CN107834142B - Multi-step complex impedance matching miniaturized power divider and design method thereof - Google Patents

Multi-step complex impedance matching miniaturized power divider and design method thereof Download PDF

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CN107834142B
CN107834142B CN201710838641.8A CN201710838641A CN107834142B CN 107834142 B CN107834142 B CN 107834142B CN 201710838641 A CN201710838641 A CN 201710838641A CN 107834142 B CN107834142 B CN 107834142B
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impedance
power divider
impedance transformation
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夏卫鑫
郑敏
侯晓川
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Hefei Banglian Electronic Technology Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/12—Coupling devices having more than two ports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
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Abstract

The invention provides a multi-step complex impedance matching miniaturized power divider and a design method thereof, wherein the power divider comprises a cavity and an inner conductor, the inner conductor is arranged in the cavity and comprises a plurality of sections of mutually connected impedance transformation sections with the diameters changing in a step mode, and the length of each impedance transformation section is 1/16 lambda corresponding to the central frequency of the power divider. The invention can reduce the volume and the weight of the power divider, has reasonable design and convenient processing, and greatly saves the production cost and the use cost of the power divider.

Description

Multi-step complex impedance matching miniaturized power divider and design method thereof
Technical Field
The invention belongs to a signal transmission microwave device, and particularly relates to a multi-step complex impedance matching miniaturized power divider and a design method thereof.
Background
The power divider is widely applied to the technical fields of microwave communication, electronic countermeasure, radar and the like as a common signal transmission microwave device. As shown in fig. 1, the current cavity power divider mainly adopts a circular cavity structure, the inner conductor adopts a standard 1/4 wavelength impedance transformation mode, and the cavity is mainly processed by aluminum or copper alloy. The most important disadvantage of the structure is that the designed impedance converter is longer, for example, a coaxial power divider of 0.8GHz-2.5GHz, the length of the inner conductor of the standard 1/4 wavelength impedance conversion reaches 172mm, which results in overlarge volume of the power divider, increases the cost of the product and the loss of metal materials, and is not beneficial to the saving and utilization of environmental resources.
The patent short-step coaxial power divider with variable impedance cavity (publication No. CN201360032Y, 2009.12.9) discloses a short-step coaxial power divider with variable impedance cavity, which is characterized in that an inner conductor is a straight rod, an outer shell is a step-type reducing structure, an impedance cavity with impedance transformation nodes is formed by the outer periphery of the straight rod-type inner conductor and the inner side wall of the step-type reducing structure of the outer shell, and the length of each impedance transformation node is 1/16 with the center frequency corresponding to the wavelength. The impedance variable cavity is formed by combining the inner conductor and the inner side wall of the outer shell, so that the impedance of the actual power divider is greatly increased compared with the impedance of the stepped impedance transformation of the inner conductor; the impedance conversion section number is too large, and the processing and detection difficulty of the outer shell is increased due to the more stepped reducing on the inner side wall of the outer shell; the length and position relation matching degree of the inner side wall and the inner conductor is high, and the flexibility is insufficient.
Therefore, a power divider with simple structure, reasonable design, convenient processing and manufacturing, greatly reduced size and saved cost is urgently needed.
Disclosure of Invention
In order to solve the technical problems, the invention provides a multi-step complex impedance matching miniaturized power divider and a design method thereof, wherein the power divider and the design method thereof can greatly reduce the volume and the weight of the power divider, are reasonable in design and convenient to process, and greatly save the production cost and the use cost of the power divider.
The invention provides the following technical scheme:
the utility model provides a miniaturized merit of multi-step complex impedance matching divides ware, includes cavity and inner conductor, and the inner conductor is installed inside the cavity, and the inner conductor includes the cascaded impedance transformation section of changing of diameter of a plurality of sections interconnect, and the length of every impedance transformation section is got the corresponding 1/16 lambda of ware central frequency of dividing.
Preferably, there are connected impedance transformation nodes of the same diameter.
Preferably, the number of impedance transformation nodes is calculated by adopting a multi-step impedance matching technology, and the specific calculation steps are as follows:
the minimum frequency of the power divider is set as thetaaMaximum frequency of thetabThe input/output impedance ratio is R, and the center frequency is thetamThe main passband bandwidth is
Figure BDA0001410188960000021
Then
Figure BDA0001410188960000022
Figure BDA0001410188960000023
Figure BDA0001410188960000024
When R is 2.0 or 3.0 or 4.0,will thetaa，θbSubstituting numerical values into the formula (1) and the formula (2) to calculate thetamAnd
Figure BDA0001410188960000031
substituting R and theta according to the passband decibel ripple less than 0.01mAnd
Figure BDA0001410188960000032
obtaining the value of n meeting the passband decibel ripple requirement, and taking n as the number of impedance transformation nodes.
Preferably, the number of impedance transformation nodes is 10.
Preferably, the inner conductor is formed by integral die casting.
Preferably, the power divider comprises an input connector and an output connector, the input connector and the output connector are mounted at two ends of the cavity, the number of the input connectors is 1, and the number of the output connectors is at least 2.
Preferably, the cavity is formed by integral die-casting, and the cavity, the input connector and the output connector are integrally formed by die-casting.
A design method of a multi-step complex impedance matching miniaturized power divider comprises the following steps:
s1: setting the length of each impedance transformation section to be 1/16 lambda, presetting that an inner conductor in the power divider comprises a plurality of interconnected impedance transformation sections with diameters changing in a stepped manner, and taking the length of each impedance transformation section to be 1/16 lambda corresponding to the center frequency of the power divider;
s2: calculating the number of impedance transformation nodes in S1 by adopting a multi-step impedance matching technology, wherein the specific calculation steps are as follows:
the minimum frequency of the power divider is set as thetaaMaximum frequency of thetabThe input/output impedance ratio is R, and the center frequency is thetamThe main passband bandwidth is
Figure BDA0001410188960000033
Then
Figure BDA0001410188960000034
Figure BDA0001410188960000035
Figure BDA0001410188960000041
When R is 2.0 or 3.0 or 4.0, thetaa，θbSubstituting numerical values into the formula (1) and the formula (2) to calculate thetamAnd
Figure BDA0001410188960000042
according to design requirements, if the passband decibel ripple is less than 0.01, the passband decibel ripple is substituted into R and thetamAnd
Figure BDA0001410188960000043
obtaining a value of n that satisfies the passband decibel ripple requirement, and taking n as the number of impedance transformation nodes in S1.
S3: the diameters of the impedance transformation nodes connected to each other are made the same, complex impedance matching is performed, and in calculating the number of impedance transformation nodes in S2, the diameters of the impedance transformation nodes connected to each other are made the same, and the lengths of the impedance transformation nodes are adjusted by using complex impedance matching and high-frequency structure electromagnetic field simulation tool HFSS software.
The invention has the beneficial effects that:
1. the invention has simple structure, convenient installation and reasonable design.
2. The invention effectively shortens the size length of the product by the 1/16-wavelength multi-step impedance matching technology, can reduce the volume length by 30 percent compared with the prior product, and can save the material cost, the packaging cost and the transportation cost by 40 percent in total.
3. In the 1/16 wavelength multi-step design, in order to reduce the difference value of high and low impedance and reduce the change of conductor steps, the invention uses a complex impedance matching technology, greatly facilitates the design and processing of products, can open a die and realize the processing of the inner conductor by adopting a die casting production mode, greatly saves the cost of the products, and has light weight and beautiful appearance.
4. The 1/16 wavelength power divider obtained by the invention is detected by a test instrument, and the actual test index of the power divider is proved to be better than that of the traditional power divider designed by 1/4 wavelength.
5. The conductor is miniaturized, mass processing and production are facilitated, processing efficiency is improved, and installation space is saved.
6. The cavity is integrally formed by die casting, and the cavity, the input connector and the output connector are integrally formed by die casting, so that standardized processing and use are facilitated.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a block diagram of a standard 1/4 wavelength impedance transformation power divider;
FIG. 2 is a block diagram of an 1/16 λ wavelength impedance transformation power divider according to the present invention;
FIG. 3 is a block diagram of the power divider with 2 connected impedance transformation nodes of the same diameter processed by complex impedance matching and high frequency structural electromagnetic field simulation tool HFSS software according to the present invention;
fig. 4 is a transmission line lumped parameter circuit shorter than 1/8 wavelengths.
Fig. 5 is a lumped parameter circuit of a low impedance transmission line in a multi-step impedance transformation element.
Labeled as: 1. a cavity; 2. an inner conductor; 3. an impedance transformation section; 4. impedance transformation nodes with the same diameter; 5. an input connector; 6. and an output connector.
Detailed Description
Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.
As shown in fig. 2, a multi-step complex impedance matching miniaturized power divider includes a cavity 1 and an inner conductor 2, the inner conductor 2 is installed inside the cavity 1, the inner conductor 2 is formed by connecting a plurality of impedance transformation nodes 3 with diameters changing in a step-like manner, and the length of each impedance transformation node 3 is 1/16 λ corresponding to the center frequency of the power divider.
Specifically, the inner conductor 2 is integrally formed by die casting.
Specifically, the power divider further comprises an input joint 5 and an output joint 6, wherein the input joint 5 and the output joint 6 are installed at two ends of the cavity 1, the number of the input joints 5 is 1, and the number of the output joints 6 is more than 2.
Specifically, the cavity 1 is integrally formed by die casting, and the cavity 1, the input connector 5 and the output connector 6 are integrally formed by die casting.
Specifically, the number of the impedance transformation nodes 3 is calculated by adopting a multi-step impedance matching technology, the technology is developed on the basis of Chebyshev response, and the maximum advantages of the technology are that the bandwidth is relatively wide and the size is small. The specific calculation process of the number of the impedance transformation nodes 3 is as follows:
the minimum frequency of the power divider is set as thetaaMaximum frequency of thetabThe input/output impedance ratio is R, and the center frequency is thetamThe main passband bandwidth is
Figure BDA0001410188960000061
Then
Figure BDA0001410188960000062
Figure BDA0001410188960000063
Figure BDA0001410188960000064
When R is 2.0 or 3.0 or 4.0, thetaa，θbSubstituting numerical values into the formula (1) and the formula (2) to calculate thetamAnd
Figure BDA0001410188960000065
substituting R and theta according to the passband decibel ripple less than 0.01mAnd
Figure BDA0001410188960000066
obtaining the value of n meeting the passband decibel ripple requirement, and taking n as the number of the impedance transformation nodes.
Specifically, when R is 2.0 and θ m is 1.65GHz
Figure BDA0001410188960000071
For a passband decibel ripple less than 0.01, when R is 2.0 and ω is 1.2, a passband ripple less than 0.01 can be satisfied only when n is 10. At this time, the length of each section can be calculated according to
Figure BDA0001410188960000072
Deducing
Figure BDA0001410188960000073
Multiplying the above-mentioned wavelength by
Figure BDA0001410188960000074
Thus obtaining the actual length l of each section is 11.4 mm.
After the above calculation, the normalized value of the first 5 sections is obtained according to the table lookup, and the normalized value of the second 5 sections is obtained by the following formula:
Figure BDA0001410188960000075
wherein i represents the number of the last 5 sections, i.e., 6, 7, 8, 9, 10.
The normalized value of each section is obtained by the above calculation as follows:
Figure BDA0001410188960000076
Figure BDA0001410188960000081
specifically, the calculation results show that the section number of the 1/16 lambda impedance transformation section 3 of the 0.8GHz-2.5GHz coaxial power divider can meet the requirement of 10 sections. The total length of the conductor 2 in the 10 section 1/16 lambda impedance transformation section 3 is about 119 mm. And as shown in fig. 1, the total length of the inner conductor of the 0.8GHz-2.5GHz coaxial power divider adopting the 1/4 lambda impedance transformation joint is 172 mm. 1/16 lambda of the length dimension of the inner conductor 2 is shortened by 53mm, by about 30% of the length.
As shown in fig. 2, the size difference of each impedance transformation section step of the inner conductor 2 is large, which causes difficulty in batch processing, and in order to solve this problem, the diameters of more than 2 connected impedance transformation sections can be made the same, and then the matching problem is solved by using a complex matching technique.
As shown in fig. 3, the impedance transformation nodes connected by 2 nodes are set to be the same diameter, i.e., the same diameter impedance transformation node 4, so as to reduce the number of times of change of the steps of the impedance transformation nodes. The specific design process is as follows:
a transmission line shorter than 1/8 wavelengths may be equivalent to the lumped parameter circuit shown in fig. 4. Wherein the content of the first and second substances,
Figure BDA0001410188960000082
Figure BDA0001410188960000083
as shown in fig. 5, the operating characteristic of the low-impedance transmission line in the multi-step impedance transformer element is like a parallel capacitor, so that the equivalent capacitance of the step discontinuity can be calculated by combining the equivalent capacitance of the transmission element. Wherein the content of the first and second substances,
Figure BDA0001410188960000084
Figure BDA0001410188960000085
therefore, when the impedance value of a variable link is to be adjusted, the length and the impedance value of two connected variable links are adjusted to perform matching, and the structure diagram of the product optimized by using the microwave simulation software high-frequency structure electromagnetic field simulation tool HFSS is shown in FIG. 3 through the recalculated values. The length of the final matched inner conductor 2 is 126 mm.
According to the standing wave ratio and loss performance analysis of the instrument on the power divider in fig. 3, the actual test index of the power divider is better than that of the traditional power divider designed at 1/4 wavelengths, and the mass production is facilitated.
A design method of a multi-step complex impedance matching miniaturized power divider comprises the following steps:
s1: setting the length of each impedance transformation section to be 1/16 lambda, presetting that an inner conductor in the power divider comprises a plurality of interconnected impedance transformation sections with diameters changing in a stepped manner, and taking the length of each impedance transformation section to be 1/16 lambda corresponding to the center frequency of the power divider;
s2: calculating the number of impedance transformation nodes in S1, wherein the specific calculation steps are as follows:
the minimum frequency of the power divider is set as thetaaMaximum frequency of thetabThe input/output impedance ratio is R, and the center frequency is thetamThe main passband bandwidth is
Figure BDA0001410188960000091
Then
Figure BDA0001410188960000092
Figure BDA0001410188960000093
Figure BDA0001410188960000094
When R is 2.0 or 3.0 or 4.0, thetaa，θbSubstituting numerical values into the formula (1) and the formula (2) to calculate thetamAnd
Figure BDA0001410188960000095
according to design requirementsIf the passband decibel ripple is less than 0.01, the input is R and thetamAnd
Figure BDA0001410188960000096
obtaining a value of n that satisfies the passband decibel ripple requirement, and taking n as the number of impedance transformation nodes in S1.
S3: the diameters of the impedance transformation nodes connected to each other are made the same, complex impedance matching is performed, and in calculating the number of impedance transformation nodes in S2, the diameters of the impedance transformation nodes connected to each other are made the same, and the lengths of the impedance transformation nodes are adjusted by using complex impedance matching and high-frequency structure electromagnetic field simulation tool HFSS software.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (7)

1. A multi-step complex impedance matching miniaturized power divider is characterized by comprising a cavity and an inner conductor, wherein the inner conductor is installed inside the cavity and comprises a plurality of sections of mutually connected impedance transformation sections with diameters changing in a step mode, and the length of each impedance transformation section is 1/16 lambda corresponding to the center frequency of the power divider;
the number of the impedance transformation nodes is calculated by adopting a multi-step impedance matching technology, and the specific calculation steps are as follows:
the minimum frequency of the power divider is set as thetaaMaximum frequency of thetabThe input/output impedance ratio is R, and the center frequency is thetamThe main passband bandwidth is
Figure FDA0002999431290000011
Zn+1Is the normalized impedance value of section n +1,Z0is characteristic impedance, then
Figure FDA0002999431290000012
Figure FDA0002999431290000013
Figure FDA0002999431290000014
R is 2.0 or 3.0 or 4.0, anda，θbsubstituting numerical values into the formula (1) and the formula (2) to calculate thetamAnd
Figure FDA0002999431290000015
substituting R and theta according to the passband decibel ripple less than 0.01mAnd
Figure FDA0002999431290000016
obtaining the value of n meeting the passband decibel ripple requirement, and taking n as the number of the impedance transformation nodes.
2. The multi-step complex impedance-matching miniaturized power divider of claim 1, wherein the diameters of the impedance transformation nodes connected are the same.
3. The multi-step complex impedance-matching miniaturized power divider of claim 1, wherein the number of the impedance transformation nodes is 10.
4. The multi-step complex impedance-matching miniaturized power divider of claim 1, wherein the inner conductor is integrally die-cast.
5. The multi-step complex impedance matching miniaturized power divider of claim 4, wherein the power divider comprises an input connector and an output connector, the input connector and the output connector are installed at two ends of the cavity, the number of the input connectors is 1, and the number of the output connectors is at least 2.
6. The multi-step complex impedance matching miniaturized power divider of claim 5, wherein the cavity is integrally die-cast, and the cavity is integrally die-cast with the input connector and the output connector.
7. A design method of a multi-step complex impedance matching miniaturized power divider is characterized by comprising the following steps:
s1: setting the length of each impedance transformation section to be 1/16 lambda, presetting that an inner conductor in the power divider comprises a plurality of interconnected impedance transformation sections with diameters changing in a stepped manner, and taking the length of each impedance transformation section to be 1/16 lambda corresponding to the center frequency of the power divider;
s2: calculating the number of the impedance transformation nodes in the step S1 by adopting a multi-step impedance matching technology, wherein the specific calculation steps are as follows:
the minimum frequency of the power divider is set as thetaaMaximum frequency of thetabThe input/output impedance ratio is R, and the center frequency is thetamThe main passband bandwidth is
Figure FDA0002999431290000021
Zn+1Normalized impedance value, Z, for section n +10Is characteristic impedance, then
Figure FDA0002999431290000022
Figure FDA0002999431290000031
Figure FDA0002999431290000032
R is 2.0 or 3.0 or 4.0, anda，θbsubstituting numerical values into the formula (1) and the formula (2) to calculate thetamAnd
Figure FDA0002999431290000033
according to design requirements, if the passband decibel ripple is less than 0.01, the passband decibel ripple is substituted into R and thetamAnd
Figure FDA0002999431290000034
obtaining a value of n meeting passband decibel ripple requirements, and taking n as the number of impedance transformation nodes in the S1;
s3: in the calculation of the number of impedance transformation nodes in S2, the diameters of the impedance transformation nodes connected to each other are set to be the same, and the lengths of the impedance transformation nodes are adjusted by using complex impedance matching and high-frequency structural electromagnetic field simulation tool HFSS software.
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CN205657154U (en) * 2016-04-26 2016-10-19 苏州赫斯康通信科技有限公司 Coaxial power distribution unit of multisection impedance conversion radio frequency
CN205723897U (en) * 2016-04-29 2016-11-23 福州同创微波通讯技术有限公司 A kind of wideband cavity two power divider of exposure transmission

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CN201210510Y (en) * 2008-04-24 2009-03-18 杭州紫光网络技术有限公司 Novel cavity type power divider
CN101674059A (en) * 2009-09-28 2010-03-17 北京邮电大学 Strict dual-band impedance matcher applied to frequency dependent plural impedance
CN102122745A (en) * 2010-12-16 2011-07-13 深圳市大富科技股份有限公司 Cavity power divider and manufacturing method
CN205657154U (en) * 2016-04-26 2016-10-19 苏州赫斯康通信科技有限公司 Coaxial power distribution unit of multisection impedance conversion radio frequency
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