CN107896435A - Display device and its shell structure - Google Patents
Display device and its shell structure Download PDFInfo
- Publication number
- CN107896435A CN107896435A CN201711376015.8A CN201711376015A CN107896435A CN 107896435 A CN107896435 A CN 107896435A CN 201711376015 A CN201711376015 A CN 201711376015A CN 107896435 A CN107896435 A CN 107896435A
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- Prior art keywords
- main board
- circuit main
- heat emission
- shell structure
- top cover
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- 230000004308 accommodation Effects 0.000 claims abstract description 19
- 230000004888 barrier function Effects 0.000 claims description 31
- 230000002787 reinforcement Effects 0.000 claims description 27
- 230000005611 electricity Effects 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- 230000003068 static effect Effects 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 230000000630 rising effect Effects 0.000 claims 1
- 239000006185 dispersion Substances 0.000 abstract description 5
- 239000006260 foam Substances 0.000 description 5
- 229920000915 polyvinyl chloride Polymers 0.000 description 5
- 239000004800 polyvinyl chloride Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000007598 dipping method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000000615 nonconductor Substances 0.000 description 2
- 206010020843 Hyperthermia Diseases 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000036031 hyperthermia Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 210000002435 tendon Anatomy 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
This application discloses a kind of display device and shell structure, shell structure includes：Top cover and the first side wall, second sidewall, the 3rd side wall and the 4th side wall set around top cover, to form the accommodation space of shell structure；Circuit main board is arranged in accommodation space；First radiator structure, it is arranged on top cover, and the first radiator structure includes several and corresponds to the first heat emission hole that circuit main board is set, so that the heat of circuit main board sheds in time；Also include the second radiator structure being arranged on the first side wall.The backboard of the application is provided with multiple thermal vias structures upper, and is arranged according to predetermined layout, and radiator structure is provided with the corresponding region of backboard and circuit main board, is easy to strengthen the heat dispersion of circuit main board in display screen.
Description
Technical field
The application is related to display device technology field, more particularly to the radiating knot of a kind of display device and shell structure
Structure.
Background technology
At present, display device is used for showing image, to be available for user to watch.In general, display device mainly includes frame
Body, display panel, backlight module, circuit board and shell structure etc. form component, and wherein display panel and backlight module is contained in
In framework, and the circuit board for being arranged on backlight module dorsal part is shielded by shell structure, outer to avoid exposure to.Typical display is set
It is standby mostly to be locked shell structure in its dorsal part using screw.
But typical display screen heat-sinking capability is poor, for user when using mobile terminal, local height occurs in display screen
Temperature, the usage experience of user is influenceed, result even in mobile terminal and be damaged, make the service life of display screen reduce, used time radiating
Area is smaller and heat dispersion is poor.
The content of the invention
The purpose of the application be in order to solve in typical technology in shell structure shell structure, display screen heat-sinking capability compared with
Difference, for user when using mobile terminal, localized hyperthermia occurs in display screen, influences the usage experience of user, results even in shifting
The problem of dynamic terminal is damaged, and makes the service life of display screen reduce, and used time area of dissipation is smaller and heat dispersion is poor, and propose
A kind of display device and shell structure radiator structure.
To achieve these goals, the application employs following technical scheme：
A kind of radiator structure of display device and shell structure, top cover and around the top cover set the first side
Wall, second sidewall, the 3rd side wall and the 4th side wall, to form the accommodation space of the shell structure；The circuit main board is set
In the accommodation space；
Safeguard structure, it includes being arranged on the top cover, the top insulating barrier towards the circuit main board, with described in isolation
The static sent out of circuit main board；
First radiator structure, it is arranged on the top cover, and first radiator structure includes several corresponding to described
The first heat emission hole that circuit main board is set, so that the heat of the circuit main board sheds in time；
Lug boss, it is arranged on the top cover and protrudes from the top cover surface.
Alternatively, in addition to the second radiator structure for being arranged on the first side wall, second radiator structure include
Several scattered second heat emission holes laid and at least one the first reinforcement set through second heat emission hole.
Alternatively, second heat emission hole is laid perpendicular to the long axis direction of the first side wall in strip, and at least one
First reinforcement is set parallel to the long axis direction of the first side wall through second heat emission hole.
Alternatively, second heat emission hole also includes waterproof portion, the waterproof portion is arranged on second radiator structure,
And keep away that pool is corresponding with the circuit main board, directly invade the keeping away in pool of the circuit main board to obstruct water droplet.
Alternatively, in addition to the 3rd radiator structure that is arranged in the second sidewall, the 3rd radiator structure include
Several scattered the 3rd heat emission holes laid and at least one the second reinforcement set through the 3rd heat emission hole.
Alternatively the 3rd heat emission hole is laid perpendicular to the long axis direction of the second sidewall in strip, at least one institute
The long axis direction that the second reinforcement is stated parallel to second sidewall is set through the 3rd heat emission hole.
Alternatively, in addition at least two senders, at least two sender be arranged in the second sidewall and
It is respectively arranged at the both sides of the 3rd radiator structure.
Alternatively, the boss strip；The lug boss is parallel to the second sidewall and is arranged at described first
Below radiator structure.
A kind of display device is also provided in another embodiment of the application, it includes：Backboard, circuit main board, it is arranged at institute
State on backboard, be provided with the circuit main board and keep away pool；Loudspeaker；Shell structure, its corresponding hamper on the backboard to protect
Protect the circuit main board and the loudspeaker；The shell structure includes：Top cover and around the top cover set the first side wall,
Second sidewall, the 3rd side wall and the 4th side wall, to form the accommodation space of the shell structure；The circuit main board is arranged at institute
State in accommodation space；Safeguard structure, it includes the first insulating barrier, and first insulating barrier is arranged at the circuit main board and described
Between backboard, so that the circuit main board insulate with the backboard；First radiator structure, it is arranged on the top cover, described
First radiator structure includes several and corresponds to the first heat emission hole that the circuit main board is set, so that the heat of the circuit main board
Amount sheds in time；Lug boss, it is arranged on the top cover and protrudes from the top cover surface.
Alternatively, the relatively described accommodation space of the first side wall is outward-dipping, to increase the effective of the first side wall
Area of dissipation.
Alternatively, in addition to the second radiator structure for being arranged on the first side wall, second radiator structure include
Several scattered second heat emission holes laid and at least one the first reinforcement set through second heat emission hole.
Alternatively, second heat emission hole is laid perpendicular to the long axis direction of the first side wall in strip, and at least one
First reinforcement is set parallel to the long axis direction of the first side wall through second heat emission hole.
Alternatively, second heat emission hole also includes waterproof portion, the waterproof portion is arranged between second heat emission hole,
And keep away that pool is corresponding with the circuit main board, directly invade the keeping away in pool of the circuit main board to obstruct water droplet.
Alternatively, in addition to the 3rd radiator structure that is arranged in the second sidewall, the 3rd radiator structure include
Several scattered the 3rd heat emission holes laid and at least one the second reinforcement set through the 3rd heat emission hole.
Alternatively, the 3rd heat emission hole is laid perpendicular to the long axis direction of the second sidewall in strip, and at least one
Second reinforcement is set parallel to the long axis direction of second sidewall through the 3rd heat emission hole.
Alternatively, in addition at least two senders, at least two sender be arranged in the second sidewall and
It is respectively arranged at the both sides of the 3rd radiator structure；At least two sender is corresponding with the loudspeaker.
Alternatively, the sender leads to including several perpendicular to the strip that the long axis direction of the second sidewall is laid
Hole, at least one the 3rd reinforcement are set parallel to the long axis direction of second sidewall through the strip through hole.
Alternatively, the boss strip；The lug boss is parallel to the second sidewall and is arranged at described first
Below radiator structure.
Alternatively, the shell structure is arranged at the middle and lower part of the backboard, and the shell structure is on the backboard
Projected area accounts for the backboard area no more than 1/2.
Alternatively, the shell structure includes：
Top cover and the first side wall, second sidewall, the 3rd side wall and the 4th side wall set around the top cover, to be formed
The accommodation space of the shell structure；The circuit main board is arranged in the accommodation space；
First radiator structure, it is arranged on the top cover, and first radiator structure includes several corresponding to described
The first heat emission hole that circuit main board is set, so that the heat of the circuit main board sheds in time；
Second radiator structure, it is arranged on the first side wall, second radiator structure include several second dissipate
Hot hole and at least one the first reinforcements；Second heat emission hole is in strip perpendicular to the long axis direction of the first side wall
Lay, at least one first reinforcement is set parallel to the long axis direction of the first side wall through second heat emission hole
Put；
Lug boss, it is arranged on the top cover and protrudes from the top cover surface.
Circuit main board in the application is arranged in the accommodation space of shell structure；It is right that first radiator structure includes several
The first heat emission hole that should be set in circuit main board, so that the heat of circuit main board sheds in time, it is easy to improve the radiating of display screen
Performance；Second heat emission hole also includes waterproof portion, and waterproof portion is arranged between the second heat emission hole and keeps away pool pair with circuit main board
Should, the keeping away in pool of the circuit main board is directly invaded to obstruct water droplet, the first side wall is outward-dipping with respect to accommodation space, with increasing
Effective area of dissipation of big the first side wall, increases heat dispersion, improves the service life of display screen, and backboard is provided with multiple dissipate upper
Heat through-hole structure, and arranged according to predetermined layout, radiator structure is provided with the corresponding region of backboard and circuit main board, is easy to
Strengthen the heat dispersion of circuit main board in display screen, at the top of shell structure, the distribution of radiator structure is away from circuit main board
Corresponding region radiator structure number of openings it is more, close to circuit main board corresponding region number of openings it is few, radiator structure
Predetermined distribution design so that display device radiating more uniformly, effectively, at the top of backboard, close to the correspondence of circuit main board
Region is additionally provided with decoration hole, so as to seem more attractive in appearance and uniformly, in thermal vias have to add in the lateral surface of shell structure
Strengthening tendons, reinforcement close to shell structure medial surface, its can not also be influenceed while radiating the overall intensity of shell structure and
It is attractive in appearance.
Brief description of the drawings
Fig. 1 is the structural representation of the shell structure of the embodiment of the application one；
Fig. 2 is shell structure and the assembly structure diagram of backboard in the embodiment of the application one；
Fig. 3 is the mplifying structure schematic diagram at A in Fig. 2；
Fig. 4 is the mplifying structure schematic diagram at B in Fig. 1；
Fig. 5 is the shell structure of display device in another embodiment of the application, loudspeaker and the signal of circuit main board package assembly
Figure；
Fig. 6 is the structural representation of display device in another embodiment of the application.
Fig. 7 is the backboard and power supply mainboard structure schematic diagram of display device in another embodiment of the application；
Fig. 8 is the enlarged drawing in C regions in Fig. 7.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present application, the technical scheme in the embodiment of the present application is carried out clear, complete
Site preparation describes, it is clear that described embodiment is only some embodiments of the present application, rather than whole embodiments.
In the description of the present application, it is to be understood that term " on ", " under ", "front", "rear", "left", "right", " top ",
The orientation or position relationship of the instruction such as " bottom ", " interior ", " outer " are based on orientation shown in the drawings or position relationship, merely to just
Described in description the application and simplifying, rather than instruction or imply signified device or element must have specific orientation, with
Specific azimuth configuration and operation, therefore it is not intended that limitation to the application.
Reference picture 1, a kind of shell structure 10 is provided in the embodiment of the application, for corresponding hamper in the display dress
In the circuit main board (not shown) put, including：Top cover 11 and the first side wall 11a set around top cover, second sidewall
11b, the 3rd side wall 11c and the 4th side wall 11d, to form the accommodation space 12 of shell structure 10；Circuit main board is arranged at accommodating
In space 12；
Further, the shell structure 10 of the present embodiment also the first radiator structure 14, the second radiator structure 15 and the 3rd
Radiator structure 16.
Wherein, with reference to shown in Fig. 2, the first radiator structure 14 is arranged on top cover 11.First radiator structure 14 includes some
Individual first heat emission hole 141 and lug boss 142, first heat emission hole 141 is set corresponding to circuit main board, so that circuit main board
Heat shed in time；The lug boss 142 is arranged at top cover 11 backwards to the one side of the circuit main board and protrudes from top cover 11
Surface.Specifically, lug boss 142 is strip；Lug boss 142 is parallel to second sidewall 11b and is arranged at the first radiator structure 14
Lower section.This design can be when shell structure 10 be leaned on wall to hang and hung, and lug boss 142 remains to support top cover 11 to keep necessarily with metope
Distance so that heat can pass through first heat emission hole 141 and shed.
With reference to shown in Fig. 3, the second radiator structure 15 is arranged at the first side wall 11a.Second radiator structure 15 includes several
Scattered the second heat emission hole 151 and at least one the first reinforcement 152 set through the second heat emission hole 151 laid.
Further, the second heat emission hole 151 is laid perpendicular to the first side wall 11a long axis direction in strip, and at least one
First reinforcement 152 is set parallel to the first side wall 11a long axis direction through the second heat emission hole 151.
Second radiator structure 15 also includes waterproof portion 153, waterproof portion 153 be arranged between the second heat emission hole 151 and with electricity
Road mainboard keeps away that pool (not shown) is corresponding, and the keeping away in pool of circuit main board is directly invaded to obstruct water droplet.Wherein, it is described
It may be, for example, the integrated position of Important Components, electric power connecting position etc. to keep away pool.It is visible with reference to Fig. 1, Fig. 2, the second heat emission hole
151 interior views structure and external view structure is differed, i.e., the waterproof portion of the second heat emission hole 151 can be substantially distinguished from Fig. 1
153, and then it is difficult to the position for differentiating waterproof portion 153 from Fig. 2, it is arranged so that the outward appearance of shell structure is more beautiful
See, be symmetrical.
With reference to shown in Fig. 4, the 3rd radiator structure 16 is arranged on second sidewall 11b.3rd radiator structure 16 includes some
3rd heat emission hole 161 of individual scattered laying and at least one the second reinforcement 162 set through the 3rd heat emission hole 161.
3rd heat emission hole 161 is laid perpendicular to second sidewall 11b long axis direction in strip, at least one the second reinforcements
162 are set parallel to second sidewall 11b long axis direction through the 3rd heat emission hole 161.
The shell structure 10 of the present embodiment also includes at least two senders 17, and at least two senders 17 are arranged at second
On side wall 11b and it is respectively arranged at the both sides of the 3rd radiator structure 16.
The shell structure that the embodiment of the present application is provided, it is provided with multiple radiator structures, disclosure satisfy that the electricity on backboard
The cooling requirements of road mainboard or other circuit each side.
Further, with reference to shown in Fig. 1, top insulating barrier 425 is additionally provided with the inner side of top cover 11 of the shell structure 10,
The top insulating barrier 425 is corresponding with the power line (not shown) splicing position of the circuit main board 30, to prevent circuit main board
The electrostatic of 30 transmittings leaks and causes the situation of electric leakage.Further, it is described top insulating barrier 425 material may be, for example, foam or
The non-conductor of the electricity such as polyvinyl chloride.
In another embodiment of the application, with reference to shown in Fig. 5, Fig. 6, a kind of display device 100 is also provided, it includes：The back of the body
Plate 20, and circuit main board 30, the loudspeaker 40 being arranged on backboard 20；And shell structure 10, the correspondence of shell structure 10
Hamper on backboard 20 with protection circuit mainboard 30 and loudspeaker 40.
Wherein, shell structure 10 includes：Top cover 11 and the first side wall 11a set around top cover 11, second sidewall
11b, the 3rd side wall 11c and the 4th side wall 11d, to form the accommodation space 12 of shell structure；Circuit main board 30 is arranged at accommodating
In space 12.
Further, the shell structure 10 of the present embodiment also the first radiator structure 14, the second radiator structure 15 and the 3rd
Radiator structure 16.
Wherein, with reference to shown in Fig. 5, Fig. 6, the first radiator structure 14 is arranged on top cover 11.First radiator structure 14 includes
Several first heat emission holes 141 and lug boss 142, first heat emission hole 141 is set corresponding to circuit main board, so that circuit
The heat of mainboard sheds in time；The lug boss 142 is arranged at top cover 11 backwards to the one side of the circuit main board and protrudes from top
The surface of lid 11.Specifically, lug boss 142 is strip；Lug boss 142 is parallel to second sidewall 11b and is arranged at the first radiating knot
The lower section of structure 14.This design can be when shell structure 10 be hung by wall and hung, and lug boss 142 remains to support top cover 11 to keep one with metope
Fixed distance so that heat can pass through first heat emission hole 141 and shed.
With reference to shown in Fig. 3, the second radiator structure 15 is arranged at the first side wall 11a.Second radiator structure 15 includes several
Scattered the second heat emission hole 151 and at least one the first reinforcement 152 set through the second heat emission hole 151 laid.
Further, the second heat emission hole 151 is laid perpendicular to the first side wall 11a long axis direction in strip, and at least one
First reinforcement 152 is set parallel to the first side wall 11a long axis direction through the second heat emission hole 151.
Second radiator structure 15 also includes waterproof portion 153, waterproof portion 153 be arranged between the second heat emission hole 151 and with electricity
Road mainboard 30 keeps away the correspondence of pool 31, and the keeping away in pool of circuit main board is directly invaded to obstruct water droplet.Wherein, it is described to keep away pool 31
May be, for example, integrated position, electric power connecting position of Important Components etc..It is visible with reference to Fig. 5, Fig. 6, the second heat emission hole 151 it is interior
Portion's view structure and external view structure differ, i.e., can substantially distinguish the waterproof portion 153 of the second heat emission hole 151 from Fig. 1, and from
Fig. 6 observations are then difficult to the position for differentiating waterproof portion 153, are arranged so that the outward appearance of shell structure is more attractive in appearance, symmetrical.
With reference to shown in Fig. 4, the 3rd radiator structure 16 is arranged on second sidewall 11b.3rd radiator structure 16 includes some
3rd heat emission hole 161 of individual scattered laying and at least one the second reinforcement 162 set through the 3rd heat emission hole 161.
3rd heat emission hole 161 is laid perpendicular to second sidewall 11b long axis direction in strip, at least one the second reinforcements
162 are set parallel to second sidewall 11b long axis direction through the 3rd heat emission hole 161.
The shell structure 10 of the present embodiment also includes at least two senders 17, and at least two senders 17 are arranged at second
On side wall 11b and it is respectively arranged at the both sides of the 3rd radiator structure 16.The loudspeaker 40 are provided with a pair, and each loudspeaker 40 are distinguished
Set corresponding to two senders 17, be respectively arranged at the second sidewall 11b of shell structure 10 both sides.
Further, with reference to shown in Fig. 5, top insulating barrier 425 is additionally provided with the inner side of top cover 11 of the shell structure 10,
The top insulating barrier 425 is corresponding with (not shown) at the power line plug wire of the circuit main board 30, to prevent circuit main board
The electrostatic of 30 transmittings leaks and causes the situation of electric leakage.Further, it is described top insulating barrier 425 material may be, for example, foam or
The non-conductor of the electricity such as polyvinyl chloride.
Further, with reference to shown in Fig. 7, the backboard 20 of the present embodiment is provided with the first recess 41 and forms circuit main board installation
Area, the circuit main board 30 are correspondingly arranged in the circuit main board installing zone.
Safeguard structure 42 is additionally provided with first recess 41 of the backboard 20, the safeguard structure 42 is coated on whole electricity
Outside road mainboard 30, to prevent the static sent out of circuit main board 30.
With reference to shown in Fig. 5, Fig. 7, Fig. 8, the top that safeguard structure 42 both includes being arranged in the shell structure 10 is exhausted
Edge layer 425, in addition to the first insulating barrier 421, the second insulating barrier 422, the 3rd insulating barrier 423 being arranged on the backboard 20.
First insulating barrier 421 is arranged in circuit main board installing zone, and the first insulating barrier 421 is arranged at circuit main board and backboard
Between 20, so that circuit main board insulate with backboard 20.First insulating barrier 421 is foam or polyvinyl chloride.
Safeguard structure 42 also includes the second insulating barrier 422, and the second insulating barrier 422 is correspondingly arranged in circuit main board and is connected with electricity
One side-lower of source line 31.
In the present embodiment, the second insulating barrier 422 stretches out along the first recess 11, and extends to what is be connected with circuit main board
The lower section of power line 31；Second insulating barrier 422 and the first insulating barrier 421 are integrally formed.First insulating barrier 421, the second insulating barrier 422
Material be foam or polyvinyl chloride.
Further, the first insulating barrier 421 is exhausted along circuit main board, the past direction extension acquisition the 3rd away from the backboard 20
Edge layer 423, the 3rd insulating barrier 423 are correspondingly arranged in circuit main board side, and electricity is directly contacted to obstruct the dust to drop and water droplet
Road mainboard.3rd insulating barrier 423 is bent towards circuit main board direction, and extends lateral margin 424, lateral margin 424 along circuit main board direction
It is arranged between circuit main board and shell structure.
First insulating barrier 421, the second insulating barrier 422, the material of the 3rd insulating barrier 423 are foam or polyvinyl chloride.
In the application, circuit main board 30 is arranged in accommodation space 12；First radiator structure 14 corresponds to including several
The first heat emission hole 142 that circuit main board is set, so that the heat of circuit main board 30 sheds in time, it is easy to improve the radiating of display screen
Performance；And the introducing of lug boss 142 can make shell structure 10 by also can guarantee that top cover 11 is kept at a distance with metope during wall hanging,
Ensure good radiating effect.Second heat emission hole 151 also includes waterproof portion 153, and waterproof portion 153 is arranged at the second heat emission hole 151
Between and with circuit main board 30 keep away that pool 31 is corresponding, keep away pool 31 with obstruct that water droplet directly invades the circuit main board 30
In, the first side wall 11a is outward-dipping with respect to accommodation space 12, to increase the first side wall 11a effective area of dissipation, increase radiating
Performance, the service life of display screen is improved, backboard 20 is provided with multiple thermal vias structures upper, and is arranged according to predetermined layout
Cloth, radiator structure is provided with the corresponding region of backboard 20 and circuit main board, is easy to strengthen the radiating of circuit main board in display screen
Performance, at the top of shell structure, the distribution of radiator structure is the through hole of the radiator structure of the corresponding region away from circuit main board
Quantity is more, and the number of openings close to the corresponding region of circuit main board 30 is few, the predetermined distribution design of radiator structure so that display dress
Put radiating more uniformly, effectively；There is reinforcement in thermal vias, reinforcement close to shell structure medial surface, what it radiated
The overall intensity of shell structure 10 and attractive in appearance can not also be influenceed simultaneously.
It is described above, the only preferable embodiment of the application, but the protection domain of the application is not limited thereto,
Any one skilled in the art in the technical scope that the application discloses, according to the technical scheme of the application and its
Application design is subject to equivalent substitution or change, should all cover within the protection domain of the application.
Claims (10)
- A kind of 1. shell structure, for corresponding hamper in the circuit main board of the display device, it is characterised in that the housing Structure includes：Top cover and the first side wall, second sidewall, the 3rd side wall and the 4th side wall set around the top cover, with described in formation The accommodation space of shell structure；Circuit main board is arranged in the accommodation space；Safeguard structure, it includes being arranged on the top cover, the top insulating barrier towards the circuit main board, to isolate the circuit The static sent out of mainboard；First radiator structure, it is arranged on the top cover, and first radiator structure includes several first heat emission holes and convex The portion of rising, first heat emission hole are set corresponding to the circuit main board, and the lug boss is arranged at the top cover backwards to the electricity The one side of road mainboard simultaneously protrudes from the top cover surface.
- 2. shell structure according to claim 1, it is characterised in that also include second be arranged on the first side wall Radiator structure, second radiator structure include several scattered second heat emission holes laid and at least one through described The first reinforcement that second heat emission hole is set.
- 3. shell structure according to claim 2, it is characterised in that second heat emission hole is perpendicular to the first side wall Long axis direction laid in strip, at least one first reinforcement runs through institute parallel to the long axis direction of the first side wall State the setting of the second heat emission hole.
- 4. the shell structure according to Claims 2 or 3, it is characterised in that second heat emission hole also includes waterproof portion, institute State waterproof portion be arranged on second radiator structure and with the circuit main board to keep away pool corresponding, it is direct to obstruct water droplet Invade keeping away in pool for the circuit main board.
- 5. shell structure according to claim 1, it is characterised in that also include the 3rd be arranged in the second sidewall Radiator structure, the 3rd radiator structure include several scattered the 3rd heat emission holes laid and at least one through described The second reinforcement that 3rd heat emission hole is set.
- 6. shell structure according to claim 5, it is characterised in that the 3rd heat emission hole is perpendicular to the second sidewall Long axis direction laid in strip, at least one second reinforcement runs through institute parallel to the long axis direction of the second sidewall State the setting of the 3rd heat emission hole.
- 7. the shell structure according to claim 5 or 6, it is characterised in that also including at least two senders, it is described at least Two senders are arranged in the second sidewall and are respectively arranged at the both sides of the 3rd radiator structure.
- 8. shell structure according to claim 1, it is characterised in that the lug boss is strip；The lug boss is parallel In the second sidewall and it is arranged at below first radiator structure.
- A kind of 9. display device, it is characterised in that including：Backboard, the circuit main board are arranged on the backboard, are provided with the circuit main board and are kept away pool；Loudspeaker；Shell structure, its corresponding hamper on the backboard to protect the circuit main board and the loudspeaker；The shell structure Including：Top cover and the first side wall set around the top cover, the second sidewall, the 3rd side wall and described the Four side walls, to form the accommodation space of the shell structure；The circuit main board is arranged in the accommodation space；Safeguard structure, it includes the first insulating barrier, and first insulating barrier is arranged between the circuit main board and the backboard, So that the circuit main board insulate with the backboard；First radiator structure, it is arranged on the top cover, and first radiator structure corresponds to the circuit including several The first heat emission hole that mainboard is set, so that the heat of the circuit main board sheds in time；The lug boss, it is arranged at the top cover backwards to the one side of the backboard and protrudes from the top cover surface.
- 10. display device according to claim 9, it is characterised in that the shell structure also includes being arranged at described the The second radiator structure in one side wall, second radiator structure include several scattered the second heat emission hole laid, Yi Jizhi Few first reinforcement set through second heat emission hole.
Priority Applications (1)
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| CN201711376015.8A CN107896435A (en) | 2017-12-19 | 2017-12-19 | Display device and its shell structure |
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| CN201711376015.8A CN107896435A (en) | 2017-12-19 | 2017-12-19 | Display device and its shell structure |
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| CN110969942A (en) * | 2018-09-28 | 2020-04-07 | 乐金显示有限公司 | Rollable display device |
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