CN107846781B - Manufacturing method of ultrathin easy-to-break circuit board - Google Patents
Manufacturing method of ultrathin easy-to-break circuit board Download PDFInfo
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- CN107846781B CN107846781B CN201711182804.8A CN201711182804A CN107846781B CN 107846781 B CN107846781 B CN 107846781B CN 201711182804 A CN201711182804 A CN 201711182804A CN 107846781 B CN107846781 B CN 107846781B
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- circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a manufacturing method of an ultrathin easy-to-break circuit board, which comprises the steps of S1, cutting and baking a board; step S2, preparing a circuit layer; step S3, preparing a target hole pattern; step S4, circuit layer lamination; and step S5, manufacturing a secondary circuit layer. The invention improves the toughness of the ultrathin easy-to-break circuit board by preparing the circuit on the two sides of the circuit board, reduces the cost of auxiliary tools generated in the manufacturing process, reduces the production cost and improves the quality yield of the ultrathin easy-to-break circuit board.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a manufacturing method of an ultrathin easy-to-break circuit board.
Background
In the prior art, the ultrathin easy-to-break circuit board is manufactured by mainly adopting two modes of processing a tool clamp and enlarging an auxiliary edge. The adoption of the tooling fixture increases the manufacturing cost and the manufacturing difficulty, and the batch production amount is determined according to the number of the fixtures in the manufacturing process, which is not beneficial to the manufacturing of large-batch ultrathin easy-to-break circuit boards. By adopting the mode of enlarging the auxiliary edge, the technical edge of the plate is windowed, the windowing is formed on the inner side of the outer edge of the plate, the protective copper in the graphic area of the plate is separated from the protective copper in the plate area, the protective copper in the plate edge area is larger, the waste of the plate is caused, and the cost is increased. The ultrathin easy-to-break circuit is easy to cause the scrapping of folded plates in the conventional processing procedure through the processes of high-pressure water washing and the like, so that the yield is low.
Disclosure of Invention
The invention aims to provide a manufacturing method of an ultrathin easy-to-break circuit board, which improves the toughness of the ultrathin easy-to-break circuit board by preparing circuits on two sides of the circuit board, reduces the cost of auxiliary tools generated in the manufacturing process, reduces the production cost and improves the quality yield of the ultrathin easy-to-break circuit board.
The invention can be realized by the following technical scheme:
the invention discloses a manufacturing method of an ultrathin easy-to-break circuit board, which comprises the following steps:
step S1, cutting and baking the board: cutting and baking the substrate according to the specification and size of the product to obtain a circuit board substrate; the internal stress of the circuit board substrate can be eliminated after the circuit board substrate is baked, and the phenomenon that the substrate expands and contracts in an overlarge range due to the action of the internal stress can be avoided in the subsequent lamination processing process;
step S2, first circuit layer fabrication: the circuit board substrate is divided into a circuit board substrate A surface and a circuit board substrate B surface, the circuit layer is etched on the surface of the circuit board substrate A surface, and an anti-corrosion layer is prepared on the surface of the circuit board substrate B surface; firstly, the circuit layer is made on one side, so that the risk that the circuit board substrate is easily bent and broken due to too thin circuit board substrate and too small copper coating amount after etching is avoided; in addition, the pattern on the B surface of the circuit board substrate is aligned and etched according to the alignment target pattern made on the A surface of the circuit board substrate, so that the alignment degree of the alignment patterns of the A surface of the circuit board substrate and the B surface of the circuit board substrate is improved;
step S3, target hole pattern preparation: manufacturing a pressing target hole pattern and an alignment target hole pattern on the surface A of the circuit board substrate; the pressing target hole pattern manufactured on the A surface of the circuit board substrate is a target hole aligned with the line surface in pressing so as to avoid the situation of line surface deviation in the pressing process, and in addition, the alignment degree of the alignment patterns of the A surface of the circuit board substrate and the B surface of the circuit board substrate is improved through the alignment target hole;
step S4, circuit layer lamination: pressing the circuit surfaces of the A surfaces of the circuit board substrates together, and punching the alignment target holes and the pressing target holes which are manufactured in the step S3 of the primary circuit layer by using a target hole machine after pressing; punching by a target hole machine to form an alignment target hole and a pressing target hole, wherein punching by adopting a punching mode can ensure that the alignment target hole and the pressing target hole are complete in shape and etched lines cannot be influenced;
step S5, manufacturing a secondary circuit layer: and (5) according to the alignment target holes punched in the step (S4), measuring the expansion and contraction of the circuit board substrate, and manufacturing a circuit pattern on the B surface of the circuit board substrate according to the alignment target holes. By aligning the alignment target holes, the circuit pattern on the circuit board substrate A is ensured to be highly aligned with the circuit pattern on the circuit board substrate B, and the pattern deviation is avoided when the circuit on the circuit board substrate B is etched.
Further, the number of the alignment target hole patterns prepared in the step S3 is at least 4. The number of counterpoint target position sets up according to the number of piles on circuit layer, guarantees that each layer circuit layer can accurate counterpoint.
Still further, in step S4, before punching out the alignment target hole and the press target hole by using a target hole punching machine, a hard plate is placed under the circuit board substrate. Because the circuit board substrate is too thin, if the hard board is not padded, the circuit board substrate is easy to crack if the target hole machine is used for punching directly, and the pressure generated when the target hole machine punches the hole can be effectively buffered by the hard board padding, so that the circuit board substrate is protected.
Still further, the hard plate thickness is greater than 1.0 mm. And the thickness of the hard plate is less than 1.0mm, so that the effective buffering effect cannot be achieved.
The manufacturing method of the ultrathin easy-to-break circuit board has the following beneficial effects:
firstly, the toughness of the ultrathin easy-to-break circuit board is improved. According to the invention, the inner layer circuit is manufactured on the A surface of the circuit board substrate and the B surface of the circuit board substrate respectively, the corrosion resistant layer on the B surface of the circuit board substrate is synchronously made when the circuit surface on the A surface of the circuit board substrate is etched, and the circuit diagram on the B surface of the circuit board substrate is manufactured according to the alignment target hole reserved on the A surface of the circuit board substrate after one-time circuit lamination, so that the toughness of the ultrathin easy-to-break circuit board is improved.
And secondly, the cost of auxiliary tools generated in the manufacturing process is reduced. The traditional processing method of the ultrathin easy-to-break circuit board needs a tool fixture for fixing, increases the manufacturing cost and the manufacturing difficulty, determines the production condition according to the quantity of the fixture in the manufacturing engineering, and is not beneficial to the manufacturing of large-batch ultrathin easy-to-break circuit boards.
Thirdly, the production cost is reduced and the quality and the yield of the ultrathin easy-to-break circuit board are improved. The traditional processing method enlarges the auxiliary edge of the circuit board substrate, forms a window opening at the inner side of the outer edge of the circuit board substrate, separates the protection copper in the pattern area of the circuit board substrate from the protection copper in the board edge area, and the protection copper in the board edge area is large, thereby causing material waste and improving the production cost. According to the invention, through twice inner layer circuit manufacturing, the toughness of the ultrathin easy-to-break circuit board is improved, the processability of the ultrathin easy-to-break circuit board is improved, auxiliary edges are not required to be arranged, the conditions of plate breaking, plate folding and the like are not easy to occur in the processing process, the loss of materials is reduced, the quality yield of products is improved, and the production cost is reduced.
Detailed Description
In order to make the technical solution of the present invention better understood by those skilled in the art, the following provides a detailed description of the product of the present invention with reference to the examples.
Example 1
The manufacturing method of the ultrathin easy-to-break circuit board comprises the following manufacturing steps:
step S1, cutting and baking the board: cutting the circuit board according to the specification and size of the product, and baking for 40 minutes at 120 ℃ to obtain a circuit board substrate;
step S2, first circuit layer fabrication: the circuit board substrate is divided into a circuit board substrate A surface and a circuit board substrate B surface, the circuit layer is etched on the surface of the circuit board substrate A surface, and an anti-corrosion layer is prepared on the surface of the circuit board substrate B surface;
step S3, target hole pattern preparation: manufacturing a pressing target hole pattern and an alignment target hole pattern on the surface A of the circuit board substrate, and manufacturing 8 alignment target hole patterns on the surface A of the circuit board substrate according to the number of layers to be laminated on the surface A of the circuit board substrate, wherein the number of layers is 4;
step S4, circuit layer lamination: pressing the circuit surfaces of the A surfaces of the circuit board substrates together, stacking a hard plate with the thickness of 2mm on the bottom of the circuit board substrate after pressing, and punching alignment target holes and pressing target holes by using a target hole machine;
step S5, manufacturing a secondary circuit layer: and (5) according to the alignment target holes punched in the step (S4), measuring the expansion and contraction of the circuit board substrate, and manufacturing a circuit pattern on the B surface of the circuit board substrate according to the alignment target holes.
The subsequent steps are conventional processing steps, and the ultrathin easy-to-break circuit board is obtained.
Example 2
The manufacturing method of the ultrathin easy-to-break circuit board comprises the following manufacturing steps:
step S1, cutting and baking the board: cutting the circuit board according to the specification and size of the product, and baking for 60 minutes at 110 ℃ to obtain a circuit board substrate;
step S2, first circuit layer fabrication: the circuit board substrate is divided into a circuit board substrate A surface and a circuit board substrate B surface, the circuit layer is etched on the surface of the circuit board substrate A surface, and an anti-corrosion layer is prepared on the surface of the circuit board substrate B surface;
step S3, target hole pattern preparation: manufacturing a pressing target hole pattern and an alignment target hole pattern on the surface A of the circuit board substrate, and manufacturing 12 alignment target hole patterns on the surface A of the circuit board substrate according to the number of layers to be laminated on the surface A of the circuit board substrate, wherein 6 layers are required;
step S4, circuit layer lamination: pressing the circuit surfaces of the A surfaces of the circuit board substrates together, stacking a hard board with the thickness of 1mm on the bottom of the circuit board substrate after pressing, and punching alignment target holes and pressing target holes by using a target hole machine;
step S5, manufacturing a secondary circuit layer: and (5) according to the alignment target holes punched in the step (S4), measuring the expansion and contraction of the circuit board substrate, and manufacturing a circuit pattern on the B surface of the circuit board substrate according to the alignment target holes.
The subsequent steps are conventional processing steps, and the ultrathin easy-to-break circuit board is obtained.
Example 3
The manufacturing method of the ultrathin easy-to-break circuit board comprises the following manufacturing steps:
step S1, cutting and baking the board: cutting the circuit board according to the specification and size of the product, and baking for 40 minutes at 130 ℃ to obtain a circuit board substrate;
step S2, first circuit layer fabrication: the circuit board substrate is divided into a circuit board substrate A surface and a circuit board substrate B surface, the circuit layer is etched on the surface of the circuit board substrate A surface, and an anti-corrosion layer is prepared on the surface of the circuit board substrate B surface;
step S3, target hole pattern preparation: manufacturing a pressing target hole pattern and an alignment target hole pattern on the surface A of the circuit board substrate, and manufacturing 4 alignment target hole patterns on the surface A of the circuit board substrate according to the number of layers to be laminated on the surface A of the circuit board substrate, wherein the number of layers is 2;
step S4, circuit layer lamination: pressing the circuit surfaces of the A surfaces of the circuit board substrates together, stacking a hard plate with the thickness of 3mm on the bottom of the circuit board substrate after pressing, and punching alignment target holes and pressing target holes by using a target hole machine;
step S5, manufacturing a secondary circuit layer: and (5) according to the alignment target holes punched in the step (S4), measuring the expansion and contraction of the circuit board substrate, and manufacturing a circuit pattern on the B surface of the circuit board substrate according to the alignment target holes.
The subsequent steps are conventional processing steps, and the ultrathin easy-to-break circuit board is obtained.
The foregoing is merely a preferred embodiment of the invention and is not intended to limit the invention in any manner; those of ordinary skill in the art can readily implement the present invention as described herein and as illustrated above; however, those skilled in the art should appreciate that they can readily use the disclosed conception and specific embodiments as a basis for designing or modifying other structures for carrying out the same purposes of the present invention; meanwhile, any changes, modifications, and evolutions of the equivalent changes of the above embodiments according to the actual techniques of the present invention are still within the protection scope of the technical solution of the present invention.
Claims (3)
1. A manufacturing method of an ultrathin easy-to-break circuit board is characterized by comprising the following steps: the manufacturing method comprises the following steps:
step S1, cutting and baking the board: cutting and baking the substrate according to the specification and size of the product to obtain a circuit board substrate;
step S2, first circuit layer fabrication: the circuit board substrate is divided into a circuit board substrate A surface and a circuit board substrate B surface, the circuit layer is etched on the surface of the circuit board substrate A surface, and an anti-corrosion layer is prepared on the surface of the circuit board substrate B surface;
step S3, target hole pattern preparation: manufacturing a pressing target hole pattern and an alignment target hole pattern on the surface A of the circuit board substrate;
step S4, circuit layer lamination: pressing the circuit surfaces of the A surfaces of the circuit board substrates together, and punching the alignment target holes and the pressing target holes which are manufactured in the step S3 of the primary circuit layer by using a target hole machine after pressing;
step S5, manufacturing a secondary circuit layer: according to the alignment target holes punched in the step S4, measuring the expansion and contraction of the circuit board substrate, and manufacturing a circuit pattern on the B surface of the circuit board substrate according to the alignment target holes;
and step S4, before punching the alignment target hole and the press target hole by using a target hole punching machine, a hard board is padded under the circuit board substrate.
2. The manufacturing method of the ultrathin easy-to-break circuit board as claimed in claim 1, wherein the manufacturing method comprises the following steps: the number of the alignment target hole patterns prepared in the step S3 is at least 4.
3. The manufacturing method of the ultrathin easy-to-break circuit board as claimed in claim 1, wherein the manufacturing method comprises the following steps: the thickness of the hard board is more than 1.0 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711182804.8A CN107846781B (en) | 2017-11-23 | 2017-11-23 | Manufacturing method of ultrathin easy-to-break circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711182804.8A CN107846781B (en) | 2017-11-23 | 2017-11-23 | Manufacturing method of ultrathin easy-to-break circuit board |
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| Publication Number | Publication Date |
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| CN107846781A CN107846781A (en) | 2018-03-27 |
| CN107846781B true CN107846781B (en) | 2020-09-25 |
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| CN201711182804.8A Active CN107846781B (en) | 2017-11-23 | 2017-11-23 | Manufacturing method of ultrathin easy-to-break circuit board |
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Citations (5)
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|---|---|---|---|---|
| CN102170745A (en) * | 2010-02-26 | 2011-08-31 | 日本特殊陶业株式会社 | Multilayered wiring board and method of manufacturing the same |
| CN102497749A (en) * | 2011-12-16 | 2012-06-13 | 东莞生益电子有限公司 | Method for embedding capacitor into PCB (printed circuit board) multilayer board |
| CN103140050A (en) * | 2011-12-05 | 2013-06-05 | 深南电路有限公司 | Machining method of burying capacitance circuit board |
| CN104270889A (en) * | 2014-09-28 | 2015-01-07 | 广州兴森快捷电路科技有限公司 | Local high-precision printed circuit board and manufacturing method thereof |
| CN104349613A (en) * | 2013-08-08 | 2015-02-11 | 北大方正集团有限公司 | PCB (Printed Circuit Board) and manufacturing method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100867889B1 (en) * | 2007-03-30 | 2008-11-10 | 주식회사 뉴프렉스 | Method for forming embedded capacitor in flexible printed circuit board |
-
2017
- 2017-11-23 CN CN201711182804.8A patent/CN107846781B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102170745A (en) * | 2010-02-26 | 2011-08-31 | 日本特殊陶业株式会社 | Multilayered wiring board and method of manufacturing the same |
| CN103140050A (en) * | 2011-12-05 | 2013-06-05 | 深南电路有限公司 | Machining method of burying capacitance circuit board |
| CN102497749A (en) * | 2011-12-16 | 2012-06-13 | 东莞生益电子有限公司 | Method for embedding capacitor into PCB (printed circuit board) multilayer board |
| CN104349613A (en) * | 2013-08-08 | 2015-02-11 | 北大方正集团有限公司 | PCB (Printed Circuit Board) and manufacturing method thereof |
| CN104270889A (en) * | 2014-09-28 | 2015-01-07 | 广州兴森快捷电路科技有限公司 | Local high-precision printed circuit board and manufacturing method thereof |
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| CN107846781A (en) | 2018-03-27 |
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