CN107874550A - A kind of multifunctional assembled thermos cup based on semiconductor chilling plate - Google Patents
A kind of multifunctional assembled thermos cup based on semiconductor chilling plate Download PDFInfo
- Publication number
- CN107874550A CN107874550A CN201711006484.0A CN201711006484A CN107874550A CN 107874550 A CN107874550 A CN 107874550A CN 201711006484 A CN201711006484 A CN 201711006484A CN 107874550 A CN107874550 A CN 107874550A
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- Prior art keywords
- cup
- warm
- plectane
- lid
- chilling plate
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Classifications
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- A—HUMAN NECESSITIES
- A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
- A47G—HOUSEHOLD OR TABLE EQUIPMENT
- A47G19/00—Table service
- A47G19/22—Drinking vessels or saucers used for table service
- A47G19/2288—Drinking vessels or saucers used for table service with means for keeping liquid cool or hot
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention provides a kind of multifunctional assembled thermos cup based on semiconductor chilling plate, including cup, the insulation temperature adjustment post that is arranged in cup, and it is separately positioned on the cup lid and cup of cup upper and lower ends；Insulation temperature adjustment post includes shell, and semiconductor refrigerating pipe is embedded with shell, is provided with inside semiconductor refrigerating pipe and leads Wen Zhu, and cup lid includes lid, and manhole is provided with the middle part of lid, and cup includes pedestal, cylindrical bump is provided with the middle part of pedestal top surface.Advantage is：By using the technology of semiconductor chilling plate, the temperature of insulation temperature adjustment post can be adjusted by control circuit, realizes and heating, cooling and the effect of constant temperature is carried out to the liquid in cup, mentality of designing is ingenious, and operation strategies are wide, has good market prospects；The modular design of cup lid and cup and cup is employed, extends service life, it is convenient that replacing maintenance is carried out to each part, can be more according to the length being actually needed to adjust cup and be incubated temperature adjustment post, to adapt to different consumer demands.
Description
Technical field
The present invention relates to insulation cup technology field, more particularly to a kind of multifunctional assembled guarantor based on semiconductor chilling plate
Warm cup.
Background technology
Semiconductor chilling plate, thermoelectric module is also, is a kind of heat pump.Its advantages of is no slide unit, is applied
Some spaces are restricted, and reliability requirement is high, the occasion of no refrigerant pollution.Using the Peltier effects of semi-conducting material,
When the galvanic couple that direct current is connected into by two kinds of different semi-conducting materials, heat can be absorbed respectively at the both ends of galvanic couple and put
Go out heat, it is possible to achieve the purpose of refrigeration.It is a kind of Refrigeration Technique for producing negative thermal resistance, is characterized in movement-less part, can
It is also higher by property.
In principle, semiconductor chilling plate is the instrument of a heat transfer.When one piece of N-type semiconductor material and one piece of p-type
The thermocouple centering that semi-conducting material is coupled to have electric current by when, heat transfer will be produced between both ends, heat will be from
One end is transferred to the other end, and hot and cold side is formed so as to produce the temperature difference.But there is resistance when electric current is led through more than half in semiconductor itself
Heat will be produced during body, so as to which heat transfer can be influenceed.And the heat between two pole plates can also pass through air and semiconductor
Material itself carries out reverse heat transfer.When hot and cold side reaches certain temperature difference, when the amount of both heat transfers is equal, one will be reached
Individual equalization point, just reverse heat transfer are cancelled out each other.Now the temperature of hot and cold side would not continue to change.It is lower in order to reach
Temperature, the modes such as radiating can be taken to reduce the temperature in hot junction to realize.
At present, the function of existing thermos cup is single, and is incubated more heat-insulation layers by cup and draws realization insulation, a side
Face, the liquid heat in thermos cup can elapse over time to dribble so that fluid temperature constantly reduces, it is difficult to reaches constant temperature
Effect, on the other hand, when placing into boiling water or cold water, it is difficult to reach the consumption temperature of human body, it may appear that scald excessively or what is be subcooled shows
As being very difficult to drinking in time for consumer.
The content of the invention
To solve the above problems, the invention discloses a kind of multifunctional assembled thermos cup based on semiconductor chilling plate.
In order to reach object above, the present invention provides following technical scheme：
A kind of multifunctional assembled thermos cup based on semiconductor chilling plate, it is characterised in that：Including the cup in straight tube-like
Body, the insulation temperature adjustment post being arranged in cup, and it is separately positioned on the cup lid and cup of cup upper and lower ends；The cup
Circumferentially direction is respectively equipped with annular groove in upper and lower ends face；The insulation temperature adjustment post includes the shell in straight tube-like, described
The semiconductor refrigerating pipe in straight tube-like is embedded with shell, its top outer is provided with the first external screw thread, and bottom inside is provided with first
Internal thread, it is close on the outside of the semiconductor refrigerating pipe on the inside of shell, inside is provided with the matched Wen Zhu that leads, described to lead temperature
The outside of post on the inside of semiconductor refrigerating pipe with being close to；The cup lid includes lid in the form of annular discs, is provided with the middle part of the lid
Manhole, lower peripheral circumferential direction are provided with first annular projection, are provided with and semiconductor refrigerating pipe in the manhole
The second internal thread that the external screw thread of top outer first is adapted；The cup includes pedestal in the form of annular discs, the pedestal top surface
Middle part is provided with cylindrical bump, and the cylindrical bump is externally provided with the second external screw thread being adapted with the first internal thread, the seat
Body top surface periphery circumferential direction is provided with the second annular protrusion, first annular raised and the second annular protrusion and the annular groove
It is adapted.
Further, the top surface of the semiconductor refrigerating pipe flushes with outer casing top surface, bottom surface and the top surface of the first internal thread
Flush.
Further, the top surface for leading Wen Zhu and bottom surface flush with the top surface of semiconductor refrigerating pipe and bottom surface respectively.
Further, first is additionally provided with the top of the lid and dissipates warm device, described first, which dissipates warm device, includes being arranged on lid
First at the top of body leads warm plectane, and described first leads and second is provided with above warm plectane leads warm plectane, described first lead warm plectane and
Second leads between warm plectane that circumferentially direction is evenly distributed the first fin being vertically arranged, and described second leads at the top of warm plectane
Provided with fan, containment vessel is arranged with outside the fan.
Further, it is evenly equipped with heat emission hole on the containment vessel.
Further, the cup holder bottom is additionally provided with the second scattered warm device, and described second, which dissipates warm device, includes being arranged on cup
The 3rd of seat bottom leads warm plectane, and the described 3rd leads and the 4th is provided with below warm plectane leads warm plectane, the described 3rd lead warm plectane and
4th leads between warm plectane that circumferentially direction is evenly distributed the second fin being vertically arranged.
Further, the cup top surface is provided with rubber waterproof layer.
Further, the side wall of the cup is hollow structure, and insulating lining is filled with hollow structure.
Compared with prior art, the beneficial effects of the present invention are：By using the technology of semiconductor chilling plate, can pass through
Control circuit is incubated the temperature of temperature adjustment post to adjust, and realizes and carries out heating, cooling and the effect of constant temperature to the liquid in cup,
Mentality of designing is ingenious, and operation strategies are wide, has good market prospects；The combined type for employing cup lid and cup and cup is set
Meter, on the one hand, it is convenient to cup inwall, cup lid, cup and the cleaning for being incubated temperature adjustment post, extend service life, conveniently to each
Part carries out replacing maintenance；On the other hand, can be more according to the length being actually needed to adjust cup and be incubated temperature adjustment post, to adapt to
Different consumer demands；In addition, dissipating warm device and second by using first dissipates warm device, can be effectively by semiconductor refrigerating pipe
During work, the energy on the inside of it ensures the operating efficiency of semiconductor refrigerating pipe, improves its job stability to cup is transferred out of.
Brief description of the drawings
Fig. 1 is a kind of structural representation of the multifunctional assembled thermos cup based on semiconductor chilling plate of the present invention.
Fig. 2 is the structural representation of cup in a kind of multifunctional assembled thermos cup based on semiconductor chilling plate of the present invention
Figure.
Fig. 3 is the structure that temperature adjustment post is incubated in a kind of multifunctional assembled thermos cup based on semiconductor chilling plate of the present invention
Schematic diagram.
Fig. 4 is the structural representation of cup lid in a kind of multifunctional assembled thermos cup based on semiconductor chilling plate of the present invention
Figure.
Fig. 5 is the structural representation of cup in a kind of multifunctional assembled thermos cup based on semiconductor chilling plate of the present invention
Figure.
Reference numerals list：
1- cups, 2- insulation temperature adjustment posts, 21- shells, 22- semiconductor refrigerating pipes, the external screw threads of 23- first, spiral shell in 24- first
Line, 25- lead Wen Zhu, 3- cup lids, 31- lids, 32- manholes, the first annular projections of 33-, the internal threads of 34- second, 4- cups,
41- pedestals, 42- cylindrical bumps, the external screw threads of 43- second, the annular protrusions of 44- second, 5- annular grooves, 6- first lead Wen Yuan
Plate, 7- second lead warm plectane, the fin of 8- first, 9- fans, 10- containment vessels, and 11- the 3rd leads warm plectane, and 12- the 4th leads Wen Yuan
Plate, the fin of 13- second, 14- rubber waterproof layers.
Embodiment
With reference to the accompanying drawings and detailed description, the present invention is furture elucidated, it should be understood that following embodiments are only
For illustrating the present invention rather than limitation the scope of the present invention.It should be noted that the word " preceding " used below in description,
" rear ", "left", "right", "up" and "down" refer to the direction in accompanying drawing, and word " interior " and " outer " refer respectively to direction or remote
From the direction of particular elements geometric center.
Embodiment 1
As illustrated, a kind of multifunctional assembled thermos cup based on semiconductor chilling plate, including the cup in straight tube-like
1st, the insulation temperature adjustment post 2 being arranged in cup 1, and it is separately positioned on the cup lid 3 and cup 4 of the upper and lower ends of cup 1；The cup
Circumferentially direction is respectively equipped with annular groove 5 in the upper and lower ends face of body 1；The insulation temperature adjustment post 2 is included in the outer of straight tube-like
Shell 21, the semiconductor refrigerating pipe 22 in straight tube-like is embedded with the shell 21, and its top outer is provided with the first external screw thread 23, bottom
The first internal thread 24 is provided with the inside of portion, the inner side of shell 21 is close in the outside of the semiconductor refrigerating pipe 22, and inside is provided with and its phase
Adaptation leads warm post 25, and the outside for leading warm post 25 is close to the inner side of semiconductor refrigerating pipe 22；The cup lid 3 is included in circle
The lid 31 of plate-like, the middle part of lid 31 are provided with manhole 32, and lower peripheral circumferential direction is provided with first annular projection
33, the manhole 32 is interior to be provided with the second internal thread being adapted with the first external screw thread of top outer 23 of semiconductor refrigerating pipe 22
34；The cup 4 includes pedestal 41 in the form of annular discs, and cylindrical bump 42, the cylinder are provided with the middle part of the top surface of pedestal 41
Shape projection 42 is externally provided with the second external screw thread 43 being adapted with the first internal thread 24, in the top surface periphery circumferential direction of pedestal 41
Provided with the second annular protrusion 44, described first annular raised 33 and second annular protrusion 44 be adapted with annular groove 5.
By using the technology of semiconductor chilling plate, the temperature of insulation temperature adjustment post 2 can be adjusted by control circuit, is realized
Heating, cooling and the effect of constant temperature are carried out to the liquid in cup 1, mentality of designing is ingenious, and operation strategies are wide, has well
Market prospects, employ the modular design of cup lid 3 and cup 4 and cup 1, on the one hand, it is convenient to the inwall of cup 1, cup lid 2,
The cleaning of cup 4 and insulation temperature adjustment post 2, extends service life, convenient to carry out replacing maintenance to each part；On the other hand, may be used
More according to the length being actually needed to adjust cup 1 and be incubated temperature adjustment post 2, to adapt to different consumer demands.
In the present embodiment, the top surface of the semiconductor refrigerating pipe 22 flushes with the top surface of shell 21, spiral shell in bottom surface and first
The top surface of line 24 flushes, and the top surface for leading warm post 25 and bottom surface flush with the top surface of semiconductor refrigerating pipe 22 and bottom surface respectively.
In the present embodiment, the top of lid 31 is additionally provided with the first scattered warm device, and described first, which dissipates warm device, includes setting
Put first at the top of lid and lead warm plectane 6, described first leads the warm top of plectane 6 leads warm plectane 7 provided with second, and described first leads
Warm plectane 6 and second leads between warm plectane 7 that circumferentially direction is evenly distributed the first fin 8 being vertically arranged, and described second
Lead the warm top of plectane 7 and be provided with fan 9, containment vessel 10 is arranged with outside the fan 9, wherein, it is evenly equipped with heat emission hole on containment vessel 10.
Temperature that warm post 25 is led in warm temperature adjustment post 2 will effectively be led to conducting by dissipating warm device by first.
Embodiment 2
As illustrated, a kind of multifunctional assembled thermos cup based on semiconductor chilling plate, including the cup in straight tube-like
1st, the insulation temperature adjustment post 2 being arranged in cup 1, and it is separately positioned on the cup lid 3 and cup 4 of the upper and lower ends of cup 1；The cup
Circumferentially direction is respectively equipped with annular groove 5 in the upper and lower ends face of body 1；The insulation temperature adjustment post 2 is included in the outer of straight tube-like
Shell 21, the semiconductor refrigerating pipe 22 in straight tube-like is embedded with the shell 21, and its top outer is provided with the first external screw thread 23, bottom
The first internal thread 24 is provided with the inside of portion, the inner side of shell 21 is close in the outside of the semiconductor refrigerating pipe 22, and inside is provided with and its phase
Adaptation leads warm post 25, and the outside for leading warm post 25 is close to the inner side of semiconductor refrigerating pipe 22；The cup lid 3 is included in circle
The lid 31 of plate-like, the middle part of lid 31 are provided with manhole 32, and lower peripheral circumferential direction is provided with first annular projection
33, the manhole 32 is interior to be provided with the second internal thread being adapted with the first external screw thread of top outer 23 of semiconductor refrigerating pipe 22
34；The cup 4 includes pedestal 41 in the form of annular discs, and cylindrical bump 42, the cylinder are provided with the middle part of the top surface of pedestal 41
Shape projection 42 is externally provided with the second external screw thread 43 being adapted with the first internal thread 24, in the top surface periphery circumferential direction of pedestal 41
Provided with the second annular protrusion 44, described first annular raised 33 and second annular protrusion 44 be adapted with annular groove 5.
In the present embodiment, the top surface of the semiconductor refrigerating pipe 22 flushes with the top surface of shell 21, spiral shell in bottom surface and first
The top surface of line 24 flushes, and the top surface for leading warm post 25 and bottom surface flush with the top surface of semiconductor refrigerating pipe 22 and bottom surface respectively.
In the present embodiment, the top of lid 31 is additionally provided with the first scattered warm device, and described first, which dissipates warm device, includes setting
Put first at the top of lid and lead warm plectane 6, described first leads the warm top of plectane 6 leads warm plectane 7 provided with second, and described first leads
Warm plectane 6 and second leads between warm plectane 7 that circumferentially direction is evenly distributed the first fin 8 being vertically arranged, and described second
Lead the warm top of plectane 7 and be provided with fan 9, containment vessel 10 is arranged with outside the fan 9.Temperature will effectively be led by dissipating warm device by first
The temperature of warm post 25 is led in temperature adjustment post 2 to conducting.
In the present embodiment, it is evenly equipped with heat emission hole on the containment vessel 10.
In the present embodiment, 4, the cup bottom is additionally provided with the second scattered warm device, and described second, which dissipates warm device, includes setting
Warm plectane 11 is led the 3rd of the bottom of cup 4, the described 3rd leads the warm lower section of plectane 11 leads warm plectane 12 provided with the 4th, and the described 3rd
Lead warm plectane 11 and the 4th and lead between warm plectane 12 that circumferentially direction is evenly distributed the second fin 13 being vertically arranged.Pass through
Second dissipates warm device, can be conducted the temperature for leading warm post 25 from the bottom for leading warm temperature adjustment post 2.
Embodiment 3
As illustrated, a kind of multifunctional assembled thermos cup based on semiconductor chilling plate, including the cup in straight tube-like
1st, the insulation temperature adjustment post 2 being arranged in cup 1, and it is separately positioned on the cup lid 3 and cup 4 of the upper and lower ends of cup 1；The cup
Circumferentially direction is respectively equipped with annular groove 5 in the upper and lower ends face of body 1；The insulation temperature adjustment post 2 is included in the outer of straight tube-like
Shell 21, the semiconductor refrigerating pipe 22 in straight tube-like is embedded with the shell 21, and its top outer is provided with the first external screw thread 23, bottom
The first internal thread 24 is provided with the inside of portion, the inner side of shell 21 is close in the outside of the semiconductor refrigerating pipe 22, and inside is provided with and its phase
Adaptation leads warm post 25, and the outside for leading warm post 25 is close to the inner side of semiconductor refrigerating pipe 22；The cup lid 3 is included in circle
The lid 31 of plate-like, the middle part of lid 31 are provided with manhole 32, and lower peripheral circumferential direction is provided with first annular projection
33, the manhole 32 is interior to be provided with the second internal thread being adapted with the first external screw thread of top outer 23 of semiconductor refrigerating pipe 22
34；The cup 4 includes pedestal 41 in the form of annular discs, and cylindrical bump 42, the cylinder are provided with the middle part of the top surface of pedestal 41
Shape projection 42 is externally provided with the second external screw thread 43 being adapted with the first internal thread 24, in the top surface periphery circumferential direction of pedestal 41
Provided with the second annular protrusion 44, described first annular raised 33 and second annular protrusion 44 be adapted with annular groove 5.
In the present embodiment, the top surface of the semiconductor refrigerating pipe 22 flushes with the top surface of shell 21, spiral shell in bottom surface and first
The top surface of line 24 flushes, and the top surface for leading warm post 25 and bottom surface flush with the top surface of semiconductor refrigerating pipe 22 and bottom surface respectively.
In the present embodiment, the top of lid 31 is additionally provided with the first scattered warm device, and described first, which dissipates warm device, includes setting
Put first at the top of lid and lead warm plectane 6, described first leads the warm top of plectane 6 leads warm plectane 7 provided with second, and described first leads
Warm plectane 6 and second leads between warm plectane 7 that circumferentially direction is evenly distributed the first fin 8 being vertically arranged, and described second
Lead the warm top of plectane 7 and be provided with fan 9, containment vessel 10 is arranged with outside the fan 9.Temperature will effectively be led by dissipating warm device by first
The temperature of warm post 25 is led in temperature adjustment post 2 to conducting.
In the present embodiment, it is evenly equipped with heat emission hole on the containment vessel 10.
In the present embodiment, 4, the cup bottom is additionally provided with the second scattered warm device, and described second, which dissipates warm device, includes setting
Warm plectane 11 is led the 3rd of the bottom of cup 4, the described 3rd leads the warm lower section of plectane 11 leads warm plectane 12 provided with the 4th, and the described 3rd
Lead warm plectane 11 and the 4th and lead between warm plectane 12 that circumferentially direction is evenly distributed the second fin 13 being vertically arranged.It will lead
The temperature of warm post 25 is conducted.
In the present embodiment, the top surface of cup 4 is provided with rubber waterproof layer 14, can effectively prevent water in cup 1 from cup
The top surface of seat 4 oozes out, and ensures the security used.
In the present embodiment, the side wall of the cup 1 is hollow structure, and insulating lining is filled with hollow structure,
Improve insulation and heat-proof quality.
Technological means disclosed in the present invention program is not limited only to the technological means disclosed in above-mentioned embodiment, in addition to
Formed technical scheme is combined by above technical characteristic.It should be pointed out that for those skilled in the art
For, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (8)
- A kind of 1. multifunctional assembled thermos cup based on semiconductor chilling plate, it is characterised in that：Including the cup in straight tube-like (1) the insulation temperature adjustment post (2), being arranged in cup (1), and it is separately positioned on the cup lid (3) and cup of cup (1) upper and lower ends Seat (4)；Circumferentially direction is respectively equipped with annular groove (5) in the upper and lower ends face of the cup (1)；The insulation temperature adjustment post (2) include the shell (21) in straight tube-like, the semiconductor refrigerating pipe (22) in straight tube-like is embedded with the shell (21), it is pushed up Be provided with the first external screw thread (23) on the outside of portion, bottom inside is provided with the first internal thread (24), the semiconductor refrigerating pipe (22) outside Side is close on the inside of shell (21), and Wen Zhu (25) is led in inside provided with matched, and the outside for leading Wen Zhu (25) is with partly leading Body refrigerator pipes are close on the inside of (22)；The cup lid (3) includes lid (31) in the form of annular discs, is provided with the middle part of the lid (31) Manhole (32), lower peripheral circumferential direction are provided with first annular raised (33), be provided with the manhole (32) with The second internal thread (34) that semiconductor refrigerating pipe (22) the first external screw thread of top outer (23) is adapted；The cup (4) includes Pedestal (41) in the form of annular discs, pedestal (41) the top surface middle part are provided with cylindrical bump (42), the cylindrical bump (42) The second external screw thread (43) being adapted with the first internal thread (24) is externally provided with, is set in the circumferential direction of pedestal (41) the top surface periphery There is the second annular protrusion (44), first annular raised (33) and the second annular protrusion (44) are adapted with annular groove (5).
- A kind of 2. multifunctional assembled thermos cup based on semiconductor chilling plate according to claim 1, it is characterised in that： The top surface of the semiconductor refrigerating pipe (22) flushes with shell (21) top surface, and bottom surface flushes with the top surface of the first internal thread (24).
- A kind of 3. multifunctional assembled thermos cup based on semiconductor chilling plate according to claim 1, it is characterised in that： The top surface for leading Wen Zhu (25) and bottom surface flush with the top surface of semiconductor refrigerating pipe (22) and bottom surface respectively.
- A kind of 4. multifunctional assembled thermos cup based on semiconductor chilling plate according to claim 1, it is characterised in that： First is additionally provided with the top of the lid (31) and dissipates warm device, described first, which dissipates first that warm device includes being arranged at the top of lid, leads Warm plectane (6), described first leads and second is provided with above warm plectane (6) leads warm plectane (7), and described first leads warm plectane (6) and the Two lead between warm plectane (7) that circumferentially direction is evenly distributed the first fin (8) being vertically arranged, and described second leads warm plectane (7) top is provided with fan (9), and containment vessel (10) is arranged with outside the fan (9).
- A kind of 5. multifunctional assembled thermos cup based on semiconductor chilling plate according to claim 4, it is characterised in that： Heat emission hole is evenly equipped with the containment vessel (10).
- A kind of 6. multifunctional assembled thermos cup based on semiconductor chilling plate according to claim 1, it is characterised in that： Cup bottom (4) portion is additionally provided with second and dissipates warm device, and described second, which dissipates warm device, includes being arranged on the 3rd of cup (4) bottom Warm plectane (11) is led, the described 3rd leads warm plectane (11) lower section leads warm plectane (12) provided with the 4th, and the described 3rd leads warm plectane (11) and the 4th leads between warm plectane (12) that circumferentially direction is evenly distributed the second fin (13) being vertically arranged.
- A kind of 7. multifunctional assembled thermos cup based on semiconductor chilling plate according to claim 1, it is characterised in that： Cup (4) top surface is provided with rubber waterproof layer (14).
- A kind of 8. multifunctional assembled thermos cup based on semiconductor chilling plate according to claim 1, it is characterised in that： The side wall of the cup (1) is hollow structure, and insulating lining is filled with hollow structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711006484.0A CN107874550A (en) | 2017-10-25 | 2017-10-25 | A kind of multifunctional assembled thermos cup based on semiconductor chilling plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711006484.0A CN107874550A (en) | 2017-10-25 | 2017-10-25 | A kind of multifunctional assembled thermos cup based on semiconductor chilling plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107874550A true CN107874550A (en) | 2018-04-06 |
Family
ID=61782171
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711006484.0A Pending CN107874550A (en) | 2017-10-25 | 2017-10-25 | A kind of multifunctional assembled thermos cup based on semiconductor chilling plate |
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| Country | Link |
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| CN (1) | CN107874550A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114532817A (en) * | 2022-02-18 | 2022-05-27 | 北京悦米科技有限公司 | Electronic refrigeration type water cup |
| WO2023142818A1 (en) * | 2022-01-28 | 2023-08-03 | 青岛海尔电冰箱有限公司 | Stirring rod having temperature changing function |
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| CN202681419U (en) * | 2012-05-31 | 2013-01-23 | 黎勇潮 | Multifunctional cup utilizing solar energy to cool and heat |
| CN103120521A (en) * | 2013-03-15 | 2013-05-29 | 苏州卫生职业技术学院 | Combined-type semiconductor cold and hot vacuum cup |
| CN206079505U (en) * | 2016-04-21 | 2017-04-12 | 杭州吻吻鱼科技有限公司 | Insulating cup with rapid cooling function |
| CN206166492U (en) * | 2016-04-25 | 2017-05-17 | 昆明学院 | Cold and hot water glass based on semiconductor component adds nice and warm refrigeration |
| CN206284746U (en) * | 2016-08-11 | 2017-06-30 | 安徽工程大学机电学院 | Cool-warm cup |
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2017
- 2017-10-25 CN CN201711006484.0A patent/CN107874550A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202681419U (en) * | 2012-05-31 | 2013-01-23 | 黎勇潮 | Multifunctional cup utilizing solar energy to cool and heat |
| CN103120521A (en) * | 2013-03-15 | 2013-05-29 | 苏州卫生职业技术学院 | Combined-type semiconductor cold and hot vacuum cup |
| CN206079505U (en) * | 2016-04-21 | 2017-04-12 | 杭州吻吻鱼科技有限公司 | Insulating cup with rapid cooling function |
| CN206166492U (en) * | 2016-04-25 | 2017-05-17 | 昆明学院 | Cold and hot water glass based on semiconductor component adds nice and warm refrigeration |
| CN206284746U (en) * | 2016-08-11 | 2017-06-30 | 安徽工程大学机电学院 | Cool-warm cup |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023142818A1 (en) * | 2022-01-28 | 2023-08-03 | 青岛海尔电冰箱有限公司 | Stirring rod having temperature changing function |
| CN114532817A (en) * | 2022-02-18 | 2022-05-27 | 北京悦米科技有限公司 | Electronic refrigeration type water cup |
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Application publication date: 20180406 |