CN107863947A - A kind of SMD quartz resonator bases - Google Patents
A kind of SMD quartz resonator bases Download PDFInfo
- Publication number
- CN107863947A CN107863947A CN201711432670.0A CN201711432670A CN107863947A CN 107863947 A CN107863947 A CN 107863947A CN 201711432670 A CN201711432670 A CN 201711432670A CN 107863947 A CN107863947 A CN 107863947A
- Authority
- CN
- China
- Prior art keywords
- boss
- pad
- glue point
- barricade
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010453 quartz Substances 0.000 title claims abstract description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 15
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 30
- 239000000956 alloy Substances 0.000 claims abstract description 30
- 239000003292 glue Substances 0.000 claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 238000007789 sealing Methods 0.000 claims abstract description 16
- 238000005476 soldering Methods 0.000 claims abstract description 16
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 229910000846 In alloy Inorganic materials 0.000 claims 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 abstract description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 101150094373 Padi4 gene Proteins 0.000 description 4
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 230000005484 gravity Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008542 thermal sensitivity Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
The invention discloses a kind of SMD quartz resonator bases, including substrate, glue point Pad, barricade, boss, alloy lead wire and alloy soldering and sealing ring are provided with described upper surface of substrate, elargol is provided with the glue point Pad, barricade is provided with the glue point Pad, boss is provided with the glue point Pad of barricade side, elargol is provided with boss, described glue point Pad, boss, barricade and alloy lead wire are located in alloy soldering and sealing ring；Described substrate lower surface is provided with input and output Pad, glue point Pad is connected with input and output Pad by alloy lead wire, boss can increase Pad roughness so as to increase the bond strength of chip, glue point, pedestal, stabilize the electrical parameter of product, improve the reliability of product.
Description
Technical field
The present invention relates to resonator base field, particularly a kind of SMD quartz resonator bases.
Background technology
Quartz wafer can obtain the excellent quartz-crystal resonator of electrical parameter by the reasonably mode of carrying.Pedestal pair
The carrying of quartz wafer has important influence, the reasonable carrying state for directly influencing whether chip of its structure and resonance
The electrical parameters such as resistance, dynamic capacity and the pulling force thermal sensitivity of device, while also influence whether the reliability of quartz resonance.
With the lifting of consumer electronics applications requirement, the expansion of application field, there is provided electrical parameter is more stable, can
It is necessary trend by the more preferable resonator of property.
The content of the invention
A kind of the shortcomings that it is an object of the invention to overcome prior art, there is provided SMD quartz resonator bases.
The purpose of the present invention is achieved through the following technical solutions：A kind of SMD quartz resonator bases, including substrate, institute
Glue point Pad, barricade, boss, alloy lead wire and alloy soldering and sealing ring are provided with the upper surface of substrate stated, on the glue point Pad
Elargol is provided with, barricade is provided with the glue point Pad, boss is provided with the glue point Pad of barricade side, is set on boss
Elargol is equipped with, described glue point Pad, boss, barricade and alloy lead wire are located in alloy soldering and sealing ring；Described substrate lower surface is set
Input and output Pad, glue point Pad and input and output Pad is equipped with by alloy lead wire to be connected.
Specifically, described substrate is ceramic material.
Specifically, a lid is welded with described alloy soldering and sealing ring, substrate, alloy soldering and sealing ring and lid form one
The space of individual closing.
Specifically, described input and output Pad is provided with four, and four input and output Pad are arranged on four angles of substrate
On.
Specifically, described boss is cylinder boss, and boss is provided with some, array arrangement between boss.
Beneficial effects of the present invention are as follows：The barricade of the present invention can effectively improve the carrying state of chip, to chip
Play a part of support, chip is unlikely to the Action of Gravity Field by oneself body and is connect the free end of chip and ceramic bases
Touch.The material of pedestal is made up of the good alloy hoop of heat conduction and ceramic bases, and heat-sinking capability and intensity are significantly larger than Plastic Package；
Boss can increase Pad roughness so as to increase the bond strength of chip, glue point, pedestal, stabilize product electrical parameter,
Improve the reliability of product.
Brief description of the drawings
Fig. 1 is the overlooking the structure diagram of the present invention；
Fig. 2 is the present invention looks up structural representation of the present invention；
In figure：1- elargol, 2- barricades, 3- alloy lead wires, 4- input and output Pad, 5- alloy soldering and sealing ring, 6- substrates, 7- glue points
Pad, 8- boss.
Embodiment
The present invention will be further described below in conjunction with the accompanying drawings, but protection scope of the present invention is not limited to following institute
State.
As shown in Figure 1 and Figure 2, a kind of SMD quartz resonator bases, including substrate 6, set on the described upper surface of substrate 6
There are glue point Pad7, barricade 2, boss 8, alloy lead wire 3 and alloy soldering and sealing ring 5, elargol 1, institute are provided with the glue point Pad7
State and barricade 2 is provided with glue point Pad7, be provided with boss 8 on the glue point Pad7 of barricade side, elargol is provided with boss 8
1, described glue point Pad7, boss 8, barricade 2 and alloy lead wire 3 are located in alloy soldering and sealing ring 5；The described lower surface of substrate 6 is set
Input and output Pad4, glue point Pad7 and input and output Pad4 is equipped with by alloy lead wire 3 to be connected.
Further, described substrate 6 is ceramic material.
Further, a lid, substrate 6, alloy soldering and sealing ring 5 and lid are welded with described alloy soldering and sealing ring 5
The space of a closing is formed, and vacuum or nitrogen environment are provided for chip.
Further, described input and output Pad4 is provided with four, and four input and output Pad4 are arranged on the four of substrate 6
On individual angle.
Further, described boss 8 is cylinder boss 8, and boss 8 is provided with some, array arrangement between boss 8.
The course of work of the present invention is as follows：Two electrodes of chip are connected with elargol 1, and then wafer-carrying is on barricade 2
Face, chip by the support force of the adhesion of elargol 1 and barricade 2 is fixed, make eyeglass be unlikely to Action of Gravity Field by itself and
The hanging section of chip is set to be contacted with ceramic bases 6.Simultaneously because the contact area of boss 8 and elargol 1 increases, so as to increase crystalline substance
Piece, glue point Pad7, the bond strength of substrate 6, reach and enhance product performance, and alloy soldering and sealing ring 5 and lid form a closing
Space, and provide vacuum or nitrogen environment for chip, the material of pedestal is done by the good alloy hoop of heat conduction and by ceramic material
Into substrate 6 form, heat-sinking capability and intensity are significantly larger than Plastic Package.
Claims (5)
- A kind of 1. SMD quartz resonator bases, it is characterised in that：Including substrate（6）, described substrate（6）Set on upper surface There is glue point Pad（7）, barricade（2）, boss（8）, alloy lead wire（3）And alloy soldering and sealing ring（5）, the glue point Pad（7）On set It is equipped with elargol（1）, the glue point Pad（7）On be provided with barricade（2）, the glue point Pad in barricade side（7）On be provided with boss （8）, in boss（8）On be provided with elargol（1）, described glue point Pad（7）, boss（8）, barricade（2）And alloy lead wire（3）Position In alloy soldering and sealing ring（5）It is interior；Described substrate（6）Lower surface is provided with input and output Pad（4）, glue point Pad（7）It is defeated with inputting Go out Pad（4）Pass through alloy lead wire（3）It is connected.
- A kind of 2. SMD quartz resonator bases according to claim 1, it is characterised in that：Described substrate（6）For ceramics Material.
- A kind of 3. SMD quartz resonator bases according to claim 1, it is characterised in that：Described alloy soldering and sealing ring（5） On be welded with a lid, substrate（6）, alloy soldering and sealing ring（5）And lid forms the space of a closing.
- A kind of 4. SMD quartz resonator bases according to claim 1, it is characterised in that：Described input and output Pad （4）Four are provided with, four input and output Pad（4）It is arranged on substrate（6）Four angles on.
- A kind of 5. SMD quartz resonator bases according to claim 1, it is characterised in that：Described boss（8）For cylinder Boss（8）, boss（8）It is provided with some, boss（8）Between array arrange.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711432670.0A CN107863947A (en) | 2017-12-26 | 2017-12-26 | A kind of SMD quartz resonator bases |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711432670.0A CN107863947A (en) | 2017-12-26 | 2017-12-26 | A kind of SMD quartz resonator bases |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107863947A true CN107863947A (en) | 2018-03-30 |
Family
ID=61707650
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711432670.0A Pending CN107863947A (en) | 2017-12-26 | 2017-12-26 | A kind of SMD quartz resonator bases |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107863947A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1906848A (en) * | 2004-05-12 | 2007-01-31 | 株式会社大真空 | Package for piezoelectric oscillation element, and piezoelectric oscillator |
| CN204089747U (en) * | 2014-09-30 | 2015-01-07 | 东晶锐康晶体（成都）有限公司 | A kind of SMD quartz resonator base |
| CN104617909A (en) * | 2013-11-05 | 2015-05-13 | 精工爱普生株式会社 | Resonator, oscillator, electronic apparatus, and moving object |
| JP2017050578A (en) * | 2015-08-31 | 2017-03-09 | 京セラクリスタルデバイス株式会社 | Crystal device |
| JP2017204665A (en) * | 2016-05-09 | 2017-11-16 | 京セラ株式会社 | Piezoelectric device |
| CN207368996U (en) * | 2017-12-26 | 2018-05-15 | 东晶锐康晶体（成都）有限公司 | A kind of SMD quartz resonator bases |
-
2017
- 2017-12-26 CN CN201711432670.0A patent/CN107863947A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1906848A (en) * | 2004-05-12 | 2007-01-31 | 株式会社大真空 | Package for piezoelectric oscillation element, and piezoelectric oscillator |
| CN104617909A (en) * | 2013-11-05 | 2015-05-13 | 精工爱普生株式会社 | Resonator, oscillator, electronic apparatus, and moving object |
| CN204089747U (en) * | 2014-09-30 | 2015-01-07 | 东晶锐康晶体（成都）有限公司 | A kind of SMD quartz resonator base |
| JP2017050578A (en) * | 2015-08-31 | 2017-03-09 | 京セラクリスタルデバイス株式会社 | Crystal device |
| JP2017204665A (en) * | 2016-05-09 | 2017-11-16 | 京セラ株式会社 | Piezoelectric device |
| CN207368996U (en) * | 2017-12-26 | 2018-05-15 | 东晶锐康晶体（成都）有限公司 | A kind of SMD quartz resonator bases |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180330 |
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| WD01 | Invention patent application deemed withdrawn after publication |