CN107900528A - Radium-shine marking machine based on the positioning of CCD images - Google Patents
Radium-shine marking machine based on the positioning of CCD images Download PDFInfo
- Publication number
- CN107900528A CN107900528A CN201711454052.6A CN201711454052A CN107900528A CN 107900528 A CN107900528 A CN 107900528A CN 201711454052 A CN201711454052 A CN 201711454052A CN 107900528 A CN107900528 A CN 107900528A
- Authority
- CN
- China
- Prior art keywords
- microscope carrier
- radium
- marking machine
- positioning
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 61
- 230000007246 mechanism Effects 0.000 claims abstract description 55
- 238000004140 cleaning Methods 0.000 claims description 13
- 238000003825 pressing Methods 0.000 claims description 8
- 229910000831 Steel Inorganic materials 0.000 claims description 6
- 239000011230 binding agent Substances 0.000 claims description 6
- 239000003638 chemical reducing agent Substances 0.000 claims description 6
- 239000010959 steel Substances 0.000 claims description 6
- 238000009434 installation Methods 0.000 claims description 4
- 239000012876 carrier material Substances 0.000 claims 1
- 238000010521 absorption reaction Methods 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 241001124569 Lycaenidae Species 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 235000014987 copper Nutrition 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work
Abstract
The technical problem of mark location can not be accurately positioned in order to solve radium-shine marking machine in the prior art, the present invention provides a kind of radium-shine marking machine based on CCD positioning, including controller, board and vacuum extractor, board has one block of horizontal microscope carrier, several stomatas are distributed with the table top of microscope carrier, vacuum extractor is vacuumized material absorption on microscope carrier；The both ends of microscope carrier are respectively arranged with discharge mechanism and receiving mechanism, and the XY being installed on a board mechanical arm is provided with above microscope carrier, a laser is provided with the platform of XY mechanical arms；The both sides of laser are respectively arranged with a CCD camera, and one of camera is installed on board, another camera is installed on the platform of XY mechanical arms.After discharge mechanism and rolling-up mechanism only stop according to system command, two CCD cameras further confirm that mark location, it is therefore prevented that mark location deviates.
Description
Technical field
The present invention relates to radium-shine marking machine, more particularly to the radium-shine marking machine positioned based on CCD images.
Background technology
Radium-shine mark is to carry out local irradiation to workpiece using the laser of high-energy-density, skin-material is vaporized or is occurred
The chemical reaction of color change, so as to leave a kind of marking method of permanent marker.Radium-shine mark can get various words,
Symbol and pattern etc., character boundary can be from millimeters to micron dimension, this has special meaning to the false proof of product.
With the development of radium-shine processing technology, the appearance of new laser has promoted laser technology in plastic flexible package and electricity
The application of sub- materials industry.Material retractable of the film electron-like material in radium-shine marking machine is using reel-to-reel pattern, mark
The definite of position is only stopped by the fixed point of unwinding mechanism, but the accumulation of the vibration of machine and unwinding mechanism operation misses
Difference can all cause the deviation of mark location, so also needing to be improved existing radium-shine marking machine.
The content of the invention
The purpose of the invention is to overcome the problems of the above-mentioned prior art and mark can precisely be confirmed by providing one kind
The radium-shine marking machine based on the positioning of CCD images of position.
To reach above-mentioned purpose, technical scheme is as follows：
Based on the radium-shine marking machine of CCD images positioning, including controller, board and vacuum extractor, the board has one piece
Horizontal microscope carrier, is distributed with several stomatas on the table top of the microscope carrier, the vacuum extractor, which vacuumizes, adsorbs material in institute
State on microscope carrier；The both ends of the microscope carrier are respectively arranged with discharge mechanism and receiving mechanism, and one is provided with above the microscope carrier
The XY mechanical arms being installed on board, are provided with a laser on the platform of the XY mechanical arms；The both sides of the laser
A CCD camera is respectively arranged with, one of camera is installed on the board, another camera is installed on XY machineries
On the platform of arm.
It is further that material pressing device is provided with the microscope carrier, the material pressing device is by binder bar and driving binder bar
The cylinder composition of lifting.
It is further that the microscope carrier is suspended in above the table top of the board, leads between the microscope carrier and the table top
Cross C-type steel connection.
It is further the material roller that installation reel is both provided with the discharge mechanism and receiving mechanism, and is installed on
The buffer roll at the microscope carrier edge；The discharge mechanism and receiving mechanism are used as power source using motor.
It is further that a gear reducer is provided with the discharge mechanism.
It is further that idler roller is both provided with the discharge mechanism and receiving mechanism, the idler roller passes through tensioning
Adjusting mechanism is installed in the lower section of the microscope carrier.
It is further that the tensioning adjusting mechanism is arranged on the idler roller both ends and for described in fixation including two
The fixed seat of idler roller, is connected between two fixed seats, the both ends of the fixed link are each provided with by a fixed link
One connection handle, is provided with a strip hole in the connection handle, is fixed the connection handle through the strip hole with bolt
On the board.
It is further that material strip cleaning device is additionally provided with the discharge mechanism；The material strip cleaning device is located at institute
The top of buffer roll is stated, is mainly made of mounting bracket, cleaning roll paper mounted roller, dirty roll paper material receiving roller, the top of the mounting bracket
Portion is provided with a U-lag, and the both ends of the cleaning roll paper mounted roller are inserted in the U-lag, are provided with the mounting bracket
One ellipse hole, the both ends of the dirty roll paper material receiving roller are inserted in the ellipse hole.
It is further that the end of the microscope carrier is provided with two buffer rolls being arranged side by side, this two described slow
Rush between roller and be provided with one piece of intermediate plate, material pressing device described in two groups is provided with the intermediate plate.
The beneficial effects of the invention are as follows：After 1. discharge mechanism and rolling-up mechanism only stop according to system command, two CCD cameras
Further confirm that mark location, prevent mark location from deviateing；2. motor is all set as power in discharge mechanism and receiving mechanism
Source, can so keep the tension force of material；3. the gear reducer set in unreeling structure can be eliminated because of material coil diameter change and band
The tension variation come；After 4. discharge mechanism and rolling-up mechanism only stop according to system command, vacuum extractor, which vacuumizes, inhales material
It is attached on microscope carrier, makes the inner surface for not destroying material during laser head mark, keeps the performance of material；5. it is supported on below microscope carrier
C-type steel can absorb the vibration when vibration and laser head mark of board.
Brief description of the drawings
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described.
Fig. 1 is the material volume partial schematic diagram disclosed in the present embodiment；
Fig. 2 is the stereogram of the radium-shine marking machine disclosed in the present embodiment；
Fig. 3 is the front view of the radium-shine marking machine disclosed in the present embodiment.
Embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete
Site preparation describes.
To coordinate the radium-shine marking machine in the present embodiment, it is necessary to determine in the pre-buried several coppers in the both sides of coiled thin-film material
Site A and B（Referring to Fig. 1）, the anchor point equidistant arrangement per one side.
As shown in Figures 2 and 3, a kind of radium-shine marking machine based on the positioning of CCD images, including controller, board 1 and vacuumize
Device, board have one block of horizontal microscope carrier 2, and microscope carrier is suspended in above the table top of board, passes through C-type steel between microscope carrier and table top
3 connections, C-type steel can absorb the vibration when vibration and laser head mark of board.Several gas are distributed with the table top of microscope carrier
Hole, vacuum extractor are vacuumized by material absorption on microscope carrier, and when laser head mark will not destroy the inner surface of material, maintain
The performance of material.The both ends of microscope carrier are respectively arranged with discharge mechanism and receiving mechanism, the two mechanisms are both provided with installation reel
Material roller 4a and 4b, and buffer roll 5a and 5b installed in microscope carrier edge.One is provided with above microscope carrier and is installed in board
On XY mechanical arms 6, a laser 7 is installed on the platform of XY mechanical arms；The both sides of laser are respectively arranged with a CCD
Camera 8 and 8 ', one of camera 8 are installed on board, another camera 8 ' is installed on the platform of XY mechanical arms.
One roll of material is placed on the material roller 4a of discharge mechanism, and one end of material is pulled to the material roller 4b of receiving mechanism
On, first group of copper anchor point is manually adjusted under CCD camera, and two CCD cameras of control gather this section of thin-film material left side respectively
The characteristic image of right copper anchor point, and the characteristic image collected is arranged to standard picture in the controller.Collecting machine
Structure and discharge mechanism advance according to system command driving material and only stop after the distance of one end, and two CCD cameras gather film material respectively
Expect the characteristic image of left and right copper anchor point, and be passed along controller, controller is by the characteristic image and system that receive
The standard picture of setting is compared, and whether judgement is herein mark location, if mark location, laser head carries out mark,
If it is not, system alarm.
In laser head mark, material displacement in order to prevent, so being provided with microscope carrier by binder bar 9a and cylinder 9b
The material pressing device of composition, cylinder drive general who has surrendered's material under binder bar to be pressed on microscope carrier.The end of microscope carrier is provided with two and arranges side by side
The buffer roll 5b and 5c of row, are provided with one piece of intermediate plate 10 between this two buffer rolls, two groups of above-mentioned pressures are provided with intermediate plate
Expect device.Two groups of material pressing devices on intermediate plate, which can not only push down material, prevents displacement, but also can be in preceding mark several times
When prepressing materials, the loss of material is reduced, so the cylinder on the cylinder and intermediate plate on microscope carrier is separately controlled.
Discharge mechanism and receiving mechanism can so keep the tension force of material using motor as power source.Discharge mechanism
In be provided with a gear reducer, gear reducer can eliminate the tension variation brought because material coil diameter changes.
It is both provided with adjusting the idler roller 4d of material tension in discharge mechanism and receiving mechanism, idler roller is adjusted by being tensioned
Mechanism is installed in the lower section of microscope carrier.Tensioning adjusting mechanism is arranged on idler roller both ends and for fixing consolidating for idler roller including two
Reservation 4e, is each provided with a connection handle 4g between two fixed seats by a fixed link 4f connection, the both ends of fixed link, even
Connect and a strip hole is provided with handle, fixed the stem to bolt through strip hole on board.
The material strip cleaning device for material surface cleaning is additionally provided with discharge mechanism；Material strip cleaning device is positioned at buffering
The top of roller, is mainly made of, the top of mounting bracket mounting bracket 11a, cleaning roll paper mounted roller 11b, dirty roll paper material receiving roller 11c
A U-lag 11d is provided with, the both ends of cleaning roll paper mounted roller are inserted in U-lag, an ellipse is provided with mounting bracket and is led to
Hole, the both ends of dirty roll paper material receiving roller are inserted in ellipse hole.U-type groove and ellipse hole can eliminate vibration and material is thick
The influence that degree change is brought.
In conclusion above-mentioned marking machine has the advantages that is：
After 1. discharge mechanism and rolling-up mechanism only stop according to system command, two CCD cameras further confirm that mark location, prevent
Mark location deviates；
2. all setting motor in discharge mechanism and receiving mechanism as power source, the tension force of material can be so kept；
3. the gear reducer set in unreeling structure can eliminate the tension variation brought because material coil diameter changes；
After 4. discharge mechanism and rolling-up mechanism only stop according to system command, vacuum extractor, which vacuumizes, adsorbs material in microscope carrier
On, make the inner surface for not destroying material during laser head mark, keep the performance of material；
5. the C-type steel being supported on below microscope carrier can absorb the vibration when vibration and laser head mark of board.
A variety of modifications to these embodiments will be apparent for those skilled in the art, herein
Defined General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Cause
This, the present invention is not intended to be limited to the embodiments shown herein, and is to fit to and principles disclosed herein and new
The consistent most wide scope of clever feature.
Claims (9)
1. the radium-shine marking machine based on the positioning of CCD images, it is characterised in that described including controller, board and vacuum extractor
Board has one block of horizontal microscope carrier, is distributed with several stomatas on the table top of the microscope carrier, the vacuum extractor vacuumize by
Material is adsorbed on the microscope carrier；The both ends of the microscope carrier are respectively arranged with discharge mechanism and receiving mechanism, the microscope carrier it is upper
Side is provided with the XY being installed on a board mechanical arm, and a laser is provided with the platform of the XY mechanical arms；It is described
The both sides of laser are respectively arranged with a CCD camera, and one of camera is installed on the board, the installation of another camera
On the platform of the XY mechanical arms.
2. the radium-shine marking machine according to claim 1 based on the positioning of CCD images, it is characterised in that set on the microscope carrier
Material pressing device is equipped with, the material pressing device is made of the cylinder that binder bar and driving binder bar lift.
3. the radium-shine marking machine according to claim 2 based on the positioning of CCD images, it is characterised in that the microscope carrier suspends
Above the table top of the board, connected between the microscope carrier and the table top by C-type steel.
4. the radium-shine marking machine according to claim 3 based on the positioning of CCD images, it is characterised in that the discharge mechanism
With the material roller that installation reel is both provided with receiving mechanism, and the buffer roll installed in the microscope carrier edge；The feeding machine
Structure and receiving mechanism are used as power source using motor.
5. the radium-shine marking machine according to claim 4 based on the positioning of CCD images, it is characterised in that the discharge mechanism
In be provided with a gear reducer.
6. the radium-shine marking machine according to claim 5 based on the positioning of CCD images, it is characterised in that the discharge mechanism
With idler roller is both provided with receiving mechanism, the idler roller is installed in the lower section of the microscope carrier by being tensioned adjusting mechanism.
7. the radium-shine marking machine according to claim 6 based on the positioning of CCD images, it is characterised in that the tensioning is adjusted
Mechanism includes two and is arranged on the idler roller both ends and for fixing the fixed seat of the idler roller, two fixed seats it
Between connected by fixed link, the both ends of the fixed link are each provided with a connection handle, one are provided with the connection handle
The connection handle, is fixed on the board by a strip hole with bolt through the strip hole.
8. the radium-shine marking machine according to claim 7 based on the positioning of CCD images, it is characterised in that the discharge mechanism
In be additionally provided with material strip cleaning device；The material strip cleaning device is located at the top of the buffer roll, mainly by mounting bracket, cleaning
Roll paper mounted roller, dirty roll paper material receiving roller form, and a U-lag, the cleaning roll paper peace are provided with the top of the mounting bracket
The both ends of dress roller are inserted in the U-lag, and an ellipse hole, the dirty roll paper material receiving roller are provided with the mounting bracket
Both ends be inserted in the ellipse hole.
9. the radium-shine marking machine according to claim 8 based on the positioning of CCD images, it is characterised in that the end of the microscope carrier
End is provided with two buffer rolls being arranged side by side, and one piece of intermediate plate is provided between this two described buffer rolls, in described
Between be provided with material pressing device described in two groups on plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711454052.6A CN107900528A (en) | 2017-12-28 | 2017-12-28 | Radium-shine marking machine based on the positioning of CCD images |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711454052.6A CN107900528A (en) | 2017-12-28 | 2017-12-28 | Radium-shine marking machine based on the positioning of CCD images |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107900528A true CN107900528A (en) | 2018-04-13 |
Family
ID=61871668
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711454052.6A Pending CN107900528A (en) | 2017-12-28 | 2017-12-28 | Radium-shine marking machine based on the positioning of CCD images |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107900528A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108672944A (en) * | 2018-08-25 | 2018-10-19 | 深圳市超越激光智能装备股份有限公司 | A kind of stainless steel belt laser marking machine of view-based access control model identification positioning |
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2017
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| CN201989411U (en) * | 2011-01-31 | 2011-09-28 | 山东泰宝防伪技术产品有限公司 | Full-automatic gold stamping and marking machine |
| CN102433934A (en) * | 2011-10-19 | 2012-05-02 | 沈阳建筑大学 | Automatic-resetting multidirectional earthquake isolating bearing with C-type steel plates combined in form of Chinese character 'Mi' |
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Cited By (2)
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