CN107834624A - Intelligent charging frame charge information remote comprehensive manages module - Google Patents
Intelligent charging frame charge information remote comprehensive manages module Download PDFInfo
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- CN107834624A CN107834624A CN201710990382.0A CN201710990382A CN107834624A CN 107834624 A CN107834624 A CN 107834624A CN 201710990382 A CN201710990382 A CN 201710990382A CN 107834624 A CN107834624 A CN 107834624A
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Abstract
The present invention relates to the Added Management module on Intelligent charging frame, specially Intelligent charging frame charge information remote comprehensive management module.Intelligent charging frame charge information remote comprehensive manages module, including power supply circuit, liquid crystal driver module circuit, infrared receiver terminal circuit, electromagnetism lock control circuit, program burn writing circuit, voice module circuit, RS485 communicating circuits and data acquisition circuit.Present invention uses the 32 of 144 pin single-chip microcomputer STM32F103_144, substantially increase the speed of service, many peripheral hardwares can also be driven simultaneously, using the 5th interface module P5 drivings liquid crystal display, utilize chip U2 drive the speakers, also it is connected using chip U1 and data transmission interface P1 with transceiver boards, the data collected are transferred to host computer by transceiver boards again.This module is fused to multiple modules on one circuit board, the failure easily occurred on circuit-line before solving, and cost greatly reduces;Installation procedure is easy, so as to reduce cost of labor.
Description
Technical field
The present invention relates to the Added Management module on Intelligent charging frame, specially Intelligent charging frame charge information remote comprehensive
Manage module.
Background technology
Safety of Coal Mine Production is concerning economic development and social stability, concerning people's life's safety and property safety.Coal
Charcoal industry is Frequent Accidents industry, is the major fields of safety in production.For a long time, leaders pay much attention to colliery peace
Full production work, constantly strengthens Coal Mine Safety Supervision, carries out colliery basic management activity, while from team foundation, financial resources guarantee
Etc. increase to the input of safety manufacture supervising.Mine lamp is the indispensable mine lighting instrument of coal miner, the security of mine lamp
Management and safe coal production and can be used closely bound up.But the information system management of mine lamp is also very weak.In order to adapt to colliery
The needs of modernization construction, improve lithium cell mine lamp charging performance, realize the information system management of mine lamp, existing collection charging rack pipe
Reason, miner's lamp management and attendance management are in the Intelligent charging management system of one.And cover on Intelligent charging management system charging rack
Polylith circuit, data acquisition circuit, electromagnetism lock control circuit, also electromagnetic lock coil, liquid crystal display circuit, cause circuit board more,
Line is complicated, and the node of connection is more, easily breaks down.
The content of the invention
Cover polylith circuit for current charging rack, cause that circuit board is more, line is complicated, asking of easily breaking down
Topic, the problem of can only using wired charging mine lamp also directed to current charging rack, there is provided Intelligent charging frame charge information is long-range
Integrated management module.
The present invention adopts the following technical scheme that realization:Intelligent charging frame charge information remote comprehensive manages module,
Including power supply circuit, liquid crystal driver module circuit, infrared receiver terminal circuit, electromagnetism lock control circuit, program burn writing circuit, voice
Modular circuit, RS485 communicating circuits and data acquisition circuit;
Wherein power supply circuit includes the 3rd interface module P3, the 3rd interface module P3 10 pins access direct current VCC, 10 pipes
Pin is grounded by the 7th resistance R7 being sequentially connected and the 8th resistance R8, and the 8th resistance R8 both ends are parallel with the 18th electric capacity C18,
11 pins access direct current VCC1, and 11 pins are grounded by the 9th resistance R9 being sequentially connected and the tenth resistance R10, the tenth resistance
R10 both ends are parallel with the 19th electric capacity C19, and 12 pins access direct current VCC2, and 12 pins are electric by the be sequentially connected the 11st
R11 and the 12nd resistance R12 ground connection is hindered, the 12nd resistance R12 both ends are parallel with the 20th electric capacity C20;
Liquid crystal driver module circuit includes model YEJIN28 the 5th interface module P5, and the 5th interface module P5 5 pins connect
Ground, 6 pins meet direct current VCC, and 11 pins meet direct current VCC by the 20th resistance R20, also pass through the 21st resistance R21
Ground connection, 16 pins meet direct current VCC, are also grounded by the 14th electric capacity C14, and 32 pins and the connection of 33 pins, 32 pins also connect
Direct current VCC is met, is also grounded by the 15th electric capacity C15,34 pins ground connection;
Infrared receiver terminal circuit includes infrared receiving module P2, and infrared receiving module P2 VCC pins meet direct current VCC, also logical
Cross the 6th resistance R6 to connect with VOUT pins, GND pins ground connection;
Electromagnetism lock control circuit includes model RC522 chip U3, chip U3 1 pin ground connection, 2 pins, 3 pins, 12 pipes
Pin, 15 pins and 32 pins meet direct current VCC, and 4 pins and 5 pins ground connection, 6 pins meet direct current VCC by 3rd resistor R3,
10 pins are grounded, and 14 pins ground connection, 16 pins are grounded by the second electric capacity C2, and 16 pins are connected by the 4th resistance R4 and 17 pins
Connect, 17 pins are connected by the 5th resistance R5 and the 5th electric capacity C5 one end, and 11 pins pass through the first inductance L1 and the 7th electric capacity
C7 one end connection, the 7th electric capacity C7 other end ground connection, 11 pins are connected by the first inductance L1 and the 6th electric capacity C6 one end
Connect, the 6th electric capacity C6 other end is grounded by the tenth electric capacity C10, is also grounded by the 3rd inductance L3, the 5th electric capacity C5's is another
One end is connected with the 6th electric capacity C6 other end, and 13 pins are connected by the second inductance L2 and the 8th electric capacity C8 one end, and the 8th
Electric capacity C8 other end ground connection, 13 pins are also connected by the second inductance L2 and the 9th electric capacity C9 one end, and the 9th electric capacity C9 is another
End is grounded by the 11st electric capacity C11, is also grounded by the 4th inductance L4,18 pins ground connection, is connected between 21 pins and 22 pins
The first crystal-vibration-chip Y1 is connected to, 21 pins are grounded by the 4th electric capacity C4, and 22 pins are grounded by the 3rd electric capacity C3;
Program burn writing circuit includes model JTAG program burn writing module P4, and program burn writing module P4 1 pin, 2 pins connect
Direct current VCC, 3 pins meet direct current VCC by the 17th resistance R17, and 5 pins connect direct current by the 16th resistance R16
VCC, 7 pins meet direct current VCC by the 15th resistance R15, and 13 pins connect direct current VCC, 9 pipes by the 14th resistance R14
Pin is grounded by the 19th resistance R19, and 11 pins are connected by the 18th resistance R18 and 9 pins, 4 pins, 6 pins, 8 pins,
10 pins, 12 pins, 14 pins, 16 pins, 18 pins and 20 pins ground connection;
Voice module circuit includes model SC8035 electronic lock master chip U2, and electronic lock master chip U2 1 pin passes through
One electric capacity C1 is grounded, and 2 pins and 3 pins connect with loudspeaker LS, and 4 pins connect direct current VCC, 5 pins ground connection;
RS485 communicating circuits include model SP3485 chip U1, and chip U1 2 pins and the connection of 3 pins, 5 pins are grounded,
6 pins are grounded by second resistance R2, and 7 pins meet direct current VCC by first resistor R1, and 6 pins, 7 pins also pass with data
Defeated interface P1 connections, 8 pins meet direct current VCC;
Data acquisition circuit includes model STM32F103_144 master chip U4, master chip U4 8 pins and 9 pins and
Two crystal-vibration-chip Y2 both ends are connected, and 8 pins are also grounded by the 16th electric capacity C16, and 9 pins are grounded by the 17th electric capacity C17, and 16
Pin ground connection, 25 pins meet direct current VCC by the 13rd resistance, are also grounded by the 21st electric capacity C21,25 pins and core
The 15 pins connection of piece U3 6 pins, the 5th interface module P5 31 pins, the 4th interface module P4,26 pins connect the 18th
Electric capacity C18,27 pins meet the 19th electric capacity C19, and 28 pins meet the 20th electric capacity C20, and 30 pins, 31 pins are grounded, 32 pins,
33 pins meet direct current VCC, and 36 pins connect with chip U1 4 pins, and 37 pins connect with chip U1 1 pin, 38 pins
Ground connection, 39 pins meet direct current VCC, and 40 pins connect to be connected with chip U3 24 pins, and 41 pins and chip U3 29 pins connect
Connect, 42 pins connect with chip U3 31 pins, and 43 pins connect with chip U3 30 pins, and 46 pins pass through the 26th
Resistance R26 connects with triode Q1 base stage, and triode Q1 grounded emitter, colelctor electrode passes through the 22nd resistance respectively
R22, the 23rd resistance R23, the 24th resistance R24 and the 25th resistance R25 and the 5th interface module P5 17 pins,
18 pins, 19 pins and the connection of 20 pins, 47 pins and the 3rd interface module P3 9 pins connection, 48 pins and the 3rd interface
Module P3 15 pins connection, 49 pins connect with electronic lock master chip U2 6 pins, 50 pins and electronic lock master chip U2's
7 pins connect, and 51 pins ground connection, 52 pins meet direct current VCC, and 53 pins connect to be connected with electronic lock master chip U2 8 pins, and 54
Pin and the 3rd interface module P3 14 pins connect, 56 pins and the 5th interface module P5 8 pins connection, 57 pins and the
Three interface module P3 13 pins connection, 58 pins, 59 pins and 60 pins 22 pins with the 5th interface module P5,35 respectively
Pin and 36 pins connection, 63 pins, 64 pins, 65 house keepers, 66 pins, 67 pins, 68 pins respectively with the 5th interface module
P5 37 pins, 23 pins, 24 pins, 25 pins, 26 pins and the connection of 27 pins, 71 pins ground connection, 72 pins connect direct current
VCC, 77 pins, 78 pins and 79 pins connect with the 5th interface module P5 28 pins, 29 pins and 30 pins respectively, 83 pipes
Pin is grounded, and 84 pins connect direct current VCC, 85 pins and the 5th interface module P5 1 pin connection, 86 pins and the 5th interface mould
Block P5 2 pins connection, 1 pin with the 3rd interface module P3,2 are managed respectively for 89 pins, 90 pins, 91 pins and 92 pins
Pin, 3 pins and the connection of 4 pins, 94 pins ground connection, 95 pins connect direct current VCC, 98 pins, 99 pins, 100 pins and 101 pipes
Pin connects the 3rd interface module P3 5 pins, 6 pins, 7 pins and 8 pins respectively, and 102 pins connect infrared receiving module P2's
VOUT pins, 105 pins connect the 4th interface module P4 7 pins, 107 pins ground connection, and 108 pins connect direct current VCC, 109 pipes
Pin connects the 4th interface module P4 9 pins, and 110 pins connect the 4th interface module P4 5 pins, 114 pins and 115 pins difference
Connect the 5th interface module P5 3 pins and 4 pins, 118 pins and 119 pins connect respectively the 5th interface module P5 10 pins and
9 pins, 120 pins ground connection, 121 pins meet direct current VCC, 122 pins ground connection, and 123 pins connect chip U1 2 pins, 127 pipes
Pin connects the 5th interface module P5 7 pins, 130 pins ground connection, and 131 pins meet direct current VCC, and 133 pins connect the 4th interface mould
Block P4 13 pins, 134 pins connect the 4th interface module P4 3 pins, 143 pins ground connection, and 144 pins meet direct current VCC.
Present invention uses the 32 of 144 pin single-chip microcomputer STM32F103_144, the speed of service is substantially increased, can be with
Many peripheral hardwares are driven simultaneously, liquid crystal display is driven, using chip U2 drive the speakers using the 5th interface module P5, also utilizes chip
U1 and data transmission interface P1 are connected with transceiver boards, and the data collected are transferred to host computer by transceiver boards again.Existing charging
Frame can only use wired charging, and this circuit can match wired charging circuit, can also match wireless charging circuit use, wirelessly
The charge data of charging is received and dispatched by the infrared signal emitter on wireless mine lamp and infrared receiving module P2, there is micro USB
After the data that electricity collects are by single-chip microcomputer processing in Charge Management module on charging rack, by infrared signal emitter and red
Outer receiving module P2 is received and dispatched.This module is powerful:Charge data collection, the data collected are sent to host computer etc..
Multiple modules are fused on a circuit board, the failure easily occurred on circuit-line before solving, and cost is significantly
Reduce;Installation procedure is easy, so as to reduce cost of labor.
Have the advantage that compared with prior art:
1. this circuit level is high, connecting node is effectively reduced, fault rate declines.
2. compared with traditional charging rack, the data that the module collects are transmitted directly to transceiver boards, are passed by Ethernet
Host computer is defeated by, the data compared to the database of former charging rack circuit collection are reduced, and the speed of service greatly improves.
3rd, install convenient, maintenance is easy, so as to reduce cost of labor.
Brief description of the drawings
Fig. 1 is the circuit theory diagrams of power supply circuit.
Fig. 2 is the circuit theory diagrams of liquid crystal driver module circuit.
Fig. 3 is the circuit theory diagrams of infrared receiver terminal circuit.
Fig. 4 is the circuit theory diagrams of electromagnetism lock control circuit.
Fig. 5 is the circuit theory diagrams of program burn writing circuit.
Fig. 6 is the circuit theory diagrams of voice module circuit.
Fig. 7 is the circuit theory diagrams of RS485 communicating circuits.
Fig. 8 is the circuit theory diagrams of data acquisition circuit.
Embodiment
Intelligent charging frame charge information remote comprehensive manages module, including power supply circuit, liquid crystal driver module circuit, infrared
Receiving terminal circuit, electromagnetism lock control circuit, program burn writing circuit, voice module circuit, RS485 communicating circuits and data acquisition electricity
Road;
Wherein power supply circuit includes the 3rd interface module P3, the 3rd interface module P3 10 pins access direct current VCC, 10 pipes
Pin is grounded by the 7th resistance R7 being sequentially connected and the 8th resistance R8, and the 8th resistance R8 both ends are parallel with the 18th electric capacity C18,
11 pins access direct current VCC1, VCC1 magnitude of voltage is 5V, and 11 pins pass through the 9th resistance R9 being sequentially connected and the tenth resistance
R10 is grounded, and the tenth resistance R10 both ends are parallel with the 19th electric capacity C19, and 12 pins access direct current VCC2, VCC2 magnitude of voltage is
12V, 12 pins are grounded by the 11st resistance R11 being sequentially connected and the 12nd resistance R12, and the 12nd resistance R12 both ends are simultaneously
It is associated with the 20th electric capacity C20;
Liquid crystal driver module circuit includes model YEJIN28 the 5th interface module P5, and the 5th interface module P5 5 pins connect
Ground, 6 pins meet direct current VCC, and 11 pins meet direct current VCC by the 20th resistance R20, also pass through the 21st resistance R21
Ground connection, 16 pins meet direct current VCC, are also grounded by the 14th electric capacity C14, and 32 pins and the connection of 33 pins, 32 pins also connect
Direct current VCC is met, is also grounded by the 15th electric capacity C15,34 pins ground connection;
Infrared receiver terminal circuit includes infrared receiving module P2, and infrared receiving module P2 VCC pins meet direct current VCC, also logical
Cross the 6th resistance R6 to connect with VOUT pins, GND pins ground connection;
Electromagnetism lock control circuit includes model RC522 chip U3, chip U3 1 pin ground connection, 2 pins, 3 pins, 12 pipes
Pin, 15 pins and 32 pins meet direct current VCC, and 4 pins and 5 pins ground connection, 6 pins meet direct current VCC by 3rd resistor R3,
10 pins are grounded, and 14 pins ground connection, 16 pins are grounded by the second electric capacity C2, and 16 pins are connected by the 4th resistance R4 and 17 pins
Connect, 17 pins are connected by the 5th resistance R5 and the 5th electric capacity C5 one end, and 11 pins pass through the first inductance L1 and the 7th electric capacity
C7 one end connection, the 7th electric capacity C7 other end ground connection, 11 pins are connected by the first inductance L1 and the 6th electric capacity C6 one end
Connect, the 6th electric capacity C6 other end is grounded by the tenth electric capacity C10, is also grounded by the 3rd inductance L3, the 5th electric capacity C5's is another
One end is connected with the 6th electric capacity C6 other end, and 13 pins are connected by the second inductance L2 and the 8th electric capacity C8 one end, and the 8th
Electric capacity C8 other end ground connection, 13 pins are also connected by the second inductance L2 and the 9th electric capacity C9 one end, and the 9th electric capacity C9 is another
End is grounded by the 11st electric capacity C11, is also grounded by the 4th inductance L4,18 pins ground connection, is connected between 21 pins and 22 pins
The first crystal-vibration-chip Y1 is connected to, 21 pins are grounded by the 4th electric capacity C4, and 22 pins are grounded by the 3rd electric capacity C3;
Program burn writing circuit includes model JTAG program burn writing module P4, and program burn writing module P4 1 pin, 2 pins connect
Direct current VCC, 3 pins meet direct current VCC by the 17th resistance R17, and 5 pins connect direct current by the 16th resistance R16
VCC, 7 pins meet direct current VCC by the 15th resistance R15, and 13 pins connect direct current VCC, 9 pipes by the 14th resistance R14
Pin is grounded by the 19th resistance R19, and 11 pins are connected by the 18th resistance R18 and 9 pins, 4 pins, 6 pins, 8 pins,
10 pins, 12 pins, 14 pins, 16 pins, 18 pins and 20 pins ground connection;
Voice module circuit includes model SC8035 electronic lock master chip U2, and electronic lock master chip U2 1 pin passes through
One electric capacity C1 is grounded, and 2 pins and 3 pins connect with loudspeaker LS, and 4 pins connect direct current VCC, 5 pins ground connection;
RS485 communicating circuits include model SP3485 chip U1, and chip U1 2 pins and the connection of 3 pins, 5 pins are grounded,
6 pins are grounded by second resistance R2, and 7 pins meet direct current VCC by first resistor R1, and 6 pins, 7 pins also pass with data
Defeated interface P1 connections, 8 pins meet direct current VCC;
Data acquisition circuit includes model STM32F103_144 master chip U4, master chip U4 8 pins and 9 pins and
Two crystal-vibration-chip Y2 both ends are connected, and 8 pins are also grounded by the 16th electric capacity C16, and 9 pins are grounded by the 17th electric capacity C17, and 16
Pin ground connection, 25 pins meet direct current VCC by the 13rd resistance, are also grounded by the 21st electric capacity C21,25 pins and core
The 15 pins connection of piece U3 6 pins, the 5th interface module P5 31 pins, the 4th interface module P4,26 pins pass through the tenth
Eight electric capacity C18 are grounded, and 27 pins are grounded by the 19th electric capacity C19, and 28 pins are grounded by the 20th electric capacity C20,30 pins,
31 pins are grounded, and 32 pins, 33 pins meet direct current VCC, and 36 pins connect with chip U1 4 pins, 37 pins and chip U1
The connection of 1 pin, 38 pins ground connection, 39 pins meet direct current VCC, and 40 pins connect to be connected with chip U3 24 pins, 41 pins
Being connected with chip U3 29 pins, 42 pins connect with chip U3 31 pins, and 43 pins connect with chip U3 30 pins,
46 pins are connected by the 26th resistance R26 with triode Q1 base stage, triode Q1 grounded emitter, colelctor electrode difference
Connect by the 22nd resistance R22, the 23rd resistance R23, the 24th resistance R24 and the 25th resistance R25 and the 5th
Mouth mold block P5 17 pins, 18 pins, 19 pins and the connection of 20 pins, 47 pins and the 3rd interface module P3 9 pins connection,
48 pins and the 3rd interface module P3 15 pins connect, and 49 pins connects with electronic lock master chip U2 6 pins, 50 pins with
Electronic lock master chip U2 7 pins connection, 51 pins ground connection, 52 pins meet direct current VCC, and 53 pins connect and electronic lock master chip
U2 8 pins connection, 54 pins and the 3rd interface module P3 14 pins connection, 56 pins and the 5th interface module P5 8 pipes
Pin connects, 57 pins and the 3rd interface module P3 13 pins connection, 58 pins, 59 pins and 60 pins respectively with the 5th interface
Module P5 22 pins, 35 pins and the connection of 36 pins, 63 pins, 64 pins, 65 house keepers, 66 pins, 67 pins, 68 pins
37 pins with the 5th interface module P5,23 pins, 24 pins, 25 pins, 26 pins and 27 pins connect respectively, and 71 pins connect
Ground, 72 pins meet direct current VCC, 77 pins, 78 pins and 79 pins 28 pins with the 5th interface module P5,29 pins respectively
Being connected with 30 pins, 83 pins ground connection, 84 pins meet direct current VCC, 85 pins and the 5th interface module P5 1 pin connection,
86 pins and the 5th interface module P5 2 pins connect, 89 pins, 90 pins, 91 pins and 92 pins respectively with the 3rd interface
Module P3 1 pin, 2 pins, 3 pins and the connection of 4 pins, 94 pins ground connection, 95 pins connect direct current VCC, 98 pins, 99 pipes
Pin, 100 pins and 101 pins connect the 3rd interface module P3 5 pins, 6 pins, 7 pins and 8 pins respectively, and 102 pins connect red
Outer receiving module P2 VOUT pins, 105 pins connect the 4th interface module P4 7 pins, 107 pins ground connection, and 108 pins connect directly
Electric VCC is flowed, 109 pins connect the 4th interface module P4 9 pins, and 110 pins connect the 4th interface module P4 5 pins, 114 pins
Connect the 5th interface module P5 3 pins and 4 pins respectively with 115 pins, 118 pins and 119 pins connect the 5th interface mould respectively
Block P5 10 pins and 9 pins, 120 pins ground connection, 121 pins meet direct current VCC, 122 pins ground connection, and 123 pins connect chip
U1 2 pins, 127 pins connect the 5th interface module P5 7 pins, 130 pins ground connection, and 131 pins connect direct current VCC, 133 pipes
Pin connects the 4th interface module P4 13 pins, and 134 pins connect the 4th interface module P4 3 pins, 143 pins ground connection, 144 pins
Meet direct current VCC.
Claims (1)
1. Intelligent charging frame charge information remote comprehensive manages module, it is characterised in that including power supply circuit, liquid crystal driver module
Circuit, infrared receiver terminal circuit, electromagnetism lock control circuit, program burn writing circuit, voice module circuit, RS485 communicating circuits and
Data acquisition circuit;
Wherein power supply circuit includes the 3rd interface module P3, the 3rd interface module P3 10 pins access direct current VCC, 10 pipes
Pin is grounded by the 7th resistance R7 being sequentially connected and the 8th resistance R8, and the 8th resistance R8 both ends are parallel with the 18th electric capacity C18,
11 pins access direct current VCC1, and 11 pins are grounded by the 9th resistance R9 being sequentially connected and the tenth resistance R10, the tenth resistance
R10 both ends are parallel with the 19th electric capacity C19, and 12 pins access direct current VCC2, and 12 pins are electric by the be sequentially connected the 11st
R11 and the 12nd resistance R12 ground connection is hindered, the 12nd resistance R12 both ends are parallel with the 20th electric capacity C20;
Liquid crystal driver module circuit includes model YEJIN28 the 5th interface module P5, and the 5th interface module P5 5 pins connect
Ground, 6 pins meet direct current VCC, and 11 pins meet direct current VCC by the 20th resistance R20, also pass through the 21st resistance R21
Ground connection, 16 pins meet direct current VCC, are also grounded by the 14th electric capacity C14, and 32 pins and the connection of 33 pins, 32 pins also connect
Direct current VCC is met, is also grounded by the 15th electric capacity C15,34 pins ground connection;
Infrared receiver terminal circuit includes infrared receiving module P2, and infrared receiving module P2 VCC pins meet direct current VCC, also logical
Cross the 6th resistance R6 to connect with VOUT pins, GND pins ground connection;
Electromagnetism lock control circuit includes model RC522 chip U3, chip U3 1 pin ground connection, 2 pins, 3 pins, 12 pipes
Pin, 15 pins and 32 pins meet direct current VCC, and 4 pins and 5 pins ground connection, 6 pins meet direct current VCC by 3rd resistor R3,
10 pins are grounded, and 14 pins ground connection, 16 pins are grounded by the second electric capacity C2, and 16 pins are connected by the 4th resistance R4 and 17 pins
Connect, 17 pins are connected by the 5th resistance R5 and the 5th electric capacity C5 one end, and 11 pins pass through the first inductance L1 and the 7th electric capacity
C7 one end connection, the 7th electric capacity C7 other end ground connection, 11 pins are connected by the first inductance L1 and the 6th electric capacity C6 one end
Connect, the 6th electric capacity C6 other end is grounded by the tenth electric capacity C10, is also grounded by the 3rd inductance L3, the 5th electric capacity C5's is another
One end is connected with the 6th electric capacity C6 other end, and 13 pins are connected by the second inductance L2 and the 8th electric capacity C8 one end, and the 8th
Electric capacity C8 other end ground connection, 13 pins are also connected by the second inductance L2 and the 9th electric capacity C9 one end, and the 9th electric capacity C9 is another
End is grounded by the 11st electric capacity C11, is also grounded by the 4th inductance L4,18 pins ground connection, is connected between 21 pins and 22 pins
The first crystal-vibration-chip Y1 is connected to, 21 pins are grounded by the 4th electric capacity C4, and 22 pins are grounded by the 3rd electric capacity C3;
Program burn writing circuit includes model JTAG program burn writing module P4, and program burn writing module P4 1 pin, 2 pins connect
Direct current VCC, 3 pins meet direct current VCC by the 17th resistance R17, and 5 pins connect direct current by the 16th resistance R16
VCC, 7 pins meet direct current VCC by the 15th resistance R15, and 13 pins connect direct current VCC, 9 pipes by the 14th resistance R14
Pin is grounded by the 19th resistance R19, and 11 pins are connected by the 18th resistance R18 and 9 pins, 4 pins, 6 pins, 8 pins,
10 pins, 12 pins, 14 pins, 16 pins, 18 pins and 20 pins ground connection;
Voice module circuit includes model SC8035 electronic lock master chip U2, and electronic lock master chip U2 1 pin passes through
One electric capacity C1 is grounded, and 2 pins and 3 pins connect with loudspeaker LS, and 4 pins connect direct current VCC, 5 pins ground connection;
RS485 communicating circuits include model SP3485 chip U1, and chip U1 2 pins and the connection of 3 pins, 5 pins are grounded,
6 pins are grounded by second resistance R2, and 7 pins meet direct current VCC by first resistor R1, and 6 pins, 7 pins also pass with data
Defeated interface P1 connections, 8 pins meet direct current VCC;
Data acquisition circuit includes model STM32F103_144 master chip U4, master chip U4 8 pins and 9 pins and
Two crystal-vibration-chip Y2 both ends are connected, and 8 pins are also grounded by the 16th electric capacity C16, and 9 pins are grounded by the 17th electric capacity C17, and 16
Pin ground connection, 25 pins meet direct current VCC by the 13rd resistance, are also grounded by the 21st electric capacity C21,25 pins and core
The 15 pins connection of piece U3 6 pins, the 5th interface module P5 31 pins, the 4th interface module P4,26 pins connect the 18th
Electric capacity C18,27 pins meet the 19th electric capacity C19, and 28 pins meet the 20th electric capacity C20, and 30 pins, 31 pins are grounded, 32 pins,
33 pins meet direct current VCC, and 36 pins connect with chip U1 4 pins, and 37 pins connect with chip U1 1 pin, 38 pins
Ground connection, 39 pins meet direct current VCC, and 40 pins connect to be connected with chip U3 24 pins, and 41 pins and chip U3 29 pins connect
Connect, 42 pins connect with chip U3 31 pins, and 43 pins connect with chip U3 30 pins, and 46 pins pass through the 26th
Resistance R26 connects with triode Q1 base stage, and triode Q1 grounded emitter, colelctor electrode passes through the 22nd resistance respectively
R22, the 23rd resistance R23, the 24th resistance R24 and the 25th resistance R25 and the 5th interface module P5 17 pins,
18 pins, 19 pins and the connection of 20 pins, 47 pins and the 3rd interface module P3 9 pins connection, 48 pins and the 3rd interface
Module P3 15 pins connection, 49 pins connect with electronic lock master chip U2 6 pins, 50 pins and electronic lock master chip U2's
7 pins connect, and 51 pins ground connection, 52 pins meet direct current VCC, and 53 pins connect to be connected with electronic lock master chip U2 8 pins, and 54
Pin and the 3rd interface module P3 14 pins connect, 56 pins and the 5th interface module P5 8 pins connection, 57 pins and the
Three interface module P3 13 pins connection, 58 pins, 59 pins and 60 pins 22 pins with the 5th interface module P5,35 respectively
Pin and 36 pins connection, 63 pins, 64 pins, 65 house keepers, 66 pins, 67 pins, 68 pins respectively with the 5th interface module
P5 37 pins, 23 pins, 24 pins, 25 pins, 26 pins and the connection of 27 pins, 71 pins ground connection, 72 pins connect direct current
VCC, 77 pins, 78 pins and 79 pins connect with the 5th interface module P5 28 pins, 29 pins and 30 pins respectively, 83 pipes
Pin is grounded, and 84 pins connect direct current VCC, 85 pins and the 5th interface module P5 1 pin connection, 86 pins and the 5th interface mould
Block P5 2 pins connection, 1 pin with the 3rd interface module P3,2 are managed respectively for 89 pins, 90 pins, 91 pins and 92 pins
Pin, 3 pins and the connection of 4 pins, 94 pins ground connection, 95 pins connect direct current VCC, 98 pins, 99 pins, 100 pins and 101 pipes
Pin connects the 3rd interface module P3 5 pins, 6 pins, 7 pins and 8 pins respectively, and 102 pins connect infrared receiving module P2's
VOUT pins, 105 pins connect the 4th interface module P4 7 pins, 107 pins ground connection, and 108 pins connect direct current VCC, 109 pipes
Pin connects the 4th interface module P4 9 pins, and 110 pins connect the 4th interface module P4 5 pins, 114 pins and 115 pins difference
Connect the 5th interface module P5 3 pins and 4 pins, 118 pins and 119 pins connect respectively the 5th interface module P5 10 pins and
9 pins, 120 pins ground connection, 121 pins meet direct current VCC, 122 pins ground connection, and 123 pins connect chip U1 2 pins, 127 pipes
Pin connects the 5th interface module P5 7 pins, 130 pins ground connection, and 131 pins meet direct current VCC, and 133 pins connect the 4th interface mould
Block P4 13 pins, 134 pins connect the 4th interface module P4 3 pins, 143 pins ground connection, and 144 pins meet direct current VCC.
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Application publication date: 20180323 |