CN107924038B - Optical member and light irradiation device - Google Patents
Optical member and light irradiation device Download PDFInfo
- Publication number
- CN107924038B CN107924038B CN201680050043.8A CN201680050043A CN107924038B CN 107924038 B CN107924038 B CN 107924038B CN 201680050043 A CN201680050043 A CN 201680050043A CN 107924038 B CN107924038 B CN 107924038B
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- Prior art keywords
- adhesive
- optical element
- holder
- optical
- recess
- Prior art date
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- 230000003287 optical effect Effects 0.000 title claims abstract description 113
- 239000000853 adhesive Substances 0.000 claims abstract description 97
- 230000001070 adhesive effect Effects 0.000 claims abstract description 95
- 239000007769 metal material Substances 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 9
- 229920001187 thermosetting polymer Polymers 0.000 claims description 5
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 230000008602 contraction Effects 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 229920002050 silicone resin Polymers 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 2
- 239000003522 acrylic cement Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mounting And Adjusting Of Optical Elements (AREA)
- Lens Barrels (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Securing Globes, Refractors, Reflectors Or The Like (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Provided is a structure which, in an optical component in which an optical element is fixed to a holder made of a metal material via an adhesive, can prevent the adhesive from being cut due to a difference in linear expansion coefficient between the holder and the optical element, and can appropriately maintain the relative positional relationship between the optical element and the holder. The holder is characterized in that a recess is formed in a mounting surface on which the optical element is mounted, the recess is filled with the adhesive, and the optical element is fixed to the holder by the adhesive.
Description
Technical Field
The present invention relates to an optical member and a light irradiation device, and more particularly, to an optical member in which an optical element is bonded to a holding frame, and a light irradiation device using the optical member.
Background
In recent years, a discharge lamp has been switched to an LED as a light source for an application using light.
The emission beam per chip of the LED is less compared to a discharge lamp. Therefore, light emitted from a plurality of LEDs is required to be condensed to be irradiated with light, and an optical system is required for this purpose. For example, japanese patent application laid-open No. 2014-3086 (patent document 1) describes a technique of an optical system capable of efficiently acquiring light emitted from a light source constituted by a plurality of LEDs to an integrator.
According to the technique described in patent document 1, in order to effectively utilize light emitted from a plurality of LEDs, a more precise optical design is required, and in device design, it is required to suppress variations in installation and fixation of optical components (optical components such as a condenser lens, a collimator lens, and an integrator), and it is necessary to fix the optical components with high accuracy.
As shown in fig. 8, in a light irradiation device including such an LED, an optical member 30 in which an optical element 32 made of a transparent member is attached to an upper portion of a metal holder 31 with an adhesive 33 is often used.
However, since the optical element 32 is a glass member and the difference in thermal expansion between the optical element and the metal holder 31 is large, there is a problem that a strong shear strain is applied to the adhesive 33 during a temperature change, and the bonding interface peels off. Such peeling of the bonding interface causes positional displacement or separation of the optical element 32, and it is difficult to maintain a desired optical design.
In particular, in the technical field described in patent document 1, the optical member for acquiring light emitted from the plurality of LEDs needs to be increased in size according to the number of LEDs to be mounted, but the difference in thermal expansion becomes more significant with the increase in size of the optical member, and the optical member is more likely to be displaced or detached.
Documents of the prior art
Patent document
Disclosure of Invention
Problems to be solved by the invention
In view of the above-described problems of the prior art, it is an object of the present invention to provide an optical component that does not cause positional deviation and detachment of an optical element due to peeling from a metal holder caused by temperature change.
Further, a structure of a light irradiation device using the optical member is desired.
Means for solving the problems
In order to solve the above problem, an optical component according to the present invention is an optical component including a holder made of a metal material and an optical element made of a light-transmitting member fixed to the holder via an adhesive, wherein a recess is formed in a mounting plane of the holder on which the optical element is mounted, the recess is filled with the adhesive, and the optical element is fixed to the holder by the adhesive.
In the optical member of the present invention, the optical element has a quadrangular shape, and the concave portions are formed at positions corresponding to four side edges of the optical element in the holder.
In the optical member of the present invention, the concave portions are formed along side edges of the optical element in a dispersed manner.
In the optical member of the present invention, the concave portion has a continuous groove shape extending along a side edge of the optical element.
Effects of the invention
According to the optical member of the present invention, since the recess is formed in the mounting plane on which the optical element is mounted and the adhesive is filled in the recess, the thickness of the adhesive can be secured to a large extent, and even if thermal strain occurs due to a difference in thermal expansion between the optical element and the holder, the strength against shear stress can be increased, and peeling of the bonding interface by the adhesive can be prevented.
This prevents the optical element from being positionally displaced or peeled off.
Drawings
Fig. 1 is a partially sectional plan view (a) and a side sectional view (B) of an optical member of the present invention.
Fig. 2 is an explanatory view of shear stress.
Fig. 3 is an explanatory view of the operation of the present invention in comparison with the conventional example.
FIG. 4 is a partial cutaway top view of other embodiments.
FIG. 5 is a partial cutaway top view of another alternative embodiment.
Fig. 6 is a partially enlarged view (a) of the portion a of fig. 5 and a sectional view (B) of B-B thereof.
Fig. 7 is a schematic view of the entire light irradiation device of the present invention.
Fig. 8 is a perspective view (a) and a side sectional view (B) of a conventional optical component.
Detailed Description
Fig. 1 (a) and (B) show an optical component 1 of the present invention, and an optical element 3 is mounted on and fixed to a mounting plane 4 of a metal holder 2.
Examples of the optical element 3 include a condenser lens, a collimator lens, and a fly-eye lens. The optical element 3 may include a portion having no optical function in part. For example, a margin portion (so-called reserved portion) that engages with the holder 2 may be provided at the periphery of the optical element 3.
A plurality of recesses 5, 5 are formed in the mounting surface 4 of the holder 2, and the recess 5 is filled with an adhesive 6. The optical element 3 is bonded and fixed by the adhesive 6.
In the embodiment of fig. 1, the holder 2 and the optical element 3 have a quadrangular shape in plan view, the concave portions 5 are formed at the respective side edges of the mounting plane 4, and the optical element 3 is bonded and fixed at the four side edges.
In addition, although the above-described example is shown in which one concave portion 5 is formed at each side edge, 2 or more concave portions may be formed at each side edge.
Since the thickness of the adhesive 6 to be filled into the recess 5 is determined according to the depth of the recess 5, the thickness of the adhesive 6 can be secured to a large extent by adjusting the depth of the recess 5.
The adhesive 6 used in the present invention may be any of various adhesives, for example, an epoxy adhesive containing an epoxy resin as a main component, an acrylic adhesive containing an acrylic resin as a main component, or the like. In addition, a thermosetting adhesive may be used, and for example, a silicone adhesive may be used.
The number of the recesses 5 formed in the mounting plane 4 of the holder 2 and the size or depth of the cross section of the recess 5 itself are determined according to the size of the optical element 3 and the type of the adhesive 6.
The depth of the recess 5 of the light irradiation device of the present invention was examined.
1. The use of thermosetting silicone-based adhesives
An example in which an optical element 3(100 × 100mm) made of silica glass was bonded to a holder 2 made of aluminum.
(1) The optical element 3 has a quadrangular shape, and is bonded at each side edge with an adhesive 6 filled in the concave portion 5. (the distance between the adhesives at the opposite side edges was set at 100mm)
(2) Coefficient of linear expansion of aluminum: 23X 10-6/K
(3) Linear expansion coefficient of silica glass: 0.5X 10-6/K
(4) After adhesive application, the temperature was increased from 20 ℃ (293K) to 150 ℃ (423K) (temperature difference 130K).
(5) The adhesive was cured at 150 deg.C (423K). In this case, the adhesive is not subjected to shear stress.
(6) When the temperature is lowered by cooling, both the holder 2 (aluminum) and the optical element 3 (silica glass) contract according to the linear expansion coefficient.
(7) The shrinkage of the holder 2 was 0.3mm, which was 100mm × 23 × 10-6/K × 130K.
(8) The shrinkage of the optical element 3 was 100mm × 0.5 × 10-6/K × 130K, 0.007 mm.
(9) The strain applied to the adhesive on one side was (0.3-0.007)/2-0.15 mm.
The shear strain applied to the adhesive was studied with reference to fig. 2.
(1) Let t be the thickness of the adhesive.
(2) The amount of strain when a force is applied in a direction perpendicular to the thickness direction is denoted by Δ t.
(3) At this time, the shear strain is defined as γ ═ Δ t/t.
(4) The strain at which the adhesive is cut is approximately 1. The amount of strain with which the binder is cut is a physical parameter determined by the material of the binder, and in the case of Si-based resins, the strain reaches about 1 to cut.
(5) Critical thickness of adhesive cut t0＝Δt/γ＝0.15/1＝0.15mm。
If there is no recess 5, then,
(1) the thickness of the adhesive was set to t 0.01 mm.
(2) The γ ═ Δ t/t is 0.15/0.01 ═ 15.
(3) When γ is 15 times the shear strain at the time of cutting the adhesive, the cutting is always caused.
Therefore, the depth of the recess needs to be 0.15mm or more in the above combination (the holder 2 is aluminum, the optical element 3 is silica glass, and the interval between the adhesives 6 on the opposite side edges is 100 mm).
In other words, a depth of 0.15% or more of the gap of the adhesive is required.
2. Next, a case where an epoxy-based adhesive or an acrylic-based adhesive is used as the adhesive 6 is examined. The conditions other than the following conditions are the same as those in the above "1. case of using a thermosetting silicone-based adhesive".
(1) The temperature of the optical element 3 was increased from room temperature 20 ℃ (293K) to an operating temperature 50 ℃ (323K) (temperature difference 30K).
(2) The adhesive was cured at 20 deg.C (293K). In this case, the adhesive is not subjected to shear stress.
(3) When the temperature rises to 50 ℃ (323K) due to the lighting of the LED, both the holder 2 (aluminum) and the optical element 3 (silica glass) expand according to the linear expansion coefficient.
(4) The holder 2 had an expansion of 100mm × 23 × 10-6/K × 30K, which was 0.08 mm.
(5) The expansion amount of the optical element 3 was 100mm × 0.5 × 10-6/K × 30K — 0.002 mm.
(6) The strain applied to the adhesive on one side was (0.08-0.002)/2-0.04 mm.
In the case of an epoxy-based adhesive or an acrylic adhesive, the strain at which the adhesive is cut is approximately 0.05.
The critical thickness of the adhesive cut is tc＝Δt/γ＝0.04/0.05＝0.8mm。
If there is no recess 5, then,
(1) the thickness of the adhesive was set to t 0.01 mm.
(2) The γ ═ Δ t/t ═ 0.04/0.01 ═ 4.
(3) When γ is 4, the shear strain is 80 times the shear strain when the adhesive is cut, and the cutting is always initiated.
Therefore, the depth of the recess needs to be 0.8mm or more in the above combination (the holder 2 is aluminum, the optical element 3 is silica glass, and the interval between the adhesives 6 on the opposite side edges is 100 mm).
In other words, a depth of 0.8% or more of the gap of the adhesive 6 is required.
The relationship between the thickness of the adhesive and the shear strain is schematically shown in fig. 4, and in the conventional structure (a) having no recess, since the thickness of the adhesive cannot be obtained largely, the shear strain based on the difference in deformation amount caused by thermal expansion or thermal contraction of the holder 2 and the optical element 3 is largely affected by the adhesive, and the shear resistance cannot be secured.
In contrast, in the present invention (B) having the concave portion, the shear strain is buffered by the thickness of the adhesive and dispersed in the thickness direction, and therefore the shear resistance is greatly improved.
In addition, in the conventional structure not including the recess, if the thickness of the adhesive is set to be the same as the depth of the recess of the present invention, the adhesive in a softened state is unstable in shape, and the instability becomes more remarkable as the thickness increases, and it is not realistic to maintain the relative positional relationship between the optical element and the holder, and further, the relative positional relationship between the optical element and the light source unit.
In contrast, in the present invention, since the recess is formed in the mounting plane of the holder, the relative positional relationship between the holder and the optical element can be sufficiently ensured by the mounting plane, and the thickness of the adhesive can be ensured at the same time.
Fig. 4 shows another embodiment. In the embodiment of fig. 1, the recessed portions 5 formed in the mounting plane 4 of the holder 2 are dispersed along the side edge of the optical element 3, but in the embodiment of fig. 4, the recessed portions 5 are formed as continuous grooves along the side edge of the optical element 3.
In fig. 5 and 6, another embodiment is shown in which a filling hole 7 that communicates with the recess 5 and opens to the outside is formed in the holder 2. According to this embodiment, when the optical element 3 is mounted, the optical element 3 is placed on the mounting plane 4 of the holder 2, and the adhesive 6 can be filled into the recess 5 through the filling hole 7. By pressing the optical element 3 against the mounting plane 4 with a predetermined pressure, unstable floating of the optical element 3 due to injection of the adhesive 6 is suppressed, and an appropriate relative positional relationship between the optical element 3 and the holder 2 is further ensured.
Fig. 7 shows an example of the light irradiation device 15 to which the optical member 1 is attached.
A light source unit 10 and an optical component 1 disposed on an optical axis of the light source unit 10 are disposed in a housing 16 of the light irradiation device 15, and the light source unit 10 is configured by disposing LEDs 12 in parallel on a substrate 11 and placing the substrate 11 on a support body 13. The optical member 10 is provided with a projection optical system 17, and light from the light source unit 10 is projected onto a light projection surface 18 via the optical member 1 → the projection optical system 17.
As an example, a collimator lens is provided as the optical element 3 in the optical component 1, and the optical element 3 is mounted on and fixed to the mounting plane 4 of the holder 2.
As described above, in the optical component according to the present invention including the holder made of a metal material and the optical element made of a light transmitting member fixed to the holder with an adhesive interposed therebetween, the thickness of the adhesive is sufficiently ensured by forming the recess in the mounting plane of the holder on which the optical element is mounted, filling the recess with the adhesive, and fixing the optical element to the holder with the adhesive, thereby relieving shear stress applied to the adhesive due to a difference in linear expansion coefficient between the holder and the optical element, and preventing the adhesive from being cut.
Further, the relative positional relationship between the optical element and the holder can be appropriately maintained by the mounting plane of the holder.
Description of the reference numerals
1 optical component
2 holding member
3 optical element
4 mounting plane
5 concave part
6 adhesive
7 filling the hole
10 light source unit
11 substrate
12 LED
13 supporting table
15 light irradiation device
16 case body
17 projection optical system
18 light projection surface
Claims (4)
1. An optical component comprising a holder made of a metal material and an optical element made of a light-transmitting member fixed to the holder via an adhesive,
a recess is formed in each side edge of a quadrangular mounting plane on which the optical element is mounted in the holder, the recess is filled with the adhesive, and the optical element is fixed to the holder by the adhesive,
the adhesive is a thermosetting silicone resin material, and the critical thickness t of the adhesive after cutting is0Is determined as t0＝Δt/γ，
Wherein,
Δ t is a strain applied to the adhesive based on a difference in deformation amount accompanying thermal expansion or thermal contraction of the holder and the optical element, and is an amount of strain of the adhesive when a force is applied to the adhesive in a direction perpendicular to a thickness direction of the adhesive,
γ is a shear strain of the adhesive, and is defined as γ ═ Δ t/t, where t is a thickness of the adhesive, Δ t, which is an amount of strain by which the adhesive is cut, is a physical parameter determined by a material of the adhesive, and γ, which is a shear strain by which the adhesive is cut, is about 1 in the case where the material of the adhesive is a silicone-based resin material,
the depth of the recess is the critical thickness t of the adhesive0The above.
2. The optical component of claim 1,
the concave portions are formed along the side edge of the optical element in a dispersed manner.
3. The optical component of claim 1,
the recess has a continuous groove shape extending along a side edge of the optical element.
4. A light irradiation device comprising a substrate on which a plurality of LEDs are mounted and an optical member disposed on the optical axis of the LEDs in a case of the device,
the optical component is composed of a holder made of a metal material and an optical element fixed to the holder via an adhesive,
a recess is formed in each side edge of a quadrangular mounting plane on which the optical element is mounted in the holder, the recess is filled with the adhesive, and the optical element is fixed to the holder by the adhesive,
the adhesive is a thermosetting silicone resin material, and the critical thickness t of the adhesive after cutting is0Is determined as t0＝Δt/γ，
Wherein,
Δ t is a strain applied to the adhesive based on a difference in deformation amount accompanying thermal expansion or thermal contraction of the holder and the optical element, and is an amount of strain of the adhesive when a force is applied to the adhesive in a direction perpendicular to a thickness direction of the adhesive,
γ is a shear strain of the adhesive, and is defined as γ ═ Δ t/t, where t is a thickness of the adhesive, Δ t, which is an amount of strain by which the adhesive is cut, is a physical parameter determined by a material of the adhesive, and γ, which is a shear strain by which the adhesive is cut, is about 1 in the case where the material of the adhesive is a silicone-based resin material,
the concave partIs the critical thickness t of the adhesive0The above.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015168874A JP6108293B2 (en) | 2015-08-28 | 2015-08-28 | Optical member and light irradiation device |
| JP2015-168874 | 2015-08-28 | ||
| PCT/JP2016/065592 WO2017038171A1 (en) | 2015-08-28 | 2016-05-26 | Optical member and optical irradiation device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107924038A CN107924038A (en) | 2018-04-17 |
| CN107924038B true CN107924038B (en) | 2021-03-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680050043.8A Active CN107924038B (en) | 2015-08-28 | 2016-05-26 | Optical member and light irradiation device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6108293B2 (en) |
| CN (1) | CN107924038B (en) |
| WO (1) | WO2017038171A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6504193B2 (en) * | 2017-03-30 | 2019-04-24 | 日亜化学工業株式会社 | Light emitting device |
| JP6913532B2 (en) * | 2017-06-28 | 2021-08-04 | 京セラ株式会社 | Optical semiconductor device storage package and optical semiconductor device |
| JP7398882B2 (en) * | 2019-05-09 | 2023-12-15 | 三菱電機株式会社 | Light source units, lamps and lighting equipment |
| JP6884189B2 (en) * | 2019-10-29 | 2021-06-09 | レノボ・シンガポール・プライベート・リミテッド | Portable information devices and their manufacturing methods |
| JP7395376B2 (en) * | 2020-02-06 | 2023-12-11 | Hoya株式会社 | light irradiation device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH03271707A (en) * | 1990-03-20 | 1991-12-03 | Fujitsu Ltd | Fixing structure for optical lens |
| JP4149184B2 (en) * | 2002-03-19 | 2008-09-10 | 株式会社エヌ・ティ・ティ・データ | Airspace design support system and method |
| JP2011197081A (en) * | 2010-03-17 | 2011-10-06 | Konica Minolta Business Technologies Inc | Optical scanning apparatus |
| JP2014003086A (en) * | 2012-06-15 | 2014-01-09 | Ushio Inc | Light irradiation device and exposure device |
-
2015
- 2015-08-28 JP JP2015168874A patent/JP6108293B2/en active Active
-
2016
- 2016-05-26 WO PCT/JP2016/065592 patent/WO2017038171A1/en active Application Filing
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2017044947A (en) | 2017-03-02 |
| WO2017038171A1 (en) | 2017-03-09 |
| CN107924038A (en) | 2018-04-17 |
| JP6108293B2 (en) | 2017-04-05 |
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