CN107850461A - The manufacture method and sensor of sensor - Google Patents

Abstract

A kind of manufacture method of sensor, generating unit that the sensor includes being used to produce predetermined detection object, for detecting the action body acted in as caused by the generating unit test section of detection object and region between generating unit and test section, the manufacture method of the sensor is by making substrate bending or bending make generating unit relative with test section, the part 1 provided with generating unit of the substrate is integral with the part 2 provided with test section, substrate is relatively moved with action body in a manner of action body enters the region between generating unit and test section.

Description

The manufacture method and sensor of sensor

Technical field

The present invention relates to the manufacture method of sensor and sensor.

Background technology

As the structure of rotary encoder, known following structure：By the substrate provided with the light-emitting component for sending light With the substrate of the photo detector provided with the light sent for detecting self-emission device, it is accommodated in the housing of rotary encoder (such as patent document 1).

Prior art literature

Patent document

Patent document 1：Japanese Unexamined Patent Publication 2001-027551 publications

The content of the invention

Problems to be solved by the invention

But the light-emitting component and photo detector of the rotary encoder described in patent document 1 are present in independently of each other Substrate on, therefore there are the following problems：In assembling, it is necessary to carry out the irradiation model of light sent for determining self-emission device Enclose and positioned with the relation between by optical range of photo detector.When generation caused by location of mistake when misplacing, light is first The output of part is not sometimes desired output, is caused unstable along with the output of sensing detection.Particularly, in photo detector In the case of multiple, when misplacing, each output of multiple photo detectors is fluctuated, and is caused along with sensing detection Export unstable.

The problem of rotary encoder of patent document 1 as described above, is not limited to carry out the swinging coding of light detection Device, for send detection object (such as light etc.) generating unit and for detect as caused by generating unit detection object detection Portion is arranged in the sensor on separate substrate, the problem of being common.

It is more prone to the sensor carried out it is an object of the present invention to provide positioning between generating unit and test section is made Manufacture method and sensor.In addition, the present invention also aims to, there is provided it is more prone to the manufacture method of the sensor of manufacture And sensor.

The solution used to solve the problem

A kind of manufacture method for the sensor of the invention for being used to reach described purpose, the sensor include being used to produce The generating unit of predetermined detection object, for detect as caused by the generating unit test section of the detection object, Yi Ji The action body acted in region between the generating unit and the test section, wherein, by making substrate bending or bending And making the generating unit relative with the test section, the part 1 provided with the generating unit of the substrate is with being provided with the inspection The part 2 in survey portion is integral, in a manner of the action body enters the region between the generating unit and the test section The substrate is set to be relatively moved with the action body.

Thus, because the part 1 provided with generating unit and the part 2 provided with test section are present on integral substrate, Therefore can utilize makes the easy operation such as substrate bending or bending, carries out the positioning of generating unit and test section.Thus, generating unit Positioning with test section is more prone to carry out.Further, since the easy positioning can be carried out, therefore it can simplify and be related to positioning Manufacturing process.Thus, the manufacture of sensor is more prone to carry out.Further, since so that action body enters generating unit and detection The mode in the region between portion makes substrate be relatively moved with action body, therefore can carry out the system of following this sensor Make：Action body can be carried out using the generating unit and test section that are located on the substrate that part 1 and part 2 be integrated The sensor of the sensing detection of action.

In the manufacture method of sensor of the invention, the substrate, which has, connects the part 1 and the part 2 Pick up come connecting portion, by the action body from the opposite side of the connecting portion enter the region in a manner of make the substrate with The action body is relatively moved.

Thus, it is possible to the space between part 1 and part 2 is more easily set using connecting portion.Therefore, it is possible to Detected region between generating unit and test section is more easily set.In addition, by making action body from the opposite of connecting portion Side enters region, can take into account make positioning and it is easy to manufacture with the advantages of connecting portion be present.

In the manufacture method of sensor of the invention, the part 1 and institute after the bending or bending of the substrate It is parallel to state part 2, and the relative movement direction of the substrate and the action body is along the part 1 and described the 2 parts.

Thus, it is possible to based on the part 1 be arrangeding in parallel and the relation of part 2, adjustment is located at the generating unit of part 1 With the position relationship for the test section for being located at part 2.Therefore, in the case where generating unit has directionality, for by test section The position adjustment as caused by generating unit in the generating region of detection object is accommodated in be more prone to carry out, and on that will produce The design that portion and test section are located at position angle when on substrate is more prone to carry out.In addition, by making substrate and action body Relative movement direction along part 1 and part 2, can more easily determine to relatively move the benchmark in direction, and And in relative movement substrate can be made to be difficult to contact with action body.Therefore, it is possible to more easily make action body enter region.

In the manufacture method of sensor of the invention, the action body is to support the disk for that can rotate by axle The component of shape, breach is provided with least one of the part 1 and the part 2, the breach is used for described dynamic In the state of body is entered in the region between the generating unit and the test section, the axle is set not connect with the substrate Touch.

Thus, it is possible to suppress to hinder the motion of axle because substrate contacts with axle.

In the manufacture method of sensor of the invention, by the substrate be installed to form housing multiple components in one Individual component is on the 1st component, by a component for making to be used as in the multiple components for forming the housing and described for supporting The 2nd component and the 1st component of action body are close, carry out the assembling of the housing, and so that the action body enters institute Stating the mode in the region between generating unit and the test section makes the substrate be relatively moved with the action body.

Thus, simultaneously action body can be made to enter the area between generating unit and test section in this process of the assembling of housing Domain.In addition, also can according to the 1st component and the position relationship of the 2nd component during the assembling of housing, determine generating unit and test section it Between ray and action body position relationship adjustment.Therefore, using the present invention, the manufacture of sensor is made to be more prone to carry out.

In the manufacture method of sensor of the invention, it is assemblied together by the 1st component and the 2nd component Afterwards, the inlet port entered possessed by the 2nd component for the substrate is covered using The lid component.

Thus, generating unit, test section and action body can be enclosed in housing.Therefore, can using present embodiment More accurately carry out the sensing detection of the action of action body.

Sensor of the invention for achieving the object above includes：Generating unit, it is used to produce predetermined detection object； Test section, it is used to detect the detection object as caused by the generating unit；Substrate, the generating unit and the test section Located at the substrate；Action body, it is acted in region between the generating unit and the test section；And housing, its For storing the generating unit, the test section and the action body, the part 1 provided with the generating unit of the substrate It is integral with the part 2 provided with the test section, and the substrate has the generating unit relative with the test section Bending or bending shape, the housing have for the substrate installation the 1st component and for the action body set the 2nd Component, by making the 2nd component and the 1st component relatively move and abut along predetermined direction, carry out the group of the housing Dress, the predetermined direction are the directions that the action body can be made to enter in the region between the generating unit and the test section.

Thus, because the part 1 set for generating unit and the part 2 set for test section are present in integral substrate On, therefore the easy operation for making substrate bending or bending etc. can be utilized, carry out the positioning of generating unit and test section.Thus, The positioning that generating unit and test section can be provided is more prone to the sensor carried out.Further, since it is readily fixed to carry out this Position, therefore the manufacturing process for being related to positioning can be simplified.Thereby, it is possible to provide the sensor for being more prone to manufacture.Further, since Substrate is set to be relatively moved with action body in a manner of action body is entered the region between generating unit and test section, therefore energy Enough manufactures for carrying out following this sensor：It is enough using the generating unit being located on the substrate that part 1 and part 2 are integrated with And test section carries out the sensor of the sensing detection of the action of action body.In addition, using sensor of the invention, can be in housing Assembling this process in action body is entered region between generating unit and test section simultaneously.In addition, using the present invention's Sensor, also can according to the 1st component and the position relationship of the 2nd component during the assembling of housing, determine generating unit and test section it Between ray and action body position relationship adjustment.Therefore, using the present invention, the manufacture of sensor is made to be more prone to carry out.

In sensor of the invention, the housing has The lid component, and the The lid component will assemble the 2nd component With the opening portion covering of the existing housing after the 1st component.

Thus, generating unit, test section and action body can be enclosed in housing.Thus, can be more using the present invention Accurately carry out the sensing detection of the action of action body.

The effect of invention

Using the manufacture method and sensor of sensor of the invention, positioning between generating unit and test section can be made more Add easy progress.In addition, using the manufacture method and sensor of sensor of the invention, it is more prone to the manufacture of sensor Carry out.

Brief description of the drawings

Fig. 1 is the structure chart of the sensor of one embodiment of the present invention.

Fig. 2 is the stereoscopic figure of sensor.

Fig. 3 is the explanation figure of an example of the configuration for illustrating generating unit, optical scale and test section.

Fig. 4 is the block diagram of optical encoders, angle sensors.

Fig. 5 is the explanation figure of an example of the pattern for representing optical scale.

Fig. 6 is the stereogram for an example for representing substrate.

Fig. 7 is the plan for an example for representing the substrate before bending.

Fig. 8 is knot of the circuit configuration for representing to be provided with the face of that side of generating unit and test section with being located at its back side The figure of one example of the corresponding relation between structure.

Fig. 9 is the stereogram for an example for representing the main body of stator and the structure being located in main body.

Figure 10 is the stereogram for an example for representing to be located at the structure on the base of stator.

Figure 11 is the figure of an example of the position relationship for representing generating unit and test section.

Figure 12 is the figure of an example of the position relationship for representing generating unit and test section.

Figure 13 be represent install circuit before substrate an example plan.

Figure 14 be represent for by optical scale be located at detected region, stator assembling an example figure.

Figure 15 be represent for by optical scale be located at detected region, stator assembling an example figure.

Figure 16 is the explanation figure for illustrating test section example.

Figure 17 is the explanation figure for illustrating an example of the 1st light accepting part of test section.

Figure 18 is the explanation figure for illustrating an example of the 3rd light accepting part of test section.

Figure 19 is the explanation figure separated for the polarized component for illustrating to be carried out by optical scale.

Figure 20 is the explanation figure separated for the polarized component for illustrating to be carried out by optical scale.

Figure 21 is the explanation figure separated for the polarized component for illustrating to be carried out by optical scale.

Figure 22 is the functional block diagram of optical encoders, angle sensors.

Figure 23 is saying for the intensity variation of the polarized component of the anglec of rotation and each light accepting part for illustrating optical scale Bright figure.

Figure 24 is the explanation figure for illustrating the anglec of rotation of optical scale and the relation of Lisa such as angle.

Figure 25 is the figure for illustrating generating unit.

Figure 26 is the generation scope and test section and an example of the relation of the position of axle for representing the light from generating unit Figure.

Figure 27 is the flow chart of an example of the flow of the process for the manufacture for representing sensor.

Figure 28 is the figure for representing another configuration example of multiple photo detectors possessed by test section.

Figure 29 is the stereoscopic figure for the sensor for employing the stator with the profile different from the example shown in Fig. 2.

Figure 30 is the figure of sensor for representing to be installed in the hole for the component for being located at tabular.

Figure 31 is the figure of an example of the cross sectional shape for representing recess portion etc..

Embodiment

The form (embodiment) for implementing the present invention is explained in detail with reference to the accompanying drawings.The present invention is not by following embodiment party Content described in formula limits.In addition, the inscape recorded below include those skilled in the art it can be readily appreciated that Key element and substantially equivalent key element.In addition, the inscape recorded below can be combined as.

Fig. 1 is the structure chart of the sensor 31 of one embodiment of the present invention.Fig. 2 is the stereoscopic figure of sensor 31. Fig. 1 is Fig. 2 schematic cross-sectional view.Fig. 3 is an example of the configuration for illustrating generating unit 41, optical scale 11 and test section 35 Explanation figure.Fig. 4 is the block diagram of optical encoders, angle sensors 2.Fig. 5 is the explanation of an example of the pattern for representing optical scale 11 Figure.Sensor 31 includes：Generating unit 41, it is used to produce the detection object as electromagnetic wave (such as light)；Test section 35, its every Detected region and detect the detection object as caused by generating unit 41；And substrate 50, generating unit 41 and test section 35 are set In the substrate 50.In the present embodiment, sensor 31 also has rotor 10 and stator 20, and the rotor 10 has：Axle 12, it connects Tie in rotating machineries such as motor；And action body (optical scale 11), it is arranged on the end of the axle 12 and with revolvable Mode is located at detected region.In addition, detected region refers to the space between generating unit 41 and test section 35.Present embodiment In generating unit 41 have and be used to send the light-emitting component of light.Test section 35 in present embodiment is used for received from as hair The photo detector for the light that the generating unit 41 of optical element is sent.More specifically, the test section 35 of present embodiment includes：With inclined Shake layer PP1 the 1st light accepting part PD1, the 2nd light accepting part PD2 with polarization layer PP2, the 3rd light accepting part PD3 with polarization layer PP3 And with this four photo detectors of polarization layer PP4 the 4th light accepting part PD4.In figure 3, in order to represent to send out from by generating unit 41 Incident light 73 from the light source light 71 gone out to each light accepting part (the 1st light accepting part PD1~the 4th light accepting part PD4) by each polarization layer PP1~ Polarization layer PP4 situation, and the light accepting part PD4 of polarization layer PP1~polarization layer PP4 and the 1st light accepting part PD1~the 4th is discretely entered Row is described, but actually both are to abut.

Fig. 6 is the stereogram for an example for representing substrate 50.Fig. 7 is an example for representing the substrate 50 before bending Plan.Fig. 8 is the circuit configuration for representing to be provided with the face of that side of generating unit 41 and test section 35 with being located at its back side On structure corresponding relation an example figure.Fig. 9 is the knot for representing the main body 21 of stator 20 and being located in main body 21 The stereogram of one example of structure.Figure 10 is the stereogram of an example of structure for representing to be located on the base 22 of stator 20. Figure 11 and Figure 12 is the figure of an example of the position relationship for representing generating unit 41 and test section 35.Figure 13 is to represent installation electricity The plan of one example of the substrate before road.Figure 14 and Figure 15 is to represent to be used to optical scale 11 being located at detected region , the figure of an example of the assembling of stator 20.Figure 16 is the explanation figure for illustrating test section 35 example.Substrate 50 part 1 51 provided with generating unit 41 and the part 2 52 provided with test section 35 are integral.Such as such as Fig. 6 and Fig. 7 institutes Show, substrate 50 is a substrate of the part 2 52 of the part 1 51 and round shape that include semicircle arcuation.Substrate 50 is, for example, to scratch Property printed base plate (Flexible Printed Circuits：FPC), it is provided with including generating unit 41 and test section 35 Various circuits (such as IC circuits 60 shown in Fig. 6 etc.).More specifically, FPC is that it passes through with flexible circuit board Following manner is formed：Such as using polyimide film or photoresistance flux film be insulator as basement membrane, adhesive linkage is formed on basement membrane And conductor layer, cover the part in addition to portion of terminal (including soldering portion) in conductor layer with insulator.Conductor layer is copper etc. Electric conductor, the signal wire and power line of the part of various circuits etc. are connected to provided with the pattern using conductor layer.The present invention The concrete structure for the flexible substrate that can be used is not limited to this, can suitably change.The grade of IC circuits 60 except test section 35 with And preamplifier AMP shown in the Figure 22 of various circuit configuration examples as be described hereinafter beyond generating unit 41, differential operational circuit DS, Filter circuit NR and multiple circuit AP etc..Hereinafter, sometimes by be provided with substrate 50 generating unit 41 and test section 35 that The face of side is referred to as surface 50A, and the face of surface 50A opposite side is referred to as into back side 50B (reference picture 8).In addition, sometimes to substrate 50 Surface 50A in the surface 51A of part 1 51 and the surface 52A of part 2 52 make a distinction record.It is in addition, sometimes right The back side 51B of part 1 51 in the back side 50B of substrate 50 and the back side 52B of part 2 52 make a distinction record.

Substrate 50 is provided with the face comprising the electronic component including generating unit 41 and part 2 52 in part 1 51 On the face of rear side provided with the face comprising at least one of the face of electronic component including test section 35, be provided with by provided with The face of electronic component remains the supporting member of the tabular of plane.Specifically, such as shown in fig. 7, except forming light member Beyond the photodiode (the 1st light accepting part PD1~the 4th light accepting part PD4) of part, it is located in part 2 52 and photo detector phase Part 61 on same face (surface 52A) is located at the inner side of the fitting limit of the IC circuits 60 on the back side 52B of part 2 52. Part 61 is located at and other circuits on photo detector identical face (surface 52A), specifically, example in part 2 52 Such as include IC chip, resistor and capacitor circuit component.IC circuits 60 are to employ such as QFN (Quad flat no Lead package, quad flat non-pin package) mode packaging body integrated circuit.In this way, the in present embodiment the 2nd The supporting member of part 52 is the packaging body of integrated circuit (IC circuits 60), is located in the part 2 52 for being provided with the packaging body More than one electronic component (such as test section 35 and part 61) be located at the packaging body in the rear side across substrate 50 Existing position.In addition, the mode of the packaging body of integrated circuit is not limited to QFN modes, can as long as there is that can be used as The face (such as surface 52A of part 2 52) of the opposite side in the face of that side provided with the integrated circuit is remained into plane Supporting member plays the supporting construction portion of function.In addition, in the present embodiment, as the surface for being located at part 2 52 The parts such as IC chip, resistor and the capacitor of other circuits on 52A 61, including it is connected to by soldering the encapsulation of wiring Circuit and the bare chip that wiring is connected to the methods of pass through wire bonding, but this is an example, and the present invention is not limited to This, both can be any one of above-mentioned encapsulated circuit and bare chip or part or all employs other modes Circuit.

In addition, as shown in figure 8, the confession in the part 1 51 of present embodiment is packaged with luminescent device 41U light-emitting component The rear side in the face that (reference picture 25) is set is provided with supporting substrates 65.Supporting substrates 65 are the anti-circular arcs for example with part 1 51 The tabular component of the corresponding semicircle arcuation of the shape of shape.More specifically, part 1 51 and supporting substrates 65 have semicircle The plate face of arcuation, the plate face of the semicircle arcuation correspond to and the diameter circle smaller than the diameter of the plectane will be provided with the center in plectane face The plate face of the ring-type (arc-shaped) in the hole of shape be diametrically divided into it is two-part in the case of a part.Supporting substrates 65 are for example by having The resin for having insulating properties is formed.In this way, the supporting member of the part 1 51 in present embodiment is the shape with part 1 51 The tabular component with insulating properties matchingly formed.Supporting substrates 65 in present embodiment are the branch of inverter circuit after all One example of bearing member, the present invention are not limited to this, can suitably changed.

Substrate 50 has the connecting portion 53 for connecting part 1 51 and part 2 52.Specifically, such as such as Fig. 6 Shown in Fig. 7, connecting portion 53 be arranged between part 1 51 and part 2 52 by the peripheral part of the circular arc of part 1 51 with The peripheral part of the circular arc of part 2 52 connects.

Connecting portion 53 has the wiring for being connected to generating unit 41 (or test section 35).In the present embodiment, connecting portion 53 Possess the signal wire and power line for being connected to generating unit 41.Specifically, the wiring of connecting portion 53 be arranged to for example installed in Signal wire and power line on FPC.In addition, the connecting portion 53 of present embodiment is not provided with circuit, but can also be in connecting portion 53 set the parts such as circuit.

As shown in Figure 6 and Figure 7, the connecting portion 53 of present embodiment is compared with part 1 51 and part 2 52, with The orthogonal direction of the bearing of trend of connecting portion 53 between part 1 51 and part 2 52 and be along the side of the plate face of substrate 50 Upward narrower width.

Substrate 50 has an electric wiring section 54, and the electric wiring section 54, which has, is connected to generating unit 41 and test section 35 Wiring.Specifically, such as shown in Figure 6 and Figure 7, electric wiring section 54 be arranged to from part 1 51 to the institute of connecting portion 53 In side, opposite side extends.Electric wiring section 54, which possesses, to be connected to generating unit 41, test section 35 and is located at each on substrate 50 The signal wire and power line of kind circuit.Specifically, the wiring of electric wiring section 54 is arranged to the letter for example on FPC Number line and power line.In the present embodiment, the wiring of generating unit 41 is located at part 1 51, connecting portion 53 and electrically matched somebody with somebody Line portion 54.In addition, the wiring of test section 35 is located at part 2 52 and electric wiring section 54.

In addition, for example as shown in figure 1, electric wiring section 54 can also be connected with connector CNT.Connector CNT be by The interface that sensor 31 connects with other devices (such as arithmetic unit 3).Sensor 31 fills via connector CNT and computing 3 are put to be connected.That is, electric wiring section 54 is as the various circuits that will be located on substrate 50 and other devices (such as arithmetic unit 3) wiring connected plays function.Alternatively, it is also possible to set the parts such as circuit in electric wiring section 54.Connector CNT energy It is enough to omit.In this case, the top of electric wiring section 54 is arranged to terminal, and the terminal can be inserted into for example will in sensor 31 In the connector (omitting diagram) that the device side to be connected is set.

It is parallel with part 2 52 that substrate 50 is arranged to part 1 51.Specifically, as shown in figures 1 to 6, the folding of substrate 50 Curve the shape relative with test section 35 of generating unit 41 (Japanese "U" font).In the present embodiment, substrate 50 is located at even Bending position 55a, 55b rectangular bending in a manner of surface 50A is located at inner side at the two of socket part 53.That is, the bending of substrate 50 is Part 1 51 and part 2 52 are vertical with connecting portion 53, and part 1 51 and part 2 52 are present in relative position. Thus, part 1 51 be arranged in parallel with part 2 52, and generating unit 41 is relative with test section 35.In the present embodiment, by two The bending position of close part 1 51 in bending position 55a, the 55b at place is referred to as bending position 55a, will be close to part 2 52 Bending position be referred to as bending position 55b.

That provided with test section 35 in the face and part 2 52 of that side provided with generating unit 41 in part 1 51 The face of side is the same face (surface 50A) in substrate 50.By by the face of that side provided with generating unit 41 and provided with inspection The face of that side in survey portion 35 is arranged to relative, and the position relationship of generating unit 41 and test section 35 is as shown in Fig. 3 etc., in can The position relationship of the detection object (such as light) as caused by generating unit 41 is detected using test section 35.In addition, relative generating unit Space between 41 and test section 35, which turns into, is detected region.

In this way, in substrate 50, the part 1 51 provided with generating unit 41, the part 2 52 provided with test section 35 and general The connecting portion 53 that part 1 51 connects with part 2 52 is integrated, and bending position 55a, 55b at two at right angles roll over It is curved, so as to by the face (table provided with test section 35 in face (surface 51A) of the part 1 51 provided with generating unit 41 and part 2 52 Face 52A) it be arranged in parallel and makes its relative.Here, as shown in fig. 7, the bending axis at bending position 55a be the 1st axis LA with Bending axis at bending position 55b is that the 2nd axis LB is parallel.Bending axis refers to, in bending substrate 50, turn into relative to The substrate of bending clips one of relative (such as the part 1 51 or the 2nd of bending part (such as bending position 55a, 55b) institute Part 52), the axis of the action center axis of the rotational action of another one (such as connecting portion 53).In present embodiment 1 axis LA and the 2nd axis LB is respectively present in two articles of foldings with being formed as folding line at bending position 55a, 55b of substrate 50 The position that curved line overlaps.

In addition, the generation central point on the detection object of generating unit 41 in the plane before the bending of substrate 50 is the 1st The center for the detection zone that point and the 1st axis LA distance and test section 35 are detected to detection object and test section 35 Any one of configuration center of possessed multiple detection zones i.e. the 2nd point of distance with the 2nd axis LB, above-mentioned two distance It is equal.Specifically, as shown in fig. 7, injection point 41S and bending position on the light of the generating unit 41 in present embodiment Bending line at 55a is four photo detectors i.e. the 1st light accepting part possessed by the 1st axis LA distance W1 and test section 35 PD1, the 2nd light accepting part PD2, the 3rd light accepting part PD3, the 4th light accepting part PD4 configuration center S0 and bending position 55b at bending line That is the 2nd axis LB distance W2, above-mentioned distance W1 are equal with distance W2.Here, the injection point 41S of the light of generating unit 41 is this reality The 1st point in mode is applied, configuration center S0 is at the 2nd point in present embodiment.

In addition, the 1st point and the 2nd point is present on the same straight line extended along the substrate 50 before bending, the straight line and the 1st Axis LA and the 2nd axis LB square crossings.1st point and the 2nd point be present in it is orthogonal with the 1st axis LA and the 2nd axis LB On same straight line.Specifically, as shown in fig. 7, injection the point 41S and configuration center S0 of the light of generating unit 41 are present in and rolled over Two articles of bending lines at curved position 55a, 55b are the orthogonal same straight line i.e. straight line L1 of the 1st axis LA and the 2nd axis LB On.

In addition, four photo detectors are arranged respectively at the different positions in predetermined plane, in four photo detectors Each photo detector and the distance of any in predetermined plane are all equal, by any and each light in four photo detectors Four line segments that the center in region connects mutually form right angle.Specifically, four light members possessed by test section 35 Part is the 1st light accepting part PD1, the 2nd light accepting part PD2, the 3rd light accepting part PD3 and the 4th light accepting part PD4, in the part 2 of substrate 50 It is configured on 52 surface 52A equidistant relative to a bit (configuration center S0).In addition, on the 52A of surface, the 1st light accepting part PD1 With the 3rd light accepting part PD3 configurations across the position of configuration center S0 and point symmetry, the 2nd light accepting part PD2 and the 4th light accepting part PD4 match somebody with somebody Put across configuration center S0 and point symmetry position.In addition, in the present embodiment, the 1st light accepting part PD1, the 2nd light accepting part Each the shape of possessed light area and area are all equal by PD2, the 3rd light accepting part PD3 and the 4th light accepting part PD4.Separately Outside, in test section 35, the center of the center of the 1st light accepting part PD1 light area and the 3rd light accepting part PD3 light area with Configuration center S0 be midpoint distance W2 configure, the center of the 2nd light accepting part PD2 light area and the 4th light accepting part PD4's The center of light area configures using configuration center S0 as midpoint distance W2.In other words, configuration center S0 and the 1st light accepting part The distance at the center of the light area of this four photo detectors of the light accepting part PD4 of PD1~the 4th is all distance W, all equal.In addition, In the present embodiment, the 1st light accepting part PD1, the 2nd light accepting part PD2, the 3rd light accepting part PD3 and the 4th light accepting part PD4 sensitive area The center in domain is more than the 1st light accepting part PD1, the 2nd light accepting part PD2, the 3rd light accepting part PD3 and the 4th with configuration center S0 distance W Light accepting part PD4 width w.In addition, the center of the 1st light accepting part PD1 light area, configuration center S0 and the 3rd will passed through The axis of imaginaries at the center of light accepting part PD3 light area is set as x-axis, by by the 2nd light accepting part PD2 light area When the axis of imaginaries at the center of the light area of the heart, configuration center S0 and the 4th light accepting part PD4 is set as y-axis, x-axis exists with y-axis It is orthogonal on the surface 52A of part 2 52.That is, on the surface 52A of part 2 52, in the 1st light accepting part PD1 light area The angle, θ 1 that the center of the heart and the 2nd light accepting part PD2 light area is formed is 90 °.Equally, the 2nd light accepting part PD2 sensitive area Angle, θ 2 that the center of the center in domain and the 3rd light accepting part PD3 light area is formed, the 3rd light accepting part PD3 light area The light area for the light accepting part PD4 of angle, θ 3 and the 4th that the center of center and the 4th light accepting part PD4 light area is formed The angle, θ 4 that the center of center and the 1st light accepting part PD1 light area is formed is 90 °.In this way, the 1st light accepting part PD1, the 2nd by Light portion PD2, the 3rd light accepting part PD3 and the 4th light accepting part PD4 on the 52A of surface using configuration center S0 as circle center it is same On circumference with interval 90 ° equally spaced configure.In addition, by the x/y plane that x-axis and y-axis are formed and the injection by the light of generating unit 41 The z-axis that point 41S and configuration center S0 are connected is orthogonal.That is, surface 52A feelings are overlooked along the z-axis direction from the side of generating unit 41 Under condition, project point 41S and overlapped with configuration center S0.That is, by (such as the 2nd, the predetermined plane of a bit (configuration center S0) Points 52 surface 52A) normal be the light that straight line L2 (reference picture 12) passes through generating unit 41 the center for projecting point 41S.Thus, 1st light accepting part PD1, the 2nd light accepting part PD2, the 3rd light accepting part PD3 and the 4th light accepting part PD4 configurations are in the light away from illuminating part 41 Project the position of point 41S equidistances.

Test section 35 is used to detect detection object (such as light etc. occurred by the change for the physical quantity being detected in region Electromagnetic wave) change.The change of physical quantity is for example caused by being present in the rotation of action body in detected region.In detail and Speech, such as shown in FIG. 1 to 3, it is being detected optical scale 11 of the region provided with rotor 10.Sensor 31 be carry out with by making For the sensor of the corresponding output of the change of the testing result of detection object caused by the rotation of the optical scale 11 of action body. That is, sensor 31 plays function as rotary encoder, and it is used to detect is connected to rotor in a manner of transmitting spinning movement The angle position of 10 rotational action body.

One of part 1 51 and part 2 52 are smaller than another one.Specifically, such as shown in Figure 6 and Figure 7, originally The diameter of the part 1 51 of arc-shaped in embodiment is roughly the same with the diameter of the part 2 52 of circle.Wherein, the 1st Divide 51 to have and be provided with the shape of the notch part 51a of semicircle shape semicircle arcuation in the FPC of semicircle shape inner circumferential sides.Therefore, the 1st 51 areas for accounting for substrate 50 are divided to be less than the area that part 2 52 accounts for substrate 50.In order to not make optical scale 11 be contacted with substrate 50 And notch part 51a is set.

Rotor 10 has the optical scale 11 of the component as the circular plate shape (or polygonal shape) shown in Fig. 5.Optics Scale 11 is formed such as silicon, glass, high polymer material.Optical scale 11 shown in Fig. 5 has signal tracks in side plate face Road T1.In addition, axle is installed in the plate face of the opposite side for the plate face of optical scale 11 is provided with of rotor 10 12.Optical scale 11 inclination but angle of inclination it is less in the case of, not polarisation-affecting separation function.In present embodiment Optical scale 11 in the detected region in the space being used as between generating unit 41 and test section 35 by being acted, so as to make To play function to the component that light is exerted one's influence.Optical scale 11 as the action body in present embodiment is by axle branch The discoid component for holding to rotate, but this is an example, and the present invention is not limited to this, the shape of optical scale 11 Etc. can suitably change.

Stator 20 is by encirclement bearing 26a, 26b, axle 12, test section 35 and the optical scale 11 installed in the end of axle 12 The component of light-proofness formed.Accordingly, it is capable to suppress external optical noise in the inside of stator 20.Stator 20 in present embodiment Function is played as the housing of storage substrate 50 and component (optical scale 11).Housing has a part for substrate 50 fixed The 1st component and be the 2nd component that can be acted by member supporting.Specifically, stator 20 includes lid 23, as the 2nd Component plays the main body 21 of function and the base 22 of function is played as the 1st component.Main body 21 is will by bearing 26a, 26b The supporting of axle 12 is the shell that can be rotated.The inner circumferential of main body 21 is fixed on bearing 26a, 26b outer ring, and the periphery of axle 12 is fixed on Bearing 26a, 26b inner ring.When axle 12 rotates because of the rotation from rotating machineries such as motor, optical scale 11 and axle 12 Axis is rotated centered on pivot Zr in linkage.Main body 21, which has, to be used to the base 22 provided with substrate 50 being installed on The opening portion 21a of main body 21.With the face (back of the body of the opposite side of that side provided with test section 35 in the part 2 52 of substrate 50 Face) the mode that is abutted with base 22 of at least a portion, substrate 50 is fixed on base 22.Specifically, exist as described above The back side 50B of substrate 50 is provided with the IC circuits 60 as the part for forming sensor 31.Such as shown in Figure 10, base 22 The shape abutted with the IC circuits 60 from the outer side covers back side and the circular peripheral part with part 2 52.It is bent into day The connecting portion 53 of the substrate 50 of literary "U" font is located to be erected from the part 2 52 by being fixed on base 22 to be supported by base 22 Erect the position put.In this way, in the present embodiment, substrate 50 is fixed on base 22 so as to the substrate by part 2 52 50 are fixed on base 22.Lid 23 is the component of a part for the cylindric outer peripheral face to form stator 20.Lid 23 is located at main body 21 Opening portion 21a sides, the notch part 21b to be extended out from base 22 for electric wiring section 54 opposite side.By main body 21 In the state of being fitted together with base 22, lid 23 is further assembled into covering opening portion 21a, so as to main body 21, base 22 And lid 23 forms the stator 20 of cylindrical shape, and block influence of the inside from the optical noise of outside of stator 20.In this way, base 22 and lid 23 as shell be main body 21 lid play function.

In addition, part 1 51 is adhered to the 2nd component (such as main body with the face of side opposite side where detected region 21).Specifically, part 1 51 with the face (back side 51B) of side opposite side where detected region by tabular component (such as supporting substrates 65) are adhered to the 2nd component.More specifically, the supporting substrates 65 of present embodiment with part 1 51 On the two faces of the face of the opposite side in the face of abutting and the face, the adhesive tape with cohesive is pasted with.The adhesive tape is so-called Two-sided tape, two faces are respectively provided with cohesive.That is, the one side of supporting substrates 65 by adhesive tape bonding in the back side of part 1 51 The face (back side 51B) of side.In addition, supporting substrates 65 turn into another side with viscous in the state of part 1 51 is simultaneously adhered to The state of conjunction property.Another side in the face to be extended out for the autonomous agent 21 of axle 12 and is present in by the side of base 22 by adhesive tape bonding Face (hereinafter referred to as bonding plane 21c).In this way, one of part 1 51 and part 2 52 (are the 2nd in the present embodiment Part 52) the 1st component (base 22) is fixed on, the other of part 1 51 and part 2 52 (are in the present embodiment Part 1 51) be adhered to main body 21 with the face of side opposite side where detected region.In addition, tabular component (such as support Substrate 65) be simultaneously adhered to the other of part 1 51 and part 2 52 with detected region where side opposite side Face (back side 51B) in the state of, another side is adhered to main body 21.Additionally it may be desirable to it is present in part 1 51 and the 2nd Point the other of 52 (such as part 1s 51) with the face (such as back side 51B) of side opposite side where detected region with The rigidity of tabular component (such as supporting substrates 65) between 2nd component (such as main body 21) is higher than the rigidity of substrate 50.

In addition, in the present embodiment, part 1 51 with the face of side opposite side where detected region by supporting Substrate 65 is adhered to the 2nd component, but this is an example of the concrete mode being bonded, and the present invention is not limited to this.For example, the The back side 51B of 1 part 51 can also utilize bonding agent, adhesive tape (two-sided tape etc.) to be adhered to bonding plane 21c.Specifically, example Such as can by bonding agent in point-like be coated near the periphery of supporting substrates 65 or the number of inner peripheral portion at, by supporting substrates 65 and the The back side 51B and supporting substrates 65 of 1 part 51 are fixed up with bonding plane 21c points.In addition, as bonding. in solid point regularly Reinforcement before agent solidification, also it can also use adhesive tape simultaneously.

, can also be by adhesive applicating to the 2nd component (such as main body 21) using in the case of bonding agent, or coating To the other of part 1 51 and part 2 52 with where detected region on the face of side opposite side, only by making the 2 components abut with above-mentioned another one, just the face of another one and side opposite side where detected region can be adhered into the 2nd structure Part, therefore the assembling of sensor 31 can be made to be more prone to carry out.

When above-mentioned rotor 10 axle 12 rotate when, as shown in figure 3, optical scale 11 for example along R directions relative to detection Portion 35 relatively moves.Thus, the signal track T1 of optical scale 11 relatively moves relative to test section 3.Optical scale 11 Polariscopic polarization direction Pm in plane is towards predetermined direction, and polarization direction Pm changes with rotation.Test section 35 by receive the light source light 71 of generating unit 41 penetrate optical scale 11 and incidence incident light (transmitted light) 73, figure can be read The signal track T1 of optical scale 11 shown in 5.

Optical encoders, angle sensors 2 include above-mentioned sensor 31 and arithmetic unit 3, as shown in figure 4, sensor 31 fills with computing 3 are put to be connected.The control unit 5 of the rotating machinery such as with motor of arithmetic unit 3 is connected.

Optical encoders, angle sensors 2 penetrate optical scale 11 using test section 35 to light source light 71 and incident incident light 73 is carried out Detection.Arithmetic unit 3 according to the rotor 10 of the detection signal computing sensor 31 of test section 35 and the relative position of test section 35, Exported using the information of relative position as control signal to the control unit 5 of the rotating machineries such as motor.

The e.g. computer such as PC (PC), including input interface 4a, output interface 4b, CPU of arithmetic unit 3 (Central Processing Unit, CPU) 4c, ROM (Read Only Memory, read-only storage) 4d, RAM (Random Access Memory, random access memory) 4e and internal storage device 4f.Input interface 4a, output Interface 4b, CPU 4c, ROM 4d, RAM 4e and internal storage device 4f are connected by internal bus.In addition, arithmetic unit 3 It can be made up of special treatment loop.

Input interface 4a receives the input signal of the test section 35 from sensor 31 and is output to CPU 4c.Output interface 4b receives control signal from CPU 4c and is output to control unit 5.

The programs such as BIOS (Basic Input Output System, basic input output system) are stored with ROM 4d. Internal storage device 4f is, for example, HDD (Hard Disk Drive, hard disk drive), flash memory etc., is stored with operating system journey Sequence, application program.CPU 4c using RAM 4e as workspace while use, while performing in ROM 4d, internal storage device The program stored in 4f, so as to realize various functions.

Internally storage device 4f, which is stored with, will correspondingly go up test section by polarization direction Pm as caused by optical scale 11 The database of 35 output.Or internally be stored with can be by the injection point 41S of the light of generating unit 41 with matching somebody with somebody by storage device 4f Put the database of the corresponding positional information of upper optical scale 11 of center S0 (test section 35) distance D (reference picture 12) value.

In the signal track T1 shown in Fig. 5, the arrangement form for being referred to as metal fine (wire) g of wire grid pattern is being schemed On optical scale 11 shown in 1.Optical scale 11 makes adjacent metal fine g parallel and linearly configuration is used as signal tracks Road T1.Therefore, in optical scale 11, no matter the position of radiation source light 71 where, all as identical axis of polarization, put down Polariscopic polarization direction in face is facing one direction.

In addition, the optical scale 11 with the metal fine g for being referred to as wire grid pattern is compared with the polarizer of photoinduction, energy Enough improve heat resistance.In addition, optical scale 11 is also in the absence of the linear pattern of part as intersecting, therefore can local As high accuracy and the few optical scale 11 of error.In addition, optical scale 11 can also utilize unified exposure or nano impression skill Art stably manufactures, therefore can turn into high accuracy and the few optical scale 11 of error.In addition, optical scale 11 can also be The polarizer of photoinduction.

A plurality of metal fine g is not configured across.It is the whole or one that can supply light source light 71 between adjacent metal fine g The penetration region d of partial penetration.In metal fine g width and adjacent metal fine g interval, i.e. metal fine g Width and penetration region d width it is narrower than the wavelength of the light source light 71 of generating unit 41 it is enough in the case of, optical scale 11 Can be by the polarization separation of incident light 73 of light source light 71.Therefore, optical scale 11 has consistent inclined of the polarization direction Pm in plane Galvanometer.In the circumference that optical scale 11 rotates, the axis of polarization of the incident light 73 incident to test section 35 is with optical scale 11 rotation and change.In the present embodiment, the change of axis of polarization is turned around relative to the rotation of optical scale 11 and repeats The increase and decrease that row is 2 times.

Optical scale 11 need not segment the different region in polarization direction.Also, optical scale 11 has consistent polarization side To Pm, therefore in the absence of the border in regions different polarization direction Pm, the inclined of the incident light 73 as caused by the border can be suppressed The situation that the state of shaking is disturbed.The optical encoders, angle sensors 2 of present embodiment can reduce the possibility of the generation of error detection or noise Property.

Figure 17 is the explanation figure for illustrating the 1st light accepting part PD1 of test section 35 example.Figure 18 is to be used to illustrate The explanation figure of 3rd light accepting part PD3 of test section 35 example.Generating unit 41 is, for example, light emitting diode.As shown in figure 3, The light source light 71 irradiated from generating unit 41 penetrates above-mentioned optical scale 11 and penetrates polarization layer PP1, polarization as incident light 73 Layer PP2, polarization layer PP3 and polarization layer PP4, incide the 1st light accepting part PD1, the 2nd light accepting part PD2, the 3rd light accepting part PD3 and 4th light accepting part PD4.When being overlooked from z-axis direction, the 1st light accepting part PD1, the 2nd light accepting part PD2, the 3rd light accepting part PD3 and the 4th Light accepting part PD4 is arranged respectively at around generating unit 41.From the 1st light accepting part PD1, the 2nd light accepting part PD2, the 3rd light accepting part PD3 with And the 4th light accepting part PD4 to configuration center S0 distance it is equal.It is configured to mitigate the CPU 4c as arithmetic unit using this Computational load.

As shown in figure 17, the 1st light accepting part PD1 includes silicon substrate 34, the polarization layer 39a of light accepting part 37 and the 1st.In addition, such as Shown in Figure 18, the 3rd light accepting part PD3 includes silicon substrate 34, the polarization layer 39b of light accepting part 37 and the 2nd.For example, silicon substrate 34 is n-type Semiconductor, light accepting part 37 are p-type semiconductors, silicon substrate 34 and light accepting part 37 can be utilized to form the pole of photoelectricity two formed by PN junction Pipe.1st polarization layer 39a and the 2nd polarization layer 39b can form by the polarization layer of photoinduction or by metal fine is arranged in parallel The formation such as wire grid pattern.1st polarization layer 39a makes the edge of incident light 73 that the optical scale 11 shown in Fig. 3 is incided from light source light 71 1st polarization direction separates, and the 2nd polarization layer 39b makes above-mentioned incident light 73 be separated along the 2nd polarization direction.Preferably, these the 1st The axis of polarization that the axis of polarization of separation light separates light with the 2nd relatively differs 90 °.Using the structure, arithmetic unit 3 can be made CPU 4c easily carry out the computing of polarization angle.

Equally, illustrated using Figure 17 and Figure 18, the 2nd light accepting part PD2 includes silicon substrate 34, light accepting part 37 and the 1 polarization layer 39a.In addition, as shown in figure 18, the 4th light accepting part PD4 includes silicon substrate 34, the polarization layer 39b of light accepting part 37 and the 2nd. For example, silicon substrate 34 is n-type semiconductor, light accepting part 37 is p-type semiconductor, can utilize silicon substrate 34 and light accepting part 37 form by The photodiode that PN junction is formed.1st polarization layer 39a and the 2nd polarization layer 39b can be by the polarization layer of photoinduction or by metal Wire grid pattern of thin line of parallel arrangement etc. is formed.1st polarization layer 39a makes to incide the optical scale shown in Fig. 3 from light source light 71 11 incident light 73 separates along the 1st polarization direction, and the 2nd polarization layer 39b makes above-mentioned incident light 73 be separated along the 2nd polarization direction.It is excellent Choosing, the axis of polarization that these the 1st axis of polarization for separating light separate light with the 2nd relatively differ 90 °.Using the structure, The CPU 4c of arithmetic unit 3 can be made easily to carry out the computing of polarization angle.

1st light accepting part PD1, the 2nd light accepting part PD2, the 3rd light accepting part PD3 and the 4th light accepting part PD4 are via making incident light 73 Polarization layer PP1, PP2, PP3, the PP4 separated along respectively different polarization direction receives light.It is preferred, therefore, that by polarization layer The axis of polarization that the axis of polarization of PP1 separation separates with by polarization layer PP2 relatively differs 45 °.Preferably, by polarization layer The axis of polarization that the axis of polarization of PP2 separation separates with by polarization layer PP3 relatively differs 45 °.Preferably, by polarization layer The axis of polarization that the axis of polarization of PP3 separation separates with by polarization layer PP4 relatively differs 45 °.Preferably, by polarization layer The axis of polarization that the axis of polarization of PP4 separation separates with by polarization layer PP1 relatively differs 45 °.Using the structure, computing can be made The CPU 4c of device 3 easily carry out the computing of polarization angle.

Figure 19, Figure 20 and Figure 21 are the explanation figures of the separation of the polarized component for illustrating to be carried out by optical scale 11. It is incident as shown in Figure 19 according to the incident light that the signal track T1 of optical scale 11 has polarized along polarization direction Pm.In Figure 19 In, foreign matter D1 and foreign matter D2 in the range of sensing detection be present.The polarization direction Pm of incident light can utilize above-mentioned the 1st inclined The luminous intensity PI (-) of composition and the luminous intensity PI (+) of composition of the 2nd polarization direction in direction of shaking is represented.As described above, it is preferred to , the 1st polarization direction and the 2nd polarization direction are to differ 90 ° of direction, are, for example ,+45 ° of composition relative to reference direction With -45 ° of composition.In Figure 19, Figure 20 and Figure 21, the axis direction of wiregrating is parallel with paper, but relative to paper with Identical angle tilt and angle of inclination it is less in the case of, do not interfere with the function of polarization separation yet.That is, optical scale 11 is Make to tilt relative to rotation axis, can also be used as polarization separation element to play function.

As shown in figure 20, the 1st light accepting part PD1 enters by the 1st polarization layer 39a for making incident light be separated along the 1st polarization direction Row detection, therefore detect the luminous intensity PI (-) of the composition of the 1st polarization direction.As shown in figure 21, the 3rd light accepting part PD3 by make into Penetrate the 2nd polarization layer 39b that light separates along the 2nd polarization direction to be detected, therefore detect the luminous intensity of the composition of the 2nd polarization direction PI(+).Equally, as shown in figure 20, the 2nd light accepting part PD2 is by the 1st polarization layer 39a for making incident light be separated along the 1st polarization direction Detected, therefore detect the luminous intensity PI (-) of the composition of the 1st polarization direction.As shown in figure 21, the 4th light accepting part PD4 is by making The 2nd polarization layer 39b that incident light separates along the 2nd polarization direction is detected, therefore detects the light intensity of the composition of the 2nd polarization direction Spend PI (+).

Figure 22 is the functional block diagram of optical encoders, angle sensors 2.Figure 23 is for illustrating the anglec of rotation of optical scale 11 and each The explanation figure of the intensity variation of the polarized component of light accepting part.As shown in figure 22, generating unit 41 carries out the hair based on reference signal Light, to the radiation source light 71 of optical scale 11.The detected portion 35 of incident light 73 as transmitted light receives.Differential operational circuit DS What is carried out is to have used Autonomous test portion 35 to export and handled by the differential operational of the preamplifier AMP detection signals being exaggerated. According to the size of the output of test section 35, preamplifier AMP can be omitted.

Differential operational circuit DS obtains detection signal, the 1st polarization direction composition (the 1st separation as test section 35 Light) luminous intensity PI (-) and the 2nd polarization direction composition (the 2nd separation light) luminous intensity PI (+).With luminous intensity PI (-) and Luminous intensity PI (+) is corresponding, the 1st light accepting part PD1, the 2nd light accepting part PD2, the 3rd light accepting part PD3 and the 4th light accepting part PD4 Respective output is for example as shown in figure 23, be luminous intensity I1, I2 as the rotatable phase of optical scale 11 is deviateed, I3、I4。

Differential operational circuit DS follows formula (1) and formula (2), according to the luminous intensity PI of the composition of the 1st polarization direction The luminous intensity PI (+) of the composition of (-) and the 2nd polarization direction, to the differential wave Vc of the rotation dependent on optical scale 11 with And differential wave Vs carries out computing.Differential wave Vc is the signal corresponding with so-called cosine (cos) composition, differential wave Vs It is the signal corresponding with so-called sinusoidal (sin) composition.

Vc=(I1-I3)/(I1+I3) ... (1)

Vs=(I2-I4)/(I2+I4) ... (2)

In this way, differential operational circuit DS based on luminous intensity I1 and luminous intensity I3 computing luminous intensities and [I1+I3] and light The difference [I1-I3] of intensity, and the difference [I1-I3] of computing luminous intensity divided by luminous intensity and the differential letter that is obtained after [I1+I3] Number Vc.In addition, differential operational circuit DS based on luminous intensity I2 and luminous intensity I4 computing luminous intensities and [I2+I4] and luminous intensity Difference [I2-I4], and the difference [I2-I4] of computing luminous intensity divided by luminous intensity and the differential wave Vs that is obtained after [I2+I4]. Not comprising the luminous intensity by light source light 71 in differential wave Vc, Vs obtained using formula (1) and formula (2) computing The parameter of influence, the output of sensor 31 can reduce distance, the luminous intensity of generating unit 41 of test section 35 and optical scale 11 Fluctuation etc. influence.The anglec of rotation that differential wave Vc, Vs turns into optical scale 11 is the axis of polarization of optical scale 11 The anglec of rotation (the hereinafter referred to as angle of polarization) β function.But it should be noted that with by located at the light of the light source of generating unit 41 In the case that amount control is constant automated power control (APC), it is not necessary to carry out above-mentioned division arithmetic.

As shown in figure 22, differential wave Vc, Vs is input in filter circuit NR, is removed noise.Then, in multiple circuit In AP, according to the Lissajou's figure shown in differential wave Vc, Vs arithmograph 24, entering from initial position for rotor 10 is capable of determining that Gone rotation the anglec of rotation absolute angle.Differential wave Vc, Vs is to differ the differential wave of the phase of λ/4, therefore computing exists Transverse axis represents differential wave Vc cosine curve, differential wave Vs sinusoidal Lissajou's figure, foundation is represented in the longitudinal axis The anglec of rotation determines Lisa such as angle.For example, the Lissajou's figure shown in Figure 24 is surround two weeks in 1 circle of rotation of rotor 10.Fortune Calculating device 3 has following function：Storage optical scale 11 rotation position be positioned at 0 ° less than in the range of 180 °, also It is less than in the range of 360 ° positioned at 180 °.Thus, it can turn into optical encoders, angle sensors 2 and be capable of the exhausted of computing rotor 10 To the absolute encoder of position.

Figure 25 is the figure for illustrating generating unit 41.Generating unit 41 shown in Figure 25 is lighted such as by light emitting diode The light-emitting component obtained after device 41U encapsulation.Luminescent device 41U can also be other structures.Specifically, such as can also be The LASER Light Sources such as vertical cavity surface emitting laser and filament etc..Generating unit 41 includes pedestal substrate 41F, photomask 41R, is embedded in Conductive layer 41H is penetrated in through hole SH, with penetrating outer electrode 41P that conductive layer 41H electrically connects, being mounted in pedestal substrate 41F On luminescent device 41U, by luminescent device 41U and penetrate conductive layer 41H connect connection bonding wire 41W and protection it is luminous Device 41U sealing resin 41M.

The photomask 41R of generating unit 41 plays converges to outgoing plane 41T's by the light source light 71 that luminescent device 41U is radiated In the range of light source light 71 aperture function.Lens face is not present on outgoing plane 41T, light source light 71 is shown with light distribution To match somebody with somebody light distribution into the θ o of predetermined angular 2 relative to outgoing plane 41T section.The θ o of angle 2 with light distribution depend on generating unit 41.The θ o of angle 2 are, for example, 30 °, but angle can also be made bigger or smaller than this value than this value.

Sensor 31 can use the generating unit 41 without lens.By make generating unit 41 light injection point 41S with Configuration center S0 (test section 35) distance D is close, it is possible to increase SN ratios.On the 1st light accepting part PD1, the 2nd light accepting part PD2, The respective distance W with configuration center S0 of 3 light accepting part PD3 and the 4th light accepting part PD4, can configure can reduce generating unit 41 Diffusion light influence and receive in the scope of light.Therefore, the measurement accuracy of sensor 31 and optical encoders, angle sensors 2 obtains Improve.It is of course also possible to use the lensed generating unit 41 of tool.

Figure 26 is the injection scope of light and the relation of the position of test section 35 and axle 12 for representing to project from generating unit 41 An example figure.In the present embodiment, using generating unit 41 produce and detected portion 35 detect detection object be light. The injection angle of the light source light 71 of generating unit 41 (above-mentioned θ o of angle 2) can be arbitrarily set by designing.Therefore, as schemed Shown in 26, the whole light area that light is carried out by test section 35 can be included in the range of the injection angle of light source light 71, and And connecting portion 53 and axle 12 are not included.However, it is very difficult to it is the 71 complete pinching of light source light of light source to penetrating to make using light emitting diode It is zero to make light leak in the range of going out.In addition, further contemplate reflected light after projecting etc., it is difficult to make the light source light except direct projection All light (such as diffusing) beyond 71 are not incident on test section 35 completely.Therefore, in the present embodiment, in order to subtract Few reflected light, to the antireflection process of the face implementation light for being provided with light-emitting component and photo detector of substrate 50.Specifically, make For the antireflection process of light, can use in the plate face of substrate 50 at least provided with that of generating unit 41 and test section 35 Face (surface 50A) application of side has application processing of the anti-reflection materials such as the blacking of light absorptive etc..

Furthermore, it is contemplated that the possibility of the reflection of light occurs on the outer peripheral face of axle 12, counnter attack can also be implemented to axle 12 Penetrate processing.In this case, sensor 31 turns into such as lower sensor：It includes scale (optical scale 11) and rotation supporting portion (main body 21 of stator 20), the scale is revolved in the detected region as the space between generating unit 41 and test section 35 Rotate and make, so as to be exerted one's influence to light, the rotation supporting portion has the axle 12 supported scale as that can rotate, and axle 12 is carried out The antireflection process of light.Specifically, the antireflection process as light, such as the periphery to metal axle 12 can be used Face carry out black oxidation film layer electroplating processes, above-mentioned application processing etc.., can also be to storing light for same design The inner peripheral surface for learning the stator 20 of scale 11 and substrate 50 implements antireflection process.

Next, the flow chart of reference picture 27 illustrates the manufacture method of sensor 31.Figure 27 is the system for representing sensor 31 The flow chart of one example of the flow for the process made.Hereinafter, illustrate to grasp with production operation personnel or by production operation personnel The machinery for the manufacture being used as is the flow chart of main body.First, substrate 50 is formed, set for generating unit 41 the of the substrate 50 1 part 51 is integral (step S1) with the part 2 52 set for test section 35.Specifically, such as shown in figure 13, shape Into the FPC for including such as lower part：The part 1 51 of semicircle arcuation, circular part 2 52, by part 1 51 and part 2 52 connecting portions 53 connected and electric from part 1 51 to being extended out with the place side opposite side of connecting portion 53 Wiring part 54.In the process, formed on the FPC and be connected with the various circuits being installed in process afterwards on substrate 50 Signal wire and the wiring such as power line.In addition, antireflection process is implemented to the surface of the FPC.Now, not to afterwards with comprising The portion of terminal of the wiring connection of various circuits including generating unit 41 and test section 35 implements antireflection process.In this way, this implementation The manufacture method of the sensor 31 (optical sensor) of mode has following process：Substrate 50 is formed, the substrate 50 supplies production The part 1 51 that life portion 41 is set is integral with the part 2 52 set for test section 35.

Then, various parts are installed on substrate 50.Specifically supporting substrates 65, such as are first pasted the 1st The back side 51B (step S2) of part 51.Then, the various works for setting IC circuits 60 are implemented in the back side 52B of part 2 52 Sequence.More specifically, the solder printing (step S3) for the back side 52B installations IC circuits 60 in part 2 52 is undergone, to the The back side 52B installation IC circuits 60 (step S4) of 2 parts 52, to the processing by step S4 and the part 2 after installing The soldering for the back side 52B by heating the Reflow Soldering (step S5) carried out and part 2 52 that 52 back side 52B sides are carried out Visual examination (step S6) etc., so as to set IC circuits 60 on the back side 52B of part 2 52.In this way, present embodiment The manufacture method of sensor 31 (optical sensor) has following process：Confession in part 1 51 exists comprising generating unit 41 Confession in the face (surface 51A) of interior electronic component setting and part 2 52 is set comprising the electronic component including test section 35 On the face (back side 51B, 52B) of the rear side in the face (surface 52A) put, the face (surface for supplied for electronic part to be set is installed 51A, 52A) remain plane tabular supporting member (IC circuits 60 and supporting substrates 65).

Next, implement the various processes for installing part in the surface 50A of substrate 50.More specifically, experience is used Pacify in the part that generating unit 41 and part 61 are installed in the surface 51A of part 1 51 and in the surface 52A of part 2 52 Fill the solder printing (step S7) of test section 35, various circuits are installed to the surface 50A with generating unit 41 and test section 35 (step S8), to the processing by step S8 and the surface 50A sides after installing carry out by heating the Reflow Soldering carried out Visual examination (step S10) of (step S9) and surface 50A soldering etc., so as to install to enter by soldering on the 50A of surface The part of row wiring connection.Then, cleaning base plate 50 (step S11).After substrate 50 has been cleaned, using as the one of part 61 The cream (such as Ag welding pastes) of the installation of the bare chip divided is coated to (step S12) on the 50A of surface, installation bare chip (step S13), bare chip is fixed by heat cure (step S14).Also, by wire bonding (step S15) by bare chip and substrate 50 Wiring connect.After wire bonding has been carried out, base will be coated to using the resin (UV solidified resins) of ultraviolet curing The surface 50A sides (step S16) of plate 50, the substrate (such as glass substrate) of sealing is carried to it is coated with UV solidified resins Surface 50A sides (step S17), the processing i.e. UV curing process (step implemented irradiation ultraviolet and solidify UV solidified resins S18).In this way, the manufacture method of the sensor 31 (optical sensor) of present embodiment has following process：In part 1 51 set generating unit 41, and test section 35 is set in part 2 52.Here, tabular component (such as supporting substrates 65) will be provided with That side substrate 50 face (back side 50B) be set to one side in the case of, generating unit 41 and test section 35 are located at another side (surface 50A) side.In addition, be located on the surface 52A of part 2 52 more than one electronic component (such as test section 35 with And part 61) located at IC circuits 60 packaging body overleaf 52B on present in scope in.

Wire bonding is, for example, to have used the Au wire bondings of gold thread, but this is an example, and the present invention is not limited to This, can suitably change.Alternatively, it is also possible to instead of wire bonding, and use TAB (Tape Automated Bonding, winding It is automatic to combine), can also be using bare chip as flip-chip and together with the wiring soldering of substrate.

Then, make generating unit 41 relative with test section 35.Specifically, such as so that part 1 51 is provided with generating unit 41 face (surface 51A) and the face (surface 52A) provided with test section 35 of part 2 52 be arranged in parallel and relative mode, will Bending (the step S19) at two of substrate 50.In this way, the manufacture method tool of the sensor 31 (optical sensor) of present embodiment There is following process：Face (the table provided with generating unit 41 that substrate 50 as flexible substrate (FPC) is formed as making part 1 51 Face 51A) bending shape relative with the face (surface 52A) provided with test section 35 of part 2 52.

As illustrated in above-mentioned step S7~step S14 process, (the optics of sensor 31 of present embodiment Formula sensor) manufacture method there is following process：Generating unit 41 is set in part 1 51, test section is set in part 2 52 35.Additionally it may be desirable to forming the light accepting part PD4 of the 1st light accepting part PD1 of test section 35~the 4th is arranged respectively at predetermined plane Different positions on (such as surface 52A), the respective distance (distance W) away from any in predetermined plane of four photo detectors It is all equal, four line segments that the center of any and the respective light area of four photo detectors connects are formed each other Right angle.Additionally it may be desirable to after by the bending of substrate 50, pass through the predetermined plane (surface 52A) of a bit (configuration center S0) Normal be light that straight line L2 passes through generating unit 41 the center for projecting point 41S.Desirably, it is contemplated that set to the above situation Generating unit 41 and test section 35.Specifically, meet to make bending axis i.e. the 1st axis LA and the bending at bending position 55a Bending axis at the 55b of position is parallel such 1st conditions of the 2nd axis LB.In addition, on the plane before the bending of substrate 50 On generating unit 41 detection object generation central point be the 1st point (such as projecting point 41S) and the 1st axis LA distance (away from From W1) and the center of detection zone detected to detection object of test section 35 or test section 35 possessed by multiple inspections Survey any one of the configuration center in region i.e. (such as configuration center S0) and the 2nd axis LB distance (distance W2) at the 2nd point, it is full Foot makes above-mentioned distance W1 such 2nd conditions equal with distance W2.In addition, meet the 1st point and the 2nd point being configured to before bending Substrate 50 on the 1st axis LA and the same straight line of the 2nd axis LB square crossings (or crossings on different level) (such as straight line L1 such 3rd condition on).The wiring of generating unit 41 and test section 35 is set when forming substrate 50, determines the 1st axis LA And the 2nd axis LB, and configuration when determining the installation of generating unit 41 and test section 35, to meet these the 1st condition, the 2 Condition and the 3rd condition.

Then, housing (such as stator 20) (step S20) is formed.Specifically, being formed has the 2nd component (such as main body 21) with the housing of the 1st component (such as base 22), the 2nd component will be such as lower member (such as optical scale 11) supporting can Acted, the component for acted in the detected region as the space between generating unit 41 and test section 35, from And the component exerted one's influence to light, a part for substrate 50 are fixed on above-mentioned 1st component.In the present embodiment, as The housing of storage substrate 50 and optical scale 11 is a structure of stator 20, is also formed with lid 23, but this is the tool of housing One example of body structure, the present invention are not limited to this.For example, lid 23 can also be and the one of base 22.In addition, also may be used So that the axle that outer peripheral face has been carried out antireflection process will be formed as located at the axle 12 that the 2nd component is main body 21.Alternatively, it is also possible to right The inner peripheral surface of stator 20 for storing substrate 50 and optical scale 11 implements antireflection process.

Then, the process (step S21) of experience assembling sensor 31.Hereinafter, in the manufacturing process for illustrating sensor 31 Assembling procedure.In the manufacturing process of sensor 31, so that action body (such as optical scale 11) enters generating unit 41 and detection The mode in the region (detected region) between portion 35 makes substrate 50 be relatively moved with action body.Specifically, sensing In the manufacturing process of device 31, such as shown in Figure 14 and Figure 15, so that action body is entered from the place side opposite side of connecting portion 53 Entering the mode in region (detected region) makes substrate 50 be relatively moved with action body.In substrate 50, connecting portion 53 across The ground of part 2 52 is located at the opposite side of electric wiring section 54, therefore in the present embodiment, with action body from electric wiring section 54 The mode that side enters detected region makes substrate 50 be relatively moved with action body.

More specifically, on the basis of predetermined plane (such as surface 52A of part 2 52), the substrate after bending is made The plate face of 50 part 1 51, part 2 52 and optical scale 11 extends along the predetermined plane.In this condition, substrate is made At least one of 50 and the stator 20 with optical scale 11 move up along the side of the predetermined plane, so that will Optical scale 11 is located at detected region.Such as the position provided with optical scale 11 in the columned outer peripheral face of stator 20 Put, the opening portion (such as opening portion 21a) that can be inserted upwardly into substrate 50 in the side of the plate face along optical scale 11 is set, lead to Crossing makes substrate 50 enter the opening portion, and optical scale 11 is located in detected region.In this case, from electric wiring section 54 Substrate 50 is inserted in side, so that substrate 50 enters opening portion 21a.In addition, the part 1 51 of semicircle arcuation enters optical scale 11 In presence axle 12 that side, circular part 2 52 enter optical scale 11 in that side in the absence of axle 12.

In the present embodiment, part 1 51 is parallel with part 2 52.Therefore, with by the surface of part 2 52 52A is as at least one of predetermined plane, the stator 20 for making substrate 50 and having optical scale 11 predetermined along this Plane the manufacture method of process, present embodiment sensor 31 that moves up of side in, substrate 50 and action body Direction is relatively moved along part 1 51 and part 2 52.

Make to demonstrate the assembling procedure in the manufacturing process of sensor 31, first, as composition sensor 31 Installation base plate 50 on the 1st component (base 22) of one in multiple components of housing (stator 20).Then, make the 1st component with As form housing multiple components in one and holding action body the 2nd component (main body 21) it is close, so as to assemble housing, And it is relative substrate 50 is carried out with action body in a manner of action body is entered the region between generating unit 41 and test section 35 It is mobile.Specifically, as shown in Figure 10, the part 2 52 of substrate 50 is fixed on base 22.Also, as shown in figure 14, make The main body 21 for being fixed with the base 22 of part 2 52 and rotor 10 being configured to rotation is in following position relationship：1st Part 51, part 2 52 and optical scale 11 are almost parallel, and optical scale 11 be located at part 1 51 and part 2 52 it Between detected region in.That is, part 1 51, part 2 52 and optical scale 11 is made to be in along the position of predetermined plane Relation.Under this position relationship, main body 21 and base 22 are made in a manner of the opening portion 21a of the autonomous agent 21 of base 22 enters along pre- Fixed plane it is close and and abut, so as to assemble main body 21 and base 22.Thus, optical scale 11 is located at detected region. This, when making main body under position relationship of the optical scale 11 in detected region between part 1 51 and part 2 52 21 with base 22 close to when, it is desirable to do not make the supporting substrates 65 that are pasted onto on the back side 51B of part 1 51 and main body 21 Bonding plane 21c abut.Also, the stage of main body 21 and base 22 is assembled making main body 21 be abutted with base 22, so that bottom Seat 22 above pushes away base 22 close to bonding plane 21c mode, so that supporting substrates 65 abut with bonding plane 21c and are bonded in one Rise.Using the assemble method, in the one side of tabular component (supporting substrates 65) to be pasted to part 1 51 and part 2 52 Another one (such as part 1 51) the face (such as back side 51B) with side opposite side where detected region on state Under, the another side of the tabular component is adhered to the 2nd component (such as main body 21).It is desirable that, in can realize it is above-mentioned as Main body 21 and base 22 assembling mode, set the length of connecting portion 53, bonding plane 21c sides axle 12 development length with And the various specific design items such as thickness of supporting substrates 65.In this way, (optical profile type senses the sensor 31 of present embodiment Device) manufacture method there is following process：One of part 1 51 and part 2 52 (such as part 2 52) are fixed on On 1st component (such as base 22), make the other of part 1 51 and part 2 52 (such as part 1 51) with it is tested The face (such as back side 51B) of side opposite side is adhered to the 2nd component (such as main body 21) where surveying region.

Main body 21 and base 22 have the construction for corresponding to following this assembling procedure：So that action body (such as optics Scale 11) into the mode in the region (detected region) between generating unit 41 and test section 35, substrate 50 is entered with action body Row relative movement.Specifically, there is base 22 the location division 22a of arc-shaped, location division 22a to be formed as mounted base The part 2 52 of plate 50 is surrounded.Location division 22a, which has, supplies electric wiring section 54 along the main body 21 and the phase of base 22 during assembling The breach to be extended out to moving direction.In addition, as shown in Figure 10 and Figure 15, location division 22a can also be corresponding to connecting portion 53 position also has breach.The outer peripheral face 22b of location division 22a arc-shaped has along the covering optical scale 11 of main body 21 The shape of the wall portion 21d of the arc-shaped in outside inner peripheral surface 21e extensions.Therefore, during assembling procedure, possessed by base A part for that side to be extended out for electric wiring section 54 in location division 22a outer peripheral face 22b is had with main body 21 Wall portion 21d inner peripheral surface 21e abut.Thus, optical scale 11 is present in such substrate 50 on straight line L2 (reference picture 12) Set up with the position relationship of action body.In other words, location division 22a and wall portion 21d are as making substrate 50 and action body (such as light Learn scale 11) position relationship set up locating structure play function.In addition, base 22 is centered on the bearing of trend of axle 12 Axis radially, has the step surface 22c for being arranged to extend out on the outside of the 22a of location division.By assembling the He of main body 21 Base 22, abut step surface 22c and the wall portion 21d of main body 21 lower end 21f.Thus, on the bearing of trend of axle 12, it is determined that Main body 21 and the position relationship of base 22, and determine the position relationship of substrate 50 and action body (such as optical scale 11).Change Yan Zhi, the base 22 with location division 22a and step surface 22c and the base 21 with wall portion 21d, which are used as, makes substrate 50 with moving Make the locating structure performance function that the position relationship of body (such as optical scale 11) is set up.In addition, in the present embodiment, step Face 22c, lower end 21f and optical scale 11 arrange along the relative movement direction of main body 21 and base 22.In addition, base 22 is set To make the surface 52A of mounted substrate 50 extend (or parallel with step surface 22c) along step surface 22c.Use the main body 21 with And the construction of base 22, optical scale 11 are also set up with the parallel relation of part 1 51 and part 2 52.Further, since deposit In notch part 51a, therefore after main body 21 and base 22 is assembled, axle 12 will not also contact with substrate 50.Therefore, it is possible to suppress Because axle 12 hinders with the contact of substrate 50 rotation of axle 12.In this way, in the manufacture method of the sensor 31 of present embodiment, Breach (notch part 51a) is provided with part 1 51 so that in the region that action body is entered between generating unit 41 and test section 35 Axle 12 will not contact with substrate 50 in the state of interior.

After main body 21 and base 22 is assembled, electric wiring section 54 is located at the opposite with opening portion 21a of main body 21 certainly The notch part 21b of that side extends out.Then, in the case where lid 23 and base 22 are separate, to cover main body 21 Opening portion 21a mode installs lid 23.That is, in the manufacture method of the sensor 31 of present embodiment, the 1st component is being assembled After (base 22) and the 2nd component (main body 21), cover what substrate 50 possessed by the 2nd component entered using The lid component (lid 23) Inlet port (opening portion 21a).In addition, in Figure 13 into Figure 16, the diagram of the circuit of the grade of test section 35 part is eliminated, but it is real Various circuits on border including test section 35 have installed.

It is in addition, relative with base 22 in the case where connector CNT is had been mounted on substrate 50, such as in main body 21 Main body 21 and the stage of the contraposition of base 22 before movement, as long as the tip side in electric wiring section 54 has been exposed in main body The position relationship in 21 outside.By being arranged such, carrying out being used to make action body enter generating unit 41 and test section 35 Between region, main body 21 and during the relative movement of base 22, will not occur connector CNT can not by notch part 21b and Situation about blocking, it can be assembled well.In addition, connector CNT can be set before the assembling of housing (stator 20) is carried out On substrate 50.It is of course also possible to connector CNT is set after the assembling for carrying out housing.

In this way, the housing of sensor 31 has the 1st component (base 22) for being provided with substrate 50 and the provided with action body the 2nd Component (main body 21), by making the 2nd component and the 1st component be relatively moved along predetermined direction to abut together, so as to group The housing is filled, predetermined direction is the side that action body can be made to enter the region (detected region) between generating unit 41 and test section 35 To.

As described above, using present embodiment, due to the part 1 51 provided with generating unit 41 and provided with test section 35 part 2 52 is present on substrate 50, therefore can utilize the bending of substrate 50 or substrate 50 is bent etc. easy Operation carries out generating unit 41 and the positioning of test section 35.In this way, using present embodiment, make determining for generating unit 41 and test section 35 Position is more prone to carry out.Further, since this readily positioning, therefore the manufacture work for being related to positioning can be simplified can be carried out Sequence.Therefore, it is more prone to carry out using present embodiment, the manufacture of sensor.Further, since so that action body enters generating unit The mode in the region between 41 and test section 35 makes substrate 50 be relatively moved with action body, therefore can carry out following this The manufacture of sensor 31：Can utilize the generating unit 41 that is located on the substrate 50 that part 1 51 and part 2 52 are integrated and Test section 35, carry out the sensing detection of the action of action body.

In addition, it can utilize connecting portion 53 that the space between part 1 51 and part 2 52 is more easily set.Cause This, can more easily set the detected region between generating unit 41 and test section 35.In addition, by make action body from The place side opposite side of connecting portion 53 enters region (detected region), and can take into account connects positioning and easy to manufacture and presence The advantages of portion 53.

In addition, by the way that part 1 51 and part 2 52 are provided parallel to, can be based on the part 1 51 be arrangeding in parallel With the relation of part 2 52, adjustment is located at the generating unit 41 of part 1 51 and is located at the position of the test section 35 of part 2 52 Relation.Therefore, in the case where generating unit 41 has directionality, detection is produced by generating unit 41 for test section 35 to be accommodated in Position adjustment in the generating region of object is more prone to carry out, and on generating unit 41 and test section 35 are located at into substrate The design of position angle when on 50 is more prone to carry out.In addition, the relative movement direction edge by making substrate 50 and action body Part 1 51 and part 2 52, can more easily determine to relatively move the benchmark in direction, and can move relative Substrate 50 is set to be difficult to contact with action body when dynamic.Therefore, it is possible to more easily make action body enter region (detected region).

In addition, by setting breach (such as notch part 51a), it can prevent substrate 50 from being contacted with axle 12 and hindering axle 12 Motion, the breach be used in the state of action body is entered in the region between generating unit 41 and test section 35, make axle 12 with Substrate 50 does not contact.

In addition, housing is assembled by making the 1st component (such as base 22) and the 2nd component (such as main body 21) close, and And substrate 50 is set to carry out relative move with action body in a manner of action body is entered the region between generating unit 41 and test section 35 It is dynamic, so as to make action body simultaneously into the region between generating unit 41 and test section 35 in the assembling of housing this process. In addition, also generating unit 41 and test section 35 can be determined according to the 1st component and the position relationship of the 2nd component during the assembling of housing Between ray and action body position relationship adjustment.Therefore, using the sensor 31 of present embodiment, the system of sensor is made Make and be more prone to carry out.

In addition, after the 1st component and the 2nd component is assembled, covering the 2nd component using The lid component (such as lid 23) is had Substrate enter inlet port (such as opening portion 21a), so as to which generating unit 41, test section 35 and action body are enclosed in In housing.Therefore, using present embodiment, sensor 31 can more accurately carry out the sensing inspection of the action of action body Survey.

In addition, by making connecting portion 53 that there is the wiring being connected with generating unit 41, the wiring being connected with generating unit 41 can be made It is integrally formed with connecting portion 53.Accordingly, it is capable to make connecting portion 53 and have the substrate 50 of the wiring compacter.

In addition, by making the width of connecting portion 53 narrower than part 1 51 and part 2 52, it is connected with making to have to clip The part 1 51 in portion 53 situation constant with the width of the substrate 50 of part 2 52 is compared, and can further reduce substrate 50 Area.Accordingly, it is capable to make 50 further lightness of substrate.

In addition, being bent over by substrate 50 in Liang Chu, the bending of substrate 50 can be utilized in generating unit 41 and test section 35 Between set be detected region.In addition, bending part can be specified.

In addition, being less than part 2 52 by part 1 51, the weight of part 1 51 can be made become lighter.Accordingly, it is capable to make The necessary conditions such as the intensity required for connecting portion 53 turn into the necessary condition for being more prone to realize.

In addition, by the way that substrate 50 is bent into the shape relative with test section 35 of generating unit 41 (such as Japanese "U" word Shape), it more easily can enter to exercise the plane (example in a part (such as part 2 52 etc.) the matching stator 20 of substrate 50 Such as planar portions of base 22) etc., sensor 31 is located in housing in the case of processing.

In addition, by making substrate 50 be flexible substrate, following a series of operation can be more easily carried out：When 1 part 51 and part 2 52 will be including generating units 41 and test section 35 in the state of being present in approximately the same plane Part be installed on substrate 50 after, be detected region and substrate processing 50 to be set between generating unit 41 and test section 35 Operation.

In addition, there is electric wiring section 54 by making substrate 50, the electric wiring section 54 include be connected to generating unit 41 with And the wiring of test section 35, so as to which the wiring of the structure of the sensor 31 with generating unit 41 and test section 35 will be connected to Intensively it is located on substrate 50.That is, by with electric wiring section 54, it is not necessary to need the part (circuit etc.) connected up certainly individually Pull out wiring.Therefore, it is no longer necessary to be processed independently of each other substrate 50 and wiring, can more easily handle sensor 31.

In addition, test section 35 detects the change of the detection object occurred by the change for the physical quantity being detected in region, So as to make the object of the change of generation physical quantity turn into the object of the sensing detection carried out by sensor 31.

In addition, by making detection object by electromagnetic wave (such as generating unit 41 send light), can be according to electromagnetic wave Change to detect the change in detected region.

In addition, produce physics by using the rotation for the action body (such as optical scale 11) for being present in detected region The change of amount, the rotary motion of action body can be made to turn into the object of the sensing detection carried out by sensor 31.

In addition, one of part 1 51 and part 2 52 (such as part 2 52) are fixed on the 1st component (such as bottom Seat 22), another one (such as part 1 51) with the face of side opposite side where detected region be adhered to the 2nd component (such as Main body 21).That is, in the assembling process of sensor 31, one is fixed on the 1st component, and by another one and detected area The face of side opposite side is adhered to the 2nd component where domain, therefore the assembling of sensor 31 is more prone to carry out.

In addition, only by setting two sides that there is the tabular component (such as supporting substrates 65) of cohesive, just can be by another one Be bonded together with the face of side opposite side where detected region with the 2nd component, therefore the assembling of sensor 31 is more prone to Carry out.

In addition, by the way that tabular component (such as supporting substrates 65) is pasted before the assembling of housing (such as stator 20) , can be in the state for making tabular component be integrally formed with substrate 50 on the face with detected region place side opposite side of another one It is lower to be bonded together another side and the 2nd component, therefore the assembling of sensor 31 is more prone to carry out.

In addition, four photo detectors are arranged respectively at the different positions in predetermined plane (such as surface 52A), four Distance (distance W) of the photo detector each away from a bit (configuration center S0) in predetermined plane is all equal, by any and four Four line segments that the center of the respective light area of individual photo detector connects form right angle (1~θ of θ 4) each other, pass through one The injection point 41S for the light that the normal (such as straight line L2) of the predetermined plane of point passes through generating unit 41, therefore four light can be made Element is each equal with the distance that light-emitting component separates.Therefore, it is possible to reduce the detection along with the light carried out by photo detector Output pulsation.In this way, using present embodiment, the output of photo detector can be made more stable.

Further, since it is provided with the face (such as the back side 51B, 52B) of rear side in FPC by the face of the opposite side in the face (such as surface 51A, 52A) remains the supporting member of plane, therefore can make to act on the electronic component and FPC being located on FPC Between the stress of connecting portion further reduce.Therefore, it is possible to further reduce FPC and be located between the electronic component on FPC Connecting portion it is bad.Thereby, it is possible to the reliability for the normal action for further improving sensor 31.Further, since can The reduction for the stress for acting on connecting portion is realized, therefore the difficulty to FPC installation electronic components can be reduced, can more be held Change places and electronic component is located on the face of opposite side of supporting member.

In addition, can be by the encapsulation of the integrated circuit being located on the face (such as back side 52B) of rear side (such as IC circuits 60) Body, made full use of as the supporting member of the electronic component on the face (such as surface 52A) for the opposite side for being located at the face.Separately Outside, due to one in the circuit of integrated circuit and composition sensor 31, therefore can be by setting circuit on FPC two sides And substrate area is more efficiently made full use of, therefore can more easily reduce the FPC relative to required circuit scale Area.Thereby, it is possible to more easily realize the miniaturization of the sensor 31 by the highly integrated acquisition of circuit.

In addition, by setting the plate with insulating properties formed as supporting substrates 65 according to the shape of part 1 51 Shape component, it can comprehensively support the face (such as surface 51A) provided with electronic component using the supporting member.

In addition, the face (such as surface 51A) provided with generating unit 41 of part 1 51 and part 2 52 are provided with test section 35 face (such as surface 52A) be arranged in parallel and relatively, the 1st axis LA is parallel with the 2nd axis LB, the 1st point (such as project a little It is 41S) equal with the 2nd axis LB distance W2 with the 1st axis LA distance W1 and the 2nd point (such as configuration center S0), the 1st point and It is present in the same with the 1st axis and the 2nd axis square crossing (or crossings on different level) on the 2nd point of substrate 50 before bending On straight line (such as straight line L1), so as to the 1st point and the 2nd point be present in it is orthogonal with the part 1 51 after bending and part 2 52 Same straight line (such as straight line L2) on.Therefore, it is possible to more accurately make generating unit 41 relative with test section 35, therefore The output of test section 35 can be made more stable.

In addition, by implementing to the face (surface 50A) for being provided with generating unit 41 and test section 35 of substrate 50 at antireflection Reason, the reflection as caused by substrate of the light sent from generating unit 41 can be reduced.Therefore, it is possible to reducing because of the detection of reflected light and The output of caused test section 35, therefore the output of test section 35 can be made more stable.

In addition, by implementing antireflection process to axle 12, being caused by axle 12 for the light that is sent from generating unit 41 can be reduced Reflection.Therefore, it is possible to reduce because of the detection of reflected light and caused by test section 35 output, therefore the defeated of test section 35 can be made Go out more stable.

In addition, playing function by making sensor 31 be used as rotary encoder, it can detect and be linked to the sensor 31 Rotational action body rotational angle angularly position.

Figure 28 is the figure for representing another configuration example of multiple photo detectors possessed by test section 35.Such as Figure 28 institutes Show, the polarization layer PP1~polarization layer PP4 respectively with square of the test section 35 light accepting part PD4 of the 1st light accepting part PD1~the 4th It can also be configured centered on configuration center S0 in the configuring area 35A of square corner.In this case, also can be by four Individual photo detector is configured to away from configuration center S0 equidistances, and is made the respective of configuration center S0 and four photo detectors Four line segments that the center of light area connects form right angle each other.The distance of configuration center S0 and four photo detectors point It is not any, but by being arranged to shorter distance, four can be made in the state of the decay of the light source light 71 of generating unit 41 is smaller Individual photo detector detects light respectively.In addition, both can be that four photo detectors are separately located in part 2 52, Can be that the test section 35 of the packaging body secured in advance as the position relationship of four photo detectors and configuration center S0 is set In part 2 52.By using the packaging body, the adjustment of the configuration of four photo detectors is set to be more prone to carry out.

In addition, part 1 51 can also be not parallel with part 2 52.As long as the relation of part 1 51 and part 2 52 For following relation：It can be set between generating unit 41 and test section 35 and be detected region, and can utilized and be located at the 2nd 52 test section 35 is divided to detect the detection object as caused by the generating unit 41 for being located at part 1 51.Part 1 51 and the 2nd Divide 52 detailed configuration can suitably to change.

In addition, the relation of part 1 51 and part 2 52 can also turn around.I.e. or, part 1 51 is fixed On the 1st component, part 2 52 is adhered to the 2nd structure with the another side (back side 52B) of side opposite side where detected region Part.But in this case, such as make the shape of part 2 52 identical with the shape of the part 1 51 in present embodiment Deng, the structure of substrate 50 and the circuit (such as part 61 etc.) being located on substrate 50 using considering to housing (such as stator 20) form of the interference of structure etc..In addition, the scope to be extended out according to axle 12, sets such as notch part 51a is such to use In making substrate 50 and 12 discontiguous notch part of axle.For example, being extended out in axle 12 in a manner of through optical scale 11, and deposit In the case of being on the position of part 1 51 and the both sides of part 2 52, it is all provided with part 1 51 and part 2 52 Put notch part.

Connecting portion 53 can also not have wiring.In this case, connecting portion 53 for example supports part 1 51 and the 2nd One of being not fixed on base 22 in points 52.In addition, the one be not necessarily intended to it is smaller than another one.Part 1 51 and the 2nd Points 52 both can be identical size, and the side that is supported by connecting portion 53 can also be made larger.In addition, stator 20 etc. can also have There is the support at least one of the part 1 51 of support connection portion 53 and present embodiment.Alternatively, it is also possible at this The structure that support is provided for being fixedly connected at least one of the part 1 51 of portion 53 and present embodiment (such as is bonded Engaging portions such as agent, adhesive tape, projection etc.).

Line as folding line can not also be formed in bending position 55a, 55b of substrate 50.Bending position after bending 55a, 55b can also be bendings.In this case, bending axis turns into the center of rotation axis of the flexure operation of substrate.But It is that in this case, the curved shape of the bending position (such as bending position 55a, 55b) at two is identical.In addition, at this In the case of, the 1st point and the 2nd point is present in along on the same straight line of the substrate before the bending at place, the straight line and the 1st axis And the 2nd crossings on different level perpendicularly to the axis.In addition, substrate 50 can also be substrate 50 part or all bending and make generation The shape relative with connecting portion 35 of portion 41.In this case, above-mentioned bending process can also be replaced, and is implemented the shape of substrate 50 The shape of substrate 50 is determined as the bending operation of the shape.Specifically, substrate 50 turns into one of such as connecting portion 53 Divide or all bend and make the shape relative with connecting portion 35 of generating unit 41, but the position bent is not limited to this, Neng Goushi Work as change.

Substrate is not limited to flexible substrate.As long as the substrate in the present invention is substrate as following：It can produce Set between portion 41 and test section 35 and be detected region, the test section 35 for being located at part 2 52 can be utilized to detect by being located at the 1st Detection object caused by the generating unit 41 of part 51, and part 1 51 is integrated with part 2 52.For example, it is also possible to using By can by the processing substrate that form the raw material of process part bending or bending such as heating, to part 1 and part 2 it Between part (such as connecting portion etc.) apply the processing and make this part bending or bending so that part 1 and part 2 phase It is right.Alternatively, it is also possible to using such as rigid flexible printed circuit board with the part that is difficult to deform and the part that is easily deformed this Both substrates.In this case, by the way that the part for being difficult to deform is used as into part 1 and part 2, and will be easily deformed Part is used as the part (such as connecting portion etc.) between part 1 and part 2, and part 1 can be made relative with part 2.

Electric wiring section 54 can be omitted suitably.In addition, the extension of function is played as electric wiring section to be set Put two or more.In addition, as electric wiring section play function extension bearing of trend be it is arbitrary, will not especially by with The position relationship of the other structures of the grade of connecting portion 53 substrate 50 is limited.

The relative movement of action body and substrate 50 can be that any one is closely moved or both sides' phase to another one Mutually closely move.Specifically, the 1st component (base 22) during the assembling of sensor 31 as escribed above and the 2nd component are (main Body 21) it is close, can in the state of any one (such as main body 21) secures by make another one (such as base 22) move Moving, to carry out, the fixed relation with movement can also turn around, can also make both to move.

The signal track T1 of optical scale 11 specific pattern and the polarization layer PP1~polarization layer for being located at test section 35 PP4 pattern can be changed suitably.The pattern is by considering to be located at detected region structure (such as the optics mark to polarize Chi 11) pattern and when being detected for light by the relation of structure (such as polarization layer) pattern determine.

The structure for being located at detected region is not limited to the optical scale 11 polarized.For example, it is also possible to instead of optics Scale 11, and the tabular for being provided with the hole for optionally passing light through or penetrating according to the rotational angle of rotor 10 or breakthrough portion is set Component.In this case, the change of the rotational angle of rotor 10 is presented as detects the position of light, opportunity using test section Change.The test section can also not have polarization layer PP1~polarization layer PP4.Detected by being exported from sensor for expression The signal of the position of light, the angle position for the rotating machinery for being linked to axle 12 can be detected.In addition, in this case, test section Also there need not be four photo detectors.Such as can both have a photo detector, it is possible to have multiple photo detectors.When by When optical element is one, it is desirable to the center (light for the detection zone for being detected a photo detector to detection object The center in region) with the 2nd axis LB distance above-mentioned distance W2 is regarded as, make distance W2 equal with distance W1 on this basis. In addition, when photo detector is multiple, it is desirable to multiple detections possessed by the test section that will be made up of multiple photo detectors The configuration center in region and the 2nd axis LB distance are regarded as above-mentioned distance W2, make distance W2 and distance W1 phases on this basis Deng.

Light emitting diode is not limited to for light-emitting component possessed by sending the generating unit 41 of light.In addition, light-emitting component Both can be spot light, or area source., can be by the production of the light in area source in the case where light-emitting component is area source The center in raw region is set to the point for projecting point 41S equivalent to the light in above-mentioned embodiment, to the light by light-emitting component Outgoing plane center and the straight line that extends along the light-emitting component direction relative with photo detector provided.To can so it advise Fixed straight line is regarded as the straight line equal with the straight line L2 shown in Figure 12, and four light members are determined in the same manner as above-mentioned embodiment The respective configuration of part.That is, four respective configurations of photo detector can be determined as follows：By four photo detectors respectively with away from The mode of the straight line equidistance configures the different position in the predetermined plane with the line orthogonal, and make by Four lines that the center of the respective light area of the straight line and the intersection point of predetermined plane and four photo detectors connects Section forms right angle each other.In addition, as the point for projecting point 41S for replacing above-mentioned light, can also use in outgoing plane 41T The heart.

In addition, in the above-described embodiment, it is mounted in both part 1 51 and part 2 52 as general Face (surface 51A, 52A) provided with electronic component remain plane supporting member play function part (IC circuits 60 and Supporting substrates 65), but not necessarily both setting.Can be according to the part being located on the FPC of the substrate 50 as the present invention Configuration suitably change, can also be positioned only in one of part 1 51 and part 2 52.Alternatively, it is also possible to connect The grade of portion 53 sets supporting member.

In addition, the electromagnetic wave as detection object is not limited to the light from light emitting diode, laser.As detection object Electromagnetic wave can also be the non-visible lights such as infrared ray and ultraviolet, X ray etc..In addition, detection object can also be magnetic force. In this case, generating unit produces the magnetic field triggered by magnetic force.Test section detection is because of the change of the physical quantity in detected region (such as object by etc.) and the change of magnetic force that occurs, so as to carry out sensing detection.By making detection object be magnetic force, energy Enough changing to detect the change in detected region according to magnetic force.In addition, detection object is in addition to electromagnetic wave, magnetic force, Can be comprising the sound wave including ultrasonic wave, plasma plasma, cathode-ray (electron ray) etc..As long as detection object Because of the object to be changed being located at the change of the physical quantity of structure in detected region.

The change of physical quantity can also be triggered using the linear motion for the linear motion body for being present in detected region. In this case, can be using the linear motion for the body that moves along a straight line as the object that sensing detection is carried out by sensor.In addition, sensor energy Enough function is played as linear encoder.Specifically, by test section to because relative to part 1 51 and part 2 52 Carried out in the change for the detection object for being detected the structure (such as scale etc.) relatively to be moved along a straight line in region and occurring Detect, carry out the sensing detection for being related to the linear motion of the structure so as to play the sensor of function as linear encoder.Cause And it can be linked to encoder the presence or absence of linear motion body to detect using the present invention and acted and operating position.Separately Outside, in the case where the above-mentioned such action body of embodiment is rotary body (optical scale 11 for being arranged on the end of axle 12), Because the part near axle 12 does not enter region (detected region), therefore it is that action body is partly into region.The opposing party Face, in the case where action body is linear motion body, naturally, at least action body is partly into region.In addition, root According to can as caused by linear motion body moving range difference, it is also possible to be that action body fully enters region (such as in area Pass through inside and outside domain).In this way, as long as action body at least a portion is acted in the region between generating unit and test section Component.

In addition, the shape that the stator 20 of function is played as housing can be changed suitably.Hereinafter, reference picture 29 and figure 30, the sensor 31A for employing the stator 20A with the profile different from the example shown in Fig. 2 is illustrated.

The outward appearance that Figure 29 is the sensor 31A for employing the stator 20A with the profile different from the example shown in Fig. 2 is stood Body figure.Figure 30 is to represent the figure installed in the sensor 31A in the hole 101 of the component 100 of tabular.Stator 20A, which has, to be prolonged Extending portion 70, recess portion 80 and holding section 90.Specifically, as shown in figure 29, stator 20A extension 70 and holding section 90 across Recess portion 80 is located at opposite position.That is, extension 70 extends across recess portion 80 to the place side opposite side of holding section 90 Out.

Recess portion 80 is embedded in the hole 101 for sensor 31A installations.Specifically, recess portion 80 is for example with setting The outer peripheral face that the inner peripheral surface in the hole 101 in the component 100 for sensor 31A installations abuts.More specifically, shown in Figure 29 The outer peripheral face for the arc-shaped that inner peripheral surface of the sensor 31A recess portion 80 with the hole 101 with circle matches.The periphery of arc-shaped Face can both form complete circumference, can also be as shown in figure 29, the linearly missing of a part.

Figure 31 is the figure of an example of the cross sectional shape for representing recess portion 80 etc..In the such hole of example as shown in figure 31 101 wait, in the case that the inner peripheral surface in hole 101 draws out circular arc to be circular, if recess portion 80 along the extension side with axle 12 Correspond to the internal diameter in hole 101 to the diameter of orthogonal plane.By making recess portion 80 be embedded in hole 101, so as to sense Device 31A is fixed on the position in the plate face of component 100.The outer peripheral face in the recess portion 80 being embedded in hole 101 and the inner circumferential in hole 101 Face abuts, so as to suppress dislocation of the sensor 31A relative to component 100 on the direction of the plate face along component 100.

Holding section 90 has the external diameter bigger than the diameter in hole 101.On the other hand, extension 70 has energy through hole 101 External diameter.Therefore, extension 70 can be by hole 101, but holding section 90 can not pass through hole 101.Sensor 31A is installed on component The operating personnel in 100 hole 101 make sensor 31A be relatively moved with component 100, so that sensor 31A is from extension 70 Side access aperture 101.The relative movement is make use of, makes extension 70 recess portion 80 is embedded in hole 101, and make by hole 101 Holding section 90 abuts with component 100.By making holding section 90 be abutted with component 100, by sensor 31A being extended along axle 12 Direction is positioned at component 100.

Extension 70 has the profile cut on outer peripheral face and have externally threaded column.Specifically, extension 70 has Formed with the externally threaded outer peripheral face that spiral is drawn using the extended direction of axle 12 as central axis.Sensor 31A is pacified The operating personnel in the hole 101 loaded on component 100 make nut 110 of the insertion provided with internal thread hole prolong with what is extended out from hole 101 The screw thread of extending portion 70 coordinates.Nut 110 is using the external diameter structure bigger than the diameter in hole 101.Thus, nut 110 and holding section 90 every The ground clamping components 100 of recess portion 80, sensor 31A is fixed on component 100.

On the extended direction of axle 12, make the width in recess portion 80 than the narrow width of component 100, so as to extend The external screw thread in portion 70 is attached to the inner side in hole 101.Thus, the clamping of nut 110 and holding section 90 to component 100 can be made more may be used Lean on, therefore sensor 31A more reliably can be fixed on component 100.

Holding section 90 has abutting part 91, the abutting part 91 and the rotation stop being located on the component 100 for sensor 31A installations Portion 95 abuts.Specifically, such as shown in Figure 29~Figure 31, rotation prevention portion 95 is located at and is mounted with sensor 31A's in hole 101 The face by the side of holding section 90 of the component 100 of tabular.Rotation prevention portion 95 is, for example, the component 100 of rectangular-shape, is fixed on tabular On component 100.Abutting part 91 is for example arranged to by the way that a part for columned outer peripheral face possessed by holding section 90 is cut off Obtained from planar portions, to be abutted with rotation prevention portion 95.Abutting part 91 is located at the position different from the extended position of electric wiring section 54 Put.Specifically, abutting part 91 is for example provided on the lid 23 of the opposite side of the extended position of electric wiring section 54.

When coordinating nut 110 and the screw thread of extension 70, torque is delivered to extension 70, but by make rotation prevention portion 95 with Abutting part 91 abuts, and on the direction of rotation of the torque, rotation prevention portion 95 is locking by sensor 31A.Thereby, it is possible to suppress sensor 31A is rotated in linkage because the screw thread of nut 110 coordinates.In addition, the abutting scope of abutting part 91 and rotation prevention portion 95 is not limited to It is plane, can suitably it change.As long as it can utilize the abutting of abutting part 91 and rotation prevention portion 95 that stator 20A is locking so as to suppressing The rotary motion coordinated with screw thread.

As described above, stator 20A has recess portion 80, holding section 90 and extension 70, extension 70 has in periphery Cutting has the profile of externally threaded column on face, and external diameter is the diameter for being capable of through hole 101, so as to more easily Used the sensor 31A of the screw thread mating parts of the grade of nut 110 installation.

In addition, have what the inner peripheral surface with the hole 101 of circle abutted in hole 101 for circular hole 101 and recess portion 80 In the case of the outer peripheral face of arc-shaped, by setting the abutting part 91 abutted with rotation prevention portion 95 in holding section 90, it can suppress to pass Sensor 31A is rotated in linkage because the screw thread of nut 110 coordinates.Thus, the sensor carried out is coordinated by the screw thread of nut 110 31A fixation is more prone to carry out.

Description of reference numerals

2nd, optical encoders, angle sensors；3rd, arithmetic unit；5th, control unit；10th, rotor；11st, optical scale；12nd, axle；20、20A、 Stator；21st, main body；22nd, base；23rd, cover；31st, 31A, sensor；35th, test section；41st, generating unit；50th, substrate；51st, the 1st Point；52nd, part 2；53rd, connecting portion；54th, electric wiring section；60th, IC circuits；65th, supporting substrates；70th, extension；80th, recess Portion；90th, holding section；91st, abutting part；95th, rotation prevention portion；100th, component；101st, hole.

Claims (10)

1. a kind of manufacture method of sensor, the sensor includes being used to produce the generating unit of predetermined detection object, for examining Survey the test section of the detection object and the area between the generating unit and the test section as caused by the generating unit The action body acted in domain, wherein,

By making substrate bending or bending make the generating unit relative with the test section, the substrate is provided with the generation The part 1 in portion with provided with the test section part 2 be it is integral,

The substrate is set to be moved with described in a manner of the action body enters the region between the generating unit and the test section Relatively moved as body.

2. the manufacture method of sensor according to claim 1, wherein,

The substrate has the connecting portion for connecting the part 1 and the part 2,

Make the substrate and the action body in a manner of the action body enters the region from the opposite side of the connecting portion Relatively moved.

3. the manufacture method of sensor according to claim 1 or 2, wherein,

The part 1 after the bending or bending of the substrate with the part 2 be it is parallel,

The relative movement direction of the substrate and the action body is along the part 1 and the part 2.

4. according to the manufacture method of sensor according to any one of claims 1 to 3, wherein,

The action body is the discoid component for supporting to rotate by axle,

Breach is provided with least one of the part 1 and the part 2, the breach is used to enter in the action body In the state of entering into the region between the generating unit and the test section, the axle is set not contacted with the substrate.

5. according to the manufacture method of sensor according to any one of claims 1 to 4, wherein,

The substrate is installed to a component in the multiple components for forming housing i.e. on the 1st component,

Pass through a component for making to be used as in the multiple components for forming the housing and the 2nd component for supporting the action body It is close with the 1st component, the assembling of the housing is carried out, and so that the action body enters the generating unit and the inspection The mode in the region between survey portion makes the substrate be relatively moved with the action body.

6. the manufacture method of sensor according to claim 5, wherein,

After the 1st component and the 2nd component are assemblied together, covering the 2nd component using The lid component is had For the substrate enter inlet port.

7. a kind of sensor, wherein,

The sensor includes：

Generating unit, it is used to produce predetermined detection object；

Test section, it is used to detect the detection object as caused by the generating unit；

Substrate, the generating unit and the test section are located at the substrate；

Action body, it is acted in region between the generating unit and the test section；And

Housing, it is used to store the generating unit, the test section and the action body,

The part 1 provided with the generating unit of the substrate and the part 2 provided with the test section are integral, and institute Stating substrate has the shape of the generating unit bending relative with the test section or bending, and the substrate, which is arranged on, makes described move As the position that body is present in the region between the generating unit and the test section,

The housing has the 1st component for substrate installation and the 2nd component for action body setting.

8. sensor according to claim 7, wherein,

The housing has The lid component,

The The lid component will cover located at the inlet port entered for the substrate of the 2nd component.

9. the sensor according to claim 7 or 8, wherein,

The housing has：

Recess portion, it is embedded into the hole of the component provided with the hole for sensor installation；

Holding section, its external diameter are more than the diameter in the hole；And

Extension, it extends out across the recess portion to the opposite side of the holding section,

The extension has the profile cut on outer peripheral face and have externally threaded column, and external diameter is can to run through the hole Diameter.

10. sensor according to claim 9, wherein,

The hole is circular hole,

The recess portion has the outer peripheral face of the arc-shaped abutted with the inner peripheral surface in the circular hole,

The holding section has the abutting part abutted with located at the rotation prevention portion of the component.