CN107833955B - 一种氮化物发光二极管 - Google Patents
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- 150000004767 nitrides Chemical class 0.000 claims abstract description 18
- 230000004888 barrier function Effects 0.000 claims abstract description 17
- 239000004065 semiconductor Substances 0.000 claims abstract description 17
- 239000000203 mixture Substances 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 230000000737 periodic effect Effects 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 8
- 238000002347 injection Methods 0.000 abstract description 4
- 239000007924 injection Substances 0.000 abstract description 4
- 230000006798 recombination Effects 0.000 description 7
- 238000005215 recombination Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005036 potential barrier Methods 0.000 description 4
- 229910002601 GaN Inorganic materials 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000000605 extraction Methods 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/24—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
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Abstract
本发明公开了一种氮化物发光二极管,包括:N型氮化物半导体,具有V‑pits的多量子阱,V‑pits调制填充层,电子阻挡层以及P型氮化物半导体,其特征在于:多量子阱和电子阻挡层之间或电子阻挡层和P型氮化物半导体之间至少具有一层V‑pits调制填充层,该层由V‑pits开口封闭层和V‑pits开口开启层构成的周期结构组成,通过V‑pits的开口的张大和缩小形成的周期结构,提升P型空穴注入量子阱的效率和局域量子限制效应,并提升对量子阱出射光的反射和散射,提升发光二极管的发光效率。
Description
技术领域
本发明涉及半导体光电器件领域,特别是一种具有V-pits调制填充层的氮化物发光二极管。
背景技术
现今,发光二极管(LED),特别是氮化物发光二极管因其较高的发光效率,在普通照明领域已取得广泛的应用。因氮化物发光二极管的底层存在缺陷,导致生长量子阱时缺陷延伸会形成V-pits。V-pits的侧壁的势垒大于多量子阱的势垒,导致电子不易跃迁进入V-pits的缺陷非辐射复合中心,同时,V-pits侧壁可对多量子阱发出的光进行反射,改变发光角度,降低全反射角对出光影响,提升光提取效率,提升发光效率和发光强度。同时,V-pits之间形成类似铟组分的涨落区域和量子尺寸区域,可以提升量子阱内电子和空穴的量子限制效应,提升电子和空穴的复合几率。
发明内容
本发明的目的在于:提供一种具有V-pits调制填充层的氮化物发光二极管,通过在多量子阱和电子阻挡层之间或电子阻挡层和P型氮化物半导体之间制作至少一层V-pits调制填充层,所述V-pits调制填充层由V-pits开口封闭层和V-pits开口开启层构成的周期结构组成,通过V-pits的开口的张大和缩小形成的周期性量子结构,提升P型空穴注入量子阱的效率和局域量子限制效应,提升电子和空穴的复合几率,并提升对量子阱出射光的反射和散射,提升发光二极管的发光效率。
一种具有V-pits调制填充层的氮化物发光二极管,包括:N型氮化物半导体,具有V-pits的多量子阱,V-pits调制填充层,电子阻挡层以及P型氮化物半导体,其特征在于:多量子阱和电子阻挡层之间或电子阻挡层和P型氮化物半导体之间至少具有一层V-pits调制填充层,所述V-pits调制填充层由V-pits开口封闭层和V-pits开口开启层构成的周期结构组成,形成V-pits的开口的张大和缩小形成的周期性量子结构。
进一步地,所述V-pits调制填充层由V-pits开口封闭层和V-pits开口开启层组成的周期结构的周期数为n,其中n≥2,第一层和最后一层均为V-pits开口封闭层。
进一步地,所述V-pits调制填充层的V-pits开口封闭层形成V-pits的开口尺寸为5~50nm,V-pits的开口角度为50°~60°;所述V-pits开口开启层形成的V-pits的开口尺寸为50~500nm,V-pits的开口角度为55°~70°。
进一步地,所述每一周期的V-pits开口封闭层由氮化镓GaN组成,生长温度为800-1000°C,厚度为50~500nm,Mg掺杂浓度为1.0E19~1.0E20cm-3。
进一步地,所述每一周期的V-pits开口开启层由AlxInyGa1-x-yN组成,其中0.2≤x≤1,0≤y≤0.2,In组分低于多量子阱的In组分,生长温度为700~800°C,厚度为50~500nm,该层无Mg掺杂。
附图说明
图1为传统多量子阱具有V-pits的氮化物发光二极管示意图。
图2为本发明实施例的具有V-pits调制填充层的氮化物发光二极管的示意图。
图3为本发明实施例的具有V-pits调制填充层的氮化物发光二极管的V-pits开口封闭层和开口开启层的示意图。
图4为本发明实施例的具有V-pits调制填充层的氮化物发光二极管的V-pits开口封闭层和开口开启层的开口示意图。
图5为本发明实施例的具有V-pits调制填充层的氮化物发光二极管的V-pits开口封闭层和开口开启层形成周期结构对光的反射和散射的效果图。
图示说明:100:衬底,101:缓冲层,102:N型氮化物半导体,103:多量子阱,104:V-pits,105:电子阻挡层,106:P型氮化物半导体,107:P型接触层,108:V-pits调制填充层,108a:V-pits开口封闭层,108b:V-pits开口开启层,108c:V-pits开口封闭层的开口,108d:V-pits开口开启层的开口。
具体实施方式
传统的氮化物发光二极管,因晶格失配和热失配在氮化物生长过程中会形成缺陷,生长多量子阱时该位错会延伸形成V-pits,如图1所示;因V-pits的侧壁的势垒大于多量子阱的势垒,导致电子不易跃迁进入V-pits的缺陷非辐射复合中心,同时,V-pits侧壁可对多量子阱发出的光进行反射,可改变发光角度,降低全反射角对出光影响,提升光提取效率,提升发光效率和发光强度。同时,V-pits之间形成类似铟组分的涨落区域和量子尺寸区域,可以提升量子阱内电子和空穴的量子限制效应,提升电子和空穴的复合几率。
本实施例的一种具有V-pits调制填充层的氮化物发光二极管,如图2和3所示,通过在多量子阱和电子阻挡层之间或电子阻挡层和P型氮化物半导体之间制作至少一层V-pits调制填充层108,所述V-pits调制填充层由V-pits开口封闭层108a和V-pits开口开启层108b构成的周期结构组成,通过V-pits的开口的张大和缩小形成的周期性量子结构,提升P型空穴注入量子阱的效率和局域量子限制效应,提升电子和空穴的复合几率,并提升对量子阱出射光的反射和散射,提升发光二极管的发光效率。
如图2~4所示,一种具有V-pits调制填充层的氮化物发光二极管,依次包括:衬底100,缓冲层101,N型氮化物半导体102,具有V-pits 104的多量子阱103,V-pits调制填充层108,电子阻挡层105,P型氮化物半导体106和P型接触层107,多量子阱103和电子阻挡层105之间或电子阻挡层105和P型氮化物半导体106之间至少具有一层V-pits调制填充层,所述V-pits调制填充层108由V-pits开口封闭层108a和V-pits开口开启层108b构成的周期结构组成,形成V-pits的开口的张大和缩小形成的周期结构。
进一步地,所述的V-pits调制填充层108由V-pits开口封闭层108a和V-pits开口开启层108b组成的周期结构的周期数为n,其中n≥2,第一层和最后一层均为V-pits开口封闭层108a。
进一步地,所述的V-pits调制填充层108的V-pits开口封闭层108a形成V-pits的开口108c尺寸为5~50nm,V-pits的开口角度为50°~60°;所述V-pits开口开启层形成的V-pits的开口108d尺寸为50~500nm,V-pits的开口角度为55°~70°。
进一步地,所述每一周期的V-pits开口封闭层108a由GaN组成,生长温度为800-1000°C,厚度为50~500nm,Mg掺杂浓度为1.0E19~1.0E20cm-3。
进一步地,所述每一周期的V-pits开口开启层108b由AlxInyGa1-x-yN组成,其中0.2≤x≤1,0≤y≤0.2,In组分低于多量子阱的In组分,生长温度为700~800°C,厚度为50~500nm,该层无Mg掺杂。
如图5所示,通过在多量子阱103中的V-pits 105上方制作V-pits调制填充层108,制作V-pits开口封闭层108a和V-pits开口开启层108b构成的周期结构,形成V-pits的开口的张大和缩小形成的周期性量子结构。因V-pits开口封闭层108a形成的V-pits的开口角度为50°~60°,而V-pits开口开启层108b形成的V-pits的开口角度为55°~70°,使两者之前形成角度偏差,使多量子阱104出射的光在经过该开口大小不同的V-pits调制填充层108时产生光的反射和散射。同时,V-pits调制填充层108形成开口大小不同的量子结构,还可提升P型空穴注入量子阱的效率和局域量子限制效应,提升电子和空穴的复合几率,从而提升发光二极管的发光效率。
以上实施方式仅用于说明本发明,而并非用于限定本发明,本领域的技术人员,在不脱离本发明的精神和范围的情况下,可以对本发明做出各种修饰和变动,因此所有等同的技术方案也属于本发明的范畴,本发明的专利保护范围应视权利要求书范围限定。
Claims (10)
1.一种氮化物发光二极管,包括:N型氮化物半导体,具有V-pits的多量子阱,V-pits调制填充层,电子阻挡层以及P型氮化物半导体,其特征在于:多量子阱和电子阻挡层之间或电子阻挡层和P型氮化物半导体之间至少具有一层V-pits调制填充层,所述V-pits调制填充层由V-pits开口封闭层和V-pits开口开启层构成的周期性量子结构组成,通过V-pits的开口的张大和缩小形成的周期性量子结构。
2.根据权利要求1所述的一种氮化物发光二极管,其特征在于:所述V-pits调制填充层由V-pits开口封闭层和V-pits开口开启层组成的周期性量子结构的周期数为n,其中n≥2,第一层和最后一层均为V-pits开口封闭层。
3.根据权利要求1所述的一种氮化物发光二极管,其特征在于:所述V-pits开口封闭层形成V-pits的开口尺寸为5~50nm。
4.根据权利要求1所述的一种氮化物发光二极管,其特征在于:所述V-pits开口封闭层形成V-pits的开口角度为50°~60°。
5.根据权利要求1所述的一种氮化物发光二极管,其特征在于:所述V-pits开口开启层形成的V-pits的开口尺寸为50~500nm。
6.根据权利要求1所述的一种氮化物发光二极管,其特征在于:所述V-pits开口开启层形成的V-pits的开口角度为55°~70°。
7.根据权利要求1所述的一种氮化物发光二极管,其特征在于:所述每一周期的V-pits开口封闭层由GaN组成。
8.根据权利要求1所述的一种氮化物发光二极管,其特征在于:所述每一周期的V-pits开口封闭层,厚度为50~500nm,Mg掺杂浓度为1.0E19~1.0E20cm-3。
9.根据权利要求1所述的一种氮化物发光二极管,其特征在于:所述每一周期的V-pits开口开启层由AlxInyGa1-x-yN组成,其中0.2≤x≤1,0≤y≤0.2。
10.根据权利要求1所述的一种氮化物发光二极管,其特征在于:所述每一周期的V-pits开口开启层,厚度为50~500 nm,无Mg掺杂。
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