CN107918095A - Horizontal conducting film line testing piece and test method - Google Patents
Horizontal conducting film line testing piece and test method Download PDFInfo
- Publication number
- CN107918095A CN107918095A CN201711114142.0A CN201711114142A CN107918095A CN 107918095 A CN107918095 A CN 107918095A CN 201711114142 A CN201711114142 A CN 201711114142A CN 107918095 A CN107918095 A CN 107918095A
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- China
- Prior art keywords
- hole
- conducting film
- copper
- liquid medicine
- aperture
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention provides a kind of horizontal plating line conducting film testing piece and test method.The testing piece includes copper-clad base plate, and some through holes are set on the copper-clad base plate, to detect conducting film plating line backlight effect；The through hole at least has three kinds of apertures, the through hole in every kind of aperture at least 20, through hole spacing at least 0.25 mm in same aperture, spacing at least 0.4 mm of different pore size.Some strip base material exposed areas etched are further included, which is 2 10mm.Testing piece good test effect cost of the present invention is low, it uses the leftover pieces after sawing sheet to make, and is individually tested, it is not necessary to producing line qualified products are extracted, it is cost-effective, and do not influence production process.
Description
Technical field
The present invention relates to board production technical field.
Background technology
At present, conductive film production line generally uses horizontal plating line, and backlight must must have been monitored in production process, if during
Backlight occurs unqualified, then occurs that abnormal phenomenon is broken in hole, to product quality there are very big hidden danger, and backlight test then need by
The eligible line plate that horizontal plating line is produced is tested after cutting into slices, and the wiring board unit after section then must be scrapped,
While the circuit plate part beyond unit of cutting into slices can also be affected, such as the substantial amounts of dry film chip that can be scattered during section, these
Chip can influence the quality of other wiring boards in development.Backlight test mode is at present：Per hour 1 is randomly selected in producing line
Plate does section test, and slice position need to be in eligible line Slab element, and wiring board must the aperture containing 0.3MM（Aperture
Smaller, backlight difficulty is bigger, and existing industry conducting film line is more than or equal to 0.3MM apertures）, it is whole to do the wiring board that section is tested
Do and scrap processing.For this test mode for enterprise, cost is very high.
The content of the invention
In view of the above-mentioned problems, the present invention provides a kind of horizontal conducting film line testing piece and test method.
Horizontal conducting film line testing piece of the present invention, including copper-clad base plate, are set on the copper-clad base plate some logical
Hole, to detect conducting film plating line backlight effect；The through hole at least has three kinds of apertures, the through hole at least two in every kind of aperture
Ten, through hole spacing at least 0.25 mm in same aperture, spacing at least 0.4 mm of different pore size.
Preferably, the through hole includes aperture for the logical of 0.3 mm or at least one of 0.4 mm or 0.5 mm aperture
Hole.
Preferably, some strip electroplating liquid medicine detection zone strip electroplating liquid medicines are additionally provided with the copper-clad base plate
Detection zone, the electroplating liquid medicine detection zone are that the base material exposed region of formation is etched on copper-clad base plate.
Preferably, the strip electroplating liquid medicine detection zone width is 2-10mm.
Preferably, the electroplating liquid medicine detection zone include width for 2mm, 3mm, 4mm, 5mm, 6mm, 7mm, 8mm, 9mm,
The base material exposed region of at least one of 10mm width.
Preferably, the copper-clad base plate uses the rim charge after normal sawing sheet to make.
The present invention also provides a kind of horizontal conducting film line performance test methods, comprise the following steps：
（1）Test board makes：Copper-clad base plate is taken, drills out the through hole at least three kinds apertures respectively on it, every kind of aperture needs at least
20 holes, same aperture spacing 0.25MM, difference bore nozzle aperture spacing 0.4MM drillings；Etching obtains some on copper-clad base plate
Strip base material exposed region；
（2）Conducting film line liquid medicine is gathered, using Haring cell to step（1）Obtained test board carries out copper test, to liquid medicine
It can be judged；
If the base material exposed region of more than 5MM in 6MIN clocks can completely on full copper, judge that liquid medicine is stablized；
If the base material exposed region of 10MM within 6MIN minutes on full copper, judge that liquid medicine is in good condition；
If the base material exposed region of 2MM within the 6MIN can not on full copper, judge that liquid medicine is used to the groove time limit is changed, need to change medicine
Water.
（3）Again with conventional working condition production test plate, then cut into slices to the hole on test board, under the microscope
The translucent effect of hole wall vertical section is observed, backlight situation is judged according to translucent effect, completely light tight is backlight optimum state.
Preferably, step（3）In the hole in every kind of aperture at least choose 5 and carry out section observation.
Preferably, step（1）Described in through hole including aperture be 0.3 mm or at least one of 0.4 mm or 0.5 mm
The through hole in aperture.
Compared with prior art, the beneficial effects of the present invention are：Test method of the present invention can be accurately to leading
The liquid medicine performance and backlight situation of electrolemma line are tested, it is ensured that and conducting film line liquid medicine and backlight work under kilter, into
And ensure output products quality；The testing piece good test effect cost is low, it uses the leftover pieces after sawing sheet to make, individually into
Row test, it is not necessary to producing line qualified products are extracted, it is cost-effective, and do not influence production process.
Brief description of the drawings
Fig. 1 is testing piece structure diagram of the present invention.
Embodiment
In order to facilitate the understanding of those skilled in the art, the present invention is done below in conjunction with specific embodiment further detailed
Description.
Heretofore described horizontal conducting film line performance test methods, are to use the leftover pieces after sawing sheet to make test
Plate, test board is placed in production process with other plates to be processed and is together processed, so as to monitor the work feelings of production line backlight
Condition, in addition coordinates Haring cell to take producing line liquid medicine to be detected, realizes the monitoring to electroplating liquid medicine state.
As schemed, when it is implemented, test board need to first be made.Remaining leftover pieces after copper-clad base plate sawing sheet are taken, are divided on it
20 holes need at least be bored for 0.3 mm, 0.4 mm, through hole A, B, the C in 0.5 mm, tri- kinds of apertures, every kind of aperture by not drilling out aperture, together
One aperture spacing is arranged to 0.25MM, and different pore size spacing is arranged to 0.4MM, to detect the backlight situation of conducting film line.Again
Dry film is made, by exposing, developing, etching, some strip base material exposed regions are obtained on copper-clad base plate, is led for detecting
Electrolemma line liquid medicine situation.In the present embodiment strip base material exposed region include width for 2mm, 3mm, 4mm, 5mm, 6mm, 7mm,
At least one of 8mm, 9mm, 10mm wide base material exposed region D.
The method being detected using the test board is as follows：Conducting film line liquid medicine is gathered, using the Haring cell pair in laboratory
Obtained test board carries out copper test, and liquid medicine performance is judged, generally there is following several situations：（1）If the base of 10MM
Material exposed region within 6MIN minutes on full copper, then judge that liquid medicine is in good condition；（2）If the base material exposed area of more than 5MM
Domain in 6MIN clocks can completely on full copper, then judge that liquid medicine is stablized；（3）If the base material exposed region of 2MM nothing within 6MIN
Full copper in method, then judge that liquid medicine is used to the groove time limit is changed, and needs to change liquid medicine.The visual production quality demand of remaining situation to liquid medicine into
Row is replaced or processing., need to be with conventional working condition production test plate, then to test board when judging conducting film line backlight situation
On hole cut into slices, the hole in every kind of aperture is at least cut into slices more than 5, under the microscope observe hole wall vertical section printing opacity effect
Fruit, judges backlight situation according to translucent effect, and completely light tight is backlight optimum state, and the grade of backlight situation is according to printing opacity feelings
Condition judges that printing opacity is more, and backlight situation is poorer, and interpretation is carried out with specific reference to production requirement.
The part not illustrated in the present invention, can use this area conventional method to realize that this will not be repeated here.
It is the specific implementation of the present invention above, its description is more specific and detailed, but can not therefore be interpreted as
Limitation to the scope of the claims of the present invention.It should be pointed out that for those of ordinary skill in the art, this hair is not being departed from
On the premise of bright design, various modifications and improvements can be made, these obvious alternative forms belong to the present invention's
Protection domain.
Claims (10)
1. horizontal conducting film line testing piece, it is characterised in that：Including copper-clad base plate, some through holes are set on the copper-clad base plate,
To detect conducting film plating line backlight effect；The through hole at least has three kinds of apertures, the through hole at least 20 in every kind of aperture
It is a, through hole spacing at least 0.25 mm in same aperture, spacing at least 0.4 mm of different pore size.
2. horizontal conducting film line testing piece according to claim 1, it is characterised in that：It is 0.3 that the through hole, which includes aperture,
Mm or the through hole at least one of 0.4 mm or 0.5 mm aperture.
3. horizontal conducting film line testing piece according to claim 1, it is characterised in that：It is additionally provided with the copper-clad base plate
Some strip electroplating liquid medicine detection zones, the electroplating liquid medicine detection zone are naked to etch the base material of formation on copper-clad base plate
Reveal region.
4. horizontal conducting film line testing piece according to claim 3, it is characterised in that：The strip electroplating liquid medicine detection
Peak width is 2-10mm.
5. horizontal conducting film line testing piece according to claim 4, it is characterised in that：The electroplating liquid medicine detection zone bag
Include base material exposed region of the width at least one of 2mm, 3mm, 4mm, 5mm, 6mm, 7mm, 8mm, 9mm, 10mm width.
6. horizontal conducting film line testing piece according to claim 1, it is characterised in that：The copper-clad base plate use is just normally opened
Rim charge after material makes.
7. horizontal conducting film line performance test methods, comprise the following steps：
Test board makes：Copper-clad base plate is taken, drills out the through hole at least three kinds apertures respectively on it, every kind of aperture needs at least 20
Hole, same aperture spacing 0.25MM, difference bore nozzle aperture spacing 0.4MM drillings；Etching obtains some strips on copper-clad base plate
Shape base material exposed region；
Conducting film line liquid medicine is gathered, using Haring cell to step（1）Obtained test board carries out copper test, to liquid medicine performance into
Row judges；
If the base material exposed region of more than 5MM in 6MIN clocks can completely on full copper, judge that liquid medicine is stablized；
If the base material exposed region of 10MM within 6MIN minutes on full copper, judge that liquid medicine is in good condition；
If the base material exposed region of 2MM within the 6MIN can not on full copper, judge that liquid medicine is used to the groove time limit is changed, need to change medicine
Water.
8. then cut into slices to the hole on test board, observe under the microscope with conventional working condition production test plate again
The translucent effect of hole wall vertical section, judges backlight situation according to translucent effect, and completely light tight is backlight optimum state.
9. horizontal conducting film line performance test methods according to claim 7, it is characterised in that：Step（3）In every kind of hole
At least choose 5 and carry out section observation in the hole in footpath.
10. horizontal conducting film line performance test methods according to claim 7, it is characterised in that：Step（1）Described in lead to
Hole includes aperture for 0.3 mm or the through hole at least one of 0.4 mm or 0.5 mm aperture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711114142.0A CN107918095A (en) | 2017-11-13 | 2017-11-13 | Horizontal conducting film line testing piece and test method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711114142.0A CN107918095A (en) | 2017-11-13 | 2017-11-13 | Horizontal conducting film line testing piece and test method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107918095A true CN107918095A (en) | 2018-04-17 |
Family
ID=61895474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711114142.0A Pending CN107918095A (en) | 2017-11-13 | 2017-11-13 | Horizontal conducting film line testing piece and test method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107918095A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112954889A (en) * | 2021-01-20 | 2021-06-11 | 江门崇达电路技术有限公司 | Copper deposition process test board and manufacturing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205058222U (en) * | 2015-10-30 | 2016-03-02 | 陈少泉 | Utilize ecological plate of corner flitch production |
| CN106028665A (en) * | 2016-07-19 | 2016-10-12 | 深圳市迅捷兴电路技术有限公司 | Tin plating process capability test method |
-
2017
- 2017-11-13 CN CN201711114142.0A patent/CN107918095A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205058222U (en) * | 2015-10-30 | 2016-03-02 | 陈少泉 | Utilize ecological plate of corner flitch production |
| CN106028665A (en) * | 2016-07-19 | 2016-10-12 | 深圳市迅捷兴电路技术有限公司 | Tin plating process capability test method |
Non-Patent Citations (1)
| Title |
|---|
| 单术平 等: "有机高分子导电膜的应用现状及其导电性研究", 《印制电路信息》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112954889A (en) * | 2021-01-20 | 2021-06-11 | 江门崇达电路技术有限公司 | Copper deposition process test board and manufacturing method thereof |
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Application publication date: 20180417 |
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