CN107941826B - Irradiation dose management device and irradiation dose management method - Google Patents
Irradiation dose management device and irradiation dose management method Download PDFInfo
- Publication number
- CN107941826B CN107941826B CN201710816155.6A CN201710816155A CN107941826B CN 107941826 B CN107941826 B CN 107941826B CN 201710816155 A CN201710816155 A CN 201710816155A CN 107941826 B CN107941826 B CN 107941826B
- Authority
- CN
- China
- Prior art keywords
- irradiation
- inspection
- ray
- irradiation amount
- dose
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/04—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and forming images of the material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
- G01N23/06—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
- G01N23/18—Investigating the presence of flaws defects or foreign matter
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/03—Investigating materials by wave or particle radiation by transmission
- G01N2223/04—Investigating materials by wave or particle radiation by transmission and measuring absorption
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/10—Different kinds of radiation or particles
- G01N2223/101—Different kinds of radiation or particles electromagnetic radiation
- G01N2223/1016—X-ray
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/60—Specific applications or type of materials
- G01N2223/645—Specific applications or type of materials quality control
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/60—Specific applications or type of materials
- G01N2223/646—Specific applications or type of materials flaws, defects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/60—Specific applications or type of materials
- G01N2223/646—Specific applications or type of materials flaws, defects
- G01N2223/6462—Specific applications or type of materials flaws, defects microdefects
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Apparatus For Radiation Diagnosis (AREA)
Abstract
The present invention provides a technique for appropriately managing the irradiation amount of each component on an inspection object. An exposure dose management device calculates the distribution of exposure doses of a first surface which is a surface on the radiation source side of an object to be inspected and a second surface which is a surface on the opposite side of the radiation source of the object to be inspected, based on the positional relationship between the radiation source and the object to be inspected in an X-ray inspection and the intensity of X-rays irradiated from the radiation source, and calculates the exposure doses of each of a plurality of members based on the respective exposure dose distributions of the first surface and the second surface and the respective arrangements of the plurality of members.
Description
Technical Field
The present invention relates to an industrial X-ray inspection apparatus, and more particularly, to a technique for managing the exposure dose of an electronic component to be subjected to X-ray inspection.
Background
There is known an industrial X-ray inspection apparatus which irradiates an object to be inspected with X-rays and detects defects or flaws of an industrial product using a transmission image or a CT image thereof. Such an X-ray inspection apparatus has an advantage that a portion difficult to be visually recognized and a state inside an object can be nondestructively inspected, and is applied to various inspections such as an inspection of a bonding failure of a surface mount substrate, an inspection of a crack or a die failure inside a component, and an inspection of all electronic devices.
Even in industrial products such as electronic devices, when the irradiation amount exceeds the allowable limit, there is a possibility that performance may deteriorate or malfunction may occur. Therefore, it is desirable for manufacturers to appropriately use the dose, method, number of times, and the like of X-ray examination so that the irradiation amount does not exceed the allowable limit.
Among industrial products, special attention is paid to electric/electronic parts (hereinafter, simply referred to as "parts"). This is because, in many cases, a part undergoes a plurality of X-ray inspection processes such as inspection by a part manufacturer, inspection by a device manufacturer, and inspection by a final product manufacturer, and even if the irradiation amount in any one manufacturer or process is below the allowable limit, there is a possibility that a defect may be caused if the cumulative irradiation amount up to the final product is increased.
In addition, when the inspection target is an object including a plurality of components (for example, a surface-mounted substrate, an electronic device and a module thereof, a component group mounted on a component tray, and the like), the exposure dose of the X-ray inspection is not necessarily the same for all the components on the inspection target. In addition, when X-ray irradiation is performed a plurality of times in one X-ray inspection, it is also possible to assume that the number of times of X-ray irradiation and the irradiation amount are different for each component.
Therefore, conventionally, a method of managing the exposure dose for each component in the X-ray inspection has been proposed. For example, patent document 1 proposes an X-ray imaging apparatus that holds component data, irradiation data, and X-ray allowable dose data of each component in a server, and calculates a predetermined X-ray irradiation dose from the component data and the irradiation data, the X-ray imaging apparatus having a function of warning when the predetermined irradiation dose exceeds the allowable dose. Further, patent document 2 proposes an X-ray exposure amount management system having a function of totaling estimated exposure amounts for each component at the time of imaging and calculating an integrated exposure amount for a target substrate.
Patent document 1: japanese patent laid-open publication No. 2002-350367
Patent document 2: japanese patent laid-open No. 2012 and 163352
Since X-rays have high transparency, a member disposed on the back surface of the substrate is also irradiated (for convenience of description, the surface on the radiation source side of the inspection object is referred to as "front surface" or "first surface", and the surface opposite to the radiation source side is referred to as "back surface" or "second surface" in the present specification). However, when the front surface member or the printed circuit board itself is transmitted, a part of the energy of the X-rays is absorbed and the X-rays are attenuated, so that the irradiation amount of the back surface member is smaller than that of the front surface member. The amount of attenuation of X-rays depends on the design of the substrate (e.g., the thickness, material, arrangement of surface members, etc. of the printed substrate). However, in the conventional technique, since the variation of the irradiation amount of the rear surface member depending on the substrate design is not considered at all, it is difficult to accurately grasp and manage the irradiation amount of each member.
Disclosure of Invention
The present invention has been made in view of the above circumstances, and an object thereof is to provide a technique for appropriately managing the irradiation amount of each component on an inspection object.
In order to achieve the above object, the present invention is configured to calculate the distribution of the irradiation dose on the surface on the radiation source side of the inspection target and the distribution of the irradiation dose on the surface on the opposite side of the radiation source.
Specifically, the present invention provides an exposure dose management apparatus including:
an exposure amount calculation unit for calculating the exposure amount of the object to be inspected by the X-ray inspection,
an information output unit that outputs information relating to an irradiation amount of the inspection target object,
the object to be inspected includes a plurality of members,
the exposure dose calculation unit calculates a distribution of exposure doses of a first surface that is a surface on the radiation source side of the inspection target object and a second surface that is a surface on the opposite side of the inspection target object from the radiation source, based on a positional relationship between the radiation source and the inspection target object in the X-ray inspection and an intensity of the X-ray irradiated from the radiation source,
the irradiation dose calculation unit calculates the irradiation dose for each component based on the distribution of the irradiation dose on each of the first surface and the second surface and the arrangement of each of the plurality of components.
According to this configuration, the irradiation dose of each member is calculated based on the distribution of the irradiation dose of the surface on the radiation source side (first surface) of the inspection target and the distribution of the irradiation dose of the surface on the opposite side to the radiation source (second surface). Therefore, preferably, the present invention can be applied to the dose management of a double-sided mounting substrate including: a printed substrate; a member disposed on the first surface of the printed circuit board; and a member disposed on the second surface of the printed circuit board.
The invention can be used for predicting the irradiation amount and recording the irradiation amount. The prediction of the exposure amount is processing for estimating the exposure amount to be applied to the inspection object in the X-ray inspection before the actual X-ray inspection is performed, and the recording of the exposure amount is processing for calculating the exposure amount to be applied to the inspection object after the actual X-ray inspection is performed.
The irradiation dose calculation unit may calculate the distribution of the irradiation dose on the second surface in consideration of absorption of X-rays by the printed circuit board and/or absorption of X-rays by a member disposed on the first surface. By taking into account the absorption of X-rays by the printed circuit board and the member on the first surface side, the intensity of X-rays transmitted through the second surface side, that is, the dose of the second surface can be calculated with high accuracy.
In the case where the X-ray irradiation is performed a plurality of times in one X-ray examination, the irradiation amount calculation unit may calculate the irradiation amount for each X-ray irradiation and add the calculated irradiation amounts cumulatively, thereby calculating the distribution of the irradiation amount in one X-ray examination. According to this configuration, for example, even when X-ray irradiation is performed a plurality of times such as when an inspection object is inspected while being divided into a plurality of fields of view, the irradiation amount can be calculated with high accuracy.
The irradiation amount management device may further include a determination unit that determines whether or not the irradiation amount is within a tolerance for each component based on the irradiation amount for each component calculated by the irradiation amount calculation unit. For example, the irradiation amount is predicted before the X-ray inspection is performed, and if a component exceeding the allowable amount is detected, measures such as changing the X-ray irradiation condition or stopping the X-ray inspection may be taken.
The exposure amount management device may further include: an inspection history storage unit for storing a history of a past X-ray inspection performed on the inspection object; and an exposure dose updating unit that integrates, based on the history, an exposure dose for which an X-ray inspection has been performed in the past with the exposure dose distribution and/or the exposure dose for each component calculated by the exposure dose calculating unit. Thus, when the object to be inspected is subjected to a plurality of X-ray inspections, the distribution of the integrated irradiation dose of the object to be inspected and the integrated irradiation dose of each component can be grasped and managed.
The information output unit may output an exposure dose map indicating a distribution of exposure doses to a display device. In addition, the information output unit may output information indicating the irradiation amount of each component to a display device. The information output unit may output, to a display device, information indicating whether or not the irradiation amount of each component is an allowable amount. By providing such information to the user, it becomes easy to grasp and manage the irradiation amount of each member of the inspection object.
The present invention may be an exposure amount management device having at least a part of the above-described structure or function. The present invention may also be an X-ray inspection system including an X-ray inspection apparatus and an exposure amount management apparatus. The present invention may be an exposure amount management method or an X-ray inspection method including at least a part of the above-described processing. In addition, the present invention may also be a computer-readable storage recording medium having stored thereon a computer program for executing the steps of these methods in a computer. The above-described structures and processes can be combined with each other to constitute the present invention as long as they do not technically conflict.
According to the present invention, the irradiation amount of each component on the inspection object can be appropriately managed.
Drawings
Fig. 1 is a diagram showing a configuration of an X-ray inspection system according to a first embodiment.
Fig. 2 is a flow chart of an X-ray examination.
Fig. 3A is a plan view of the substrate surface, and fig. 3B is a plan view of the substrate back surface.
Fig. 4 is a diagram showing an example of X-ray irradiation conditions.
Fig. 5A to 5C are diagrams showing the case of X-ray irradiation performed according to the X-ray irradiation conditions of fig. 4.
Fig. 6 is a flowchart of the process of calculating the irradiation dose according to the first embodiment.
Fig. 7 is a diagram showing an example of X-ray source information.
Fig. 8 is a diagram showing an example of object information.
Fig. 9A and 9B are diagrams showing examples of the display of the dose map.
Fig. 10 is a diagram showing a display example of the part irradiation amount and the determination result in a table format.
Fig. 11A and 11B are diagrams showing display examples of the irradiation amount of the component and the determination result in the form of arrangement diagrams.
Fig. 12 is a diagram showing a configuration of an X-ray inspection system according to a second embodiment.
Fig. 13 is a flowchart of the process of calculating the irradiation dose according to the second embodiment.
The reference numerals are explained below:
1: x-ray inspection system
10: x-ray inspection apparatus
11: irradiation amount management device
12: object to be inspected
31-37: component part
100: x-ray source
101: x-ray detector
102: platform
103: control unit
104: inspection section
105: storage unit
110: data input unit
111: exposure amount calculating part
112: determination unit
113: information output unit
114: display device
115: inspection history storage unit
116: dose update unit
Detailed Description
Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. However, the following descriptions of the respective configurations should be appropriately modified depending on the configuration of the apparatus to which the present invention is applied and various conditions, and the scope of the present invention is not limited to the following descriptions.
< first embodiment >
(X-ray inspection System)
Fig. 1 is a diagram schematically showing the configuration of an X-ray inspection system according to a first embodiment.
The X-ray inspection system 1 generally comprises: an X-ray inspection apparatus 10 and an exposure dose management apparatus 11. The X-ray inspection apparatus 10 is an apparatus for performing a nondestructive inspection of an inspection object 12 with X-rays. The X-ray substrate inspection apparatus exemplified in the present embodiment performs solder joint inspection of each component using a mounting substrate on which a plurality of components are mounted as an inspection object. The exposure dose management device 11 is a device for managing the exposure dose to which the inspection object 12 is subjected during the X-ray inspection. The X-ray inspection apparatus 10 and the exposure dose management apparatus 11 may be configured as an integrated apparatus or may be configured as separate apparatuses.
(X-ray inspection apparatus)
The X-ray inspection apparatus 10 includes: an X-ray source 100, an X-ray detector 101, a table 102, a control unit 103, an inspection unit 104, a storage unit 105, and the like. The X-ray source 100 is a mechanism for irradiating X-rays on the inspection object 12, and is configured by, for example, an X-ray generator of a cone beam type or a fan beam type. The X-ray detector 101 is an imaging means for detecting X-rays transmitted through the inspection object 12 and outputting data of X-ray transmission images, and is configured by, for example, a scintillator and a two-dimensional CMOS sensor. The stage 102 is a mechanism for holding and conveying the inspection object 12, and aligns a field of view of an imaging system including the X-ray source 100 and the X-ray detector 101 with an inspection target region on the inspection object 12. When the field of view of the imaging system is moved, the platform 102 may be moved, the imaging system may be moved, or both the platform 102 and the imaging system may be moved.
The control unit 103 is a unit that controls operations of each unit of the X-ray inspection apparatus 10 (movement of a field of view, irradiation of X-rays, acquisition of X-ray transmission images, inspection processing by the inspection unit 104, cooperation with an external apparatus, data transmission, and the like). The inspection unit 104 is a unit that performs an inspection of the inspection object 12 using the X-ray transmission image acquired by the X-ray inspection apparatus 10. Here, the functions of the control unit 103 and the inspection unit 104 may be realized by software processing performed by a computer including a CPU (processor) and a memory (memory), or may be realized by a circuit such as an FPGA or an ASIC.
The storage unit 105 is a means for storing data such as a setting file, an inspection program, an X-ray transmission image, and an inspection result of the X-ray inspection apparatus 10. The setting file is data describing common information (for example, initial setting values, specifications of the X-ray source 100 and the X-ray detector 101, and the like) that does not depend on the inspection target 12. The inspection program is data for defining the order of X-ray inspection, and is created and stored in advance for each type of the inspection target object 12. The inspection program may include definitions of information of the inspection object 12 (for example, the size, thickness, material, position on the substrate of each component, size, irradiation allowance, and the like), X-ray irradiation conditions (for example, an irradiation position (a field position), a distance between an X-ray source and the substrate, a tube voltage, a tube current, irradiation time, and the like), inspection logic (for example, a feature amount acquired from an image, a determination criterion (a threshold value, a range) of the inspection, processing corresponding to a determination result, and the like), and the like. The storage unit 105 is constituted by a nonvolatile storage device such as a flash memory or a hard disk.
(operation of X-ray examination)
An example of the operation of the X-ray inspection performed by the X-ray inspection apparatus 10 will be described with reference to the flowchart of fig. 2.
First, the control unit 103 reads a setting file from the storage unit 105 and performs initial setting of the X-ray inspection apparatus 10 (step S20). Next, the control unit 103 reads out an inspection program corresponding to the type of the inspection object 12 (for example, the number of the board) from the storage unit 105 (step S21). The type of the inspection target 12 may be input by the user, may be identified by reading a barcode, a two-dimensional code, an IC tag attached to the substrate, or a number printed on the substrate, or may be notified from an external device (for example, a host system managing the production line).
The control unit 103 executes the movement of the field of view of the imaging system, the X-ray irradiation, and the acquisition of the transmission image according to the X-ray irradiation conditions defined by the inspection program (steps S22 to S24). When a plurality of X-ray irradiation conditions are set in the inspection program, the processes of steps S22 to S24 are repeatedly executed while changing the X-ray irradiation conditions in order (step S25).
Fig. 3A and 3B show an example of a surface mount substrate as the inspection object 12. FIG. 3A is a plan view of the surface of a substrate, and five members 31 to 35 are arranged on the surface. Fig. 3B is a plan view of the back surface of the substrate (a perspective view seen from the same direction as fig. 3A), and two members 36 and 37 are arranged on the back surface. Fig. 4 shows an example of X-ray irradiation conditions set in the inspection program for the substrate. Fig. 4 shows an example in which X-ray irradiation is performed three times while changing the irradiation position (field position) of X-rays, the distance between the X-ray source and the substrate, the tube voltage of the X-ray source, and the tube current. Note that the unit "μ a" of the tube current is abbreviated as microampere. Fig. 5A to 5C are diagrams schematically showing the case where X-ray irradiation is performed under the X-ray irradiation conditions shown in fig. 4. The left side of each figure is a side view, the right side is a plan view, and the hatching indicates the irradiation range of X-rays. By this operation, X-ray transmission images relating to the three fields of view of numbers 1 to 3 are obtained.
Next, the inspection unit 104 extracts a required feature amount from the X-ray transmission image based on an inspection logic defined in the inspection program, and compares the value of the feature amount with a determination criterion to determine whether the solder bonding of the component on the substrate is good or bad (step S26). The inspection result of the inspection unit 104 is output to the display device or the external device (step S27).
(irradiation for X-ray examination)
As described above, when the irradiation amount of the component exceeds the allowable limit, performance deterioration or malfunction may be caused. Further, since a single part often undergoes a plurality of X-ray inspection processes such as inspection by a part manufacturer, inspection by a device manufacturer, and inspection by a final product manufacturer, it is desirable to facilitate grasping not only the dose in each process but also the final integrated dose. In the X-ray inspection system 1 according to the present embodiment, the X-ray inspection performed by the X-ray inspection apparatus 10 is performed by the exposure amount management apparatus 11, and the exposure amounts received by the respective components 31 to 37 on the inspection object 12 are predicted, recorded, and output. The "prediction" is a process of predicting the exposure dose to the inspection object 12 before the X-ray inspection is performed. This prediction result can be applied to, for example, verifying whether the X-ray irradiation conditions are appropriate, determining whether or not to perform an X-ray inspection of the inspection target 12, and the like. The "recording" is a process of calculating the exposure amount actually received by the inspection object 12 when the X-ray inspection is performed, and storing the calculated exposure amount as a log. The recorded log data is disclosed to the manufacturer of the supplier, the consumer, and the like in the subsequent step as proof of the exposure of the test object 12.
Here, in the inspection object 12 including a plurality of components such as a surface mount substrate, the following is preferably considered in predicting or recording the exposure dose for the X-ray inspection.
(1) In a single X-ray inspection, a plurality of X-ray irradiations are often performed while changing the X-ray irradiation conditions. In this case, the number of times of irradiation (the number of times of X-ray irradiation) and the amount of irradiation may be different depending on the component. For example, in the example of fig. 5A to 5C, the number of irradiation times of the member 31 is one, and the number of irradiation times of the member 34 is two. Therefore, it is necessary to calculate the exposure dose to each part at each X-ray exposure and calculate the total dose.
(2) The dose within the irradiation range is not constant. Since the intensity of X-rays is inversely proportional to the square of the propagation distance, for example, in the case of a general cone-beam X-ray source, the dose at the center of the irradiation range is the largest, and the dose is smaller toward the end. The dose distribution in the irradiation range can be calculated by knowing the specifications of the X-ray source 100 (irradiation angle (spread angle) of the beam, etc.), the geometric positional relationship between the X-ray source 100 and the inspection object 12, and the irradiation conditions (tube voltage, tube current, irradiation time, etc.) of the X-ray source 100.
(3) Since the X-ray has high transmittance, the members ( members 36 and 37 in fig. 5A) disposed on the back surface of the substrate are also irradiated with the X-ray. However, when the front surface member and the printed substrate are transmitted, a part of the energy of the X-rays is absorbed and the X-rays are attenuated, and therefore, the irradiation amount of the back surface member is smaller than that of the front surface member. The attenuation of X-rays depends on the design of the substrate, such as the thickness and material of the printed substrate, and the arrangement of surface members (for example, when a glass epoxy substrate having a thickness of 1mm is transmitted, the amount of irradiation is reduced by about 60%). Therefore, the irradiation amount of the back surface member should be calculated in consideration of the attenuation of the X-ray by the printed substrate itself and the front surface member.
(4) Depending on the type of component, the irradiation tolerance may vary. Therefore, it is preferable to manage the irradiation amount and the allowable amount for each component.
(irradiation amount management device)
Referring to fig. 1, the configuration of the exposure dose management apparatus 11 will be described. The exposure amount management device 11 includes, as its functions: a data input unit 110, an exposure amount calculation unit 111, a determination unit 112, and an information output unit 113. The data input unit 110 is a mechanism for acquiring various data used for calculating the exposure dose. The exposure dose calculation unit 111 is a mechanism that calculates the exposure dose of the inspection object to the X-ray inspection. The determination unit 112 is a mechanism for determining whether or not the irradiation amount is within the allowable amount for each component. The information output unit 113 is a mechanism for outputting information on the irradiation amount of the inspection target object to the display device 114 or an external device (not shown).
The irradiation amount management device 11 may be constituted by a general-purpose computer including, for example, a CPU (processor), a memory, a storage device (hard disk or the like), an input device (keyboard, mouse, touch panel or the like), a display device 114, a communication I/F, and the like. In this case, the irradiation dose management apparatus 11 may be realized by one computer or may be realized by cooperation of a plurality of computers. For example, techniques of distributed computing or cloud computing may also be utilized. Each function of the exposure amount management device 11 of the present embodiment is realized by executing a necessary program by a CPU. However, a part or all of the functions may be configured by a Circuit such as an ASIC (application specific Integrated Circuit) or an FPGA (Field-Programmable Gate Array).
(calculation of dose)
An example of the process of calculating the irradiation dose by the irradiation dose management device 11 will be described with reference to the flowchart of fig. 6. Here, assuming that the double-sided substrate shown in fig. 3A and 3B is taken as an example and the X-ray inspection is performed on the double-sided substrate under the X-ray irradiation conditions shown in fig. 4, the irradiation amounts to the plurality of components 31 to 37 on the substrate are predicted.
First, the data input unit 110 acquires data necessary for calculating the irradiation amount (step S60). The data required for calculating the irradiation amount is, for example, X-ray irradiation conditions, X-ray source information, object information, and the like. The irradiation conditions are information for calculating the irradiation position and intensity of the X-ray, and as an example shown in fig. 4, the irradiation conditions may include the irradiation position of each X-ray irradiation performed in one X-ray examination, the distance from the X-ray source 100, the tube voltage, the tube current, the irradiation time, and the like. The X-ray source information is information for calculating the shape, size, and intensity distribution of the X-ray irradiation range. In the case of the X-ray source 100 of the cone beam type or the fan beam type, as one example shown in fig. 7, as the X-ray source information, a beam irradiation angle (spread angle) can be acquired. The object information is information on the inspection object 12 of the X-ray inspection. Fig. 8 shows an example of object information on the double-sided substrate shown in fig. 3A and 3B. Here, the target information includes the size, thickness, material, and the like of the substrate, which are information on the printed substrate, or the number of components, the front and rear surfaces of the substrate, the position on the substrate, the size, the irradiation tolerance, and the like, which are information on the components. The X-ray irradiation conditions, X-ray source information, and object information can be acquired from an inspection program and/or a setting file of the X-ray inspection apparatus 10. In fig. 1, these pieces of information are acquired from the storage unit 105 of the X-ray inspection apparatus 10, but the information may be acquired from another apparatus (a host system of the X-ray inspection apparatus 10, a storage device storing data, or the like).
Next, the dose calculation unit 111 calculates a dose map of the substrate surface (the surface on the radiation source side) based on the X-ray source information and the X-ray irradiation conditions acquired in step S60 (step S61). The dose map is data representing the dose at each position on the substrate, and is recorded, for example, in the form of two-dimensional image data. The intensity of the X-rays is inversely proportional to the square of the distance from the X-ray source 100, proportional to the square of the tube voltage, proportional to the tube current, and proportional to the exposure time. Therefore, the value of the irradiation amount for each position on the substrate can be calculated based on the positional relationship between the X-ray source 100 and the substrate and the intensity of the X-rays irradiated from the X-ray source 100. In this case, the irradiation amount may be calculated by only theoretical calculation, or may be calculated by performing correction corresponding to different irradiation conditions on actual measurement values measured in advance under predetermined conditions. Examples of the latter include the following: when the actual measurement value at the tube current of 100uA is known, the irradiation dose at the tube current of 110uA is calculated by the following formula.
The irradiation dose at the tube current 110uA is equal to the actually measured value at the tube current 100uA × correction coefficient 1.1
When X-ray irradiation is performed a plurality of times in one X-ray examination, that is, when the X-ray irradiation conditions include conditions relating to a plurality of fields of view, the irradiation dose maps of the respective X-ray irradiations are obtained and synthesized (cumulatively added) to be the final irradiation dose map.
Next, the dose calculation unit 111 calculates a dose map of the back surface (the surface opposite to the radiation source) of the substrate based on the dose map of the front surface calculated in step S61 and the target information (step S62). Specifically, the irradiation dose calculation unit 111 calculates the absorption dose of the substrate based on the thickness and material of the substrate, and calculates the absorption dose of the surface member with respect to the arrangement of the surface member. Then, the irradiation dose calculation unit 111 calculates the value of the irradiation dose on the back surface of the substrate by subtracting the absorption dose of the substrate and the absorption dose of the front surface member from the value of the irradiation dose on the front surface calculated in step S61.
The absorbed dose of the substrate may be calculated based on an actual measurement value measured in advance, or may be estimated from a result obtained by actually performing X-ray imaging on a portion of the substrate where no component is present. The absorbed dose of each component may be a predetermined value (fixed value) or may be changed depending on the component type or the component size (height) (for example, the absorbed dose for each component type may be acquired from a database), or may be estimated from the result of actually performing X-ray imaging on the portion of the substrate where the component is present.
Subsequently, the processing of steps S63 to S65 is repeated for all the components on the substrate (step S66). Hereinafter, a component to be processed is referred to as a focused component.
In step S63, the irradiation dose calculation unit 111 calculates the irradiation dose of the target member. Specifically, the irradiation amount calculation unit 111 calculates a representative value of the irradiation amount in the region occupied by the attention member using an irradiation amount map of the surface (front surface or back surface) where the attention member is present, and sets the value as the irradiation amount of the attention member. As the representative value, a total value, an average value, a maximum value, a median value, or the like can be used. Note that a plurality of values (for example, an average value, a maximum value, and the like) described above may be used as an index indicating the irradiation amount of the target member.
In step S64, the irradiation dose calculation unit 111 acquires the irradiation tolerance of the target member from the target information (see fig. 8). However, the method of acquiring the irradiation tolerance is not limited to this. For example, a predetermined value (fixed value) may be uniformly applied to all the components, the irradiation tolerance may be acquired for each component type from a database, and the irradiation tolerance may be calculated based on information such as the type of the component, the material of the component, and the size input as the target information.
In step S65, the determination part 112 determines whether the irradiation amount of the component of interest is within the irradiation tolerance by comparing the irradiation amount of the component of interest calculated in step S63 with the irradiation tolerance of the component of interest acquired in step S64.
After the final processing of the components is completed (yes in step S66), the information output unit 113 outputs the dose maps of the front and back surfaces of the substrate, the dose of each component, the determination result thereof, and the like to the display device 114 (step S67).
Fig. 9A is a display example of an irradiation dose pattern of the substrate surface, and fig. 9B is a display example of an irradiation dose pattern of the substrate back surface. In this example, the magnitude of the irradiation amount is represented by gradation, and the closer to white the smaller the irradiation amount, the closer to black the larger the irradiation amount. In addition, rectangular frames represent the arrangement of components on the front and back surfaces, respectively. With such an exposure dose map, the distribution of the exposure dose on the front surface and the back surface of the substrate and the magnitude of the exposure dose of each member can be intuitively understood. In particular, by irradiating X-rays a plurality of times, the location where the irradiation amount is integrated can be easily identified. Further, as shown in fig. 9B, by showing an irradiation dose map in consideration of the absorbed doses of the substrate and the front surface member, it is also possible to accurately grasp the irradiation dose of the member on the back surface of the substrate. The method of illustrating the dose map is not limited to this, and any method may be used. For example, the magnitude of the irradiation amount (also referred to as a heat map) may be represented by a pseudo color, or may be represented by a contour diagram. In addition, an exposure dose map (computer drawing) may be superimposed on the substrate image to be displayed.
Fig. 10 is an example of the irradiation amount and the determination result of each member shown in a table format. Each part shows a part number, the front/back surface of the substrate, the irradiation amount, and the determination result. The component whose irradiation dose exceeds the allowable dose may be highlighted or blinked to alert the user as indicated by component number 5.
Fig. 11A and 11B are examples of the exposure amount and the determination result of the component shown in the form of layout diagrams. Rectangles indicating the respective members are shown on the front and back surfaces of the substrate, respectively, and the irradiation dose is indicated in the member rectangles. The color (or gradation) of the component rectangle indicates the magnitude of the irradiation amount. In addition, the user can be reminded by highlighting or blinking the member whose irradiation amount exceeds the allowable amount. It should be noted that fig. 10 and fig. 11A and 11B may be displayed, and if the user specifies (e.g., clicks) the rectangle of the part in fig. 11A or 11B, the detailed information of the part may be displayed, or the row of the table in fig. 10 may be highlighted automatically.
(advantages of the present embodiment)
According to the configuration of the present embodiment described above, the irradiation amount of each member is calculated based on the irradiation amount distribution of the front surface (surface on the side of the radiation source) and the irradiation amount distribution of the back surface (surface on the side opposite to the radiation source) of the inspection target, and therefore, the irradiation amount of the front surface member and the irradiation amount of the back surface member can be calculated with high accuracy. Further, since the absorption of X-rays by the printed circuit board and the absorption of X-rays by the front surface member are taken into consideration, the irradiation amount of the member disposed on the rear surface can be calculated with high accuracy. Therefore, the apparatus of the present embodiment is preferably applied to the irradiation dose management of not only the single-sided mounted substrate on which the component is mounted on one side but also the double-sided mounted substrate on which the component is mounted on both sides.
In the present embodiment, the irradiation dose maps of the front and back surfaces of the inspection object, the irradiation dose for each component, the result of determination as to whether or not the irradiation dose for each component is an allowable dose, and the like are output to the display device. By providing such information to the user, it is convenient to grasp and manage the exposure dose of each component at the time of X-ray examination.
< second embodiment >
An X-ray inspection system according to a second embodiment of the present invention is described with reference to fig. 12 and 13. Fig. 12 is a diagram showing the configuration of the X-ray inspection system according to the second embodiment, and fig. 13 is a flowchart of the process of calculating the dose according to the second embodiment. In the second embodiment, the cumulative exposure amount in a plurality of X-ray examinations is calculated by referring to the history of X-ray examinations performed on the same examination object in the past, while the exposure amount in one X-ray examination is calculated in the first embodiment. Only the specific configuration and processing in the second embodiment will be described below, and the description of the configuration and processing similar to those in the first embodiment will be omitted.
As shown in fig. 12, the dose management apparatus 11 of the present embodiment includes an inspection history storage unit 115 and a dose update unit 116 in addition to the functional configuration of the first embodiment. The inspection history storage unit 115 is a database that stores inspection histories for each inspection target (substrate in the present embodiment). The inspection history is information on the history of X-ray inspection performed on the inspection target in the past. The information that can calculate the cumulative exposure amount of the inspection target object may be any information, and for example, the number of previous inspections or the exposure amount received in the previous inspections may be used as the inspection history. The dose update unit 116 is a mechanism for integrating the dose in the X-ray examination performed in the past with the dose calculated by the dose calculation unit 111 based on the examination history.
The processing for calculating the irradiation dose according to the present embodiment will be described with reference to the flowchart of fig. 13. In the flowchart of fig. 13, the same process steps as those of the first embodiment (fig. 6) are assigned the same step numbers, and detailed description thereof is omitted.
First, the data input unit 110 acquires data necessary for calculating the irradiation amount (step S60). Next, the dose calculation unit 111 calculates a dose map of the front surface (the surface on the radiation source side) of the substrate based on the X-ray source information and the X-ray irradiation conditions acquired in step S60 (step S61). The dose calculation unit 111 calculates a dose map of the back surface (the surface opposite to the radiation source) of the substrate based on the dose map of the front surface calculated in step S61 and the target information (step S62). The processing up to this point is the same as in the first embodiment.
Next, the dose update unit 116 acquires the ID of the inspection target through the data input unit 110 (step S130). The ID (identification number) of the inspection target may be input by the user, may be identified by reading a barcode, a two-dimensional code, an IC tag attached to the substrate, or a number printed on the substrate, or may be notified from an external device (for example, a host system that manages the production line).
Next, the exposure dose update unit 116 acquires an inspection history corresponding to the ID of the inspection target object from the inspection history storage unit 115 (step S131). In the present embodiment, the inspection history is acquired from the inspection history storage unit 115 provided in the apparatus, but the inspection history may be acquired from an external database, an X-ray inspection apparatus, a higher-level system, or the like.
Next, the dose update unit 116 updates the front and back doses calculated in steps S61 and S62, respectively, based on the inspection history of the inspection target (step S132). For example, when the number of past inspections is acquired as the inspection history, the integrated irradiation dose can be calculated by the following equation using the irradiation dose of this time (the irradiation dose calculated in steps S61 and S62) and the number of past inspections.
Cumulative dose x (number of past inspections +1)
Alternatively, when the past irradiation amount is obtained as the inspection history, the integrated irradiation amount can be calculated by the following equation.
The cumulative dose is the current dose plus the previous dose
The updating method described here is an example, and the accumulated load may be obtained by another calculation method.
By the above processing, the integrated dose maps of the front surface and the back surface are obtained, respectively. The subsequent processing (steps S63 to S67) is the same as the first embodiment, except that the integrated dose map is used instead of the dose map.
(advantages of the present embodiment)
The mechanism according to the present embodiment described above has not only the same advantages as those of the first embodiment but also the following advantages: when an object to be inspected is subjected to a plurality of X-ray inspections, the distribution of the cumulative exposure dose of the object to be inspected and the cumulative exposure dose of each component can be grasped and managed.
< other embodiment >
The structure of the above embodiment is merely a specific example of the present invention. The scope of the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the technical idea.
For example, in the above-described embodiment, the double-sided mounting board is described as the inspection object, but the present invention can also be applied to inspection of a component group stacked on a component tray (tray inspection). In the above-described embodiment, the X-ray irradiation is performed only from above, but the present invention can also be applied to an inspection in which X-rays are irradiated from both above and below. In this case, the above-described irradiation amount calculation process may be performed for each of the case of irradiation from the upper surface and the case of irradiation from the lower surface, and the total irradiation amount may be calculated by summing the irradiation amounts.
Claims (10)
1. An exposure dose management apparatus comprising:
an exposure amount calculation unit for calculating the exposure amount of the object to be inspected by the X-ray inspection,
an information output unit that outputs information relating to an irradiation amount of the inspection target,
the exposure amount management device is characterized in that,
the inspection object includes a double-sided mounting board having a printed board, a member disposed on a first surface which is a surface on the radiation source side of the printed board, and a member disposed on a second surface which is a surface on the opposite side of the printed board from the radiation source,
the exposure dose calculation unit calculates the distribution of the exposure dose of the first surface based on the positional relationship between the radiation source and the inspection object in the X-ray inspection and the intensity of the X-ray irradiated from the radiation source,
the exposure dose calculation unit calculates a distribution of the exposure dose on the second surface by subtracting the absorbed dose of the printed circuit board and the absorbed dose of a member disposed on the first surface from the exposure dose on the first surface,
the irradiation amount calculation section calculates an irradiation amount of the component in the first surface based on a distribution of the irradiation amount of the first surface and a configuration of the component in the first surface,
the irradiation amount calculation section calculates the irradiation amount of the component in the second surface based on the distribution of the irradiation amount of the second surface and the arrangement of the component in the second surface.
2. The apparatus for managing exposure to radiation according to claim 1, wherein the apparatus for managing exposure to radiation comprises
When the X-ray irradiation is performed a plurality of times in one X-ray examination, the irradiation amount calculation unit calculates the irradiation amount for each X-ray irradiation, and calculates the distribution of the irradiation amount in one X-ray examination by cumulatively adding the irradiation amounts.
3. The irradiation amount management device according to claim 1 or 2,
the irradiation amount calculation unit calculates an irradiation amount for each of the members based on the irradiation amount for each of the members calculated by the irradiation amount calculation unit.
4. The irradiation amount management device according to claim 1 or 2,
further comprising:
an inspection history storage unit for storing the history of the X-ray inspection performed on the inspection object in the past,
and an exposure dose updating unit that integrates, based on the history, an exposure dose for which an X-ray inspection has been performed in the past with the exposure dose distribution and/or the exposure dose for each component calculated by the exposure dose calculating unit.
5. The irradiation amount management device according to claim 1 or 2,
the information output unit outputs an exposure dose map indicating the distribution of exposure doses to a display device.
6. The irradiation amount management device according to claim 1 or 2,
the information output unit outputs information indicating the irradiation amount of each component to a display device.
7. The irradiation amount management device according to claim 1 or 2,
the information output unit outputs information indicating whether or not the irradiation amount of each component is an allowable amount to a display device.
8. An X-ray inspection system having:
an X-ray inspection apparatus for performing an X-ray inspection of an object to be inspected,
the exposure management device according to any one of claims 1 to 7, which outputs information on an exposure of the inspection object to the X-ray inspection.
9. An exposure dose management method comprising:
an exposure amount calculation step of calculating an exposure amount of the object to be inspected by the X-ray inspection,
an information output step of outputting information on an irradiation amount of the inspection target,
the method of managing an exposure amount is characterized in that,
the inspection object includes a double-sided mounting board having a printed board, a member disposed on a first surface which is a surface on the radiation source side of the printed board, and a member disposed on a second surface which is a surface on the opposite side of the printed board from the radiation source,
the exposure amount calculating step includes:
a step of calculating a distribution of an irradiation amount of the first surface based on a positional relationship between the radiation source and the inspection object in the X-ray inspection and an intensity of X-rays irradiated from the radiation source,
calculating a distribution of the irradiation dose of the second surface by subtracting the absorbed dose of the printed circuit board and the absorbed dose of a member disposed on the first surface from the irradiation dose of the first surface,
calculating an irradiation amount of the component in the first surface based on a distribution of the irradiation amount of the first surface and a configuration of the component in the first surface,
a step of calculating an irradiation amount of the component in the second surface based on a distribution of the irradiation amount of the second surface and a configuration of the component in the second surface.
10. A computer-readable storage recording medium on which a computer program for executing the steps of the irradiation amount management method according to claim 9 in a computer is stored.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016201838A JP6468270B2 (en) | 2016-10-13 | 2016-10-13 | Exposure dose management apparatus and exposure dose management method |
| JP2016-201838 | 2016-10-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107941826A CN107941826A (en) | 2018-04-20 |
| CN107941826B true CN107941826B (en) | 2020-06-02 |
Family
ID=61765023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710816155.6A Active CN107941826B (en) | 2016-10-13 | 2017-09-11 | Irradiation dose management device and irradiation dose management method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6468270B2 (en) |
| CN (1) | CN107941826B (en) |
| DE (1) | DE102017216671A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021162523A (en) * | 2020-04-02 | 2021-10-11 | 株式会社サキコーポレーション | Inspection device |
| DE102020205996A1 (en) * | 2020-05-13 | 2021-11-18 | Friedrich-Alexander-Universität Erlangen-Nürnberg | Dose estimation for the irradiation of an object |
| JP7501167B2 (en) | 2020-07-03 | 2024-06-18 | オムロン株式会社 | X-ray inspection equipment |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5812629A (en) * | 1997-04-30 | 1998-09-22 | Clauser; John F. | Ultrahigh resolution interferometric x-ray imaging |
| JPH1119082A (en) * | 1997-06-30 | 1999-01-26 | Toshiba Corp | Image reconstructing apparatus |
| US6744848B2 (en) * | 2000-02-11 | 2004-06-01 | Brandeis University | Method and system for low-dose three-dimensional imaging of a scene |
| JP3999176B2 (en) * | 2003-08-20 | 2007-10-31 | ジーイー・メディカル・システムズ・グローバル・テクノロジー・カンパニー・エルエルシー | X-ray CT apparatus, information processing method, storage medium, and program |
| JP4127698B2 (en) * | 2005-04-25 | 2008-07-30 | アンリツ産機システム株式会社 | X-ray inspection equipment |
| JP4127699B2 (en) * | 2005-04-25 | 2008-07-30 | アンリツ産機システム株式会社 | Density data conversion method and apparatus, and X-ray inspection system |
| JP5002251B2 (en) * | 2006-12-06 | 2012-08-15 | 日本電子株式会社 | Sample inspection method and sample inspection apparatus |
| JP2008224606A (en) * | 2007-03-15 | 2008-09-25 | Omron Corp | X-ray inspection device and x-ray inspection method using x-ray inspection device |
| JP2008284294A (en) * | 2007-05-21 | 2008-11-27 | Toshiba Corp | Radiation control device, and medical image diagnosis apparatus with the same |
| US7453980B1 (en) * | 2007-06-25 | 2008-11-18 | Gilevich Alexander I | Apparatus and method for acquiring an image of an object |
| FR2950059B1 (en) * | 2009-09-16 | 2016-09-16 | Jacret | COMPOSITION FOR STRUCTURAL ADHESIVE |
| JP2011179936A (en) * | 2010-03-01 | 2011-09-15 | Shimadzu Corp | X-ray inspection system |
| JP2012163352A (en) * | 2011-02-03 | 2012-08-30 | Yamaha Motor Co Ltd | Management system of x-ray exposure amount |
| JP5283718B2 (en) * | 2011-02-09 | 2013-09-04 | 富士フイルム株式会社 | Radiation image detection apparatus and gain setting method used for radiation image detection apparatus |
| EP2778662B1 (en) * | 2011-11-09 | 2015-09-23 | Yamaha Hatsudoki Kabushiki Kaisha | X-ray inspection method and device |
| CN104812309B (en) * | 2012-11-15 | 2018-09-18 | 东芝医疗系统株式会社 | System is managed by dose of radiation |
| JP6109650B2 (en) * | 2013-06-06 | 2017-04-05 | 東芝メディカルシステムズ株式会社 | X-ray diagnostic apparatus, exposure management apparatus, scattered radiation dose distribution forming method, and scattered radiation dose distribution forming program |
-
2016
- 2016-10-13 JP JP2016201838A patent/JP6468270B2/en active Active
-
2017
- 2017-09-11 CN CN201710816155.6A patent/CN107941826B/en active Active
- 2017-09-20 DE DE102017216671.1A patent/DE102017216671A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE102017216671A1 (en) | 2018-04-19 |
| CN107941826A (en) | 2018-04-20 |
| JP2018063183A (en) | 2018-04-19 |
| JP6468270B2 (en) | 2019-02-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107941826B (en) | Irradiation dose management device and irradiation dose management method | |
| CN107533018B (en) | X-ray inspection apparatus, X-ray inspection method, and method for manufacturing structure | |
| US9897560B2 (en) | Screening of electronic components for detection of counterfeit articles using automated inspection system | |
| JP4944892B2 (en) | Method and apparatus for performing security inspection on liquid articles using radiation | |
| US10054432B2 (en) | X-ray inspection apparatus and control method | |
| US20110222647A1 (en) | X-ray inspection apparatus and x-ray inspection method | |
| EP3190403A1 (en) | Measurement processing device, measurement processing method, measurement processing program, and structure production method | |
| EP3190402B1 (en) | Measurement processing device, x-ray inspection apparatus, method for manufacturing a structure, measurement processing method and measurement processing program | |
| CN112013765A (en) | Method for improving measurement accuracy of size marking system | |
| CN105074896A (en) | Pattern-measuring apparatus and semiconductor-measuring system | |
| US8548121B2 (en) | X-ray analyzer | |
| JPWO2017130550A1 (en) | Defect inspection apparatus, method and program | |
| US7256392B2 (en) | Inspection method of radiation imaging system and medical image processing apparatus using the same, and phantom for use of inspection of radiation imaging system | |
| CN117589109B (en) | Quality detection and control method for quartz center tray manufacturing process | |
| CN109997028B (en) | Method and apparatus for adjusting determination condition of whether or not inspection object is good | |
| JP5028570B2 (en) | Method and apparatus for inspecting a measurement object using invasive radiation | |
| EP3258251B1 (en) | Image reconstruction method for x-ray measurement device, method for manufacturing structure, image reconstruction program for x-ray measurement device, and x-ray measurement device | |
| JP2007014775A (en) | Method of canceling impact of physical property variability on image quality performance of digital imaging system | |
| US9299135B2 (en) | Detection of weak points of a mask | |
| CN109839391A (en) | Detect the method and apparatus for carrying out the process of defect | |
| JP2013190361A (en) | X-ray inspection device and method for controlling the same | |
| EP2113767A1 (en) | Computed tomography systems and related methods involving localized bias | |
| JP6625478B2 (en) | Pattern defect inspection method and pattern defect inspection device | |
| CN114781174A (en) | Method and device for predicting residual fatigue life of mechanical component and electronic equipment | |
| CN113424191A (en) | Computer-implemented method of analyzing measurement data from measurements on an object |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |