CN107852818A - 使用两种激光器的打印方法 - Google Patents

使用两种激光器的打印方法 Download PDF

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CN107852818A
CN107852818A CN201680023476.4A CN201680023476A CN107852818A CN 107852818 A CN107852818 A CN 107852818A CN 201680023476 A CN201680023476 A CN 201680023476A CN 107852818 A CN107852818 A CN 107852818A
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laser
substrate
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安妮·帕特丽夏·布兰奇·阿隆尼勒
菲力浦·克里斯汀·莫里斯·德拉波特
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    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/44Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using single radiation source per colour, e.g. lighting beams or shutter arrangements
    • B41J2/442Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using single radiation source per colour, e.g. lighting beams or shutter arrangements using lasers
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    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
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    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00Duplicating or marking methods; Sheet materials for use therein
    • B41M5/50Recording sheets characterised by the coating used to improve ink, dye or pigment receptivity, e.g. for ink-jet or thermal dye transfer recording
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    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
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    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
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    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K2203/05Patterning and lithography; Masks; Details of resist
    • H05K2203/0502Patterning and lithography
    • H05K2203/0528Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
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    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
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    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107Using laser light
    • H05K2203/108Using a plurality of lasers or laser light with a plurality of wavelengths
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    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12Using specific substances
    • H05K2203/128Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
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    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer

Abstract

本发明涉及一种激光打印方法,其包含以下步骤:(a)提供接收器衬底(4);(b)提供目标衬底(5),该目标衬底包含透明衬底(50),该透明衬底的一个表面具有由固体金属膜构成的涂层(51);(c)通过第一激光器(8)透过所述透明衬底(50)对薄膜(51)进行局部照射,以达到液体形式的所述薄膜的目标区域中的金属的融化温度;(d)通过第二激光器透过所述透明衬底照射由步骤(c)限定的所述目标区域上的液体薄膜,以在目标区域中形成液体射流并且使其以熔融金属的形式从衬底喷射;(e)将熔融金属液滴沉积在接收器衬底的指定的接收区域上,所述液滴在冷却后固化。

Description

使用两种激光器的打印方法
技术领域
本发明涉及电子打印技术领域,更具体的,涉及一种激光打印方法。
背景技术
电子电路在柔性衬底上的实现是开发连接设备和对象及其应用的重要步骤,特别是在保健,物流和配送领域。这些物体的制造需要许多不同的技术步骤,特别是导电微尺度或微米结构的打印,以应对与互连有关的问题。
存在两种电子打印技术系列,其可以被定义为:
衍生自传统打印技术的超高速技术,例如柔版打印或胶印,需要准备雕刻辊或掩膜,并且能够在超高速下仅打印一个单一的设计。
数字技术慢得多,但是能提供确保直接控制由计算机打印设计的能力。迄今为止,最普遍的方式是喷墨技术,但能够提及的还有气溶胶喷墨打印和激光打印。
喷墨技术广泛应用于研究中心。它能够打印测量宽度为几十微米,并且厚度小于一微米的结构。
它的主要局限性在于打印头部的机械运动,其在高速时限制打印的精度和分辨率。
这种方法只能够传输低粘度的油墨,这限制了它打印用于高电流应用的厚导电结构的能力。
最后,打印头堵塞的风险很大,油墨的花费很高,并且该方法需要退火步骤。
事实上,使用油墨打印金属导线是通过传输基于银的或铜的纳米颗粒物的油墨完成的,然后通过退火步骤以蒸发溶剂并使金属颗粒融合在一起。
因此,喷墨技术与某些类型的沉积物高度相关,然而它的缺点严重限制了它的范围,特别是在电连接领域。
还有另一种可以激光打印基于银的或铜的纳米颗粒物的油墨墨滴的方法被开发出来。该工艺称为激光诱导正向传输(LIFT,Laser-Induced Forward Transfer)。
图1示意性地展示了该工艺的基本原理。激光脉冲透过透明衬底照射纳米颗粒油墨层。这导致了空泡和液体射流的产生。所述射流会一直延伸,直到它在朝向薄膜的接收器衬底形成液滴。
该LIFT工艺使打印墨滴能够具有很小的、大约20毫米的测量直径,并且厚度为几百纳米。使用导电膏体或具有高粘度的油墨也是可行的,并且使得能够打印具有几微米厚度的结构。这些墨滴的并列能够在各种不同类型的衬底(特别是聚合物和柔性材料)上打印2D结构,甚至当使用高粘度油墨时可以打印3D结构。在适当的光学系统以及高重复率下使用激光提供了以4米/秒打印宽度为20微米(μm)的导线的方法。
文献US 6815015公开了在表面被流变液体例如油墨覆盖的衬底上操作实现这种方法的工艺。
这种激光打印工艺的主要优点与喷墨技术相比如下:
精度更高,因为没有打印头部的机械运动;
在较宽的粘度范围(从1mPa.s(毫帕秒)到105mPa.s)打印油墨的方法并且因此较粗的线路用于传导具有相当高强度的电流;
消除喷墨过程中固有的打印头堵塞的问题;
生产细导线(其厚度小于15μm)。
然而这种方法并不解决所有问题。
特别是生产高分辨率、无缺陷(例如碎片或金属星)的导线的唯一方法是传输金属纳米颗粒油墨,这是繁重并且昂贵的,并且需要退火步骤。
这些步骤同样也是一种限制因素因为它们阻止了低成本衬底的使用,这些衬底无法承受通常的超过120℃的温度。
此外,这种激光打印过程会产生一种额外的限制,即供体衬底的制备。这涉及到测量厚度在几微米和几十微米之间的均匀油墨薄膜的制备,其性质因为溶剂的蒸发而随时间变化,并且其必须因此而不断地更新。
该方法同样可以通过一种透明衬底操作实现,该衬底的表面有一层金属层。
可以特别引用的文献是EP 0862791,其公开了一种中间部分的金属层划分为网络的衬底。穿过衬底的激光束造成了中间部分的快速融化以及该衬底以熔滴的形式释放。
还可以参考文献“微米级铜线打印,具有自动供体补充的飞米激光诱导正向传输”(Grant-Jacob等,光学材料快报,2013年6月,Vol.3,No.6)该文献指出了单个激光脉冲足以局部融化金属薄膜以生成一滴滴的金属。后者沉积在接收器衬底上。在冷却后,该液滴将固化并恢复固体金属的导电性能,而不需要退火步骤。
这与用液体薄膜有效实现类似过程相比是一处优点。
然而,正如上述文章所指出的那样,该过程有一些缺点,特别是喷出一滴金属所需的能量的大小足够大到同样喷出许多几乎无法消除的金属星。这种方法因此导致了高颗粒污染,这与微电子领域的大多数应用不兼容。
发明内容
因此,本发明的目的是提供一种克服已知工艺和方法的缺点的、易于实施的、可重现的激光打印方法,同时可以获得高分辨率并避免退火步骤。
因此,本发明涉及一种激光打印方法,其包含以下步骤:
(a)提供接收器衬底;
(b)提供目标衬底,该目标衬底包含透明衬底,该透明衬底的一个表面具有由固体金属膜构成的涂层;
(c)通过第一激光器透过所述透明衬底对薄膜进行局部照射,以达到液体形式的所述薄膜的目标区域中的金属的融化温度;
(d)通过第二激光器透过所述透明衬底照射由步骤(c)限定的所述目标区域上的液体薄膜,以便在目标区域中形成液体射流并且使其以熔融金属的形式从衬底喷射;
(e)将熔融金属液滴沉积在接收器衬底的指定的接收区域上,所述液滴在冷却后固化。
有利的是,第一激光器是连续激光器或长脉冲激光器,第二激光器是短脉冲激光器
对于连续的目标区域和接收区域,可以重复步骤(c)和(e)。
可以针对相同的目标区域和相同的接收区域重复步骤(c)至(e)。
目标衬底的透明衬底可以由玻璃或石英制成。
金属薄膜包含的金属可以选自铜(Cu),金(Au),银(Ag)或其合金。
特别的,金属薄膜的厚度在50纳米和10微米之间。
附图说明
通过阅读下面下述说明,本发明会更易于理解,以及本发明的其他目的、优点和特征会变得更加清楚,并且其参照附图对本发明进行了说明:
图1示意性地示出了应用于包含液体薄膜的目标衬底的LIFT方法的基本原理;
图2示意性地示出了在操作实施LIFT方法的过程中,在激光器的作用下在液体薄膜内部发生的现象;以及
图3示意性地示出了用于有效实施根据本发明的方法的设备。
具体实施方式
参考图1,现在将描述现有技术中已知的LIFT方法的基本原理。
因此,图1a示出了一种能够产生激光能量10的激光能量源1。
其还示出了包括透明衬底20以及由液体薄膜构成的涂层21的目标衬底2。
图1a还示出了接收器衬底3。
目标衬底2位于激光能量源1和接收器衬底3之间。
此外,涂层21形成在衬底20的朝向接收器衬底3的表面上。因此,涂层21包括与衬底20接触的表面210以及朝向接收器衬底3的表面211。
该涂层21可以由基于银的或铜的纳米颗粒物的油墨构成。
一旦目标衬底2和接收器衬底3如图1a所示布置,该涂层21被激光能量源1照射。
在该照射阶段中,激光能量10通过激光透过透明衬底20,以达到涂层21的指定目标区域。
激光能量10足够局部加热涂层21中存在的少量液体。
现在参考图2a,其示出了之后如何形成一滴液体。
图2a示出了穿过透明衬板20的激光能量10以及在薄膜21的指定目标区域中蒸汽22的产生。
这种数量的蒸发流体在目标区域中产生过大的压力,这导致将位于相同的目标区域存在的非蒸发流体推动到衬底20之外。
图2b到2d示意性地示出了形成空泡23和液体射流24的步骤。
这种液体射流会延伸的越来越长,直到在接收器衬底3的指定接收区域形成液滴25时(图1b)。
然后进行退火步骤。
现在参考图3,其示意性地示出了能够实施根据本发明的方法的设备。
该方法首先要求提供接收器衬底4和目标衬底5,该目标衬底包含透明衬底50,其表面501具有在这里由固态金属薄膜构成的涂层51。
如图3所示,接收器衬底和目标衬底以涂层51直接朝向接收器衬底4的方式布置。
其部件包括第一激光器6和第二激光器7,通过诸如光学扫描器8的光学系统来控制光束的移动。
如图3所示,扫描器8以能够将源自第一激光器6或第二激光器7的激光能量发射到薄膜51对侧的衬底50的表面500上的方式布置。
根据本发明的方法首先由通过第一激光器6透过透明衬底50局部照射指定目标区域上的薄膜51组成。
所述第一激光器是连续或长脉冲类型的。特别的,第一激光器是连续红外二极管激光器,其光束可以基于时间进行调制。
在照射的目标区域,薄膜达到金属的熔融温度并且因此以液体形式存在于透明衬底50上。
当所照射的区域处于液体形式下时,设备被以第二激光器7透过透明衬底50照射相同的该目标区域的方式控制。
所述第二激光器7是短脉冲类型的。作为示例,该第二激光器是红外皮秒激光器、飞秒激光器或纳秒激光器。
如先前关于图1和图2所述,这导致了液体射流的形成和熔融金属液滴沉积在接收器衬底4上。
因为熔融金属薄膜之后的行为类似液体薄膜,所以这些步骤不再进行具体描述。因此,所述方法的所述步骤与参照图1和图2描述的LIFT方法一样。
一旦沉积在接收器衬底4上,熔融金属液滴就会冷却并因此固化。然后在不需要退火步骤的情况下恢复固体金属的导电性能。
因此,根据本发明的方法提供了通过使用两种不同的激光器结合液相和固相中传输的优点的能力。
因此,该方法可以用更便宜的材料制造连接线,并且消除了限制低成本接收器衬底的使用的退火步骤。
因此,其通过允许使用较便宜的衬底并消除退火步骤,可以显着降低制造成本。它还提供了获得与用液体薄膜获得的分辨率相当的分辨率的能力,因此该分辨率优于用喷墨打印方法获得的分辨率。此外,它可以避免碎片的产生,就像使用单个激光脉冲进行固相印刷的情况一样。
该方法可以应用于制造用于显示器的柔性电路,但是也可以用在光伏领域中以生产集电极。
应当注意的是,目前在该应用中不存在用于打印用于强电流所必须的测量厚度为几微米的连接线路的任何解决方案,其方法是非接触的,并且适用于产品,从而能够满足薄膜的脆弱性。
该方法还打开了打印任何类型的材料并实现纳米级尺寸的可能性。实际上,打印像素的尺寸由激光器的能量密度(fluence)控制,但主要也由液体薄膜的厚度控制。根据本发明的打印方法有效实现了将双脉冲激光器用于生产纳米级厚度的液体薄膜,并且因此能够打印直径为几十纳米的像素。这给出了迈向实现等离子体结构和光子晶体结构的道路。
在权利要求中提及的技术特征之后插入的附图标记仅用于促进对后者的理解,并且绝不限制其范围。

Claims (8)

1.一种激光打印方法,其包括以下步骤:
(a)提供接收器衬底(4);
(b)提供目标衬底(5),该目标衬底包含透明衬底(50),该透明衬底的一个表面具有由固体金属膜构成的涂层(51);
(c)通过第一激光器(6)透过所述透明衬底(50)对薄膜(51)进行局部照射,以达到液体形式的所述薄膜的目标区域中的金属的融化温度;
(d)通过第二激光器透过所述透明衬底照射由步骤(c)限定的所述目标区域上的液体薄膜,以在所述目标区域中形成液体射流并且使其以熔融金属的形式从衬底喷射;
(e)将熔融金属液滴沉积在接收器衬底的指定接收区域上,所述液滴在冷却后固化。
2.如权利要求1所述的方法,其中,所述第一激光器是连续激光器或长脉冲激光器。
3.如权利要求1或2所述的方法,其中,所述第二激光器是短脉冲激光器。
4.如权利要求1至3所述的方法,其中,用于连续目标区域和接收区域时重复所述步骤(c)至(e)。
5.如权利要求1至3所述的方法,其中,用于同一目标区域和接收区域时重复所述步骤(c)至(e)。
6.如权利要求1至5所述的方法,其中,所述目标衬底的所述透明衬底由玻璃或石英制成。
7.如权利要求1至6所述的方法,其中,所述金属薄膜包含的金属选自包括以下各项的组:铜、金、银或其合金。
8.如权利要求1至7所述的方法,其中,所述金属薄膜的厚度在50纳米和10微米之间。
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