CN107828979A - Copper facing expanded graphite strengthens the preparation method of metal-base composites - Google Patents
Copper facing expanded graphite strengthens the preparation method of metal-base composites Download PDFInfo
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- CN107828979A CN107828979A CN201711062990.1A CN201711062990A CN107828979A CN 107828979 A CN107828979 A CN 107828979A CN 201711062990 A CN201711062990 A CN 201711062990A CN 107828979 A CN107828979 A CN 107828979A
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/05—Mixtures of metal powder with non-metallic powder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/12—Both compacting and sintering
- B22F3/14—Both compacting and sintering simultaneously
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
Abstract
A kind of preparation method of copper facing expanded graphite enhancing metal-base composites is that oxidant and intercalator are added in native graphite, prepares expanded graphite under the high temperature conditions；By expanded graphite electroplating surface copper, copper facing expanded graphite is made；Copper facing expanded graphite and metal dust are subjected to ball milling and mix powder, using high-pressure molding, then low pressure sintering, composite is made.The present invention has bond strength, and dispersing uniformity is good, the advantages of improving product final properties.
Description
Technical field
The present invention relates to technical field of composite materials, and in particular to a kind of copper facing expanded graphite strengthens metal-base composites
Preparation method
Background technology
Expanded graphite is made of natural flake graphite, and the unique network hole formed in expansion process makes its tool
There is a larger specific surface area, easily dispersed, also stronger binding ability in preparation process；In addition have many excellent
Characteristic：Pliability, plasticity and outstanding self lubricity, anti-high and low temperature, resistance to oxidation, porous, absorption property is good, good
Electric conductivity and thermal conductivity.
In recent years, because graphite/metal based composites have numerous excellent performances, it is i.e. highly conductive with metal
Rate, high intensity and good ductility, there is the small spy of good lubricating properties, corrosion-resistant, low-expansion coefficient and the proportion of graphite again
Point, it is widely used in electrician's part such as liquid metallurgical material, self-lubricating bearing, brush, pantograph.But due to metal and stone
The wetability of ink is poor, causes bond strength not strong, metal can not form continuous three-dimensional network in material, it is difficult to keep burning
The intensity and anti-wear performance of knot body.And interface cohesion mode is mechanical interlocked, bond strength is low, bears interface during larger external force
It is easily destroyed.
The content of the invention
It is an object of the invention to provide a kind of bond strength, and dispersing uniformity is good, can improve the final items of product
The preparation method of the copper facing expanded graphite enhancing metal-base composites of energy.
The present invention is compound using copper facing expanded graphite and metal_based material, and copper facing expanded graphite has larger specific surface area
And three-dimensional net structure, the contact area, bond strength and dispersing uniformity with metallic matrix are not only increased, and copper facing is swollen
Swollen graphite can effectively improve the wetting property of graphite and metal, acceleration of sintering, be advantageous to metallic matrix and form continuous three
Network structure is tieed up, so as to improve the final properties of product, reaches the requirement of function and structure integration.
The present invention is achieved through the following technical solutions：
A kind of preparation method of copper facing expanded graphite enhancing metal-base composites, comprises the following steps：
(1) oxidant and intercalator, are added in native graphite, prepares expanded graphite under the high temperature conditions；
(2), by expanded graphite electroplating surface copper, copper facing expanded graphite is made；
(3) copper facing expanded graphite and metal dust, are subjected to ball milling and mix powder, using high-pressure molding, then low pressure sintering, is made
Composite.
Step (1) of the present invention is to use native graphite to add HClO in native graphite for raw material4And CH3COOH conducts
Intercalator, KMnO4As oxidant, the expansible graphite of not sulfur-bearing is made using chemical oxidization method, can be made at 200-1000 DEG C
It is 200-600mlg to obtain allowance for expansion-1Expanded graphite.
Step (2) expanded graphite electroplating surface copper of the present invention is to do anode using copper coin, and expanded graphite plate does negative electrode, passes through
Copper facing expanded graphite is made in pretreatment, configuration electroplate liquid, plating, passivation, cleaning, drying；Wherein preprocessing solution is 10-
30wt% concentrated nitric acid, filter, be washed with deionized water to neutrality after being ultrasonically treated 10-30min, obtain pre-processing thing；Wherein
Electroplate liquid forms：CuSO4：20-300g/L, Na2H2PO2：5-50g/L, CH3COOH：1-15g/L, dense H2SO4：10-100g/L；
Plating conditions：Current density 1-15Adm-2, electroplating time 20-120min；Wherein passivating solution is 1-3wt% phenylpropyl alcohol triazole
(BTA) alcoholic solution, passivation time 10-30min；Cleaning suction filtration is carried out to the copper facing expanded graphite after passivation, gained is produced
Thing is dried at 30-80 DEG C, and the weight/mass percentage composition for obtaining copper in copper facing expanded graphite is 10-80%.
Described metal dust is the one or more in iron, magnesium, aluminium, copper, nickel, titanium, silver and its alloyed powder, can use powder
The methods of end atomization or ball milling, prepares metal dust, and metal powder granulates are the mesh of 50 mesh -400.
Copper facing expanded graphite weight/mass percentage composition is 1-25wt% in the composite of the step (3)；Ball milling parameter：Ball
Vacuumized before mill, argon gas or nitrogen protection, ratio of grinding media to material：1:1-50:1, rotating speed 100-300r/min, Ball-milling Time 20-
3600min, sizing is once avoided every 10min reversions.
To prevent that copper is oxidized and metal powder is contaminated, ball grinder need to vacuumize before ball milling, and pour argon gas or helium
Protection.In the range of the ball milling parameter of the present invention, the shape of metallic particles and the uniformity of distribution can be preferably controlled.
The high-pressure molding of the step (3), then the concrete technology step of low pressure sintering is：Mixed powder is poured into mould to pave,
The cold moudling under the conditions of the moderate pressure 200-800MPa of room, is sintered in hydrogen reducing furnace mesolow 1-10MPa, and sintering temperature is low
In 50-300 DEG C of metal dust fusing point, obtained interface cohesion is good, the copper facing expanded graphite enhancing metal-based compound of excellent performance
Material.
Compared with prior art, the invention has the advantages that：
Copper facing expanded graphite has larger specific surface area and three-dimensional net structure, not only increases and is connect with metallic matrix
Contacting surface product, bond strength and scattered uniformity, and copper facing expanded graphite can effectively improve the infiltration of graphite and metal
Performance, acceleration of sintering, be advantageous to metallic matrix and form continuous tridimensional network, so as to improve the final items of product
Can, reach the requirement of function and structure integration.
Because the content of the copper facing expanded graphite of addition is different different with the material of metallic matrix, so composite is anti-
Curved intensity, Brinell hardness and thermal conductivity factor are also different, on the whole, under equal conditions, copper facing expanded graphite and Metal Substrate
The performance of composite material is better than non-copper facing expanded graphite and metal matrix composite materials, and wherein bending strength will be higher by 15-
30%, Brinell hardness will be higher by 10-20%, and thermal conductivity factor will be higher by 20-50%.
Embodiment
With reference to embodiment to the further detailed description of the present invention, embodiment is under the premise of with technical solution of the present invention
Implement, protection scope of the present invention is not limited to following embodiments.
Embodiment 1：
(1) HClO, is added in native graphite4And CH3COOH is as intercalator, KMnO4As oxidant, at 200 DEG C
Prepare allowance for expansion and can reach 210mlg-1Expanded graphite；
(2) expanded graphite electroplating surface copper, copper coin, are done into anode, expanded graphite plate does negative electrode, by pre-processing, configuring
Plating solution, plating, passivation, cleaning, drying can be prepared by copper facing expanded graphite；Wherein preprocessing solution is 10wt% concentrated nitric acid,
Filter, be washed with deionized water to neutrality after being ultrasonically treated 10min, obtain pre-processing thing；Wherein electroplate liquid forms：CuSO4：
40g/L, Na2H2PO2：10g/L, CH3COOH：3g/L, dense H2SO4：20g/L；Plating conditions：Current density 3Adm-2, during plating
Between 100min；Wherein passivating solution be 1wt% phenylpropyl alcohol triazole (BTA) alcoholic solution, passivation time 10min；After passivation
Copper facing expanded graphite carry out cleaning suction filtration, products therefrom is dried at 35 DEG C, obtains copper in copper facing expanded graphite
Weight/mass percentage composition is 20%.
(3) copper facing expanded graphite and metal dust, are subjected to ball milling and mix powder, using high-pressure molding, then low pressure sintering is done
Composite is made in method, last deep processing.
Copper facing expanded graphite weight/mass percentage composition is 5wt% in step (3) composite, ball milling parameter：Before ball milling
Vacuumize, argon gas or helium protection, ratio of grinding media to material：3:1, rotating speed 300r/min, Ball-milling Time 60min, every 10min reversions once
Avoid sizing.Metal dust is copper powder, and particle is 100 mesh.High-pressure molding, then the concrete technology step of low pressure sintering is：Will be mixed
Powder pours into mould and paved, the cold moudling under the conditions of the moderate pressure 200MPa of room, is sintered in hydrogen reducing furnace mesolow 10MPa,
Sintering temperature is less than 80 DEG C of metal dust fusing point, and obtained interface cohesion is good, the copper facing expanded graphite enhancing metal of excellent performance
Based composites.Its bending strength 115MPa, Brinell hardness 45HBS, thermal conductivity factor 452 (w/mk).
Expanded graphite is without the electroplating surface copper of step (2), other same the above.
The bending strength 96MPa of non-copper facing expanded graphite enhancing metal-base composites, Brinell hardness 38HBS, heat conduction system
Number 348 (w/mk).Copper-plated expanded graphite enhancing metal-base composites is than non-copper facing expanded graphite enhancing metal-based compound material
Bending strength, Brinell hardness and the thermal conductivity factor of material have been respectively increased 19.8%, 18.4% and 29.9%.
Embodiment 2：
Copper facing expanded graphite strengthens the preparation method of metal-base composites, comprises the steps of：
(1) HClO, is added in native graphite4And CH3COOH is as intercalator, KMnO4As oxidant, at 250 DEG C
Prepare allowance for expansion and can reach 270m Lg-1Expanded graphite；
(2) expanded graphite electroplating surface copper, copper coin, are done into anode, graphite cake does negative electrode, by pre-process, configure plating solution,
Plating, passivation, cleaning, drying can be prepared by copper facing expanded graphite；Wherein preprocessing solution be 15wt% concentrated nitric acid, ultrasound at
Filter, be washed with deionized water to neutrality after reason 15min, obtain pre-processing thing；Wherein electroplate liquid forms：CuSO4：80g/L,
Na2H2PO2：15g/L, CH3COOH：5g/L, dense H2SO4：40g/L；Plating conditions：Current density 5Adm-2, electroplating time
80min；Wherein passivating solution be 1.5wt% phenylpropyl alcohol triazole (BTA) alcoholic solution, passivation time 15min；After passivation
Copper facing expanded graphite carries out cleaning suction filtration, and products therefrom is dried at 45 DEG C, obtains the matter of copper in copper facing expanded graphite
It is 30% to measure percentage composition.
(3) copper facing expanded graphite and metal dust, are subjected to ball milling and mix powder, using high-pressure molding, then low pressure sintering is done
Composite is made in method, last deep processing.
Copper facing expanded graphite weight/mass percentage composition is 10wt% in described composite；Ball milling parameter：Taken out before ball milling true
Sky, argon gas or helium protection, ratio of grinding media to material：3:1, rotating speed 300r/min, Ball-milling Time 120min, once kept away every 10min reversions
Free sticky material.Metal dust is Al powder, and particle is 100 mesh.
High-pressure molding, then the concrete technology step of low pressure sintering is：Mixed powder is poured into grinding tool to pave, in room moderate pressure
Cold moudling under the conditions of 300MPa, is sintered in hydrogen reducing furnace mesolow 7MPa, and sintering temperature is less than metal dust fusing point 120
DEG C, obtained interface cohesion is good, the copper facing expanded graphite enhancing metal-base composites of excellent performance.Its bending strength 45MPa,
Brinell hardness 30HBS, thermal conductivity factor 180 (w/mk).
Expanded graphite is without the electroplating surface copper of step (2), other same the above.
The bending strength 37MPa of non-copper facing expanded graphite enhancing metal-base composites, Brinell hardness 26HBS, heat conduction system
Number 150 (w/mk).Copper-plated expanded graphite enhancing metal-base composites is than non-copper facing expanded graphite enhancing metal-based compound material
Bending strength, Brinell hardness and the thermal conductivity factor of material have been respectively increased 21.6%, 15.4% and 20%.
Embodiment 3：
(1) HClO, is added in native graphite4And CH3COOH is as intercalator, KMnO4As oxidant, at 300 DEG C
Prepare allowance for expansion and can reach 310m Lg-1Expanded graphite；
(2) expanded graphite electroplating surface copper, copper coin, are done into anode, graphite cake does negative electrode, by pre-process, configure plating solution,
Plating, passivation, cleaning, drying can be prepared by copper facing expanded graphite；Wherein preprocessing solution be 20wt% concentrated nitric acid, ultrasound at
Filter, be washed with deionized water to neutrality after reason 20min, obtain pre-processing thing；Wherein electroplate liquid forms：CuSO4：120g/L,
Na2H2PO2：25g/L, CH3COOH：7g/L, dense H2SO4：60g/L；Plating conditions：Current density 7Adm-2, electroplating time
60min；Wherein passivating solution be 2wt% phenylpropyl alcohol triazole (BTA) alcoholic solution, passivation time 20min；To the plating after passivation
Copper expanded graphite carries out cleaning suction filtration, and products therefrom is dried at 55 DEG C, obtains the quality of copper in copper facing expanded graphite
Percentage composition is 50%.
(3) copper facing expanded graphite and metal dust, are subjected to ball milling and mix powder, using high-pressure molding, then low pressure sintering is done
Composite is made in method, last deep processing.
Copper facing expanded graphite weight/mass percentage composition is 15wt% in described composite；Ball milling parameter：Taken out before ball milling true
Sky, argon gas or helium protection, ratio of grinding media to material：3:1, rotating speed 300r/min, Ball-milling Time 180min, once kept away every 10min reversions
Free sticky material.Metal dust is copper powder, and particle is 300 mesh.
High-pressure molding, then the concrete technology step of low pressure sintering is：Mixed powder is poured into grinding tool to pave, in room moderate pressure
Cold moudling under the conditions of 500MPa, is sintered in hydrogen reducing furnace mesolow 5MPa, and sintering temperature is less than metal dust fusing point 150
DEG C, obtained interface cohesion is good, the copper facing expanded graphite enhancing metal-base composites of excellent performance.Its bending strength 80MPa,
Brinell hardness 55HBS, thermal conductivity factor 460 (w/mk).
Expanded graphite is without the electroplating surface copper of step (2), other same the above.
The bending strength 68MPa of non-copper facing expanded graphite enhancing metal-base composites, Brinell hardness 49HBS, heat conduction system
Number 362 (w/mk).Copper-plated expanded graphite enhancing metal-base composites is than non-copper facing expanded graphite enhancing metal-based compound material
Bending strength, Brinell hardness and the thermal conductivity factor of material have been respectively increased 17.6%, 12.2% and 27.1%.
Embodiment 4：
(1) HClO, is added in native graphite4And CH3COOH is as intercalator, KMnO4As oxidant, at 350 DEG C
Prepare allowance for expansion and can reach 370m Lg-1Expanded graphite；
(2) expanded graphite electroplating surface copper, copper coin, are done into anode, graphite cake does negative electrode, by pre-process, configure plating solution,
Plating, passivation, cleaning, drying can be prepared by copper facing expanded graphite；Wherein preprocessing solution be 25wt% concentrated nitric acid, ultrasound at
Filter, be washed with deionized water to neutrality after reason 25min, obtain pre-processing thing；Wherein electroplate liquid forms：CuSO4：180g/L,
Na2H2PO2：30g/L, CH3COOH：9g/L, dense H2SO4：80g/L；Plating conditions：Current density 9Adm-2, electroplating time
40min；Wherein passivating solution be 2.5wt% phenylpropyl alcohol triazole (BTA) alcoholic solution, passivation time 25min；After passivation
Copper facing expanded graphite carries out cleaning suction filtration, and products therefrom is dried at 65 DEG C, obtains the matter of copper in copper facing expanded graphite
It is 60% to measure percentage composition；
(3) copper facing expanded graphite and metal dust, are subjected to ball milling and mix powder, using high-pressure molding, then low pressure sintering is done
Composite is made in method, last deep processing.
Copper facing expanded graphite weight/mass percentage composition is in described copper facing expanded graphite and metal-base composites powder
20wt%；Copper-plated weight/mass percentage composition is 60% in copper facing expanded graphite；Ball milling parameter：Vacuumized before ball milling, argon gas or helium
Gas shielded, ratio of grinding media to material：1:1, rotating speed 300r/min, Ball-milling Time 240min, sizing is once avoided every 10min reversions.Metal
Powder is aluminium powder, and particle is 300 mesh.
High-pressure molding, then the concrete technology step of low pressure sintering is：Mixed powder is poured into grinding tool to pave, in room moderate pressure
Cold moudling under the conditions of 600MPa, is sintered in hydrogen reducing furnace mesolow 3MPa, and sintering temperature is less than metal dust fusing point 180
DEG C, obtained interface cohesion is good, the copper facing expanded graphite enhancing metal-base composites of excellent performance.Its bending strength 25MPa,
Brinell hardness 35HBS, thermal conductivity factor 195 (w/mk).
Expanded graphite is without the electroplating surface copper of step (2), other same the above.
The bending strength 20MPa of non-copper facing expanded graphite enhancing metal-base composites, Brinell hardness 30HBS, heat conduction system
Number 162 (w/mk).Copper-plated expanded graphite enhancing metal-base composites is than non-copper facing expanded graphite enhancing metal-based compound material
Bending strength, Brinell hardness and the thermal conductivity factor of material have been respectively increased 25%, 16.7% and 20.4%.
Embodiment 5：
(1) HClO, is added in native graphite4And CH3COOH is as intercalator, KMnO4As oxidant, at 400 DEG C
Prepare allowance for expansion and can reach 420m Lg-1Expanded graphite；
(2) expanded graphite electroplating surface copper, copper coin, are done into anode, graphite cake does negative electrode, by pre-process, configure plating solution,
Plating, passivation, cleaning, drying can be prepared by copper facing expanded graphite；Wherein preprocessing solution be 25wt% concentrated nitric acid, ultrasound at
Filter, be washed with deionized water to neutrality after reason 25min, obtain pre-processing thing；Wherein electroplate liquid forms：CuSO4：240g/L,
Na2H2PO2：40g/L, CH3COOH：12g/L, dense H2SO4：90g/L；Plating conditions：Current density 12Adm-2, electroplating time
20min；Wherein passivating solution be 3wt% phenylpropyl alcohol triazole (BTA) alcoholic solution, passivation time 30min；To the plating after passivation
Copper expanded graphite carries out cleaning suction filtration, and products therefrom is dried at 75 DEG C, obtains the quality of copper in copper facing expanded graphite
Percentage composition is 75%；
(3) copper facing expanded graphite and metal dust, are subjected to ball milling and mix powder, using high-pressure molding, then low pressure sintering is done
Composite is made in method, last deep processing.
Copper facing expanded graphite weight/mass percentage composition is in described copper facing expanded graphite and metal-base composites powder
25wt%；Copper-plated weight/mass percentage composition is 75% in copper facing expanded graphite；Ball milling parameter：Vacuumized before ball milling, argon gas or helium
Gas shielded, ratio of grinding media to material：1:1, rotating speed 300r/min, Ball-milling Time 300min, sizing is once avoided every 10min reversions.Metal
Powder is copper+Titanium Powder, and particle is 400 mesh.
High-pressure molding, then the concrete technology step of low pressure sintering is：Mixed powder is poured into grinding tool to pave, in room moderate pressure
Cold moudling under the conditions of 800MPa, is sintered in hydrogen reducing furnace mesolow 2MPa, and sintering temperature is less than metal dust fusing point 200
DEG C, obtained interface cohesion is good, the copper facing expanded graphite enhancing metal-base composites of excellent performance.Its bending strength 60MPa,
Brinell hardness 50HBS, thermal conductivity factor 475 (w/mk).
Expanded graphite is without the electroplating surface copper of step (2), other same the above.
The bending strength 50MPa of non-copper facing expanded graphite enhancing metal-base composites, Brinell hardness 43HBS, heat conduction system
Number 383 (w/mk).Copper-plated expanded graphite enhancing metal-base composites is than non-copper facing expanded graphite enhancing metal-based compound material
Bending strength, Brinell hardness and the thermal conductivity factor of material have been respectively increased 20%, 16.3% and 24%.
Claims (14)
1. a kind of preparation method of copper facing expanded graphite enhancing metal-base composites, it is characterised in that comprise the following steps：
（1）, oxidant and intercalator are added in native graphite, prepare expanded graphite under the high temperature conditions；
（2）, by expanded graphite electroplating surface copper, copper facing expanded graphite is made；
（3）, copper facing expanded graphite and metal dust are subjected to ball milling mix powder, using high-pressure molding, then low pressure sintering, be made compound
Material.
2. a kind of preparation method of copper facing expanded graphite enhancing metal-base composites as claimed in claim 1, its feature exist
In step（1）It is to use native graphite to add HClO in native graphite for raw material4And CH3COOH is as intercalator, KMnO4
As oxidant, the expansible graphite of the obtained not sulfur-bearing of chemical oxidization method is used.
3. a kind of preparation method of copper facing expanded graphite enhancing metal-base composites as claimed in claim 1, its feature exist
In step（1）Expanded graphite is that allowance for expansion can be made at 200-1000 DEG C is 200-600 mlg-1Expanded graphite.
4. a kind of preparation method of copper facing expanded graphite enhancing metal-base composites as claimed in claim 1, its feature exist
In step（2）Expanded graphite electroplating surface copper is to do anode using copper coin, and expanded graphite plate does negative electrode, by pre-processing, configuring
Copper facing expanded graphite is made in electroplate liquid, plating, passivation, cleaning, drying.
5. a kind of preparation method of copper facing expanded graphite enhancing metal-base composites as claimed in claim 4, its feature exist
In the concentrated nitric acid that preprocessing solution is 10-30wt %, filter, be washed with deionized water to neutrality after being ultrasonically treated 10-30 min,
Obtain pre-processing thing.
6. a kind of preparation method of copper facing expanded graphite enhancing metal-base composites as claimed in claim 4, its feature exist
Formed in electroplate liquid：CuSO4：20-300 g/L, Na2H2PO2：5-50 g/L, CH3COOH：1-15 g/L, dense H2SO4：10-100
g/L。
7. a kind of preparation method of copper facing expanded graphite enhancing metal-base composites as claimed in claim 4, its feature exist
In plating conditions：Current density 1-15 Adm-2, electroplating time 20-120 min.
8. a kind of preparation method of copper facing expanded graphite enhancing metal-base composites as claimed in claim 4, its feature exist
In the phenylpropyl alcohol triazole alcoholic solution that passivating solution is 1-3 wt%, passivation time is 10-30 min.
9. a kind of preparation method of copper facing expanded graphite enhancing metal-base composites as claimed in claim 4, its feature exist
Copper facing expanded graphite after to passivation carries out suction filtration cleaning, and products therefrom is dried at 30-80 DEG C.
10. a kind of preparation method of copper facing expanded graphite enhancing metal-base composites as claimed in claim 1, its feature exist
The weight/mass percentage composition of copper is 10-80% in copper facing expanded graphite.
11. a kind of preparation method of copper facing expanded graphite enhancing metal-base composites as claimed in claim 1, its feature exist
In the step（3）Metal dust be iron, magnesium, aluminium, copper, nickel, titanium, silver and its alloyed powder in one or more, metal powder
Last particle is the mesh of 50 mesh -400.
12. a kind of preparation method of copper facing expanded graphite enhancing metal-base composites as claimed in claim 1, its feature exist
In the step（3）Composite in copper facing expanded graphite weight/mass percentage composition be 1-25 wt%.
13. a kind of preparation method of copper facing expanded graphite enhancing metal-base composites as claimed in claim 1, its feature exist
In the step（3）Ball milling parameter：Vacuumized before ball milling, argon gas or nitrogen protection, ratio of grinding media to material：1:1-50:1, rotating speed 100-
300 r/min, Ball-milling Time 20-3600 min, sizing is once avoided every 10 min reversions.
14. a kind of preparation method of copper facing expanded graphite enhancing metal-base composites as claimed in claim 1, its feature exist
In the step（3）High-pressure molding, then the concrete technology step of low pressure sintering is：Mixed powder is poured into mould to pave, in room temperature
With cold moudling under the conditions of pressure 200-800MPa, sintered in hydrogen reducing furnace mesolow 1-10MPa, sintering temperature is less than metal
50-300 DEG C of its melting point.
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109014216A (en) * | 2018-09-03 | 2018-12-18 | 大同新成新材料股份有限公司 | A kind of pantograph pan preparation process based on copper coated graphite powder |
| CN110453100A (en) * | 2019-08-02 | 2019-11-15 | 中国科学院山西煤炭化学研究所 | It is a kind of in-situ inserted to prepare graphite/carbon/carbon-copper composite material method |
| CN110453206A (en) * | 2019-08-08 | 2019-11-15 | 长春工业大学 | Press from both sides metal layer crystalline flake graphite and its preparation method and application |
| CN110802225A (en) * | 2019-10-11 | 2020-02-18 | 广州盛门新材料科技有限公司 | Preparation method of copper-coated graphene |
| CN112276077A (en) * | 2020-10-28 | 2021-01-29 | 福州市辰亿五金制品有限公司 | High-wear-resistance copper-coated graphite for oil-retaining bearing and manufacturing method thereof |
| CN113151820A (en) * | 2021-03-03 | 2021-07-23 | 江苏翰纳激光科技有限公司 | Preparation method for in-situ synthesis of carbide-reinforced toughened metal-based composite coating by taking expanded graphite as carbon source |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109014216A (en) * | 2018-09-03 | 2018-12-18 | 大同新成新材料股份有限公司 | A kind of pantograph pan preparation process based on copper coated graphite powder |
| CN110453100A (en) * | 2019-08-02 | 2019-11-15 | 中国科学院山西煤炭化学研究所 | It is a kind of in-situ inserted to prepare graphite/carbon/carbon-copper composite material method |
| CN110453206A (en) * | 2019-08-08 | 2019-11-15 | 长春工业大学 | Press from both sides metal layer crystalline flake graphite and its preparation method and application |
| CN110453206B (en) * | 2019-08-08 | 2021-07-20 | 长春工业大学 | Metal-sandwiched layer flake graphite and preparation method and application thereof |
| CN110802225A (en) * | 2019-10-11 | 2020-02-18 | 广州盛门新材料科技有限公司 | Preparation method of copper-coated graphene |
| CN112276077A (en) * | 2020-10-28 | 2021-01-29 | 福州市辰亿五金制品有限公司 | High-wear-resistance copper-coated graphite for oil-retaining bearing and manufacturing method thereof |
| CN113151820A (en) * | 2021-03-03 | 2021-07-23 | 江苏翰纳激光科技有限公司 | Preparation method for in-situ synthesis of carbide-reinforced toughened metal-based composite coating by taking expanded graphite as carbon source |
| CN113151820B (en) * | 2021-03-03 | 2023-01-20 | 江苏翰纳激光科技有限公司 | Preparation method for in-situ synthesis of carbide-reinforced toughened metal-based composite coating by taking expanded graphite as carbon source |
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