CN107914102A - A kind of eutectic welding procedure and the cooler bin for being used for realization cooling technique in the technique - Google Patents
A kind of eutectic welding procedure and the cooler bin for being used for realization cooling technique in the technique Download PDFInfo
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- CN107914102A CN107914102A CN201711120396.3A CN201711120396A CN107914102A CN 107914102 A CN107914102 A CN 107914102A CN 201711120396 A CN201711120396 A CN 201711120396A CN 107914102 A CN107914102 A CN 107914102A
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- cooling section
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- babinet
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Links
- 238000001816 cooling Methods 0.000 title claims abstract description 110
- 238000000034 method Methods 0.000 title claims abstract description 44
- 230000005496 eutectics Effects 0.000 title claims abstract description 26
- 238000003466 welding Methods 0.000 title claims abstract description 19
- 239000000112 cooling gas Substances 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 19
- 238000010438 heat treatment Methods 0.000 claims abstract description 10
- 238000010992 reflux Methods 0.000 claims abstract description 9
- 230000003247 decreasing effect Effects 0.000 claims abstract description 6
- 239000007789 gas Substances 0.000 claims description 16
- 238000005192 partition Methods 0.000 claims description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000003754 machining Methods 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 230000035939 shock Effects 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- OUXCBPLFCPMLQZ-WOPPDYDQSA-N 4-amino-1-[(2r,3s,4s,5r)-4-hydroxy-5-(hydroxymethyl)-3-methyloxolan-2-yl]-5-iodopyrimidin-2-one Chemical compound C[C@H]1[C@H](O)[C@@H](CO)O[C@H]1N1C(=O)N=C(N)C(I)=C1 OUXCBPLFCPMLQZ-WOPPDYDQSA-N 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 229910000743 fusible alloy Inorganic materials 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003134 recirculating effect Effects 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
- B23K37/003—Cooling means for welding or cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Heat Treatment Of Articles (AREA)
Abstract
A kind of eutectic welding procedure and the cooler bin for being used for realization cooling technique in the technique.It is related to chip manufacture technology field.A kind of good stability, clear logic and high in machining efficiency are proposed, " winged core " problem is effectively avoided the occurrence of after use, so that rejection rate be greatly reduced, lift the eutectic welding procedure of product quality.For chip to be welded on frame, chip and frame are unidirectionally walked in track, eutectic welding procedure includes pre-heating technique, heating process, reflux technique and cooling technique, track is divided into preheating section, warming-up section, reflux section and cooling section, cooling technique is frame and chip is at the uniform velocity walked on cooling section, cooling section is equally divided into cooling section one, cooling section two, cooling section three and cooling section four along material direction of travel, the cooling gas that cooling section one, cooling section two, three temperature introduced below of cooling section are successively decreased successively, cooling section four are in room temperature environment.Rejection rate, lifting product quality is greatly reduced in the present invention.
Description
Technical field
The present invention relates to chip manufacture technology field, more particularly to the wherein improvement of the technique of eutectic welding.
Background technology
Eutectic weldering is also known as low-melting alloy welding, its fundamental characteristics is：Two kinds of different metals can be far below each molten
At a temperature of point alloy is formed in constant weight ratio.Golden chip is commonly carried on the back in the eutectic weldering for being presently used for diode chip for backlight unit
Eutectic welding is carried out between the silver-plated frame of copper, specifically, i.e., under certain temperature, certain pressure, by the golden chip of the back of the body in copper
Friction is gently rubbed on silver-plated frame, wipes the oxide layer of interfacial instability, makes to melt between contact surface, there are two solid phase shapes
Into a liquid phase, alloy is formed after cooling, chip is welded on frame, form good low-resistance Ohm contact.
However, people have found in actual processing, due to chip（It is made mostly of silicon）The coefficient of expansion be about 6, and frame
Frame（It is made of copper mostly）The coefficient of expansion be about 17.Although when eutectic welds by two kinds of metal mistakes of gold, silver between silicon and copper
Cross, but in larger-size chip load, still there is larger ratio to cause chip because the coefficient of expansion of silicon, copper has big difference
There is thermal expansion stress problem, i.e. chip is ruptured from frame, departed from（As shown in figure 4, it is commonly called as " winged core "）.
The content of the invention
The present invention has in view of the above problems, propose a kind of good stability, clear logic and high in machining efficiency, after use
Effect avoids the occurrence of " winged core " problem, so that rejection rate be greatly reduced, lift the eutectic welding procedure of product quality.
The technical scheme is that：For chip to be welded on frame, the chip and frame are unidirectional in track
Walking, the eutectic welding procedure include pre-heating technique, heating process, reflux technique and cooling technique, and the track is divided into pre-
Hot arc, warming-up section, reflux section and cooling section,
To make frame and chip at the uniform velocity walk on cooling section, the cooling section is averaged the cooling technique along material direction of travel
It is divided into cooling section one, cooling section two, cooling section three and cooling section four, the cooling section one, cooling section two, the lower section of cooling section three are logical
Enter the cooling gas that temperature is successively decreased successively, the cooling section four is in room temperature environment.
The cooling section one cooling gas introduced below is 400 DEG C, the cooling section two cooling gas introduced below
For 350 DEG C, the cooling section three cooling gas introduced below is 300 DEG C.
Thickness >=1.2um of the back of the body layer gold of the chip.
Thickness >=2um of the silver coating of the frame.
Cooling section one, cooling section two and cooling section three in the track are in cooler bin, and the cooler bin includes case
Body, a pair of of partition plate, three intake valves and a relief valve, the track run through the top of the babinet, the bottom surface of the babinet
Tapered into the spacing of track along material direction of travel, a pair of partition plate is fixedly connected with tank floor and partition plate
Leave gap in the bottom surface of apical margin and track so that the lower part of babinet is divided into space one, space two and space three by a pair of of partition plate,
The intake valve is fixedly connected on the bottom of babinet and for being passed through cooling gas, three intake valve difference into babinet
In the bottom in space one, space two and space three, the relief valve is fixedly connected on the top of babinet and for avoiding babinet
Interior air pressure is excessive.
The cooler bin further includes gas guide assembly, and the gas guide assembly is connected in babinet and is located at track
Top, the gas guide assembly includes chain, a pair of sprocket and some directing plates, and a pair of sprocket wheel is respectively hinged at case
The both sides of the inner wall of body, for the chain in a ring around being located on two sprocket wheels, some directing plates are vertically fixedly connected on chain
On the surface of bar and adjacent directing plate spacing it is equal.
The present invention carries out efficiently cooling section one, cooling section two, cooling section three by the cooling gas that temperature is successively decreased step by step
Cooling, and cooling section four is steadily cooled down by room temperature thereafter, and then finally material in orbit of walking is carried out
Cool down efficiently and smoothly, avoid material and occur the problem of temperature shock in cooling procedure, and then effectively prevent and " fly
The generation of core " phenomenon, is greatly reduced rejection rate, lifting product quality.
Brief description of the drawings
Fig. 1 is the temperature time curve figure that eutectic welds under traditional handicraft,
Fig. 2 is the theoretical temperatures time plot of eutectic weldering,
Fig. 3 is the actual temperature time plot that eutectic welds under cooling technique in this case,
Fig. 4 is the schematic diagram for flying core phenomenon,
Fig. 5 is the structure diagram of cooler bin in this case；
1 is track in figure, and 11 be cooling section one, and 12 be cooling section two, and 13 be cooling section three, and 14 be cooling section four, and 2 be babinet, 3
It is partition plate, 4 be intake valve, and 5 be relief valve, and 6 be gas guide assembly, and 61 be chain, and 62 be sprocket wheel, and 63 be directing plate.
Embodiment
As shown in Figs. 1-5, the main influencing factors that people have found to fly core in actual processing are temperature to the present invention, and chip
Temperature change when eutectic welds can be divided into：Preheating, heating, reflux and cooling, are to meet continuity in actual production
The requirement of processing, the production line of eutectic weldering is also corresponding to be divided into preheating zone, heating zone, recirculating zone and cooling zone, by core
The position that fragment is scattered after piece rupture, disengaging may determine that the generation for flying core phenomenon is concentrated in cooling zone, therefore, this
Case is made that following improvement to the processing technology in cooling zone：
For chip to be welded on frame, the chip and frame are unidirectionally walked in track, the eutectic welding procedure bag
Pre-heating technique, heating process, reflux technique and cooling technique are included, the track is divided into preheating section, warming-up section, reflux section and cooling
Section,
To make frame and chip at the uniform velocity walk on cooling section, the cooling section is averaged the cooling technique along material direction of travel
It is divided into cooling section one, cooling section two, cooling section three and cooling section four, the cooling section one, cooling section two, the lower section of cooling section three are logical
Enter the cooling gas that temperature is successively decreased successively, the cooling section four is in room temperature environment.It is cold so as to be successively decreased step by step by temperature
But gas efficiently cools down cooling section one, cooling section two, cooling section three, and cooling section four is carried out by room temperature thereafter
Steady cooling, and then efficient and smoothly cooling is finally carried out to material in orbit of walking, material is avoided cooled
Occur the problem of temperature shock in journey, and then effectively prevent the generation of " winged core " phenomenon, rejection rate, lifting product is greatly reduced
Quality.
Efficient and smoothly cooling is carried out to track to realize in this case, is also made that following measuring and calculating, traditional handicraft SMIC
The temperature curve of piece and frame when eutectic welds is mostly as shown in Figure 1, instant when material temperature shock occurs in temperature-fall period
Fly the core multiple period；Therefore, ideal temperature lowering curve should be as shown in the straight line in Fig. 2 obliquely, at present it is known that material will
At the uniform velocity walked with speed V on the cooling section that length is L, the initial temperature of cooling technique（That is welding region peak temperature）For
Tm, the end temp of cooling technique is T0（That is tapping temperature）, can draw K=（Tm-T0）/（L/V）, that is, it is bent to calculate cooling in theory
The slope K of line, the functional relation of temperature and time in figure can be calculated further according to K, finally with reference to speed V, you can finally calculate rail
The theoretical temperatures of every bit on road；Hereafter, done if can take in orbit, according to the difference of actually measured temperature and theoretical temperatures
Value, the temperature of the cooling gas introduced below to cooling section one, cooling section two, cooling section three are adjusted, finally draw following
Conclusion：
The cooling section one cooling gas introduced below is 400 DEG C, and the cooling section two cooling gas introduced below is 350
DEG C, the cooling section three cooling gas introduced below is 300 DEG C.Finally, carry out actual measurement and check, can draw Fig. 3 institutes
The temperature curve shown, you can intuitively find out that material without temperature shock, therefore, will be greatly reduced in cooling procedure from figure
The possibility that " winged core " phenomenon occurs, that is, the purpose for realize and rejection rate is greatly reduced, lifting product quality.
Thickness >=1.2um of the back of the body layer gold of the chip.
Thickness >=2um of the silver coating of the frame.So as to which gold, silver contain between silicon and copper when eutectic welding is substantially improved
Amount extremely buffers the ability of swelling stress, further avoid the generation of " winged core " phenomenon.
Cooling section 1, cooling section 2 12 and cooling section 3 13 in the track 1 are in cooler bin, the cooler bin
Including babinet 2, a pair of of 3, three intake valves 4 of partition plate and a relief valve 5, the track 1 runs through the top of the babinet 2, institute
State the bottom surface of the inner wall of babinet 2 to taper into along material direction of travel with the spacing of track 1, a pair of partition plate 3 is fixed to be connected
It is connected on the bottom surface of the inner wall of babinet 2 and gap is left in 3 apical margin of partition plate and the bottom surface of track 1 so that the lower part of babinet 2 is by one
Be divided into space 1, space 2 22 and space 3 23 to partition plate 3, the intake valve 4 be fixedly connected on the bottom of babinet 2 and
For being passed through cooling gas into babinet 2, three intake valves 4 are respectively at space 1, space 2 22 and space 3 23
Bottom, the relief valve 5 is fixedly connected on the top of babinet 2 and for avoiding air pressure in babinet 2 excessive.Wherein, a side
Face, since the bottom surface of babinet and the spacing of track are tapered into along material direction of travel, the volume in space one will be greater than sky
Between two volume, and the volume in space two will be greater than the volume in space three；On the other hand, since partition plate apical margin is in the bottom surface of track
Gap is left, therefore, the cooling gas in space one, space two and space three there will be a degree of mobility.
In use, after space one, space two and space three are passed through the cooling gas of different temperatures via intake valve, cooling
Gas to track and material will efficiently cool down step by step.At the same time, although cooling gas and track in space three
Temperature after the heat exchange of middle cooling section three be less than cooling gas in space two with the temperature after the heat exchange of cooling section in track two
Degree, but since the volume in space three is less than the volume in space two, hence in so that the air pressure in space three is still greater than in space two
Air pressure so that the cooling gas in space three with cooling section three can reenter in space two after heat exchange；Similarly,
Cooling gas in space two with cooling section two can reenter in space one after heat exchange；Thus it is possible, on the one hand, can
So that the excessive temperature between space one, space two, space three is more steady, the generation of " winged core " phenomenon further avoid；
On the other hand, flowed by the gas in space three-dimensional space two, and gas flowing of the space two into space one can effectively be dropped
The air inflow of intake valve in low spatial two and space three so that the energy consumption of cooler bin entirety is greatly reduced.
The cooler bin further includes gas guide assembly 6, and the gas guide assembly 6 is connected in babinet 2 and is located at rail
The top in road 1, the gas guide assembly 6 include chain 61, a pair of sprocket 62 and some directing plates 63, a pair of sprocket wheel 62
It is respectively hinged at the both sides of the inner wall of babinet 2, the chain 61 is in a ring around being located on two sprocket wheels 62, some directing plates 63
Vertically it is fixedly connected on the surface of chain 61 and the spacing of adjacent directing plate 63 is equal.So as on track and material
Side promotes the hot gas that distributes to move along the opposite direction of material walking, and most at last with discharge, so as to further avoid
There is temperature decrease so as to the problem of producing " winged core " phenomenon in cooling procedure in material.
Claims (6)
1. a kind of eutectic welding procedure, it is characterised in that for chip to be welded on frame, the chip and frame are in-orbit
Road is unidirectionally walked, and the eutectic welding procedure includes pre-heating technique, heating process, reflux technique and cooling technique, the track
It is divided into preheating section, warming-up section, reflux section and cooling section, it is characterised in that
To make frame and chip at the uniform velocity walk on cooling section, the cooling section is averaged the cooling technique along material direction of travel
It is divided into cooling section one, cooling section two, cooling section three and cooling section four, the cooling section one, cooling section two, the lower section of cooling section three are logical
Enter the cooling gas that temperature is successively decreased successively, the cooling section four is in room temperature environment.
A kind of 2. eutectic welding procedure according to claim 1, it is characterised in that introduced below cold of the cooling section one
But gas is 400 DEG C, and the cooling section two cooling gas introduced below is 350 DEG C, introduced below cold of the cooling section three
But gas is 300 DEG C.
A kind of 3. eutectic welding procedure according to claim 1, it is characterised in that the thickness of the back of the body layer gold of the chip >=
1.2um。
A kind of 4. eutectic welding procedure according to claim 1, it is characterised in that the thickness of the silver coating of the frame >=
2um。
5. a kind of cooler bin for being used for realization cooling technique in eutectic welding procedure according to claim 1, its feature exist
In cooling section one, cooling section two and cooling section three in the track are in cooler bin, and the cooler bin includes babinet, one
To partition plate, three intake valves and a relief valve, the track runs through the top of the babinet, the bottom surface of the babinet and track
Spacing tapered into along material direction of travel, a pair of partition plate be fixedly connected with tank floor and partition plate apical margin with
Leave gap in the bottom surface of track so that the lower part of babinet is divided into space one, space two and space three by a pair of of partition plate, it is described into
Air valve is fixedly connected on the bottom of babinet and for being passed through cooling gas into babinet, and three intake valves are respectively at sky
Between one, the bottom in space two and space three, the relief valve is fixedly connected on the top of babinet and for avoiding air pressure in babinet
It is excessive.
A kind of 6. cooler bin according to claim 5, it is characterised in that the cooler bin further includes gas guide assembly,
The gas guide assembly is connected in babinet and includes chain, Yi Duilian positioned at the top of track, the gas guide assembly
Wheel and some directing plates, a pair of sprocket wheel are respectively hinged at the both sides of the inner wall of babinet, and the chain is in a ring around being located at two
On sprocket wheel, some directing plates are vertically fixedly connected on the surface of chain and the spacing of adjacent directing plate is equal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711120396.3A CN107914102B (en) | 2017-11-14 | 2017-11-14 | A kind of eutectic welding procedure and the cooler bin for realizing cooling technique in the technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711120396.3A CN107914102B (en) | 2017-11-14 | 2017-11-14 | A kind of eutectic welding procedure and the cooler bin for realizing cooling technique in the technique |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107914102A true CN107914102A (en) | 2018-04-17 |
| CN107914102B CN107914102B (en) | 2019-11-01 |
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ID=61896177
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|---|---|---|---|
| CN201711120396.3A Active CN107914102B (en) | 2017-11-14 | 2017-11-14 | A kind of eutectic welding procedure and the cooler bin for realizing cooling technique in the technique |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050098610A1 (en) * | 2001-06-27 | 2005-05-12 | Shunji Onobori | Apparatus and method for mounting electronic components |
| CN203887355U (en) * | 2014-05-19 | 2014-10-22 | 上海威克迈龙川汽车发动机零件有限公司 | Brazing furnace equipment with protective gas switching function |
| CN104646874A (en) * | 2014-12-31 | 2015-05-27 | 吴华 | Guide rail unit of soft solder loading machine |
| CN204673106U (en) * | 2015-05-09 | 2015-09-30 | 娄斌 | A kind of net belt type gas protection soldering oven |
| CN106816804A (en) * | 2015-11-30 | 2017-06-09 | 中国科学院大连化学物理研究所 | A kind of microchannel metal foam disk like laser crystal cooling device |
-
2017
- 2017-11-14 CN CN201711120396.3A patent/CN107914102B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050098610A1 (en) * | 2001-06-27 | 2005-05-12 | Shunji Onobori | Apparatus and method for mounting electronic components |
| CN203887355U (en) * | 2014-05-19 | 2014-10-22 | 上海威克迈龙川汽车发动机零件有限公司 | Brazing furnace equipment with protective gas switching function |
| CN104646874A (en) * | 2014-12-31 | 2015-05-27 | 吴华 | Guide rail unit of soft solder loading machine |
| CN204673106U (en) * | 2015-05-09 | 2015-09-30 | 娄斌 | A kind of net belt type gas protection soldering oven |
| CN106816804A (en) * | 2015-11-30 | 2017-06-09 | 中国科学院大连化学物理研究所 | A kind of microchannel metal foam disk like laser crystal cooling device |
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| CN107914102B (en) | 2019-11-01 |
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