CN107907932B - Backlight module, manufacturing method of backlight module and display device - Google Patents
Backlight module, manufacturing method of backlight module and display device Download PDFInfo
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- CN107907932B CN107907932B CN201711043164.2A CN201711043164A CN107907932B CN 107907932 B CN107907932 B CN 107907932B CN 201711043164 A CN201711043164 A CN 201711043164A CN 107907932 B CN107907932 B CN 107907932B
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- backlight module
- lamp bar
- light guide
- guide plate
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 238000003466 welding Methods 0.000 claims abstract description 53
- 239000000463 material Substances 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 18
- 239000011265 semifinished product Substances 0.000 claims description 15
- 239000005022 packaging material Substances 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 15
- 239000002390 adhesive tape Substances 0.000 description 13
- 238000010586 diagram Methods 0.000 description 6
- 239000003292 glue Substances 0.000 description 6
- 238000012536 packaging technology Methods 0.000 description 6
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000005142 aphototropism Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000001953 sensory effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
- G02B6/0015—Means for improving the coupling-in of light from the light source into the light guide provided on the surface of the light guide or in the bulk of it
- G02B6/0016—Grooves, prisms, gratings, scattering particles or rough surfaces
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
- G02B6/0055—Reflecting element, sheet or layer
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0073—Light emitting diode [LED]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0086—Positioning aspects
- G02B6/0091—Positioning aspects of the light source relative to the light guide
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133603—Direct backlight with LEDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133608—Direct backlight including particular frames or supporting means
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Planar Illumination Modules (AREA)
Abstract
The invention discloses a backlight module, a manufacturing method of the backlight module and a display device. The backlight module includes: the lamp strip and the light guide plate are of an integrated structure; the light guide plate is provided with a first surface and a first side surface connected with the first surface, the first surface is provided with a first groove extending along a first direction, the first side surface is provided with a second groove, and the first groove is communicated with the second groove; the light bar is arranged in the first groove; the first groove is provided with a groove bottom, the lamp strip comprises a welding plate layer arranged at the groove bottom, the welding plate layer is provided with an end part, the end part is extended out of the second groove and used for connecting a driving circuit of the lamp strip, the welding layer is arranged on one side, away from the groove bottom, of the welding plate layer, the support is arranged on one side, away from the welding plate layer, of the welding layer, the LED chip is fixed on the support, a third groove is formed between the bowl cup and the first surface of the support, and the packaging material is arranged in the third. The backlight module, the manufacturing method of the backlight module and the display device provided by the invention have the advantages that the narrowing of the lower frame is realized, and meanwhile, the performance reliability is good.
Description
Technical field
The present invention relates to field of display technology, more particularly, to a kind of backlight module, backlight module production method and
Display device.
Background technique
In existing display device technology, display panel is broadly divided into liquid crystal display panel and organic light-emitting display panel
The technology of two kinds of mainstreams.Wherein, for liquid crystal display panel by applying voltage at liquid crystal molecule both ends, formation can control liquid crystal point
The electric field of son deflection, and then control the display function through realization display panel of light；Organic light-emitting display panel uses
Electroluminescent organic material, when there is electric current to pass through electroluminescent organic material, luminescent material will shine, and then realize aobvious
Show the display function of panel.In liquid crystal display device, backlight module is needed as display device, light source is provided, in the prior art
It is generally divided into sidelight type backlight module and two kinds of down straight aphototropism mode set, wherein sidelight type backlight module is aobvious due to can be realized
Showing device integral thickness is thinned, and becomes mainstream technology.
Now with the development of science and technology, the design aspect of electronic display unit constantly pursues the smooth use body of user
It tests, meanwhile, the sensory experience of user is also increasingly pursued, such as: the performances such as wide viewing angle, high-resolution, narrow frame, high screen accounting
Attraction as each electronic display unit.
Therefore it provides the production method and display device of a kind of backlight module for realizing narrow frame, backlight module, are abilities
Domain urgent problem to be solved.
Summary of the invention
In view of this, being solved the present invention provides the production method and display device of a kind of backlight module, backlight module
The technical issues of realizing narrow frame.
In order to solve the above-mentioned technical problem, the present invention proposes a kind of backlight module, comprising:
Lamp bar and light guide plate integral structure；
Light guide plate has first surface and the first side that is connected with first surface, has on first surface along first party
To the first groove of extension, there is the second groove in first side, the first groove is connected with the second groove, first direction and the
One surface is parallel；
Lamp bar is set in the first groove；
Wherein, the first groove has slot bottom, and lamp bar includes,
Welding plate layer is set to slot bottom, and welding plate layer has end, and end is stretched out by the second groove, for connecting the drive of lamp bar
Dynamic circuit,
Welding layer, is set to welding plate layer far from slot bottom side,
Bracket is set to welding layer far from welding plate layer side, is fixed with LED chip, the bowl of bracket and first on bracket
Surface forms third groove,
Encapsulating material is set in third groove.
Further, the production method that the present invention also proposes a kind of backlight module, backlight module include lamp bar and light guide plate
Integral structure；
Production method includes:
LED chip is fixed on bracket, makes the bonding wire of LED chip；
Bracket is welded on welding plate layer, semi-finished product lamp bar is fabricated to, wherein welding plate layer has end, and end is for connecting
Connect the driving circuit of lamp bar；
Semi-finished product lamp bar is set to the side in the mold of production light guide plate, light guide plate is made using Shooting Technique,
In, light guide plate includes first surface and the first side that is connected with first surface, and first surface has the first groove, semi-finished product
Lamp bar is located in the first groove, and first side has the second groove, and the end of welding plate layer is stretched out by the second groove, the bowl of bracket
Third groove is formed with first surface；
Encapsulating material is set in third groove.
Further, in order to solve the above-mentioned technical problem, the present invention also proposes that a kind of display device, including the present invention provide
Any one backlight module.
Compared with prior art, the production method and display device of backlight module of the invention, backlight module, realize as
Under the utility model has the advantages that
The production method and display device of backlight module provided by the invention, backlight module use lamp bar in backlight module
With light guide plate integral structure, by lamp bar " inlaying " inside light guide plate, binding force when using forming light guide plate fixes lamp bar,
With it is entirely different by the way of lamp bar to fix using adhesive tape in the related technology, the present invention realizes the lower frame that narrows, and this hair
The bright adjustment by process sequence, completes the packaging technology of LED chip again after light guide plate completes, and can effectively avoid sealing
High temperature is molded when package material is made by light guide plate to be influenced to generate rotten even failure, guarantees lamp bar performance reliability, Jin Erti
The performance reliability of backlight module and display device is risen.
By referring to the drawings to the detailed description of exemplary embodiment of the present invention, other feature of the invention and its
Advantage will become apparent.
Detailed description of the invention
It is combined in the description and the attached drawing for constituting part of specification shows the embodiment of the present invention, and even
With its explanation together principle for explaining the present invention.
Fig. 1 is backlight module schematic diagram in the related technology；
Fig. 2 is light guide plate schematic top plan view in backlight module provided in an embodiment of the present invention；
Fig. 3 is the diagrammatic cross-section of light guide plate in backlight module provided in an embodiment of the present invention；
Fig. 4 is backlight module schematic cross-section provided in an embodiment of the present invention；
Fig. 5 is a kind of optional embodiment schematic diagram of backlight module provided in an embodiment of the present invention；
Fig. 6 is another optional embodiment schematic top plan view of backlight module provided in an embodiment of the present invention；
Fig. 7 is another optional embodiment schematic top plan view of backlight module provided in an embodiment of the present invention；
Fig. 8 is another optional embodiment schematic top plan view of backlight module provided in an embodiment of the present invention；
Fig. 9 is that bottom of a cup plane orthographic projection where rim of a cup of bowl in backlight module provided in an embodiment of the present invention is illustrated
Figure；
Figure 10 is the backlight module cross-sectional view in Fig. 6 at the position tangent line X1；
Figure 11 is another optional embodiment schematic top plan view of backlight module provided in an embodiment of the present invention；
Figure 12 is the flow chart of the production method of backlight module provided in an embodiment of the present invention；
Figure 13 is display device schematic diagram provided in an embodiment of the present invention.
Specific embodiment
Carry out the various exemplary embodiments of detailed description of the present invention now with reference to attached drawing.It should also be noted that unless in addition having
Body explanation, the unlimited system of component and the positioned opposite of step, numerical expression and the numerical value otherwise illustrated in these embodiments is originally
The range of invention.
Be to the description only actually of at least one exemplary embodiment below it is illustrative, never as to the present invention
And its application or any restrictions used.
Technology, method and apparatus known to person of ordinary skill in the relevant may be not discussed in detail, but suitable
In the case of, the technology, method and apparatus should be considered as part of specification.
It is shown here and discuss all examples in, any occurrence should be construed as merely illustratively, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, then in subsequent attached drawing does not need that it is further discussed.
The present invention relates to the production method and display device of a kind of backlight module, backlight module, Fig. 1 is to carry on the back in the related technology
Optical mode group schematic diagram, as shown in Figure 1, the backlight module illuminated for side, light source 101 (such as LED light) are solid by pad P welding
It is scheduled on flexible circuit board 102 formation lamp bar 103, lamp bar 103 is fixed on light guide plate 105 and glue frame (or glue by adhesive tape 104
Iron integral structure) between 106, adhesive tape 104 plays shading and fixed effect simultaneously, sets in the dot surface side of light guide plate 105
It is equipped with lower reflector plate 107, to improve light utilization efficiency.Inventor has found to encounter when realization narrow frame in conventional design and ask as follows
Topic: LED light has one fixed width, if compressing the width of LED light to realize that narrow frame, the luminous efficiency of LED light are too low；Lamp bar
It is be fixed between glue frame and light guide plate by adhesive tape, if the width of compressed tape realizes narrow frame, lamp bar is fixed
Fixing reduces, and all influences the performance of display module.
Based on the above issues, a kind of design scheme of new solution narrow frame is inventors herein proposed, is no longer adopted in the present invention
Lamp bar is fixed with adhesive tape, but binding force when using forming light guide plate fixes lamp bar, by lamp bar " inlaying " in light guide plate
Face can significantly reduce the width of lower frame regardless of the fixation problem of adhesive tape.
The present invention provides a kind of backlight module, including lamp bar and light guide plate integral structure, with reference to shown in Fig. 2, Fig. 3 and Fig. 4,
Fig. 2 is light guide plate schematic top plan view in backlight module provided in an embodiment of the present invention, and Fig. 3 is backlight provided in an embodiment of the present invention
The diagrammatic cross-section of light guide plate in mould group, Fig. 4 are backlight module schematic cross-section provided in an embodiment of the present invention.Understand the present invention
When please also refer to Fig. 2, Fig. 3 and Fig. 4.
Light guide plate in backlight module provided by the invention referring to figs. 2 and 3 shown in, Fig. 3 is along Fig. 2 at tangent line X
The cross-sectional view of light guide plate, the first side 2052 that light guide plate 205 has first surface 2051 and is connected with first surface 2051,
There is the first groove C1 extended along first direction a on first surface 2051, there is the second groove C2 in first side 2052, the
One groove C1 is connected with the second groove C2, and first direction a is parallel with first surface 2051；It can be seen that this in conjunction with Fig. 2 and Fig. 3
The first groove C1 and the second groove C2 are connected in the light guide plate of invention, it should be noted that the first groove C1 in Fig. 2 and Fig. 3
It is not limitation of the invention with the relative position only schematical expression of the second groove C2, it can also be by more in the present invention
A first groove C1 or multiple second groove C2, lamp bar bracket is likely to occur multiple first when being split type structure in the present invention
The case where groove C1, connect with driving circuit if each LED light draws lead respectively, leads when including multiple LED light in lamp bar
It may include multiple second groove C2 in tabula rasa, if each LED light is all connected to one end of welding plate layer 2031 and driving circuit is built
Vertical connection, then only need a second groove C2.
With continued reference to shown in Fig. 4, reference by location Fig. 2 and Fig. 3 of the first groove C1 and the second groove C2, lamp bar are set in Fig. 4
It is placed in the first groove C1；Lamp bar includes welding plate layer 2031, welding layer 2032, bracket 2033, LED chip 2034 and encapsulating material
2036: where the first groove has slot bottom C11, and welding plate layer 2031 is set to slot bottom C11, and welding plate layer 2031 has end
20311, end 20311 is stretched out by the second groove C2, and for connecting the driving circuit of lamp bar, welding layer 2032 is set to welding plate layer
2031 are provided with the bonding wire that LED chip 2034 is connect with welding plate layer 2031, bracket far from the side slot bottom C11, welding layer 2032
2033 are set to welding layer 2032 far from 2031 side of welding plate layer, are fixed with LED chip 2034 on bracket 2033, bracket 2033
Bowl 2035 and first surface 2051 form third groove C3, and encapsulating material 2036 is set to C3 in third groove.The present invention mentions
It can also include glue frame (or glue iron integral structure) 206, in the dot surface 2,053 1 of light guide plate 205 in the backlight module of confession
Side is additionally provided with lower reflector plate 207 to improve light utilization efficiency.
Backlight module provided in an embodiment of the present invention, using lamp bar and light guide plate integral structure, the welding plate layer of lamp bar is located at
In light guide plate, welding plate layer is equivalent to the flexible circuit board in conventional lamp bar structure, and the bracket of lamp bar is welded on by welding layer
On plate layer, lamp bar provided by the invention and light guide plate integral structure complete the die bond and bonding wire processing procedure of lamp bar when production, i.e., first
LED chip 2034 is fixed on the bracket 2033 of lamp bar, then the conducting wire of production connection LED chip 2034 leads to bracket 2033
It crosses welding layer 2032 to be welded on welding plate layer 2031, why the backlight lamp bar of semi-finished product (is then known as the backlight of semi-finished product
Lamp bar is because being packaged not yet to LED chip) it is placed in the production mold of light guide plate, Shooting Technique makes light guide plate
When realize the backlight lamp bar " inlaying " by semi-finished product inside light guide plate, finally in the bowl 2035 of bracket 2033 and the first table
Encapsulating material 2036 is made in the third groove C3 that face 2051 is formed, encapsulating material 2036 is to protect LED chip 2034 can be with
For fluorescent powder.In the present invention, by lamp bar " inlaying " inside light guide plate, binding force when using forming light guide plate is come fixed light
Item, and it is entirely different by the way of lamp bar to fix using adhesive tape in the related technology, it is equivalent in the present invention and is saved in lower frame position
The width on direction c as shown in Figure 3 of adhesive tape occupancy is saved, narrowed lower frame, can be in light guide plate system in the present invention
The packaging technology for completing LED chip after the completion of making again is molded high temperature when effectively encapsulating material can be avoided to be made by light guide plate
It influences to generate rotten even failure, guarantees the luminescent properties of lamp bar, and then guarantee backlight module performance reliability.The present invention provides
Backlight module the driving chip setting of display panel is existed in conjunction with COF (Chip On Film, often claim flip chip) technology
On flexible circuit board, the display device of production ultra-narrow lower frame can be realized.
It should be noted that further narrow lower frame to realize, shown in Fig. 4 along the c of direction, bracket
Light guide plate 205 between 2033 and glue frame 206 has certain thickness d, which can be before guaranteeing that lamp bar is fixed
Put it is enough small, the present invention for the specific thickness d at the position size without limitation.
Further, in some alternative embodiments, Fig. 5 is one kind of backlight module provided in an embodiment of the present invention
Optional embodiment schematic diagram, as shown in figure 5, backlight module further includes reflecting layer 208, reflecting layer 208 is set to first surface
2051 sides, the appended drawing reference in orthographic projection covering third the groove C3, Fig. 5 of first surface 2051 of reflecting layer 208 can refer to
Explanation in Fig. 4.
Reflecting layer 208 is arranged in the side of first surface 2051 in the backlight module that the embodiment provides, and reflecting layer 208 exists
The orthographic projection of first surface 2051 covers third groove C3, and after lamp bar is lighted, reflecting layer 208 can prevent light from lamp bar top side
(namely 2051 side of light guide plate first surface) outgoing, generates light leakage phenomena, while reflecting layer 208 can be by light back
It utilizes, improves light utilization, the backlight module which provides realizes narrowing for lower frame, while improving light
Line use ratio.
Further, in some alternative embodiments, Fig. 6 is the another of backlight module provided in an embodiment of the present invention
Kind optional embodiment schematic top plan view, as shown in fig. 6, light guide plate 205 has a first groove C1, lamp bar is set to first
In groove C1, bracket 2033 is integral type bracket, and lamp bar includes multiple LED chips 2034, and a LED chip 2034 and one the
Three groove C3 are corresponding, encapsulating material are provided in third groove C3, to protect LED chip 2034.What the embodiment provided
Backlight module, including lamp bar and light guide plate integral structure, lamp bar are set in the first groove C1 of one side surface of light guide plate, lamp bar
Bracket 2033 be integral type bracket, multiple LED chips 2034 are fixed on integrated bracket, with each LED chip 2034
It is provided with encapsulating material in corresponding third groove C3, in the embodiment, by lamp bar " inlaying " inside light guide plate, using leading
Binding force when tabula rasa forms fixes lamp bar, fixed with adhesive tape is used in the related technology it is entirely different by the way of lamp bar,
The width that lower frame position saves adhesive tape occupancy is equivalent in invention, narrowed lower frame, meanwhile, it is capable to make in light guide plate
The packaging technology for completing LED chip again after the completion is molded the shadow of high temperature when effectively encapsulating material can be avoided to be made by light guide plate
It rings and generates rotten even failure, guarantee that lamp bar can normally provide light source, and then guarantee backlight module performance reliability.
Further, in some alternative embodiments, Fig. 7 is the another of backlight module provided in an embodiment of the present invention
Kind optional embodiment schematic top plan view, as shown in fig. 7, light guide plate 205 has a first groove C1, bracket 2033 is integrated
Formula bracket, lamp bar include a LED chip 2034, and a LED chip 2034 is corresponding with a third groove C3, third groove C3
It is inside provided with encapsulating material, to protect LED chip 2034.The backlight module that the embodiment provides, including lamp bar and leaded light
Plate integral structure realizes narrowing for lower frame, includes a LED chip 2034 in lamp bar, only to LED chip when lamp bar makes
A bonding wire craft is carried out, and a LED chip 2034 provides light source for entire backlight module, the LED in the embodiment
2034 size of chip compares larger, and bonding wire craft is easy to operate, and bonding wire is firm, and lamp bar performance is stablized, and then improves backlight module
Performance reliability.
Further, in some alternative embodiments, Fig. 8 is the another of backlight module provided in an embodiment of the present invention
Kind optional embodiment schematic top plan view, as shown in figure 8, light guide plate 205 has multiple first groove C1, the bracket of lamp bar is point
Body formula bracket, bracket include multiple carrier units
It is provided with a carrier unit 20331 in 20331, a first groove C1, it is solid on a carrier unit 20331
A fixed LED chip 2034, a LED chip 2034 is corresponding with a third groove C3, is provided with encapsulation in third groove C3
Material.In the embodiment, a kind of lamp bar with for separating stent-graft is provided, each carrier unit 20331 is respectively completed pair
After the fixed technique of the LED chip 2034 answered, correspondence is welded on welding plate layer, then by the lamp of unfinished chip package process
Item is placed in the production mold of light guide plate, is made light guide plate using Shooting Technique, is then completed the encapsulation work of LED chip again
Skill, high temperature is molded when effectively encapsulating material can be avoided to be made by light guide plate to be influenced to generate rotten even failure, the embodiment party
Formula realizes the lower frame that narrows, meanwhile, guarantee the luminescent properties of lamp bar, and then guarantee backlight module performance reliability.
Further, in some alternative embodiments, with reference to shown in Fig. 6 and Fig. 9, Fig. 9 mentions for the embodiment of the present invention
The bottom of a cup of bowl plane orthographic projection schematic diagram where rim of a cup in the backlight module of confession, Figure 10 are in Fig. 6 at the position tangent line X1
Backlight module cross-sectional view.As shown in fig. 6, bowl 2035 has bottom of a cup opposite on b in a second direction in the embodiment
20351 and rim of a cup 20352, second direction b is parallel with first surface 2051, and vertical with first direction a, as shown in figure 9, along
It on two direction b, is equivalent to as viewed from the light direction of lamp bar, bottom of a cup 20351 is projected as 20352 place plane of rim of a cup
One projection Y1, the first projection Y1 is located in rim of a cup the shape of rim of a cup 20352 and the first projection Y1 in 20352, Fig. 9 and does not constitute to this
The restriction of invention is only illustrative expression, with reference to diagrammatic cross-section shown in Fig. 10, it can be seen that the bracket of lamp bar
Bowl there is certain angle, or be also possible to arcuate structure.In the embodiment, using lamp bar and light guide plate integral structure
Realization narrows lower frame, and by the adjustment of process sequence, completes the encapsulation work of LED chip again after light guide plate completes
Skill, high temperature is molded when effectively encapsulating material can be avoided to be made by light guide plate to be influenced to generate rotten even failure, guarantees lamp bar
Performance reliability, meanwhile, the angle of the bowl of setting adjustment bracket increases the light emitting angle of LED chip, reduces light loss, mention
Bloom line use ratio promotes light-out effect before lamp.
Further, in some alternative embodiments, Figure 11 is the another of backlight module provided in an embodiment of the present invention
A kind of optional embodiment schematic top plan view, as shown in figure 11, bracket 2033 and/or welding plate layer 2031 are contacted with light guide plate 205
Surface on be provided with fastening structure M.Optionally, the fastening knot being arranged on the surface that bracket 2033 is contacted with light guide plate 205
Structure M and bracket 2033 be when making it is integrally formed, in the surface that welding plate layer 2031 is contacted with light guide plate 205 setting fastening structure
M and welding plate layer 205 be when making it is integrally formed, fastening structure M, which is equivalent to, increases the contact surface of light guide plate Yu lamp bar entirety
Product, and then the contact roughness of light guide plate with lamp bar entirety is increased, when making lamp bar and light guide plate integral structure, strengthen
Binding force after molding between lamp bar and light guide plate, lamp bar is fixed, ensure that the stability of backlight module performance.
Optionally, the fastening structure in Figure 11 is pawl structures, and each pawl of pawl structures can be embedded in light guide plate,
It significantly increases the whole contact area with light guide plate of lamp bar not loosen so that lamp bar is securely embedded in light guide plate, guarantee
The stability of backlight module performance.
Further, the present invention also provides a kind of production methods of backlight module, provide for making the embodiment of the present invention
Any one backlight module, Figure 12 be backlight module provided in an embodiment of the present invention production method flow chart, the present invention
The backlight module of offer includes lamp bar and light guide plate integral structure；The backlight mould to be completed using the production method of the embodiment
The structure of group can be accordingly with reference to shown in Fig. 2, Fig. 3 and Fig. 4.
As shown in figure 12, production method includes:
Step S101: fixing LED chip 2034 on bracket 2033, makes the bonding wire of LED chip 2034, wherein bonding wire
Bonding wire layer 2032 in as Fig. 4；
Step S102: bracket 2033 is welded on welding plate layer 2031, is fabricated to semi-finished product lamp bar, wherein welding plate layer
2031 have end 20311, and end 20311 is used to connect the driving circuit of lamp bar；
Step S103: semi-finished product lamp bar is set to the side in the mold of production light guide plate 205, using Shooting Technique system
Make light guide plate 205, wherein light guide plate 205 includes first surface 2051 and the first side being connected with first surface 2051
2052, first surface 2051 has the first groove C1, and semi-finished product lamp bar is located in the first groove C1, and first side 2052 is with the
The end 20311 of two groove C2, welding plate layer 2031 are stretched out by the second groove C2, the bowl 2035 and first surface of bracket 2033
2051 form third groove C3；
Step S104: encapsulating material 2036 is set in third groove C3.
In the production method of backlight module provided in an embodiment of the present invention, using lamp bar and light guide plate integral structure, lamp bar
Welding plate layer be located in light guide plate, welding plate layer is equivalent to the flexible circuit board in conventional lamp bar structure, and the bracket of lamp bar passes through weldering
It connects layer to be welded on welding plate layer, lamp bar provided by the invention and light guide plate integral structure, completes the die bond and bonding wire of lamp bar first
Processing procedure fixes LED chip 2034, the conducting wire of production connection LED chip 2034, then by bracket on the bracket of lamp bar 2033
2033 are welded on welding plate layer 2031 by welding layer 2032, and why the backlight lamp bar of semi-finished product (is then known as semi-finished product
Backlight lamp bar be because not yet LED chip is packaged) be placed in the production mold of light guide plate, Shooting Technique production
The backlight lamp bar " inlaying " by semi-finished product is realized when light guide plate inside light guide plate, finally the bowl 2035 of bracket 2033 with
Encapsulating material 2036 is made in the third groove C3 that first surface 2051 is formed, encapsulating material 2036 is to protect LED chip
2034 can be fluorescent powder.In the present invention, by lamp bar " inlaying " inside light guide plate, binding force when using forming light guide plate come
Fixed lamp bar, fixed with adhesive tape is used in the related technology it is entirely different by the way of lamp bar, it is of the invention in narrowed lower frame, and
And the present invention completes the packaging technology of LED chip by the adjustment of process sequence again after light guide plate completes, it can be effective
High temperature is molded when encapsulating material being avoided to be made by light guide plate to be influenced to generate rotten even failure, guarantees that lamp bar can be provided normally
Light source, and then guarantee backlight module performance reliability.
Further, in some alternative embodiments, after completing step S104, production method further include:
Reflective layer is arranged in one surface, and reflecting layer covers third groove in the orthographic projection of first surface.The back made of the embodiment
The structure of optical mode group can be with reference to shown in Fig. 5.The backlight module made of the embodiment, in the side of first surface 2051
Reflecting layer 208 is set, and reflecting layer 208 covers third groove C3, after lamp bar is lighted, reflecting layer in the orthographic projection of first surface 2051
208 can prevent light to be emitted from lamp bar top side (namely 2051 side of light guide plate first surface), generate light leakage phenomena, while anti-
Light back can be utilized by penetrating layer 208, improve light utilization.
Further, the present invention also provides a kind of display device, Figure 13 is that display device provided in an embodiment of the present invention is shown
It is intended to, display device provided by the invention includes any one backlight module provided in an embodiment of the present invention.It is provided by the invention
Display device uses lamp bar and light guide plate integral structure in backlight module, by lamp bar " inlaying " inside light guide plate, using leaded light
Binding force when sheet metal forming fixes lamp bar, and fixes entirely different, this hair by the way of lamp bar using adhesive tape in the related technology
It is bright to realize the lower frame that narrows, and the present invention completes LED core after light guide plate completes by the adjustment of process sequence again
The packaging technology of piece, high temperature is molded when effectively encapsulating material can be avoided to be made by light guide plate to be influenced to generate rotten even mistake
Effect guarantees lamp bar performance reliability, and then improves the performance reliability of display device.
Through the foregoing embodiment it is found that the production method and display device of backlight module of the invention, backlight module, reach
It is following the utility model has the advantages that
The production method and display device of backlight module provided by the invention, backlight module use lamp bar in backlight module
With light guide plate integral structure, by lamp bar " inlaying " inside light guide plate, binding force when using forming light guide plate fixes lamp bar,
With it is entirely different by the way of lamp bar to fix using adhesive tape in the related technology, the present invention realizes the lower frame that narrows, and this hair
The bright adjustment by process sequence, completes the packaging technology of LED chip again after light guide plate completes, and can effectively avoid sealing
High temperature is molded when package material is made by light guide plate to be influenced to generate rotten even failure, guarantees lamp bar performance reliability, Jin Erti
The performance reliability of backlight module and display device is risen.
Although some specific embodiments of the invention are described in detail by example, the skill of this field
Art personnel it should be understood that example above merely to being illustrated, the range being not intended to be limiting of the invention.The skill of this field
Art personnel are it should be understood that can without departing from the scope and spirit of the present invention modify to above embodiments.This hair
Bright range is defined by the following claims.
Claims (11)
1. a kind of backlight module characterized by comprising
Lamp bar and light guide plate integral structure；
The light guide plate has first surface and the first side that is connected with the first surface, has on the first surface
The first groove extended in a first direction, has the second groove in the first side, first groove and described second recessed
Slot is connected, and the first direction is parallel with the first surface；
The lamp bar is set in first groove；
Wherein, first groove has slot bottom, and the lamp bar includes,
Welding plate layer is set to the slot bottom, and the welding plate layer has end, and the end is stretched out by second groove, is used for
The driving circuit of the lamp bar is connected,
Welding layer, is set to the welding plate layer far from the slot bottom side,
Bracket is set to the welding layer far from welding plate layer side, is fixed with LED chip, the bracket on the bracket
Bowl and the first surface formed third groove,
Encapsulating material is set in the third groove.
2. backlight module according to claim 1, which is characterized in that
The backlight module further includes reflecting layer,
The reflecting layer is set to the first surface side, and the reflecting layer is described in the orthographic projection covering of the first surface
Third groove.
3. backlight module according to claim 2, which is characterized in that
The light guide plate has first groove, and the bracket is integral type bracket,
The lamp bar includes multiple LED chips, and a LED chip is corresponding with a third groove.
4. backlight module according to claim 2, which is characterized in that
The light guide plate has first groove, and the bracket is integral type bracket,
The lamp bar includes a LED chip, and a LED chip is corresponding with a third groove.
5. backlight module according to claim 2, which is characterized in that
The light guide plate has multiple first grooves, and the bracket includes multiple carrier units,
The carrier unit is provided in one first groove.
6. backlight module according to claim 2, which is characterized in that
The bowl has upper opposite bottom of a cup and rim of a cup in a second direction, and the second direction is parallel with the first surface,
And it is vertical with the first direction；
In the second direction, be projected as first projection of the bottom of a cup in plane where the rim of a cup, first projection
In the rim of a cup.
7. backlight module according to claim 2, which is characterized in that
Fastening structure is provided on the surface that the bracket and/or the welding plate layer are contacted with the light guide plate.
8. backlight module according to claim 7, which is characterized in that
The fastening structure is pawl structures.
9. a kind of production method of backlight module, which is characterized in that for making the described in any item backlights of claim 1 to 8
Mould group, the backlight module include lamp bar and light guide plate integral structure；
The production method includes:
LED chip is fixed on bracket, makes the bonding wire of the LED chip；
The bracket is welded on welding plate layer, semi-finished product lamp bar is fabricated to, wherein the welding plate layer has end, the end
Portion is used to connect the driving circuit of the lamp bar；
The semi-finished product lamp bar is set to the side in the mold for making the light guide plate, using Shooting Technique make described in lead
Tabula rasa, wherein the light guide plate includes first surface and the first side that is connected with the first surface, the first surface
With the first groove, the semi-finished product lamp bar is located in first groove, and the first side has the second groove, the weldering
The end of plate layer is stretched out by second groove, and the bowl of the bracket and the first surface form third groove；
Encapsulating material is set in the third groove.
10. the production method of backlight module according to claim 9, which is characterized in that
The production method further include:
Reflecting layer is set in the first surface, the reflecting layer is recessed in the orthographic projection covering third of the first surface
Slot.
11. a kind of display device, which is characterized in that including the described in any item backlight modules of claim 1 to 8.
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| CN201711043164.2A CN107907932B (en) | 2017-10-31 | 2017-10-31 | Backlight module, manufacturing method of backlight module and display device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711043164.2A CN107907932B (en) | 2017-10-31 | 2017-10-31 | Backlight module, manufacturing method of backlight module and display device |
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| CN107907932B true CN107907932B (en) | 2019-08-02 |
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| CN109116628B (en) * | 2018-09-26 | 2021-09-07 | 厦门天马微电子有限公司 | Display module and display device |
| CN111025753A (en) * | 2019-12-13 | 2020-04-17 | 武汉华星光电技术有限公司 | Backlight module and display device |
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| US20120163025A1 (en) * | 2009-05-12 | 2012-06-28 | Global Lighting Technologies Inc. | Light guide apparatus for a backlight module and fabricating method thereof |
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| KR20100138662A (en) * | 2009-06-25 | 2010-12-31 | 전자부품연구원 | Led back light unit and light apparatus using the same |
| CN105093681A (en) * | 2015-09-01 | 2015-11-25 | 北京京东方茶谷电子有限公司 | Backlight module and liquid crystal display device |
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| CN107907932A (en) | 2018-04-13 |
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