CN107889385A - Method for producing shell, housing and electronic equipment - Google Patents

Method for producing shell, housing and electronic equipment Download PDF

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Publication number
CN107889385A
CN107889385A CN201711036402.7A CN201711036402A CN107889385A CN 107889385 A CN107889385 A CN 107889385A CN 201711036402 A CN201711036402 A CN 201711036402A CN 107889385 A CN107889385 A CN 107889385A
Authority
CN
China
Prior art keywords
clear frit
layer
housing
blocks
electronic equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201711036402.7A
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Chinese (zh)
Other versions
CN107889385B (en
Inventor
杨光明
张涛
孙文峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
Original Assignee
Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority to CN201711036402.7A priority Critical patent/CN107889385B/en
Publication of CN107889385A publication Critical patent/CN107889385A/en
Application granted granted Critical
Publication of CN107889385B publication Critical patent/CN107889385B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0217Mechanical details of casings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0217Mechanical details of casings
    • H05K5/0243Mechanical details of casings for decorative purposes

Abstract

The embodiment of the present application discloses a kind of method for producing shell, housing and electronic equipment, by in base material towards forming prefilter layer on the surface on the outside of electronic equipment, the prefilter layer includes some blocks, the clear frit of different refractivity is alternately disposed at some blocks, by refraction and reflex of the clear frit of different blocks different refractivity to light, so as to have the function that to launch fingerprint mark, naked eyes are made to be not easy to discover fingerprint mark.

Description

Method for producing shell, housing and electronic equipment
Technical field
The application is related to technical field of electronic equipment, and in particular to a kind of method for producing shell, housing and electronic equipment.
Background technology
At present, electronic equipment, for example mobile phone, the housing outer surface of tablet personal computer easily glue fingerprint.
The content of the invention
The embodiment of the present application provides a kind of method for producing shell, housing and electronic equipment, to launch fingerprint mark, makes naked eyes It is not easy to discover fingerprint mark.
The embodiment of the present application provides a kind of method for producing shell, and the housing is applied to electronic equipment, and the housing makes Method includes:
There is provided a base material, the base material includes first surface and second surface, and the first surface is towards in electronic equipment Side, second surface is towards on the outside of electronic equipment;And
Prefilter layer is set on the second surface of the base material, and the prefilter layer includes some blocks, different refractivity Clear frit is alternately disposed at some blocks.
The embodiment of the present application also provides a kind of housing, and applied to electronic equipment, the housing is preposition including a base material and one Layer, the base material include first surface and second surface, and the first surface is electric towards electronic equipment inner side, second surface direction On the outside of sub- equipment, the prefilter layer is arranged at the second surface of the base material, and the prefilter layer includes some blocks, difference refraction The clear frit of rate is alternately disposed at some blocks.
The embodiment of the present application additionally provides a kind of electronic equipment, including housing, and the housing is preposition including a base material and one Layer, the base material include first surface and second surface, and the first surface is electric towards electronic equipment inner side, second surface direction On the outside of sub- equipment, the prefilter layer is arranged at the second surface of the base material, and the prefilter layer includes some blocks, difference refraction The clear frit of rate is alternately disposed at some blocks.
The method for producing shell that the embodiment of the present application provides, by base material towards being formed on the surface on the outside of electronic equipment Prefilter layer, the prefilter layer include some blocks, and the clear frit of different refractivity is alternately disposed at some blocks, by not With refraction and reflex of the clear frit to light of block different refractivity, so as to have the function that to launch fingerprint mark, make Naked eyes are not easy to discover fingerprint mark.
Brief description of the drawings
In order to illustrate more clearly of the technical scheme in the embodiment of the present application, make required in being described below to embodiment Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present application, for For those skilled in the art, on the premise of not paying creative work, it can also be obtained according to these accompanying drawings other attached Figure.
Fig. 1 is the structural representation for the electronic equipment that the embodiment of the present application provides.
Fig. 2 is the structural representation for the housing that the embodiment of the present application provides.
Fig. 3 is the structural representation for the bonnet that the embodiment of the present application provides.
Fig. 4 is profiles of the Fig. 3 in the first embodiment in A-A directions.
Fig. 5 is profiles of the Fig. 3 in second of embodiment in A-A directions.
Fig. 6 is the top view for the bonnet that the embodiment of the present application provides.
Fig. 7 is another structural representation for the housing that the embodiment of the present application provides.
Fig. 8 is another structural representation for the bonnet that the embodiment of the present application provides.
Fig. 9 is another structural representation for the electronic equipment that the embodiment of the present application provides.
Figure 10 is the first schematic flow sheet for the bonnet preparation method that the embodiment of the present application provides.
Figure 11 is second of schematic flow sheet of the bonnet preparation method that the embodiment of the present application provides.
Figure 12 is the third schematic flow sheet for the bonnet preparation method that the embodiment of the present application provides.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present application, the technical scheme in the embodiment of the present application is carried out clear, complete Site preparation describes.Obviously, described embodiment is only some embodiments of the present application, rather than whole embodiments.It is based on Embodiment in the application, the every other implementation that those skilled in the art are obtained under the premise of creative work is not made Example, belong to the scope of the application protection.
In the description of the present application, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ", " up time The orientation or position relationship of the instruction such as pin ", " counterclockwise " are based on orientation shown in the drawings or position relationship, are for only for ease of Describe the application and simplify to describe, rather than indicate or imply that signified device or element must have specific orientation, Yi Te Fixed azimuth configuration and operation, therefore it is not intended that limitation to the application.In addition, term " first ", " second " are only used for Purpose is described, and it is not intended that instruction or hint relative importance or the implicit quantity for indicating indicated technical characteristic. Thus, " first " is defined, the feature of " second " can be expressed or implicitly includes one or more feature. In the description of the present application, " multiple " are meant that two or more, unless otherwise specifically defined.
, it is necessary to illustrate in the description of the present application, unless otherwise clearly defined and limited, term " installation ", " phase Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or be integrally connected;Can To be mechanical connection or electrical connection or can mutually communicate;Can be joined directly together, can also be by between intermediary Connect connected, can be connection or the interaction relationship of two elements of two element internals.For the ordinary skill of this area For personnel, the concrete meaning of above-mentioned term in this application can be understood as the case may be.
In this application, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it " under " Can directly it be contacted including the first and second features, it is not directly to contact but pass through it that can also include the first and second features Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " to include first special Sign is directly over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.Fisrt feature exists Second feature " under ", " lower section " and " following " fisrt feature that includes are immediately below second feature and obliquely downward, or be merely representative of Fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the application.In order to Simplify disclosure herein, hereinafter the part and setting of specific examples are described.Certainly, they are only example, and And purpose does not lie in limitation the application.In addition, the application can in different examples repeat reference numerals and/or reference letter, This repetition is for purposes of simplicity and clarity, between itself not indicating discussed various embodiments and/or setting Relation.In addition, this application provides various specific techniques and material examples, but those of ordinary skill in the art can be with Recognize the application of other techniques and/or the use of other materials.
The embodiment of the present application provides a kind of method for producing shell, housing and electronic equipment.It will carry out respectively below detailed Explanation.
In the present embodiment, will be described from the angle of bonnet preparation method, the method for producing shell can be formed Housing, the housing can be set in the electronic device, such as mobile phone, tablet personal computer, palm PC (Personal Digital Assistant, PDA) etc..
Refer to the structural representation that 1, Fig. 1 is the electronic equipment that the embodiment of the present application provides.The electronic equipment 1 includes Housing 10, display screen 20, printed circuit board 30, battery 40.
Referring to Fig. 2, Fig. 2 is the structural representation for the housing that the embodiment of the present application provides.
Wherein, the housing 10 can include cover plate 11, center 12 and bonnet 13.The cover plate 11, the and of the center 12 The bonnet 13 is mutually combined to form the housing 10.The housing 10, which has, passes through the cover plate 11, the center 12 and institute A confined space of the formation of bonnet 13 is stated, to accommodate the devices such as display screen 20, printed circuit board 30, battery 40.
In certain embodiments, the lid of cover plate 11 is set on the center 12.The lid of bonnet 13 is set to the center On 12.The cover plate 11 and bonnet 13 are located at the opposite face of the center 12.The cover plate 11 and bonnet 13 are oppositely arranged.It is described The confined space of housing 10 is between the cover plate 11 and bonnet 13.
The cover plate 11 can be transparent glass cover plate.In some embodiments, the cover plate 11 can be with such as Glass cover-plate made of the materials such as sapphire.
The center 12 can be metal shell, such as aluminium alloy center 12.It should be noted that in the embodiment of the present application The material of frame 12 is not limited to this, can also use other manner, such as:The center 12 can ceramic center, glass center. For another example:The center 12 can be plastic cement center.Also such as:The center 12 can be the knot that metal and plastic cement cooperate Structure, plastic portions and being molded on sheet metal can be formed.
The bonnet 13 can be with metal back cover, such as aluminium alloy bonnet, stainless steel bonnet.The bonnet 13 can also be glass Glass bonnet or ceramic bonnet.
Also referring to Fig. 3, Fig. 3 is the structural representation for the bonnet that the embodiment of the present application provides.
The bonnet 13 can include inner surface 131 and the outer surface 132 being oppositely arranged.The inner surface of the bonnet 13 131 close to center 12 and cover plate 11, forms a part for the inner surface of the housing 10.The outer surface 132 of the bonnet 13 is remote From center 12 and cover plate 11, a part for the outer surface of the housing 10 is formed.The bonnet 13 can also include through hole 133, The through hole 133 can be used for installing camera.
Also referring to Fig. 4, Fig. 4 is profiles of the Fig. 3 in A-A directions.
For purposes of illustration only, housing is illustrated by taking bonnet 13 as an example below.
The bonnet 13 can include a base material 134 and a prefilter layer 135.The prefilter layer 135 is arranged at the bonnet 13 surfaces away from cover plate 11.
Wherein, the base material 134 can use aluminium, such as aluminium alloy, can also use stainless steel, can also use glass Glass, ceramics etc..
The base material 134 includes first surface 1341 and second surface 1342.The first surface 1341 is set towards electronics Standby inner side, second surface 1342 is towards on the outside of electronic equipment.In one embodiment, the first surface 1341 is towards cover plate 11 Set with the direction of center 12.The first surface 1341 can be the inner surface 131 of bonnet 13.The first surface 1341 is The inner surface of the housing 11.The second surface 1342 faces away from cover plate 11 and the direction of center 12 is set.Described second Surface 1342 is the outer surface of the housing 11.
In one embodiment, referring to Fig. 5, the base material 134 can include a base layer 134a and a dyed layer 134b.The dyed layer 134b is arranged on described matrix layer 134a.The first surface 1341 is located at described matrix layer 134a. The second surface 1342 is located at the dyed layer 134b.
The dyed layer 134b can include an a color layers 134b1 and hyaline layer 134b2.The color layers 134b1 can To form layer of oxide layer by once oxidation.Such as:Monochrome oxidation forms the oxide layer, can specifically pass through oxidation technology After coloured to be formed.
It should be noted that in some embodiments, it is also possible to formed using oxidation twice or oxidation more than twice more Layer oxide layer.
In one embodiment, the color layers 134b1 can have multiple painted areas, and different painted areas are set not Same color, to form pattern.
In one embodiment, can be first right in the step of dyed layer 134b is set on described matrix layer 134a Described matrix layer 134a surface is processed by shot blasting, is then set on the described matrix layer 134a of polishing surface Chromatograph 134b, then the dyed layer 134b is processed by shot blasting.
In one embodiment, in order that the color layers 134b1 can more be firmly adhered to described matrix layer 134a, described matrix layer 134a can be processed by shot blasting, to increase the flatness on described matrix layer 134a surface, so as to Adhesive force of the color layers 134b1 in described matrix layer 134a is added, and then enables the dyed layer 134b securely It is attached to described matrix layer 134a.
In one embodiment, in order that the hyaline layer 134b2 can more be firmly adhered to the color layers 134b1, the color layers 134b1 can be processed by shot blasting, to increase the flatness on the surface of the color layers 134b1, So as to add adhesive force of the hyaline layer 134b2 in the color layers 134b1, and then enable the hyaline layer 134b2 It is firmly adhered to the color layers 134b1.
The prefilter layer 135 is arranged at the second surface 1342 of the base material 134.The prefilter layer 135 includes some areas Block 1351.
In one embodiment, the clear frit A/B of the different refractivity can use the SiO of different doping2
In one embodiment, referring to Fig. 6, some blocks 1351 can form array structure.
In one embodiment, the clear frit A/B of different refractivity is alternately disposed at some blocks 1351.
For example, the prefilter layer 135 includes some first block 1351a and some second block 1351b.Described some One block 1351a and some second block 1351b are arranged alternately.Some first block 1351a and some second blocks 1351b is arranged at intervals.The first block 1351a is provided with the clear frit A of the first refractive index.The second block 1351b It is provided with the clear frit B of second of refractive index.
In one embodiment, the first clear frit A first can be set in the first block 1351a, in the second block 1351b sets the second clear frit B, then, dries the first clear frit A and the second clear frit B, finally, has described in sintering First clear frit A and the second clear frit B base material 134, so as to obtain the housing for having the function that to launch fingerprint mark.
In one embodiment, ink-jet printer can also be utilized, by B points of the first clear frit A and the second clear frit The different print cartridges in the ink-jet printer are not taken up, and print routine is set by computer, the first clear frit and second is transparent Glaze prints on first block and the second block respectively, then, dries the first clear frit A and the second clear frit B, most Afterwards, the sintering base material 134 with the first clear frit A and the second clear frit B, so as to obtain the work with transmitting fingerprint mark Housing.
In one embodiment, the base material 134 for being provided with clear frit A/B can be sintered using kiln.
In one embodiment, the colored varnish can be sprayed on the prefilter layer 135, a protective layer 137 is formed, to protect Prefilter layer 135 is stated, avoids the prefilter layer 135 in the fragmentation using process.
It should be noted that the structure of the embodiment of the present application housing is not limited to this, such as, referring to Fig. 7, Fig. 7 is this Apply for another structural representation for the housing that embodiment provides.
The housing 10a includes cover plate 16 and bonnet 17.In certain embodiments, the cover plate 16 directly lid is set to described On bonnet 17.The cover plate 16 and the bonnet 17 are mutually combined to form the housing 10a.The housing 10a, which has, passes through institute The confined space that cover plate 16 and bonnet 17 are formed is stated, to accommodate the devices such as display screen 20, printed circuit board 30, battery 40.
Compared to the housing 10 shown in Fig. 2, Fig. 7 housing 10a does not include center, or perhaps by the center in Fig. 2 12 and bonnet 13 be integrally formed to form the structure of a bonnet 17.
Specifically, referring to Fig. 8, Fig. 8 is another structural representation for the bonnet that the embodiment of the present application provides.
In certain embodiments, bonnet 17 includes inner surface 171 and outer surface 172, inner surface 171 and the phase of outer surface 172 To setting, the whole surface of bonnet 17 is formed.Each Rotating fields of the bonnet 17 can refer to bonnet 13, will not be repeated here.
The printed circuit board 30 is installed in the housing 10, and the printed circuit board 30 can be the mainboard of electronic equipment 1, Antenna, motor, microphone, camera, light sensor, receiver and processor etc. can be integrated with printed circuit board 30 Functional unit.In certain embodiments, the printed circuit board 30 is fixed in housing 10.Specifically, the printed circuit board 30 can be screwed on center 12 by screw, can also be fitted on using card by the way of buckle on center 12.It should be noted that The mode that the embodiment of the present application printed circuit board 30 is specifically fixed on center 12 is not limited to this, can with other manner, than Such as by way of buckle and screw are fixed jointly.
The battery 40 is installed in the housing 10, and battery 40 is electrically connected with the printed circuit board 30, with to electronics Equipment 1 provides power supply.Housing 10 can be as the battery cover of battery 40.Housing 10 covers battery 40 to protect battery 40, specifically Be that bonnet 13 covers battery 40 to protect battery 40, reduce battery 40 due to electronic equipment 1 collision, fall etc. and be subject to Damage.
The display screen 20 is installed in the housing 10, meanwhile, the display screen 20 is electrically connected on printed circuit board 30, with Form the display surface of electronic equipment 1.The display screen 20 includes viewing area 14 and non-display area 15.The viewing area 14 It can be used for showing the picture of electronic equipment 1 or carry out touching manipulation etc. for user.The top region of the non-display area 15 Domain opens up the perforate for sound and light conduction, and fingerprint module, touch controlled key can be set on the bottom of non-display area 15 Deng functional unit.Wherein described cover plate 11 is installed on display screen 20, to cover display screen 20, is formed and the identical of display screen 20 Viewing area and non-display area, it can specifically refer to viewing area and the non-display area of display screen 20.
It should be noted that the structure of the display screen 20 is not limited to this.For example the display screen can be to shield comprehensively Or opposite sex screen, specifically, referring to Fig. 9, Fig. 9 is another structural representation for the electronic equipment that the embodiment of the present application provides.Fig. 9 In electronic equipment and Fig. 1 in the difference of electronic equipment be:The non-display area 15a is formed directly into display screen 20a On, for example in display screen 20a non-display area 15a it is arranged to transparent configuration, so that optical signal passes through, or directly showing Screen 20a non-display area is opened up for structures such as the perforate of light conduction or breach, can be by front camera, photoelectric sensor Etc. being arranged at non-display area position, so that front camera takes pictures, photoelectric sensor detection.The viewing area 14a is paved with Electronic equipment 1a whole surfaces.It should be noted that housing 10, printed circuit board 30 and battery 40 in the electronic equipment 1a Above content can be referred to Deng device, will not be repeated here.
The present invention also provides a kind of preparation method of housing.
It should be noted that illustrated below by taking bonnet as an example, but the embodiment of the present application method for producing shell is not It is limited to bonnet.
Also referring to Figure 10, Figure 10 is the schematic flow sheet for the bonnet preparation method that the embodiment of the present application provides.It is described Method for producing shell comprises the following steps:
Step S101 a, there is provided base material 134, the base material 134 includes first surface 1341 and second surface 1342, described First surface 1341 is towards on the inside of electronic equipment, and second surface 1342 is towards on the outside of electronic equipment.
The base material 134 can be metal material, such as aluminium, further, such as aluminium alloy.It should be noted that The base material 134 can be directly commercially available, and sheet fabrication can also be obtained, for example, aluminum alloy plate materials are forged and pressed, when The PROCESS FOR TREATMENTs such as effect obtain.The base material 134 can also use glass, ceramics etc..
The first surface 1341 is set towards the direction of cover plate 11 and center 12.After the first surface 1341 can be The inner surface 131 of lid 13.The first surface 1341 is the inner surface of the housing 11.The second surface 1342 faces away from The direction of cover plate 11 and center 12 is set.The second surface 1342 is the outer surface of the housing 11.
In one embodiment, referring to Fig. 5, the base material 134 can include a base layer 134a and a dyed layer 134b.The dyed layer 134b is arranged on described matrix layer 134a.The first surface 1341 is located at described matrix layer 134a. The second surface 1342 is located at the dyed layer 134b.
The dyed layer 134b can include an a color layers 134b1 and hyaline layer 134b2.The color layers 134b1 can To form layer of oxide layer by once oxidation.Such as:Monochrome oxidation forms the oxide layer, can specifically pass through oxidation technology After coloured to be formed.
It should be noted that in some embodiments, it is also possible to formed using oxidation twice or oxidation more than twice more Layer oxide layer.
In one embodiment, the color layers 134b1 can have multiple painted areas, and different painted areas are set not Same color, to form pattern.
In one embodiment, can be first right in the step of dyed layer 134b is set on described matrix layer 134a Described matrix layer 134a surface is processed by shot blasting, is then set on the described matrix layer 134a of polishing surface Chromatograph 134b, then the dyed layer 134b is processed by shot blasting.
In one embodiment, in order that the color layers 134b1 can more be firmly adhered to described matrix layer 134a, described matrix layer 134a can be processed by shot blasting, to increase the flatness on described matrix layer 134a surface, so as to Adhesive force of the color layers 134b1 in described matrix layer 134a is added, and then enables the dyed layer 134b securely It is attached to described matrix layer 134a.
In one embodiment, in order that the hyaline layer 134b2 can more be firmly adhered to the color layers 134b1, the color layers 134b1 can be processed by shot blasting, to increase the flatness on the surface of the color layers 134b1, So as to add adhesive force of the hyaline layer 134b2 in the color layers 134b1, and then enable the hyaline layer 134b2 It is firmly adhered to the color layers 134b1.
Step S102, sets prefilter layer 135 on the second surface 1342 of the base material 134, and the prefilter layer 135 includes Some blocks 1351, the clear frit A/B of different refractivity are alternately disposed at some blocks 1351.
In one embodiment, the clear frit A/B of the different refractivity can use the SiO of different doping2
In one embodiment, referring to Fig. 6, some blocks 1351 can form array structure.
In one embodiment, the clear frit A/B of different refractivity is alternately disposed at some blocks 1351.
For example, the prefilter layer 135 includes some first block 1351a and some second block 1351b.Described some One block 1351a and some second block 1351b are arranged alternately.Some first block 1351a and some second blocks 1351b is arranged at intervals.The first block 1351a is provided with the clear frit A of the first refractive index.The second block 1351b It is provided with the clear frit B of second of refractive index.
It should be noted that the refractive index species for the clear frit that the present embodiment provides is not limited to two kinds, or It is two or more.
In one embodiment, Figure 11 is referred to, the step S102 can include:
Step S1021:In the first block 1351a, the first clear frit A is set;
Step S1022:In the second block 1351b, the second clear frit B is set;And
Step S1023:Dry the first clear frit A and the second clear frit B.
In one embodiment, the first clear frit A first can be set in the first block 1351a, in the second block 1351b sets the second clear frit B, then, dries the first clear frit A and the second clear frit B.
In one embodiment, Figure 12 is referred to, the step S102 can also include:
Step S102a:The first clear frit A and the second clear frit B are printed on described first respectively using ink-jet printer Block 1351a and the second block 1351b;And
Step S102b:Dry the first clear frit A and the second clear frit B.
In one embodiment, ink-jet printer can also be utilized, by B points of the first clear frit A and the second clear frit The different print cartridges in the ink-jet printer are not taken up, and print routine is set by computer, the first clear frit and second is transparent Glaze prints on first block and the second block respectively, then, dries the first clear frit A and the second clear frit B.
Step S103:The base material 134 for being provided with clear frit A/B is sintered.
In one embodiment, the base material 134 for being provided with clear frit A/B can be sintered using kiln.
After the step S103, it can also include:
Step S104:The colored varnish 136 is sprayed on the prefilter layer 135.
In one embodiment, the colored varnish can be sprayed on the prefilter layer 135, a protective layer 137 is formed, to protect Prefilter layer 135 is stated, avoids the prefilter layer 135 in the fragmentation using process.
In summary, the method for producing shell that the embodiment of the present application provides, by base material towards on the outside of electronic equipment Form prefilter layer on surface, the prefilter layer includes some blocks, and the clear frit of different refractivity is alternately disposed at described some Block, by refraction and reflex of the clear frit of different blocks different refractivity to light, so as to reach transmitting fingerprint The effect of note, naked eyes are made to be not easy to discover fingerprint mark.
It will be understood by those skilled in the art that the structure of the electronic equipment 1 shown in Fig. 1 is not formed to electronic equipment 1 Restriction.Electronic equipment 1 can be included than illustrating more or less parts, either combine some parts or different portions Part is arranged.Electronic equipment 1 can also include memory, bluetooth module etc., will not be repeated here.
Method for producing shell, housing and the electronic equipment provided above the embodiment of the present application is described in detail, this Apply specific case in text to be set forth the principle and embodiment of the application, the explanation of above example is only intended to Help understands the application.Meanwhile for those skilled in the art, according to the thought of the application, in embodiment and answer With there will be changes in scope, in summary, this specification content should not be construed as the limitation to the application.

Claims (10)

1. a kind of method for producing shell, the housing is applied to electronic equipment, it is characterised in that the method for producing shell bag Include:
One base material is provided, the base material includes first surface and second surface, and the first surface is towards on the inside of electronic equipment, and the Two surfaces are towards on the outside of electronic equipment;
Prefilter layer is set on the second surface of the base material, the prefilter layer includes some blocks, different refractivity it is transparent Glaze is alternately disposed at some blocks;And
The base material for being provided with clear frit is sintered.
2. method for producing shell as claimed in claim 1, it is characterised in that the prefilter layer comprises at least some first blocks With some second blocks, some first blocks and the spaced setting of the second block, the prefilter layer is at least provided with One clear frit and the second clear frit, the refractive index of first clear frit and the second clear frit is different, and first clear frit is set The first block is placed in, second clear frit is arranged at the second block.
3. method for producing shell as claimed in claim 2, it is characterised in that set on the second surface of the base material preposition The step of layer, the prefilter layer include some blocks, and the clear frit of different refractivity is alternately disposed at some blocks includes:
In first block, the first clear frit is set;
In second block, the second clear frit is set;And
Dry first clear frit and the second clear frit.
4. method for producing shell as claimed in claim 3, it is characterised in that set on the second surface of the base material preposition The step of layer, the prefilter layer include some blocks, and the clear frit of different refractivity is alternately disposed at some blocks includes:
First clear frit and the second clear frit are printed on by first block and the second block using ink-jet printer respectively;With And
Dry first clear frit and the second clear frit.
5. method for producing shell as claimed in claim 1, it is characterised in that described to the base material for being provided with clear frit After the step of being sintered, in addition to:
One protective layer is set on the prefilter layer.
A kind of 6. housing, applied to electronic equipment, it is characterised in that:The housing includes a base material and a prefilter layer, the base Material includes first surface and second surface, and the first surface is towards on the inside of electronic equipment, and second surface is towards outside electronic equipment Side, the prefilter layer are arranged at the second surface of the base material, and the prefilter layer includes some blocks, different refractivity it is transparent Glaze is alternately disposed at some blocks.
7. housing as claimed in claim 6, it is characterised in that:The base material includes a base layer and a dyed layer, described The dyed layer is set on base layer, and the first surface is located at described matrix layer, and the second surface is located at the dyed layer.
8. housing as claimed in claim 6, it is characterised in that:The prefilter layer comprises at least some first blocks and some the Two blocks, some first blocks and the spaced setting of the second block, the prefilter layer is at least provided with the first clear frit With the second clear frit, the refractive index of first clear frit and the second clear frit is different, and first clear frit is arranged at first Block, second clear frit are arranged at the second block.
9. housing as claimed in claim 6, it is characterised in that:A protective layer is additionally provided with the prefilter layer.
10. a kind of electronic equipment, it is characterised in that including housing, the housing is as any one of claim 6 to 9 Housing.
CN201711036402.7A 2017-10-30 2017-10-30 Shell manufacturing method, shell and electronic equipment Active CN107889385B (en)

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Publication number Priority date Publication date Assignee Title
CN111182754A (en) * 2020-01-19 2020-05-19 Oppo(重庆)智能科技有限公司 Electronic equipment shell, manufacturing method thereof and electronic equipment

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CN101225263A (en) * 2006-12-28 2008-07-23 触媒化成工业株式会社 Paint for transparent film and transparent film coated substrate
JP2010181743A (en) * 2009-02-06 2010-08-19 Univ Of Tsukuba Photonic crystal exhibiting interference modulation electromism and refractive index modulation function
CN102211427A (en) * 2010-04-05 2011-10-12 霍尼韦尔国际公司 Film structure having inorganic surface structures and related fabrication methods
CN104903755A (en) * 2013-10-18 2015-09-09 日油株式会社 Fingerprint-resistant anti-reflection film
CN104956148A (en) * 2012-09-20 2015-09-30 芬兰国家技术研究中心股份公司 Optical device with diffractive grating
WO2017127376A1 (en) * 2016-01-18 2017-07-27 Corning Incorporated Enclosures having an improved tactile surface

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Publication number Priority date Publication date Assignee Title
CN1266750A (en) * 1999-02-26 2000-09-20 日产自动车株式会社 Coloring structure for generating color
CN101225263A (en) * 2006-12-28 2008-07-23 触媒化成工业株式会社 Paint for transparent film and transparent film coated substrate
JP2010181743A (en) * 2009-02-06 2010-08-19 Univ Of Tsukuba Photonic crystal exhibiting interference modulation electromism and refractive index modulation function
CN102211427A (en) * 2010-04-05 2011-10-12 霍尼韦尔国际公司 Film structure having inorganic surface structures and related fabrication methods
CN104956148A (en) * 2012-09-20 2015-09-30 芬兰国家技术研究中心股份公司 Optical device with diffractive grating
CN104903755A (en) * 2013-10-18 2015-09-09 日油株式会社 Fingerprint-resistant anti-reflection film
WO2017127376A1 (en) * 2016-01-18 2017-07-27 Corning Incorporated Enclosures having an improved tactile surface

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111182754A (en) * 2020-01-19 2020-05-19 Oppo(重庆)智能科技有限公司 Electronic equipment shell, manufacturing method thereof and electronic equipment

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