CN107856314A - Flat board film bonding machine - Google Patents
Flat board film bonding machine Download PDFInfo
- Publication number
- CN107856314A CN107856314A CN201711083287.9A CN201711083287A CN107856314A CN 107856314 A CN107856314 A CN 107856314A CN 201711083287 A CN201711083287 A CN 201711083287A CN 107856314 A CN107856314 A CN 107856314A
- Authority
- CN
- China
- Prior art keywords
- bakelite
- block
- bonding machine
- flat board
- film bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/43—Joining a relatively small portion of the surface of said articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2007/00—Flat articles, e.g. films or sheets
Abstract
The present invention provides a kind of flat board film bonding machine, it includes upper die component and lower mold assemblies, upper membrane module includes upper mounted plate, cylinder assembly, upper mould and fixes push pedal, bakelite, cooling block, spacing block, silicagel pad, fire-bar, guide pillars and bushes, cylinder assembly is installed on upper mounted plate, push pedal, bakelite, cooling block and spacing block, fire-bar are fixed below upper mounted plate equipped with upper film successively to be embedded in bakelite, silicagel pad, cooling block and spacing block；Lower mold assemblies include lower template, support block, bakelite, stroke post, silicagel pad, fire-bar and locating pin and are respectively positioned on below upper mounted plate, bakelite, support block and stroke post are installed in lower template, bakelite has been sequentially arranged above cooling block and spacing block, and fire-bar is embedded in bakelite, silicagel pad, cooling block and spacing block.The bonding machine can produce various sizes of diaphragm and diaphragm qualification rate is higher.
Description
Technical field
The invention belongs to sewage water filtration process field, it is related to the welding equipment technology of membrane for water treatment, and in particular to Yi Zhongping
Plate film welder.
Background technology
Flat board membrane technology is widely used in gas and liquid separation field, be in China an emerging advanced separation,
Concentration, purification, purification techniques.Flat Membrane is suitable for the stain disease processing and reuse of various scales, its scope of application：Industrial and mineral is looked forward to
The processing of the high concentrated organic wastewater such as pharmacy, sugaring, alcohol, leather, papermaking in industry.The diaphragm of original Flat Membrane and support
Plate/plastic plate is simply bonded together with glue, is bonded between the diaphragm of the Flat Membrane of formation and supporting plate/plastic plate fastness not
Stable, glue is not easily controlled, the flat board film outward appearance of glue bonding extremely unsightly, after the diaphragm drying after being secondly bonded due to
The temperature of control is not quite identical, and product is also different, and the quality of product cannot be guaranteed.
Kunshan Jing Rong precision optical machineries Co., Ltd pin is studied and after 2014 to diaphragm weldering to solve the present situation
Pick and applied for Patents.A kind of chimney filter ultrasonic welding machine of Application No. 201510019929.3 is directed to single or multiple lift film
Welded, including cradle, supersonic welding system, around rod, pressing plate, pinch roller, power motor, controller, man machine operation interface
Deng, and said modules annexation is described in detail, when making filter paper progress single or multiple lift film ultrasonic bonding, welding
Effect is good, and weld seam is firm and realizes the welding of the filter paper of multiple diameter.Application No. 201410109049.0MBR flat board film bonding machines
And its production technology provides another bonding machine and production technology, the bonding machine fills by frame, for the pneumatic control of charging
Put, the hydraulic control device for welding and provide complete machine electric drive system controlling organization, increase in addition on bonding machine
Oil pressure shut-off switch and proximity transducer etc., make that the diaphragm quality of production is relatively stable, dependable performance.
When being engaged in the production and assembly of diaphragm, to solve, the obtained diaphragm quality of bonding way is unstable etc. to ask the applicant
Topic, has accordingly carried out a series of research, and provide another diaphragm bonding machine.
The content of the invention
Cannot by being bonded the diaphragm quality for forming diaphragm and plastic plate/supporting plate it is an object of the invention to overcome
The problems such as guarantee, and another flat board film bonding machine for being different from mentioning in background technology is provided.
The present invention is achieved through the following technical solutions：
The flat board film bonding machine of the present invention includes upper die component and lower mold assemblies, upper membrane module including upper mounted plate, cylinder assembly,
Upper mould fixes push pedal, bakelite, cooling block, spacing block, silicagel pad and fire-bar, and cylinder assembly is provided with upper mounted plate, upper solid
Push pedal, bakelite, cooling block and spacing block, fire-bar, which are fixed, below fixed board equipped with upper film successively is embedded in bakelite, silicagel pad, cooling
In block and spacing block；Lower mold assemblies include lower template, support block, bakelite, stroke post, silicagel pad and fire-bar and are located at upper fixation
Below plate, bakelite, support block and stroke post are installed in lower template, bakelite is sequentially arranged above cooling block and spacing block,
Fire-bar is embedded in bakelite, silicagel pad, cooling block and spacing block.
Further, the upper die component also includes guide pillars and bushes, and the guide pillar and the guide pin bushing are installed on described
Above fixed plate and the guide pillar is embedded in the guide pin bushing, and the setting of guide pillars and bushes can make diaphragm bonding machine more smart in welding
Certainly position.
Further, the lower membrane module also includes locating pin, and the locating pin is installed on the described of the lower mold assemblies
It is convenient to weld different diaphragm sizes on cooling block or lower module.
Further, tagblock is provided with the bakelite, the use of bakelite makes weld electric current be fixed with the upper film
Push pedal, the lower template are kept apart, and are advantageous to protect mould to prevent from being damaged.
Further, the adjustable height of the stroke post, the rigidity and thickness of diaphragm can be controlled by the regulation of height
Deng.
Further, it be 18-50mm that the upper mould, which fixes push pedal thickness, to ensure diaphragm weld uniform force, reduction because
Cause the underproof situation of diaphragm for unbalance stress, improve the qualification rate of diaphragm.
Further, the cooling block is empty using center；Further, the cooling block is using circular or square central
Hole.Cooling block makes heat caused by welding quickly cool down, and reaches the purpose continuously welded.
Further, the cooling block is made up of metal material, and further, the metal material is aluminium.
In addition, each component is connected through a screw thread in bonding machine, convenient processing；Solder side is using alloy material as welding
Face, both ends copper facing, facilitate the connection of electric current.
Diaphragm welding is carried out using above-mentioned flat board film bonding machine, specific welding method includes：
Preheated weld machine；
Soldered diaphragm is placed on lower mold assemblies；
The welding of diaphragm is carried out using PLC system control button.
The PLC system control button adjusts corresponding operating condition according to different diaphragm material demands.
The invention has the advantages that：
（1）The level adjustability of bonding machine of the present invention, guide pillar, the setting etc. of guide pin bushing and locating pin is convenient welds different sizes
Diaphragm, meet the needs of different；
（2）The reasonable control of reasoning plate thickness in the present invention, diaphragm weld uniform force is ensure that, reduced because unbalance stress
And cause diaphragm unqualified and caused by waste on raw material, improve the qualification rate of diaphragm, control the cost of raw material；
（3）The setting of cooling block makes heat caused by welding quickly cool down in the present invention, reaches the purpose continuously welded；
（4）Using for supporting plate is horizontal so that welding diaphragm in welding in the present invention；
（5）The use of bakelite makes weld electric current and the upper mould fixes push pedal, the lower template is kept apart, and is advantageous to protect mould
Tool prevents from leaking electricity.
Brief description of the drawings
In order to illustrate more clearly of technical solution of the present invention, the accompanying drawing used required for the present invention will be made simply below
Introduce, it should be apparent that, drawings discussed below is only present invention process flow, for those of ordinary skill in the art,
On the premise of not paying creative work, still other accompanying drawings can be obtained according to the accompanying drawing of offer.
Fig. 1 is flat board film bonding machine provided by the invention；
Fig. 2 is flat board film bonding machine front view provided by the invention；
Fig. 3 is flat board film bonding machine side view provided by the invention；
Fig. 4 is flat board film bonding machine top view provided by the invention；
Fig. 5 is flat board film bonding machine upper die component provided by the invention；
Fig. 6 is flat board film bonding machine upper die component front view provided by the invention；
Fig. 7 is flat board film bonding machine upper die component side view provided by the invention；
Fig. 8 is flat board film bonding machine upper die component top view provided by the invention；
Fig. 9 is flat board film bonding machine lower film component provided by the invention；
Figure 10 is flat board film bonding machine lower film component front view provided by the invention；
Figure 11 is flat board film bonding machine lower film component side view provided by the invention；
Figure 12 is the flat board film bonding machine lower film assembly plan view that invention provides；
Wherein：1- upper mounted plates, the upper films of 2- fix push pedal, 3- bakelites, 4- cooling blocks, 5- tagblocks, 6- spacing blocks, 7- heating
Bar, 8- support blocks, 9- cylinder assemblies, 10- guide pillars, 11- guide pin bushings, 12- lower templates, 13- stroke posts, 14- locating pins, 15- silica gel
Pad.
Embodiment
Clear, complete description is carried out to the technical scheme in the embodiment of the present invention below, it is clear that described embodiment
Only part of the embodiment of the present invention, rather than whole embodiments.Based on embodiment in the present invention, ordinary skill
The every other embodiment that personnel are obtained under the premise of creative work is not made, belongs to the scope of the present invention.
For the sake of becoming apparent from, it is described in detail below by specific embodiment.
Embodiment 1
Refering to Fig. 1-12, flat board film bonding machine of the present invention includes upper die component and lower mold assemblies, and upper membrane module includes upper mounted plate
1st, cylinder assembly 9, upper mould fix push pedal 2, bakelite 3, cooling block 4, spacing block 6, silicagel pad 15, fire-bar 7, guide pillar 10 and guide pin bushing
11, cylinder assembly 9 is installed, push pedal 2, bakelite 3, cooling block are fixed in the lower section of upper mounted plate 1 equipped with upper film successively on upper mounted plate 1
4 and spacing block 6, fire-bar 7 be embedded in bakelite 3, silicagel pad 15, cooling block 4 and spacing block 6；Lower mold assemblies include lower template
12nd, support block 8, bakelite 3, stroke post 13, silicagel pad 15, fire-bar 7 and locating pin 14 and the lower section of upper mounted plate 1 is respectively positioned on, under
Bakelite 3, support block 8 and stroke post 13 are installed, bakelite 3 has been sequentially arranged above cooling block 4 and spacing block 6, added in template 12
Hot bar 7 is embedded in bakelite 3, silicagel pad 15, cooling block 4 and spacing block 6.
Guide pillar 10 and guide pin bushing 11 are installed on the top of upper mounted plate 1 and guide pillar 10 is embedded in guide pin bushing 11, guide pillar 10 and guide pin bushing 11
Setting can make diaphragm bonding machine welding when more precise positioning.
Locating pin 14 is installed on the cooling block of the lower mold assemblies, convenient to weld different diaphragm sizes.
Tagblock 5 is provided with bakelite 3, the use of bakelite 3 makes weld electric current fix push pedal 2, lower template with upper film
12 keep apart, and are advantageous to protect mould to prevent from being damaged.
The adjustable height of stroke post 13, rigidity and thickness of diaphragm etc. can be controlled by the regulation of height.
It is 18mm that upper mould, which fixes the thickness of push pedal 2, and to ensure diaphragm weld uniform force, reduction causes because of unbalance stress
The underproof situation of diaphragm, improve the qualification rate of diaphragm.
Cooling block 4 is made up using round center hole and of aluminum material, and cooling block 4 makes the fast quickly cooling of heat caused by welding
But, the purpose continuously welded is reached.
In addition, each component is connected through a screw thread in bonding machine, convenient processing；Solder side is using alloy material as welding
Face, both ends copper facing, facilitate the connection of electric current.
Embodiment 2
Refering to Fig. 1-12, flat board film bonding machine of the present invention includes upper die component and lower mold assemblies, and upper membrane module includes upper mounted plate
1st, cylinder assembly 9, upper mould fix push pedal 2, bakelite 3, cooling block 4, spacing block 6, silicagel pad 15, fire-bar 7, guide pillar 10 and guide pin bushing
11, cylinder assembly 9 is installed, push pedal 2, bakelite 3, cooling block are fixed in the lower section of upper mounted plate 1 equipped with upper film successively on upper mounted plate 1
4 and spacing block 6, fire-bar 7 be embedded in bakelite 3, silicagel pad 15, cooling block 4 and spacing block 6；Lower mold assemblies include lower template
12nd, support block 8, bakelite 3, stroke post 13, silicagel pad 15, fire-bar 7 and locating pin 14 and the lower section of upper mounted plate 1 is respectively positioned on, under
Bakelite 3, support block 8 and stroke post 13 are installed, bakelite 3 has been sequentially arranged above cooling block 4 and spacing block 6, added in template 12
Hot bar 7 is embedded in bakelite 3, silicagel pad 15, cooling block 4 and spacing block 6.
Guide pillar 10 and guide pin bushing 11 are installed on the top of upper mounted plate 1 and guide pillar 10 is embedded in guide pin bushing 11, guide pillar 10 and guide pin bushing 11
Setting can make diaphragm bonding machine welding when more precise positioning.
Locating pin 14 is installed in the lower template of the lower mold assemblies, convenient to weld different diaphragm sizes.
Tagblock 5 is provided with bakelite 3, the use of bakelite 3 makes weld electric current fix push pedal 2, lower template with upper film
12 keep apart, and are advantageous to protect mould to prevent from being damaged.
The adjustable height of stroke post 13, rigidity and thickness of diaphragm etc. can be controlled by the regulation of height.
It is 50mm that upper mould, which fixes the thickness of push pedal 2, and to ensure diaphragm weld uniform force, reduction causes because of unbalance stress
The underproof situation of diaphragm, improve the qualification rate of diaphragm.
Cooling block 4 is made up using round center hole and of aluminum material, and cooling block 4 makes the fast quickly cooling of heat caused by welding
But, the purpose continuously welded is reached.
In addition, each component is connected through a screw thread in bonding machine, convenient processing；Solder side is using alloy material as welding
Face, both ends copper facing, facilitate the connection of electric current.
Embodiment 3
Refering to Fig. 1-12, flat board film bonding machine of the present invention includes upper die component and lower mold assemblies, and upper membrane module includes upper mounted plate
1st, cylinder assembly 9, upper mould fix push pedal 2, bakelite 3, cooling block 4, spacing block 6, silicagel pad 15, fire-bar 7, guide pillar 10 and guide pin bushing
11, cylinder assembly 9 is installed, push pedal 2, bakelite 3, cooling block are fixed in the lower section of upper mounted plate 1 equipped with upper film successively on upper mounted plate 1
4 and spacing block 6, fire-bar 7 be embedded in bakelite 3, silicagel pad 15, cooling block 4 and spacing block 6；Lower mold assemblies include lower template
12nd, support block 8, bakelite 3, stroke post 13, silicagel pad 15, fire-bar 7 and locating pin 14 and the lower section of upper mounted plate 1 is respectively positioned on, under
Bakelite 3, support block 8 and stroke post 13 are installed, bakelite 3 has been sequentially arranged above cooling block 4 and spacing block 6, added in template 12
Hot bar 7 is embedded in bakelite 3, silicagel pad 15, cooling block 4 and spacing block 6.
Guide pillar 10 and guide pin bushing 11 are installed on the top of upper mounted plate 1 and guide pillar 10 is embedded in guide pin bushing 11, guide pillar 10 and guide pin bushing 11
Setting can make diaphragm bonding machine welding when more precise positioning.
Locating pin 14 is installed on the cooling block of the lower mold assemblies, convenient to weld different diaphragm sizes.
Tagblock 5 is provided with bakelite 3, the use of bakelite 3 makes weld electric current fix push pedal 2, lower template with upper film
12 keep apart, and are advantageous to protect mould to prevent from being damaged.
The adjustable height of stroke post 13, rigidity and thickness of diaphragm etc. can be controlled by the regulation of height.
It is 35mm that upper mould, which fixes the thickness of push pedal 2, and to ensure diaphragm weld uniform force, reduction causes because of unbalance stress
The underproof situation of diaphragm, improve the qualification rate of diaphragm.
Cooling block 4 is made up using round center hole and of aluminum material, and cooling block 4 makes the fast quickly cooling of heat caused by welding
But, the purpose continuously welded is reached.
In addition, each component is connected through a screw thread in bonding machine, convenient processing；Solder side is using alloy material as welding
Face, both ends copper facing, facilitate the connection of electric current.
Embodiment 4
Diaphragm welding is carried out using above-mentioned flat board film bonding machine, concrete operations are as follows：
（1）Preheated weld machine 1-3min；
（2）Soldered diaphragm is placed on lower mold assemblies；
（3）Control button adjusts the weldering of corresponding operating condition progress diaphragm according to different diaphragm material demands in PLC system
Connect.
Described above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill of the art
For personnel, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (8)
1. flat board film bonding machine, it is characterised in that it includes upper die component and lower mold assemblies, and the upper membrane module includes upper fixation
Plate, cylinder assembly, upper mould are fixed push pedal, bakelite, cooling block, spacing block, silicagel pad and fire-bar, fixed plate and are provided with
Push pedal, the bakelite, the cooling block and institute are fixed in the cylinder assembly, fixed plate lower section equipped with the upper film successively
Spacing block is stated, the fire-bar is embedded in the bakelite, the silicagel pad, the cooling block and the spacing block；Under described
Membrane module includes lower template, support block, bakelite, stroke post, silicagel pad and fire-bar and below fixed plate, described
Lower template on the bakelite, the support block and the stroke post, the bakelite are installed have been sequentially arranged above described cold
But block and the spacing block, the fire-bar are embedded in the bakelite, the silicagel pad, the cooling block and the spacing block
On.
2. flat board film bonding machine according to claim 1, it is characterised in that the upper die component also includes guide pillar and led
Set, the guide pillar and the guide pin bushing are installed on above fixed plate and the guide pillar is embedded in the guide pin bushing.
3. flat board film bonding machine according to claim 1, it is characterised in that the lower membrane module also includes locating pin, institute
Locating pin is stated to be installed in the cooling block up or down template of the lower mold assemblies.
4. flat board film bonding machine according to claim 1, it is characterised in that be provided with tagblock in the bakelite.
5. flat board film bonding machine according to claim 1, it is characterised in that the adjustable height of the stroke post.
6. flat board film bonding machine according to claim 1, it is characterised in that it is 18-50mm that the upper mould, which fixes push pedal thickness,.
7. flat board film bonding machine according to claim 1, it is characterised in that the cooling block is empty using center.
8. the flat board film bonding machine according to claim 1 or 7, it is characterised in that the cold block is using circular or square
Centre bore.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711083287.9A CN107856314A (en) | 2017-11-07 | 2017-11-07 | Flat board film bonding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711083287.9A CN107856314A (en) | 2017-11-07 | 2017-11-07 | Flat board film bonding machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107856314A true CN107856314A (en) | 2018-03-30 |
Family
ID=61701081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711083287.9A Pending CN107856314A (en) | 2017-11-07 | 2017-11-07 | Flat board film bonding machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107856314A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107696509A (en) * | 2017-11-07 | 2018-02-16 | 四川美富特水务有限责任公司 | Flat board film bonding machine and welding method |
| CN111590906A (en) * | 2020-04-30 | 2020-08-28 | 王洛 | Plastic film spot-ironing machine |
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| CN200939694Y (en) * | 2006-08-15 | 2007-08-29 | 山东新华医疗器械股份有限公司 | False welded seam welder of polyolefine coextruded film |
| CN202147399U (en) * | 2011-06-29 | 2012-02-22 | 群光电子(苏州)有限公司 | Circulating fuse machine |
| CN104772902A (en) * | 2015-04-28 | 2015-07-15 | 成都美富特膜科技有限公司 | Heat sealing machining device and method for reverse osmosis membrane bag |
| CN104890231A (en) * | 2015-04-28 | 2015-09-09 | 成都美富特膜科技有限公司 | Reverse osmosis membrane component heat sealing system and method |
| CN206201495U (en) * | 2016-11-25 | 2017-05-31 | 威士茂电子塑胶(珠海)有限公司 | New type plastic welding equipment |
| CN107696509A (en) * | 2017-11-07 | 2018-02-16 | 四川美富特水务有限责任公司 | Flat board film bonding machine and welding method |
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2017
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN200939694Y (en) * | 2006-08-15 | 2007-08-29 | 山东新华医疗器械股份有限公司 | False welded seam welder of polyolefine coextruded film |
| CN202147399U (en) * | 2011-06-29 | 2012-02-22 | 群光电子(苏州)有限公司 | Circulating fuse machine |
| CN104772902A (en) * | 2015-04-28 | 2015-07-15 | 成都美富特膜科技有限公司 | Heat sealing machining device and method for reverse osmosis membrane bag |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107696509A (en) * | 2017-11-07 | 2018-02-16 | 四川美富特水务有限责任公司 | Flat board film bonding machine and welding method |
| CN111590906A (en) * | 2020-04-30 | 2020-08-28 | 王洛 | Plastic film spot-ironing machine |
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Application publication date: 20180330 |