CN107880231A - Mould door-plate glue special of high temperature resistant degumming preventing and preparation method thereof - Google Patents

Mould door-plate glue special of high temperature resistant degumming preventing and preparation method thereof Download PDF

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Publication number
CN107880231A
CN107880231A CN201711104329.2A CN201711104329A CN107880231A CN 107880231 A CN107880231 A CN 107880231A CN 201711104329 A CN201711104329 A CN 201711104329A CN 107880231 A CN107880231 A CN 107880231A
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parts
high temperature
temperature resistant
anticreep
degumming
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张仕刚
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Ningbo Chengxin Home Furnishing Polytron Technologies Inc
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Ningbo Chengxin Home Furnishing Polytron Technologies Inc
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
    • C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
    • C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
    • C08G14/06—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols and monomers containing hydrogen attached to nitrogen
    • C08G14/08—Ureas; Thioureas
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G4/00—Condensation polymers of aldehydes or ketones with polyalcohols; Addition polymers of heterocyclic oxygen compounds containing in the ring at least once the grouping —O—C—O—
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J161/00—Adhesives based on condensation polymers of aldehydes or ketones; Adhesives based on derivatives of such polymers
    • C09J161/34—Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C09J161/04, C09J161/18 and C09J161/20
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/06—Pretreated ingredients and ingredients covered by the main groups C08K3/00 - C08K7/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0862—Nickel
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C08K2003/2241—Titanium dioxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/16—Halogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/346—Clay
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/45—Heterocyclic compounds having sulfur in the ring
    • C08K5/46—Heterocyclic compounds having sulfur in the ring with oxygen or nitrogen in the ring
    • C08K5/47—Thiazoles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation

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  • Polymers & Plastics (AREA)
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  • Detergent Compositions (AREA)

Abstract

The invention discloses a kind of mould door-plate glue special of high temperature resistant degumming preventing, its starting components includes 20 25 parts of formaldehyde, 10 15 parts of urea, 15 parts of alcohol of ethoxylation C16 18,10 15 parts of ethylene glycol dihydroxy methyl ethers, 10 15 parts of diphenylethyllene phenol APEOs, 15 parts of modification infusorial earths, 12 portions of bacteria removers, 12 parts of high temperature resistant agent, 12 parts of anticreep jellies, 15 parts of acetone, 15 parts of sodium hydroxides, 40 50 parts of water by weight.The mould door-plate glue special for the high temperature resistant degumming preventing that the present invention obtains, it is had the technical effect that by adding bacteria remover, then can be beneficial to the preservation of glue, and causes the molded door skin to have certain degerming performance；High temperature resistant agent, anticreep jelly are added, then causes the molded door skin coated with the glue, lower use can be changed commanders without producing displacement or degumming in high temperature.

Description

Mould door-plate glue special of high temperature resistant degumming preventing and preparation method thereof
Technical field
The present invention relates to mould door-plate glue special of a kind of glue, particularly high temperature resistant degumming preventing and preparation method thereof.
Background technology
Mould door-plate refers to that substrate applies glue door-plate obtained by vacuum suction last layer film again after polishing.Molded door skin Price inexpensively, and should not be ftractureed compared with Solid Door, have that the coefficient of expansion is small, characteristic of resistance to deformation, quite by consumer Welcome.
The glue wherein used in molded door skin there is also some problems, as free formaldehyde content is high, not environmentally, it is impossible to viscous Some different materials are connect, adhesive speed is slow, is corrosive, it is therefore necessary to propose a kind of new molded door skin glue special.
The content of the invention
A kind of mould of high temperature resistant degumming preventing is provided the invention aims to solve above-mentioned the deficiencies in the prior art Door-plate glue special and preparation method thereof.
To achieve these goals, the mould door-plate glue special of the high temperature resistant degumming preventing designed by the present invention, its former material Expect that component includes 20-25 parts formaldehyde, 10-15 parts urea, 1-5 part ethoxylation C16-18- alcohol, 10-15 parts second two by weight Alcohol dihydroxy methyl ether, 10-15 part diphenylethyllene phenols APEO, 1-5 parts modification infusorial earth, 1-2 parts bacteria remover, 1-2 parts High temperature resistant agent, 1-2 part anticreeps jelly, 1-5 parts acetone, 1-5 parts sodium hydroxide, 40-50 part water；
The bacteria remover includes 40-50 parts methylisothiazolinone, 30-40 parts BIT, 10-20 parts by weight Methylchloroisothiazandnone and the nano phase ag_2 o of 1-5 parts；
The high temperature resistant agent includes 60-70 parts silica, 10-15 parts carborundum, 10-15 parts silicon fluoride, 1-5 parts by weight Graphene；
The anticreep jelly includes 70-80 parts aluminum oxide, 10-20 parts titanium dioxide, 1-5 part samaric nitrates by weight.
The modification infusorial earth includes 70-85 parts diatomite, 10-15 parts nano metal nickel powder and 1-5 parts by weight Kaolin.
Glue in the present invention includes formaldehyde, urea, ethoxylation C16-18- alcohol, ethylene glycol dihydroxy methyl ether, talan Base phenol APEO, modification infusorial earth, bacteria remover, high temperature resistant agent, anticreep jelly, acetone, sodium hydroxide, wherein water, first Aldehyde and urea are the main components in glue, and it arrives adhesive action, and urea can be used for removing aldehyde radical, and ethylene glycol dihydroxy methyl ether is A kind of industrial preservative, ethoxylation C16-18- alcohol are a kind of wetting agents, and diphenylethyllene phenol APEO is nonionic Type surfactant.
Methylisothiazolinone, BIT, methylchloroisothiazandnone in the bacteria remover have very well Bactericidal effect, coordinate nano phase ag_2 o then play preferably sterilization bacteria-eliminating efficacy, have synergy.In the high temperature resistant agent Silica, carborundum, silicon fluoride, it is possible to increase the heat resistance of glue, graphene can then promote carborundum and silicon fluoride to play Heat resistance；Aluminum oxide and titanium dioxide in the anticreep jelly can improve adhesive action in the presence of samaric nitrate.
There is aperture on diatomite surface in the modification infusorial earth, in the aperture can with supported nano-gold category nickel powder and Kaolin, so as to be modified to diatomite, the final molded door skin for be coated with the glue, it can make in the case where high temperature is changed commanders With without producing displacement or degumming.
A kind of preparation method of the mould door-plate glue special of high temperature resistant degumming preventing, comprises the following steps：
The first step, bacteria remover is prepared, by 40-50 parts methylisothiazolinone, 30-40 parts BIT, 10-20 part first Base chloroisothiazole quinoline ketone and the nano phase ag_2 o of 1-5 parts stir, and are then heated in 150-160 DEG C, heat 30min After produce bacteria remover；
Second step, high temperature resistant agent is prepared, by 60-70 parts silica, 10-15 parts carborundum, 10-15 parts silicon fluoride, 1-5 part stones Black alkene, which is put into reactor, to be heated, and temperature is 600-800 DEG C, time 60min, and grind into powder produces after then cooling down High temperature resistant agent；
3rd step, anticreep jelly is prepared, 70-80 parts aluminum oxide, 10-20 parts titanium dioxide, 1-5 part samaric nitrates is stirred, It is put into reactor and is heated, temperature is 200-300 DEG C, time 30min, and grind into powder produces anticreep after then cooling down Jelly；
4th step, modification infusorial earth is prepared, first by 70-85 parts diatomite, 10-15 parts nano metal nickel powder and 1-5 part kaolinites Soil stirring soluble in water, is then made modification infusorial earth after natural air drying；
5th step, glue is prepared, 20-25 part formaldehyde is added in reactor, then add 40-50 parts water and 1-5 part ethoxies Base C16-18- alcohol, 10-15 part ethylene glycol dihydroxies methyl ether, 10-15 part diphenylethyllene phenol APEOs, 5min is stirred, In whipping process, 3 additions of 10-15 parts urea point；
Solution in reactor is warmed to 80-100 DEG C, stops heating, reacts 90min, then cools to 70-79 DEG C, adds 1-5 Part sodium hydroxide, after solution ph is reached 8-9, adds 1-5 parts acetone, 1-5 parts modification infusorial earth, 1-2 part bacteria removers, instead Answer 30min；
Finally wait until that reaction naturally cools to 40-50 DEG C after terminating, be put into the agent of 1-2 part high temperature resistants, 1-2 part anticreep jellies, produce Molded door skin glue special.
The mould door-plate glue special for the high temperature resistant degumming preventing that the present invention obtains, it has the technical effect that degerming by adding Agent, then can be beneficial to the preservation of glue, and cause the molded door skin to have certain degerming performance；Add high temperature resistant agent, anticreep Jelly, then cause the molded door skin coated with the glue, lower use can be changed commanders without producing displacement or degumming in high temperature. In addition, the preparation method technique of the glue in patent of the present invention is simple, easily operated, raw material is technical grade, and wide material sources are square Just purchase, can be in large-scale application.
Embodiment
With reference to embodiment, the present invention is further described.
Embodiment 1：
The mould door-plate glue special for the high temperature resistant degumming preventing that the present embodiment provides, its starting components include 20 parts by weight Formaldehyde, 10 parts of urea, 1 part of ethoxylation C16-18- alcohol, 10 parts of ethylene glycol dihydroxy methyl ethers, 10 parts of diphenylethyllene phenol polyoxies Vinethene, 1 part of modification infusorial earth, 1 portion of bacteria remover, 1 part of high temperature resistant agent, 1 part of anticreep jelly, 1 part of acetone, 1 part of sodium hydroxide, 40 Part water；
It is different that the bacteria remover includes 40 parts of methylisothiazolinones, 30 parts of BITs, 10 parts of methyl chlorides by weight Thiazolinone and 1 part of nano phase ag_2 o；
The high temperature resistant agent includes 60 parts of silica, 10 parts of carborundum, 10 parts of silicon fluorides, 1 part of graphene by weight；
The anticreep jelly includes 70 parts of aluminum oxide, 10 parts of titanium dioxide, 1 part of samaric nitrate by weight.
The modification infusorial earth includes 70 parts of diatomite, 10 parts of nano metal nickel powders and 1 part of kaolin by weight.
A kind of preparation method of the mould door-plate glue special of high temperature resistant degumming preventing, comprises the following steps：
The first step, bacteria remover is prepared, by 40 parts of methylisothiazolinones, 30 parts of BITs, 10 parts of different thiophenes of methyl chloride Oxazoline ketone and 1 part of nano phase ag_2 o stir, and are then heated in 150-160 DEG C, are produced after heating 30min degerming Agent；
Second step, high temperature resistant agent is prepared, 60 parts of silica, 10 parts of carborundum, 10 parts of silicon fluorides, 1 part of graphene are put into instead Answer in kettle and heated, temperature is 600-800 DEG C, time 60min, and grind into powder produces high temperature resistant agent after then cooling down；
3rd step, anticreep jelly is prepared, 70 parts of aluminum oxide, 10 parts of titanium dioxide, 1 part of samaric nitrate are stirred, are put into reaction Heated in kettle, temperature is 200-300 DEG C, time 30min, and grind into powder produces anticreep jelly after then cooling down；
4th step, modification infusorial earth is prepared, 70 parts of diatomite, 10 parts of nano metal nickel powders and 1 part of kaolin are first dissolved in water Middle stirring, modification infusorial earth is then made after natural air drying；
5th step, glue is prepared, 20 parts of formaldehyde are added in reactor, then add 40 parts of water and 1 part of ethoxylation C16- 18- alcohol, 10 parts of ethylene glycol dihydroxy methyl ethers, 10 parts of diphenylethyllene phenol APEOs, 5min is stirred, in whipping process, 10 parts of urea point, 3 additions；
Solution in reactor is warmed to 80-100 DEG C, stops heating, reacts 90min, then cools to 70-79 DEG C, adds 1 part Sodium hydroxide, after solution ph is reached 8-9,1 part of acetone, 1 part of modification infusorial earth, 1 portion of bacteria remover are added, reacts 30min；
Finally wait until that reaction naturally cools to 40-50 DEG C after terminating, be put into 1 part of high temperature resistant agent, 1 part of anticreep jelly, produce molding Door-plate glue special.
After tested, glue made from the present embodiment is used for molded door skin, will not be moved in 30min at 220 DEG C Position or the phenomenon of degumming.
Embodiment 2：
The mould door-plate glue special for the high temperature resistant degumming preventing that the present embodiment provides, its raw material and preparation method are substantially and embodiment 1 is identical, and its main distinction is that the starting components include 25 parts of formaldehyde, 15 parts of urea, 5 parts of ethoxylations by weight C16-18- alcohol, 15 parts of ethylene glycol dihydroxy methyl ethers, 15 parts of diphenylethyllene phenol APEOs, 5 parts of modification infusorial earths, 2 parts remove Microbial inoculum, 2 parts of high temperature resistant agent, 2 parts of anticreep jellies, 5 parts of acetone, 5 parts of sodium hydroxides, 50 parts of water.
After tested, glue made from the present embodiment is used for molded door skin, will not be moved in 30min at 200 DEG C Position or the phenomenon of degumming.
Embodiment 3：
The mould door-plate glue special for the high temperature resistant degumming preventing that the present embodiment provides, its raw material and preparation method are substantially and embodiment 1 is identical, and its main distinction is that the bacteria remover includes 50 parts of methylisothiazolinones, 40 parts of benzisothiazoles by weight Ketone, 20 parts of methylchloroisothiazandnones and 5 parts of nano phase ag_2 o.
After tested, glue made from the present embodiment is used for molded door skin, will not be moved in 30min at 210 DEG C Position or the phenomenon of degumming.
Embodiment 4：
The mould door-plate glue special for the high temperature resistant degumming preventing that the present embodiment provides, its raw material and preparation method are substantially and embodiment 1 is identical, and its main distinction is that the high temperature resistant agent includes 70 parts of silica, 15 parts of carborundum, 15 parts of fluorinations by weight Silicon, 5 parts of graphenes.
After tested, glue made from the present embodiment is used for molded door skin, will not be moved in 30min at 230 DEG C Position or the phenomenon of degumming.
Embodiment 5：
The mould door-plate glue special for the high temperature resistant degumming preventing that the present embodiment provides, its raw material and preparation method are substantially and embodiment 1 is identical, and its main distinction is that the anticreep jelly includes 80 parts of aluminum oxide, 20 parts of titanium dioxide, 5 parts of nitric acid by weight Samarium.
After tested, glue made from the present embodiment is used for molded door skin, will not be moved in 30min at 195 DEG C Position or the phenomenon of degumming.
Embodiment 6：
The mould door-plate glue special for the high temperature resistant degumming preventing that the present embodiment provides, its raw material and preparation method are substantially and embodiment 1 is identical, its main distinction be the modification infusorial earth by weight include 85 parts of diatomite, 15 parts of nano metal nickel powders and 5 parts of kaolin.
After tested, glue made from the present embodiment is used for molded door skin, will not be moved in 30min at 210 DEG C Position or the phenomenon of degumming.

Claims (3)

  1. A kind of 1. mould door-plate glue special of high temperature resistant degumming preventing, it is characterised in that：Its starting components includes by weight 20-25 parts formaldehyde, 10-15 parts urea, 1-5 part ethoxylation C16-18- alcohol, 10-15 part ethylene glycol dihydroxies methyl ether, 10-15 parts Diphenylethyllene phenol APEO, 1-5 parts modification infusorial earth, 1-2 parts bacteria remover, the agent of 1-2 part high temperature resistants, 1-2 part anticreeps Jelly, 1-5 parts acetone, 1-5 parts sodium hydroxide, 40-50 part water；
    The bacteria remover includes 40-50 parts methylisothiazolinone, 30-40 parts BIT, 10-20 parts by weight Methylchloroisothiazandnone and the nano phase ag_2 o of 1-5 parts；
    The high temperature resistant agent includes 60-70 parts silica, 10-15 parts carborundum, 10-15 parts silicon fluoride, 1-5 parts by weight Graphene；
    The anticreep jelly includes 70-80 parts aluminum oxide, 10-20 parts titanium dioxide, 1-5 part samaric nitrates by weight.
  2. 2. the mould door-plate glue special of high temperature resistant degumming preventing according to claim 1, it is characterised in that：The modified silicon Diatomaceous earth includes 70-85 parts diatomite, 10-15 parts nano metal nickel powder and 1-5 part kaolin by weight.
  3. 3. a kind of preparation method of the mould door-plate glue special of high temperature resistant degumming preventing as claimed in claim 1 or 2, its feature It is, comprises the following steps：
    The first step, bacteria remover is prepared, by 40-50 parts methylisothiazolinone, 30-40 parts BIT, 10-20 part first Base chloroisothiazole quinoline ketone and the nano phase ag_2 o of 1-5 parts stir, and are then heated in 150-160 DEG C, heat 30min After produce bacteria remover；
    Second step, high temperature resistant agent is prepared, by 60-70 parts silica, 10-15 parts carborundum, 10-15 parts silicon fluoride, 1-5 part stones Black alkene, which is put into reactor, to be heated, and temperature is 600-800 DEG C, time 60min, and grind into powder produces after then cooling down High temperature resistant agent；
    3rd step, anticreep jelly is prepared, 70-80 parts aluminum oxide, 10-20 parts titanium dioxide, 1-5 part samaric nitrates is stirred, It is put into reactor and is heated, temperature is 200-300 DEG C, time 30min, and grind into powder produces anticreep after then cooling down Jelly；
    4th step, modification infusorial earth is prepared, first by 70-85 parts diatomite, 10-15 parts nano metal nickel powder and 1-5 part kaolinites Soil stirring soluble in water, is then made modification infusorial earth after natural air drying；
    5th step, glue is prepared, 20-25 part formaldehyde is added in reactor, then add 40-50 parts water and 1-5 part ethoxies Base C16-18- alcohol, 10-15 part ethylene glycol dihydroxies methyl ether, 10-15 part diphenylethyllene phenol APEOs, 5min is stirred, In whipping process, 3 additions of 10-15 parts urea point；
    Solution in reactor is warmed to 80-100 DEG C, stops heating, reacts 90min, then cools to 70-79 DEG C, adds 1-5 Part sodium hydroxide, after solution ph is reached 8-9, adds 1-5 parts acetone, 1-5 parts modification infusorial earth, 1-2 part bacteria removers, instead Answer 30min；
    Finally wait until that reaction naturally cools to 40-50 DEG C after terminating, be put into the agent of 1-2 part high temperature resistants, 1-2 part anticreep jellies, produce Molded door skin glue special.
CN201711104329.2A 2017-11-10 2017-11-10 Mould door-plate glue special of high temperature resistant degumming preventing and preparation method thereof Pending CN107880231A (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101565594A (en) * 2009-05-27 2009-10-28 广西丰林木业集团股份有限公司 High-performance urea-formaldehyde glue adhesive for fibreboard
CN101928537A (en) * 2009-11-02 2010-12-29 南宁市火炬新产品开发有限责任公司 Environmental-friendly urea-formaldehyde resin adhesive and production method thereof
CN107011840A (en) * 2017-04-11 2017-08-04 薛忠来 A kind of preparation method of non-formaldehyde wood adhesive
CN107083218A (en) * 2017-04-11 2017-08-22 薛忠来 A kind of environment-friendly type wood adhesive

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101565594A (en) * 2009-05-27 2009-10-28 广西丰林木业集团股份有限公司 High-performance urea-formaldehyde glue adhesive for fibreboard
CN101928537A (en) * 2009-11-02 2010-12-29 南宁市火炬新产品开发有限责任公司 Environmental-friendly urea-formaldehyde resin adhesive and production method thereof
CN107011840A (en) * 2017-04-11 2017-08-04 薛忠来 A kind of preparation method of non-formaldehyde wood adhesive
CN107083218A (en) * 2017-04-11 2017-08-22 薛忠来 A kind of environment-friendly type wood adhesive

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Application publication date: 20180406