for preparing the flexible braided body material and a second raw material for preparing the conductive particles, the first raw material is decomposed within a certain temperature range, the flexible braided body material grows on the surface of the catalyst layer, the second raw material is decomposed in the process of growing the flexible braided body material, and the conductive particles formed by decomposition are deposited on the surface of the flexible braided body material, so that the flexible braided body composite material is generated, and the first conductive pattern is formed.
The certain temperature range may be set as desired, for example, a temperature range higher than 1000 degrees celsius.
Taking the flexible braid material as an example of carbon nanotubes, the step of forming a first conductive pattern at least covering the via hole and the edge of the via hole by an in-situ chemical deposition method may include:
step 31: and forming a catalyst layer at least covering the via hole and the edge of the via hole, wherein the catalyst layer is mainly composed of eighth group transition metal or alloy thereof, such as ferrocene and the like.
Step 32: placing the display substrate in a reaction chamber, wherein the reaction chamber is internally provided with a mixed liquid (namely the mixed raw material), the mixed liquid comprises ethanol and indium tin salt, the reaction chamber is internally provided with a high-temperature environment, the ethanol is decomposed under the action of high temperature, and carbon nano tubes are generated on the surface of the catalyst layer; in the process of growing the carbon nano tube, indium tin salt is decomposed under the action of high temperature, and ITO conductive particles formed by decomposition are deposited on the surface of the carbon nano tube, so that the flexible braided body composite material is generated, and the first conductive pattern is formed.
In some preferred embodiments of the present invention, the step of forming an insulating film layer and forming a via hole penetrating the insulating film layer may include:
step 41: forming an insulating film layer and a photoresist layer covering the insulating film layer;
step 42: exposing and developing the photoresist layer to form a photoresist layer full-reserved area, a photoresist layer semi-reserved area and a photoresist layer removed area, wherein the photoresist layer removed area corresponds to an area where the via hole is located, and the photoresist layer semi-reserved area at least corresponds to an area where the edge of the via hole is located;
step 43: etching the insulating film layer in the photoresist layer removing area to form a via hole penetrating through the insulating film layer;
step 44: removing the photoresist layer of the photoresist layer semi-reserved area to expose the edge of the via hole;
wherein the step of forming a catalyst layer covering at least the via hole and an edge of the via hole comprises: and forming a catalyst layer covering the through hole and the edge of the through hole by taking the photoresist layer of the photoresist layer full-reserved area as a mask, and removing the photoresist layer.
In the embodiment of the invention, after the via hole of the insulating film layer is formed, the photoresist layer of the photoresist layer semi-reserved area is removed to expose the edge of the porous hole, but the photoresist layer of the photoresist layer full-reserved area is not removed, the photoresist layer of the photoresist layer full-reserved area is utilized to form the catalyst layer at least covering the via hole and the edge of the via hole, and then the photoresist layer is removed, so that redundant mask plates are not required to be added when the catalyst layer is formed, and the production cost is reduced.
Of course, in other embodiments of the present invention, the catalyst layer may be formed by using a separate mask.
The flexible braided body composite material in the embodiment of the invention can also be formed by a solution method, wherein in the solution method, a flexible braided body material is required to be formed firstly, and then raw materials for preparing conductive particles are precipitated on the surface of the flexible braided body material by a solution precipitation method to form the conductive particles wrapping the surface of the flexible braided body material.
In the embodiment of the present invention, the conductive pattern may further include a second conductive pattern, and an orthographic projection area of the second conductive pattern and the orthographic projection area of the first conductive pattern on the substrate base plate do not overlap.
Namely, the conductive pattern comprises two parts, namely a first conductive pattern at least covering the via hole and the edge of the via hole, and a second conductive pattern positioned at other positions.
The second conductive pattern may be formed of a flexible conductive material, preferably, the same flexible conductive material as the first conductive pattern, or may be formed of a conventional non-flexible conductive material, for example, a transparent metal oxide conductive material, such as ITO or IZO.
When the second conductive pattern is formed using the same flexible conductive material as the first conductive pattern, the first conductive pattern and the second conductive pattern may be formed by a one-time patterning process. When the second conductive pattern is formed using a conductive material different from that of the first conductive pattern, the first conductive pattern and the second conductive pattern generally need to be formed by a one-time patterning process, respectively.
In some embodiments of the present invention, the insulating film layer includes a passivation layer, the conductive pattern is a pixel electrode layer pattern or a common electrode layer pattern, and when the conductive pattern is a pixel electrode layer pattern, the via hole may include: a via hole for connecting the pixel electrode layer pattern and a drain electrode of the thin film transistor, and a via hole in the non-display region, etc., and when the conductive pattern is the common electrode layer pattern, the via hole may include: the through holes are used for connecting the common electrode layer patterns and the common electrode wiring, and the switching holes are positioned in the non-display area.
Based on the same inventive concept, an embodiment of the present invention further provides a display substrate, where the display substrate may be formed by the method for manufacturing a display substrate described in any of the above embodiments, and the display substrate includes: the substrate comprises a substrate base plate, an insulating film layer and a conductive pattern, wherein the insulating film layer and the conductive pattern are arranged on the substrate base plate, a through hole penetrating through the insulating film layer is formed in the insulating film layer, the conductive pattern comprises a first conductive pattern at least covering the through hole and the edge of the through hole, and the first conductive pattern is formed by adopting a flexible conductive material.
In the embodiment of the invention, the flexible conductive material is adopted to replace the traditional rigid conductive material to form the first conductive pattern at least covering the via hole and the edge of the via hole, and the first conductive pattern formed by the flexible conductive material has higher flexibility, is not easy to break at the via hole and improves the reliability of the display substrate.
In the embodiment of the present invention, the insulating film layer may be a single insulating film layer, or may include at least two insulating film layers.
In the embodiment of the present invention, the flexible conductive material may be any conductive and flexible conductive material.
In some preferred embodiments, the flexible conductive material is a flexible braid composite material formed of a flexible braid material and conductive particles wrapping a surface of the flexible braid material.
The flexible woven material may be, for example, a material having a woven structure, such as carbon nanotubes, carbon fibers, or polyaniline, and being electrically conductive.
The conductive particles may be conductive particles formed of a transparent metal oxide conductive material, such as ITO conductive particles or IZO conductive particles. The conductive particles are typically nano-sized particles.
The flexible braided body composite material is a core-shell structure composite material, and has the advantages of high flexibility and low resistivity.
In the embodiment of the present invention, the conductive pattern may further include a second conductive pattern, and an orthographic projection area of the second conductive pattern and the orthographic projection area of the first conductive pattern on the substrate base plate do not overlap.
Namely, the conductive pattern comprises two parts, namely a first conductive pattern at least covering the via hole and the edge of the via hole, and a second conductive pattern positioned at other positions.
The second conductive pattern may be formed of a flexible conductive material, preferably, the same flexible conductive material as the first conductive pattern, or may be formed of a conventional non-flexible conductive material, for example, a transparent metal oxide conductive material, such as ITO or IZO.
When the second conductive pattern is formed using the same flexible conductive material as the first conductive pattern, the first conductive pattern and the second conductive pattern may be formed by a one-time patterning process. When the second conductive pattern is formed using a conductive material different from that of the first conductive pattern, the first conductive pattern and the second conductive pattern generally need to be formed by a one-time patterning process, respectively.
In some embodiments of the present invention, the insulating film layer includes a passivation layer, the conductive pattern is a pixel electrode layer pattern or a common electrode layer pattern, and when the conductive pattern is a pixel electrode layer pattern, the via hole may include: a via hole for connecting the pixel electrode layer pattern and a drain electrode of the thin film transistor, and a via hole in the non-display region, etc., and when the conductive pattern is the common electrode layer pattern, the via hole may include: the through holes are used for connecting the common electrode layer patterns and the common electrode wiring, and the switching holes are positioned in the non-display area.
The structure of the display substrate in the embodiment of the present invention is described below by taking the via hole in the above embodiment as an example.
Referring to fig. 3, fig. 3 is a schematic structural diagram of a display substrate according to an embodiment of the present invention, where the display substrate includes: the structure comprises a substrate 101, a gate metal layer pattern 102, a gate insulating layer 103, a source-drain metal layer pattern 104, a passivation layer 105 and a first conductive pattern 106, wherein a via hole 107 penetrating through the passivation layer 105 and the gate insulating layer 103 is formed on the passivation layer 105 and the gate insulating layer 103, the first conductive pattern 106 is made of a flexible conductive material, the first conductive pattern 106 is partially arranged in the via hole and partially arranged at the edge of the via hole (namely the upper surface of the passivation layer 105), and the first conductive pattern 106 is connected with the gate metal layer pattern 102 and the source-drain metal layer pattern 104 through the via hole 107. The first conductive pattern 106 formed of a flexible conductive material has higher flexibility, and is not easily broken in and at the edge of the via hole, thereby improving the reliability of the display substrate.
Referring to fig. 4, fig. 4 is a schematic structural diagram of a display substrate according to another embodiment of the present invention, the display substrate includes: the semiconductor device comprises a substrate 101, a gate metal layer pattern 102, a gate insulating layer 103, a source-drain metal layer pattern 104, a passivation layer 105 and a first conductive pattern 106, wherein a via hole 107 penetrating through the passivation layer 105 and the gate insulating layer 103 is formed on the passivation layer 105 and the gate insulating layer 103, a via hole 108 penetrating through the passivation layer 105 is further formed on the passivation layer 105, the first conductive pattern 106 is made of a flexible conductive material, and part of the first conductive pattern 106 is arranged in a via hole and part of the first conductive pattern is arranged at the edge of the via hole (namely the upper surface of the passivation layer 105). The first conductive pattern 106 is connected to the gate metal layer pattern 102 through a via 107, and is connected to the source-drain metal layer pattern 104 through a via 108. The first conductive pattern 106 formed of a flexible conductive material has higher flexibility, and is not easily broken in and at the edge of the via hole, thereby improving the reliability of the display substrate.
The embodiment of the invention also provides a display device which comprises the display substrate. The display device may be a display panel, or may be a display device including a display panel and a driver circuit.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The use of "first," "second," and similar terms in the present application do not denote any order, quantity, or importance, but rather the terms are used to distinguish one element from another. Also, the use of the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships are changed accordingly.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (7)
1. A method for manufacturing a display substrate is characterized by comprising the following steps:
forming an insulating film layer on a substrate, and forming a via hole penetrating through the insulating film layer;
forming a conductive pattern, wherein the conductive pattern comprises a first conductive pattern at least covering the via hole and the edge of the via hole, and the first conductive pattern is formed by adopting a flexible conductive material; the flexible conductive material is a flexible braided body composite material, and the flexible braided body composite material is formed by a flexible braided body material and conductive particles wrapping the surface of the flexible braided body material;
the step of forming a first conductive pattern covering at least the via and an edge of the via comprises:
forming a catalyst layer covering at least the via hole and an edge of the via hole;
placing the display substrate in a reaction chamber, wherein the reaction chamber is internally provided with mixed raw materials for preparing the flexible braided body composite material, the mixed raw materials comprise a first raw material for preparing the flexible braided body material and a second raw material for preparing the conductive particles, the first raw material is decomposed within a certain temperature range, the flexible braided body material grows on the surface of the catalyst layer, the second raw material is decomposed in the process of growing the flexible braided body material, and the conductive particles formed by decomposition are deposited on the surface of the flexible braided body material, so that the flexible braided body composite material is generated, and the first conductive pattern is formed;
the step of forming an insulating film layer and forming a via hole penetrating through the insulating film layer includes:
forming an insulating film layer and a photoresist layer covering the insulating film layer;
exposing and developing the photoresist layer by adopting a half-tone or gray-tone mask plate to form a photoresist layer full-reserved area, a photoresist layer semi-reserved area and a photoresist layer removing area, wherein the photoresist layer removing area corresponds to an area where the via holes are located, and the photoresist layer semi-reserved area at least corresponds to an area where the edges of the via holes are located;
etching the insulating film layer in the photoresist layer removing area to form a via hole penetrating through the insulating film layer;
removing the photoresist layer of the photoresist layer semi-reserved area to expose the edge of the via hole;
the step of forming a catalyst layer covering at least the via hole and an edge of the via hole includes:
forming a catalyst layer covering the via hole and the edge of the via hole by taking the photoresist layer of the photoresist layer full-reserved area as a mask;
and removing the photoresist layer.
2. The method of claim 1, wherein the flexible woven material is carbon nanotubes, carbon fibers or polyaniline, and the conductive particles are conductive particles formed of a transparent metal oxide conductive material.
3. The method for manufacturing a display substrate according to claim 1, wherein the conductive pattern further comprises a second conductive pattern, and an orthographic projection area of the second conductive pattern and the orthographic projection area of the first conductive pattern on the substrate do not overlap.
4. The method of claim 3, wherein the second conductive pattern is formed of a flexible conductive material or a transparent metal oxide conductive material.
5. The method for manufacturing the display substrate according to any one of claims 1 to 4, wherein the insulating film layer comprises a passivation layer, and the conductive pattern is a pixel electrode layer pattern or a common electrode layer pattern.
6. A display substrate formed by the manufacturing method according to any one of claims 1 to 5, the display substrate comprising:
the flexible conductive material is a flexible woven body composite material, and the flexible woven body composite material is formed by a flexible woven body material and conductive particles wrapping the surface of the flexible woven body material.
7. A display device comprising the display substrate of claim 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711122688.0A CN107942594B (en) | 2017-11-14 | 2017-11-14 | Display substrate, manufacturing method thereof and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711122688.0A CN107942594B (en) | 2017-11-14 | 2017-11-14 | Display substrate, manufacturing method thereof and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107942594A CN107942594A (en) | 2018-04-20 |
| CN107942594B true CN107942594B (en) | 2021-01-08 |
Family
ID=61934082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711122688.0A Active CN107942594B (en) | 2017-11-14 | 2017-11-14 | Display substrate, manufacturing method thereof and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107942594B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109031846B (en) * | 2018-08-29 | 2022-05-10 | 合肥鑫晟光电科技有限公司 | Flexible fiber substrate and flexible display device including the same |
| CN111326532A (en) * | 2020-03-18 | 2020-06-23 | 深圳市华星光电半导体显示技术有限公司 | Array substrate and display panel |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101041720A (en) * | 2006-03-21 | 2007-09-26 | 三星电子株式会社 | Conductive transparent material, manufacturing method thereof and display device comprising the same |
| CN101734618A (en) * | 2008-11-14 | 2010-06-16 | 清华大学 | Preparation method of nanostructure |
| CN101881667A (en) * | 2010-06-24 | 2010-11-10 | 电子科技大学 | Uncooled microbolometer and preparation method thereof |
| CN102081068A (en) * | 2011-02-16 | 2011-06-01 | 西安交通大学 | Three-electrode sulfur dioxide sensor of carbon nanotube film and concentration measurement method thereof |
| CN104081518A (en) * | 2012-01-10 | 2014-10-01 | 原子能和替代能源委员会 | Passive thermal management device |
| CN105439114A (en) * | 2014-07-25 | 2016-03-30 | 清华大学 | Carbon fiber film and preparation method thereof |
| CN107195798A (en) * | 2017-07-06 | 2017-09-22 | 京东方科技集团股份有限公司 | A kind of conductive layer and preparation method thereof, flexible base board, flexible apparatus |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102184928A (en) * | 2010-12-29 | 2011-09-14 | 友达光电股份有限公司 | Display element and method for manufacturing the same |
| CN104465668A (en) * | 2014-12-02 | 2015-03-25 | 昆山国显光电有限公司 | Flexible display device and manufacturing method thereof |
-
2017
- 2017-11-14 CN CN201711122688.0A patent/CN107942594B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101041720A (en) * | 2006-03-21 | 2007-09-26 | 三星电子株式会社 | Conductive transparent material, manufacturing method thereof and display device comprising the same |
| CN101734618A (en) * | 2008-11-14 | 2010-06-16 | 清华大学 | Preparation method of nanostructure |
| CN101881667A (en) * | 2010-06-24 | 2010-11-10 | 电子科技大学 | Uncooled microbolometer and preparation method thereof |
| CN102081068A (en) * | 2011-02-16 | 2011-06-01 | 西安交通大学 | Three-electrode sulfur dioxide sensor of carbon nanotube film and concentration measurement method thereof |
| CN104081518A (en) * | 2012-01-10 | 2014-10-01 | 原子能和替代能源委员会 | Passive thermal management device |
| CN105439114A (en) * | 2014-07-25 | 2016-03-30 | 清华大学 | Carbon fiber film and preparation method thereof |
| CN107195798A (en) * | 2017-07-06 | 2017-09-22 | 京东方科技集团股份有限公司 | A kind of conductive layer and preparation method thereof, flexible base board, flexible apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107942594A (en) | 2018-04-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108389884B (en) | Flexible array substrate, preparation method thereof and flexible display panel | |
| US11257810B2 (en) | Electrostatic discharge unit, array substrate and display panel | |
| CN100479172C (en) | Electro-optic display and manufacturing method thereof | |
| CN110137084B (en) | Thin film transistor, preparation method thereof, electronic device substrate and electronic device | |
| US20090176325A1 (en) | Halftone mask, method of manufacturing the same, and method of manufacturing an array substrate using the same | |
| WO2015100898A1 (en) | Thin-film transistor, tft array substrate and manufacturing method therefor, and display device | |
| CN112310044B (en) | Display substrate, preparation method thereof and display device | |
| CN108336100A (en) | A kind of array substrate and preparation method thereof, display panel, display device | |
| US10290822B2 (en) | Thin film transistor including recessed gate insulation layer and its manufacturing method, array substrate, and display device | |
| CN104965362A (en) | Array base plate, preparation method of same and display apparatus | |
| CN108027541A (en) | Thin film transistor base plate and its manufacture method | |
| CN103135304B (en) | Array base palte and manufacture method thereof | |
| US20220059639A1 (en) | Display Substrate and Manufacturing Method Thereof, and Display Apparatus | |
| CN104952932A (en) | Thin-film transistor, array substrate, manufacturing method of thin-film transistor, manufacturing method of array substrate, and display device | |
| CN104241296B (en) | A kind of array base palte and preparation method thereof and display device | |
| CN108446053B (en) | Array substrate, manufacturing method thereof and display device | |
| WO2013139135A1 (en) | Array substrate, manufacturing method therefor and display device | |
| CN107942594B (en) | Display substrate, manufacturing method thereof and display device | |
| US10534233B2 (en) | Array substrate, method for manufacturing the same, display device | |
| CN104133313A (en) | Array substrate, manufacturing method thereof and liquid crystal display device | |
| US9618809B2 (en) | Liquid crystal display and method for manufacturing same | |
| EP2863435A1 (en) | Array substrate, manufacturing method of same, and display device | |
| KR20150076936A (en) | Manufacturing method of thin film transistor array substrate | |
| CN104617049A (en) | Array substrate and manufacturing method thereof as well as display device | |
| CN106575062A (en) | Active matrix substrate and method for producing same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |