CN107808863A - Array base palte and display panel - Google Patents
Array base palte and display panel Download PDFInfo
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- CN107808863A CN107808863A CN201711047610.7A CN201711047610A CN107808863A CN 107808863 A CN107808863 A CN 107808863A CN 201711047610 A CN201711047610 A CN 201711047610A CN 107808863 A CN107808863 A CN 107808863A
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- arc
- pad
- shaped side
- base palte
- array base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/1301—Shape
- H01L2224/13012—Shape in top view
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
- H01L2224/141—Disposition
- H01L2224/1412—Layout
- H01L2224/1414—Circular array, i.e. array with radial symmetry
- H01L2224/14141—Circular array, i.e. array with radial symmetry being uniform, i.e. having a uniform pitch across the array
Abstract
The present invention relates to display technology field, more particularly to a kind of array base palte and display panel.This array base palte includes：Pad area and multiple pads, the pad area have at least one arc-shaped side；Each pad is successively set in the pad area along the arc-shaped side, each pad include it is relative and disjoint first while and when second, first side is adjacent with the arc-shaped side, and described first while the distance between two-end-point with described second while the distance between two-end-point it is unequal.In the present embodiment, when the pad on array base palte and other structures are bound, due on pad with respect to and disjoint first while the distance between two-end-point and the distance between two-end-point when second it is unequal, therefore, the situation for causing another side integrally to be deflected away from after one side off normal of pad can be alleviated, bad situation is bound so as to alleviate pad.
Description
Technical field
The present invention relates to display technology field, more particularly to a kind of array base palte and display panel.
Background technology
As display screen should in mobile unit (fascia), Intelligent worn device and other portable electric appts
Popularization, special-shaped display screen are favored by consumer.
Compared to convention display, the main distinction of special-shaped display screen is that non-rectangle special form is presented in its array area
Shape.And in general, the pad in display screen is mostly rectangular configuration, when the rectangular pads are applied to special-shaped display screen, especially
It is that the border of rectangular pads and array area can not be fully mated when being applied to circular display screen, so as to reduce connecing for pad
Contacting surface accumulate, be not easy to pad and bound, and its carry out binding procedure in easily cause binding it is bad.
The content of the invention
The invention provides a kind of array base palte and display panel, can alleviate pad and bind bad situation.
The invention provides a kind of array base palte, and it includes：
Pad area, the pad area have at least one arc-shaped side；
Multiple pads, each pad are successively set in the pad area along the arc-shaped side, each pad bag
Include it is relative and disjoint first while and when second, first side is adjacent with the arc-shaped side, and the both ends on first side
The distance between the distance between the point two-end-point on second side is unequal.
Present invention also offers a kind of display panel, and it includes the array base palte described in any of the above-described.
Technical scheme provided by the invention can reach following beneficial effect：
Array base palte provided by the present invention, it include with least one arc-shaped side pad area and along this arc-shaped side according to
The secondary multiple pads for being arranged on pad area, each pad include it is relative and disjoint first while and when second, the two of this first side
The distance between end points and the distance between the two-end-point on the second side are unequal.Pad and other structures on array base palte
(such as：Chip on film) when being bound, due on pad with respect to and disjoint first side the distance between two-end-point and
The distance between the two-end-point on the second side is unequal, therefore, causes another side integrally to be deflected away from after can alleviating one side off normal of pad
Situation, bind bad situation so as to alleviate pad.
It should be appreciated that the general description and following detailed description of the above are only exemplary, this can not be limited
Invention.
Brief description of the drawings
The top view for the array base palte that Fig. 1 is provided by one embodiment of the invention；
In the array base palte that Fig. 2 is provided by the embodiment of the present invention, the structure top view of pixel cell；
Fig. 3 is Fig. 2 A-A to sectional view；
The top view for the array base palte that Fig. 4 is provided by another embodiment of the present invention；
The part-structure schematic diagram for the array base palte that Fig. 5 to Figure 21 is provided by different embodiments of the invention.
Reference：
1- array base paltes；
10- pad areas；
The arc-shaped sides of 100- first；
The arc-shaped sides of 102- second；
12- pads；
The sides of 120- first；
The sides of 122- second；
The sides of 124- the 3rd；
The sides of 126- the 4th；
14- array areas；
140- pixel cells；
140a- source electrodes；
140b- drains；
140c- grids；
140d- pixel electrodes；
142- leads；
144- touch control electrodes；
16- underlay substrates.
Accompanying drawing herein is merged in specification and forms the part of this specification, shows the implementation for meeting the present invention
Example, and for explaining principle of the invention together with specification.
Embodiment
The present invention is described in further detail below by specific embodiment and with reference to accompanying drawing.To make the present invention's
Above-mentioned purpose, feature and advantage can become apparent understandable, and the present invention is done furtherly below in conjunction with drawings and examples
It is bright.However, example embodiment can be implemented in a variety of forms, and it is not understood as limited to embodiment set forth herein；
On the contrary, thesing embodiments are provided so that the present invention more comprehensively and completely, and the design of example embodiment is comprehensively passed on
To those skilled in the art.Identical reference represents same or similar structure in figure, thus will omit to them
Repeated description.The word of expression position and direction described in the present invention, is the explanation carried out by taking accompanying drawing as an example, but according to
Need to make a change, make change and be all contained in the scope of the present invention.The accompanying drawing of the present invention is only used for illustrating phase
To position relationship, the thickness at some positions employs the plotting mode lavished praise on oneself in order to understand, the thickness in accompanying drawing does not represent
The proportionate relationship of actual thickness.
It should be noted that detail is elaborated in the following description in order to fully understand the present invention.But this hair
Bright to be different from other manner described here with a variety of and be implemented, those skilled in the art can be without prejudice in the present invention
Similar popularization is done in the case of culvert.Therefore the present invention is not limited by following public embodiment.Specification is subsequently retouched
State to implement the better embodiment of the present invention, so described is for the purpose of illustrating the rule of the present invention, and is not used to
Limit the scope of the present invention.Protection scope of the present invention is worked as to be defined depending on appended claims institute defender.
The present invention is described in further detail below by specific embodiment and with reference to accompanying drawing.Wherein, in accompanying drawing
The thickness and shape of each part do not reflect the actual proportions of display device, and purpose is schematically illustrate present invention.Need
Bright, in the case where not conflicting, the feature in embodiment and embodiment in the present invention can be mutually combined.
The top view for the array base palte 1 that Fig. 1 is provided by the embodiment of the present invention, the array base palte 1 can be applied to liquid crystal
Show in panel, organic electroluminescence display panel and touch sensor.
As shown in figure 1, array base palte 1 comprises at least pad area 10 and the array area 14 adjacent with pad area 10, the array
Area 14 is the working region of array base palte 1, can have lead 142 (signal wire), the pixel cells such as grid line, data wire and touch-control line
140th, the component such as touch control electrode；And pad area 10 is (for example, covering by the signal wire of array base palte 1 with outside drive circuit board
Brilliant film) the region bound of signal wire, pad area is typically provided only with lead, without components such as pixel cells.
Wherein, the lead of the drive circuit board of outside electrically connects with the signal wire of array base palte 1 for convenience, can be in pad
Multiple pads 12 are set in area 10, and each pad 12 is electrically connected with the signal wire of pad area 10, equivalent to the pin of signal wire, is used in combination
Electrically connected in the lead of the drive circuit board with outside.
Specifically, array base palte 1 may also include underlay substrate 16, and array area 14 includes multiple pixel cells 140, each picture
Plain unit 140 is located on underlay substrate 16 and is arranged in array, and the direction of the row of this array arrangement is the x directions shown in Fig. 1,
The direction of row is the y directions shown in Fig. 1, it is necessary to which the number of explanation, each row or the pixel cell 140 in each row can not phase
Deng, that is to say, that each pixel cell 140 can be in that non-rectangular arrays are arranged.
Fig. 2 is the structural representation of pixel cell 140, and Fig. 3 is Fig. 2 sectional view along line A-A.Such as Fig. 2 and Fig. 3 institutes
Show, each pixel cell 140 includes thin film transistor (TFT) and pixel electrode 140d, and the thin film transistor (TFT) includes source electrode 140a, drain electrode
140b and grid 140c, wherein, source electrode 140a, drain electrode 140b, grid 140c and pixel electrode 140d are sequentially located at underlay substrate
On 16, grid 140c electrically connects with gate line, and source electrode 140a/ drain electrodes 140b is electrically connected with data wire, pixel electrode 140d respectively
Connect.
As depicted in figs. 1 and 2, array area 14 includes a plurality of leads 142, and one end of this lead 142 enters pad area 10 simultaneously
Electrically connected with pad 12.Alternatively, the source electrode 140a of thin film transistor (TFT) or drain electrode 140b can be electrically connected with the other end of lead 142
Connecing, that is to say, that at least a portion lead 142 of array area 14 can be data wire, and one end of data wire electrically connects with pad 12,
The other end of data wire electrically connects with the source electrode 140a or drain electrode 140b of thin film transistor (TFT).
When array base palte 1 is applied in touch sensor, as shown in figure 4, the array area 14 then includes multiple touch-controls electricity
Pole 144, to be sensed to touch.Specifically, touch control electrode 144 can electrically connect with the other end of above-mentioned lead 142, that is,
Say, at least a portion lead 142 of array area 14 can be touch-control line, the both ends of touch-control line respectively with touch control electrode 144 and pad
12 electrical connections.
It should be noted that on the thickness direction of array base palte 1, touch control electrode 144 can be multiplexed with public electrode, this
The preferably rectangular bulk of public electrode.As shown in Figure 1 and Figure 4, pad area 10 has at least one arc-shaped side, because arc-shaped side is in
Bending, in order to fully improve the space availability ratio of pad area 10, therefore, each pad 12 can be successively set on along arc-shaped side
In pad area 10, that is to say, that the arragement direction of each pad 12 is identical with the bearing of trend of arc-shaped side, and so design can improve weldering
The space availability ratio in panel 10, so as to increase the contact area of pad 12, because the contact area of pad 12 increases, therefore,
On the one hand bound using the pad 12 on pad area 10 with other structures, on the other hand can reduce the binding electricity of pad 12
Resistance, improve the display effect of array area 14.
Wherein, each pad 12 includes relative and disjoint first at 120 and second 122, this first side 120 and arc
Side is adjacent, and first when 120 the distance between two-end-point is with second the distance between 122 two-end-point it is unequal.Also
To say, first at 120 and second 122 in there is the distance between the two-end-point on one side to be more than another side, on array base palte 1
During pad 12 and other structures are bound, if first at 120 and second 122 in it is in small distance between two-end-point
One side with respect to other structures occur off normal, because the distance between the two-end-point of another side is relatively large, therefore, in array base
On the thickness direction of plate 1, even if one side in small distance between two-end-point and other structures generation off normal, distance between two-end-point
At least a portion of larger another side remains able to binding that is relative with other structures and realizing pad 12 and other structures, delays
Solve pad 12 and bind bad situation.
It should be noted that the other structures mentioned above bound with the pad of pad area 10 12 can be that flip is thin
Pad on film or FPC (Flexible Printed Circuit, flexible PCB), that is to say, that on the pad area 10
Pad 12 can be bound with the pad in chip on film or FPC, to provide signal for array area 14.
Alternatively, border of at least one arc-shaped side of pad area 10 between array area 14 and pad area 10.Namely
Say, the array area 14 adjacent with pad area 10 be heteromorphic regions (i.e.：Non-rectangle area), for example, the circle shown in Fig. 1 and Fig. 4, should
Array base palte 1 with this special-shaped array area 14 can be applied to dress display (such as wrist-watch) and be easy to be installed to automobile instrument
Special-shaped display panel on plate is (i.e.：Non-rectangle display panel) in.
In one embodiment of the invention, arc-shaped side has convex side B and concave side C (as shown in Figure 5), when pad 12 is located at
The convex side B of arc-shaped side, first when 120 the distance between two-end-point is less than second the distance between 122 two-end-point, work as weldering
Disk 12 is located at the concave side C of arc-shaped side, and first when 120 the distance between two-end-point is more than second between 122 two-end-point
Distance.
Due to first at 120 and second 122 part for belonging to pad 12, therefore, when pad 12 is located at arc-shaped side
During convex side B, then illustrate the first of pad 12 at 120 and second the 122 convex side B for also being located at arc-shaped side.Wherein, carried due to above-mentioned
It is adjacent with arc-shaped side to the first side 120, that is to say, that first while 120 compared to second while 122 closer to arc-shaped side convex side B,
Therefore can by first while 120 the design of the distance between two-end-point the distance between 122 two-end-point when being less than second, pass through
The distance between two-end-point by the first side 120 designs relatively small, can make full use of the space at the convex side B of arc-shaped side,
While the binding area of each pad 12 is increased, can make to set more pads 12 on pad area 10.
Similarly, when pad 12 is located at the concave side C of arc-shaped side, then illustrate the first of pad 12 at 120 and second 122 also positions
In the concave side C of arc-shaped side.Wherein, because the first side 120 is adjacent with arc-shaped side, that is to say, that first while 120 compared to second while
122 closer to arc-shaped side concave side C, therefore can be by the first 122 when being more than second of the distance between two-end-point design while 120
The distance between two-end-point, it is relatively large by the way that the distance between the two-end-point on the first side 120 is designed, can make full use of
Space at the concave side C of arc-shaped side, while the binding area of each pad 12 is increased, can make to set more on pad area 10
More pads 12.
The part-structure schematic diagram for the array base palte 1 that Fig. 5 to Figure 21 is provided by different embodiments of the invention.Alternatively,
The arc-shaped side of pad area 10 is at least two, including relative the first arc-shaped side 100 and the second arc-shaped side 102, the first arc-shaped side
100 is identical with the concave and convex direction of the second arc-shaped side 102.Pad 12 between the first arc-shaped side 100 and the second arc-shaped side 102,
And the first side 120 of pad 12 is close to the first arc-shaped side 100, the second side 122 of pad 12 is close to the second arc-shaped side 102, first
The distance between 122 two-end-point when 120 the distance between two-end-point is less than second.That is, pad 12 is arranged on
On pad area 10, and positioned at the convex side B and the concave side C positioned at the second arc-shaped side 102 of the first arc-shaped side 100, so design can
The space of pad area 10 is made full use of, i.e.,：The space at the convex side B of the first arc-shaped side 100 and the second arc can be made full use of
Space at the concave side C on side 102, while the binding area of each pad 12 is increased, can make to set more on pad area 10
More pads 12.
Wherein, the first arc-shaped side 100 of pad area 10 and the second arc-shaped side 102 can be in circular arc, and the first arc-shaped side
100 center of circle overlaps with the center of circle of the second arc-shaped side 102, that is to say, that points to the second arc-shaped side 102 in the first arc-shaped side 100
And on the direction by the center of circle of the first arc-shaped side 100 (the second arc-shaped side 102), the first arc-shaped side 100 and the second arc-shaped side 102
Upper relative the distance between 2 points equal everywhere so that each pad 12 set gradually along the arc-shaped side of pad area 10 can use
Same specification, to reduce the design difficulty of array base palte 1, and it is easy to array base palte 1 to be bound with other structures.
Because the first arc-shaped side 100 of pad area 10 and the second arc-shaped side 102 can be in circular arc, therefore, the pad area
10 can be adapted with the array area 14 with circular arc border, such as：Circular array area 14, as shown in Figure 1 and Figure 4, array
Area 14 is circle, and pad area 10 is the annular pad area 10 set around array area 14, wherein, the first arc-shaped side 100 can
For the part on the inner ring side in annular welds panel 10, the second arc-shaped side 102 can be one in the outer annular edge in annular welds panel 10
Part.
As shown in Fig. 5 to Figure 16, in one embodiment of the invention, above-mentioned first at 120 and second 122 in extremely
Few one is arc-shaped edges, and the center of circle of this arc-shaped edges overlaps with the center of circle of the first arc-shaped side 100, to ensure in the first arc-shaped side 100
Point on the second arc-shaped side 102 and direction by the center of circle of the first arc-shaped side 100 (the second arc-shaped side 102), arc-shaped edges and the
It is equal everywhere with respect to the distance between 2 points on one arc-shaped side 100 (the second arc-shaped side 102).Wherein, in arc-shaped edges and the first arc
Be equal on shape side 100 with respect to the distance between 2 points zero or the radius equal to the second arc-shaped side 102 and the first arc-shaped side 100 partly
During the difference in footpath, then illustrate that arc-shaped edges overlap with the first arc-shaped side 100 or the second arc-shaped side 102, without gap, therefore the weldering
Disk 12 can make full use of the first arc-shaped side 100 on pad area 10 or the space at the second arc-shaped side 102, be effectively increased pad 12
Binding area, alleviate pad 12 and other structures and bind bad situation.
In addition, it can be seen from resistance formula, in material and thickness (thickness direction of pad 12 and the array base of each pad 12
The thickness direction of plate 1 is identical) timing, the area of section of pad 12 is (i.e.：Bind area) bigger, the then binding resistance of pad 12
It is smaller, because the binding resistance of pad 12 reduces, hence in so that the energy that pad 12 is consumed reduces, so as to improve array area
14 display effect.
One alternatively in scheme, as shown in figure 5, first 122 is arc-shaped edges at 120 and second, and the first side 120
Overlapped with the first arc-shaped side 100, the second side 122 overlaps with the second arc-shaped side 102, that is to say, that the first side 120 and the first arc
Do not have gap between side 100, do not have gap between the second side 122 and the second arc-shaped side 102, therefore the pad 12 is fully sharp
With the first arc-shaped side 100 on pad area 10 and the space at the second arc-shaped side 102, the binding face of pad 12 is considerably increased
Product.Due to the binding area increase of pad 12, therefore, effectively reduce the binding resistance of pad 12 and reduce pad area 10
On pad 12 and other structures contraposition difficulty.Further, since the first side 120 overlaps with the first arc-shaped side 100, the second side
122 overlap with the second arc-shaped side 102, when pad 12 is arranged on into pad area 10, only need to position the first side 120 and the first arc
While 100 position relationship or positioning second while 122 with second arc-shaped side 102 position relationship, it is not necessary to while positioning the first side
120 and first arc-shaped side 100 position relationship and positioning the second side 122 and the second arc-shaped side 102 position relationship, improve weldering
The efficiency of assembling of disk 12 and pad area 10.
Preferably, first at 120 and second 122 between the line of opposite end point pass through the first arc-shaped side 100 (second
Arc-shaped side 102) the center of circle, that is to say, that first while 120 with second while 122 corresponding to central angle it is identical, according to similar triangle
Shape theorem, first when 120 length of side is with second the ratio of 122 length of side be：The radius and the second arc of first arc-shaped side 100
The ratio of the radius on side 102, so design can avoid the second difference mistake in 122 length of side and first between 120 length of side
Greatly, that is to say, that space larger at the second arc-shaped side 102 of long occupancy of the second side 122 can be avoided by so designing, and the first side
120 length of side is too short to take less space at the first arc-shaped side 100, so as to cause space waste at the first arc-shaped side 100
Situation, by the ratio of 122 length of side when 120 length of side is with second of rational design first, each pad 12 can increased
While binding area, the space of pad area is rationally utilized, makes to set more pads 12 on pad area 10.Another is alternatively
In scheme, as shown in figure 9, the first side 120 is straight line, by the way that the first side 120 is designed as into straight line, pad 12 can be reduced
Difficulty of processing, and the first side 120 and the first arc-shaped side 100 is tangent, it can make full use of on pad area 10 at first arc-shaped side 100
Space, to increase the binding area of pad 12；And the second side 122 is arc-shaped edges, and the second side 122 and the second arc-shaped side 102
Overlap (i.e.：Without gap), the space at the second arc-shaped side 102 on pad area 10 can be made full use of, further increases pad
12 binding area, alleviate pad 12 and bind bad situation with other structures.Wherein, due to the second side 122 and the second arc
Side 102 is arc-shaped edges, and the second side 122 can overlap with the second arc-shaped side 102, therefore, pad 12 is being positioned at into pad
During area 10, first the second side 122 and the second arc-shaped side 102 can be positioned, specifically, only need to be by the second side 122 and the second arc
Shape side 102 is completely superposed, it becomes possible to realizes the positioning of the second side 122 and the second arc-shaped side 102.When the second side 122 and the second arc
When shape side 102 is completely superposed, due to the above-mentioned design of pad, the first side 120 is natural tangent with the first arc-shaped side 100, it is not necessary to
Positioned to the first side 120 and the first arc-shaped side 100, therefore improve the efficiency of assembling of pad 12 and pad area 10.Need
It is noted that because the second arc-shaped side 102 is the side away from array area 14, it is fixed by the second side 122 and the second arc-shaped side 102
The assembling of pad 12 and pad area 10 is realized in position, can alleviate the feelings of assembling process assembly fixture or the damage of pad 12 array area 14
Condition.
Further, since the second arc-shaped side 102 is the side away from array area 14, in the second arc-shaped side 102 and the first arc-shaped side
When central angle corresponding to 100 is identical, the length of the second arc-shaped side 102 is more than the length of the first arc-shaped side 100, therefore, passes through
Second side 122 is overlapped with the second arc-shaped side 102, while the binding area of pad 12 is increased, can be made on pad area 10
More pads 12 are set.
Another is alternatively in scheme, and as shown in figure 13, the first side 120 is arc-shaped edges, the first side 120 and the first arc-shaped side
100 overlap (i.e.：Without gap), the space at the first arc-shaped side 100 on pad area 10 can be made full use of, increase pad 12
Bind area；And the second side 122 is straight line, by the way that the second side 122 is designed as into straight line, the difficult processing of pad 12 can be reduced
Degree, and the two-end-point on the second side 122 is located on the second arc-shaped side 102, the second arc-shaped side 102 on pad area 10 can be made full use of
The space at place, further increase the binding area of pad 12, alleviate pad 12 and bind bad situation with other structures.
Understood based on above three scheme, first in 120 and first between arc-shaped side 100 and 122 and second when second
There is the part of coincidence between arc-shaped side 102 so that in the bearing of trend along the first arc-shaped side 100 (the second arc-shaped side 102), respectively
Pad 12 is arranged on pad area 10 in single.In the present embodiment, by the way that each pad 12 is arranged on pad area 10 in single,
On the one hand the binding area of each pad can be increased, on the other hand can reduce the difficulty that each pad 12 is arranged in pad area 10.
As shown in Figure 17 to Figure 20, in another embodiment of the present invention, first at 120 and second 122 is straight
Line side, by 122 being processed into straight line at 120 and second by the first of pad area 10, pad 12 can be greatly reduced
Difficulty of processing, and first while 120 with second while it is 122 parallel, while the binding area of pad 12 is increased, pad area can be improved
10 space availability ratio, so as to set more pads 12 on pad area 10.
Alternatively, as shown in figure 17, the first side 120 and the first arc-shaped side 100 are tangent, and the two-end-point on the second side 122 is located at
On second arc-shaped side 102, so design takes full advantage of the sky at the first arc-shaped side 100 and the second arc-shaped side 10 on pad area 10
Between, so as to improve the binding area of pad 12.
Alternatively, the two-end-point on the first side 120 is equal with the distance between the center of circle of the first arc-shaped side 100 so that first
Line between 120 midpoint and the center of circle of the first arc-shaped side 100 perpendicular to first while 120, wherein, first side 120
Point of contact between midpoint namely the first side 120 and the first arc-shaped side 100, so design can ensure the side of point of contact both sides first
Gap area between 120 and the first arc-shaped side 100 is identical, avoids side gap area excessive, and opposite side gap area is too small,
So as to cause the situation of space waste at the first arc-shaped side 100, the space availability ratio of pad area 10 is effectively increased, it is each in increase
While the binding area of pad 12, it can make to set more pads 12 on pad area 10.
It should be noted that when first in 120 and second 122 when being arc-shaped edges, as shown in Figure 6 to 8, the first side
120 and first arc-shaped side 100 it is separable set, the second side 122 also separates setting with the second arc-shaped side 102；When the first side 120
For straight line, when the second side 122 is arc-shaped edges, as shown in Figure 10 to Figure 12, the first side 120 and the first arc-shaped side 100 are separable
Set, the second side 122 and the second arc-shaped side 102 are also separated and set；When the first side 120 is arc-shaped edges, the second side 122 is straight line
Bian Shi, as shown in Figure 14 to Figure 16, the first side 120 and the separable setting of the first arc-shaped side 100, the second side 122 and the second arc
Side 102 also separates and set；When first in 120 and second, 122 when being straight line, as shown in Figure 18 to Figure 20, the first side
120 and first arc-shaped side 100 it is separable set, the second side 122 also separates setting with the second arc-shaped side 102.
It is designed to, in the case where avoiding pad 12 from exceeding pad area 10, suitably reduce the difficult processing of pad 12 above
Degree, so as to improve the processing efficiency of pad 12.
As shown in Fig. 5 to Figure 20, the pad 12 mentioned in each embodiment also includes connection first at 120 and second 122
The 3rd at 124 and the 4th 126, this 3rd at 124 and the 4th 126 is straight line.By by the 3rd side 124 and the 4th
Side 126 is designed as straight line, on the one hand can reduce the difficulty of processing of pad 12, improves the production efficiency of pad 12, the opposing party
The pad 12 that face is easy on array base palte 1 is aligned with other structures, so as to improve pad 12 and other knots on array base palte 1
The binding efficiency of structure.
Preferably, the 3rd while 124 length be equal to the 4th while 126 length.That is, the pad 12 is axial symmetry knot
Structure, wherein, the symmetry axis of this pad 12 by first at 120 and second 122 midpoint.By the way that pad 12 is arranged into axle pair
Claim structure, on the one hand can reduce the difficulty of processing of pad 12, on the other hand can make full use of the space of pad area 10, increase
While the binding area of each pad 12, it can make to set more pads 12 on pad area 10.
Being previously mentioned array area 14 includes a plurality of leads 142, and one end of each lead 142 enters pad area 10 and welded with one
Disk 12 electrically connects, when the quantity of lead 142 is more, and pad area 10 space it is limited in the case of, as shown in figure 21, can will be each
Pad 12 is at least divided into two rows, often arranges the pad pad 12 that bearing of trend including multiple arcuately sides is arranged successively.Need
Illustrate, the shape of each pad in Figure 21 is not limited only to this, can be any weldering shown in Fig. 5, Fig. 9, Figure 13 and Figure 17
The shape of disk 12.
Preferably, the pad 12 in adjacent two rows pad misplaces on 120 direction when 122 point to first second and set
Put, so design can reduce the cabling distance of lead 142, and reduce the connection difficulty of lead 142 and pad 12.
Based on said structure, present invention also offers a kind of display panel, including the battle array described by any of the above-described embodiment
Row substrate 1.Wherein, the display panel can be liquid crystal display panel or organic electroluminescence display panel.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention, for the skill of this area
For art personnel, the present invention can have various modifications and variations.Within the spirit and principles of the invention, that is made any repaiies
Change, equivalent substitution, improvement etc., should be included in the scope of the protection.
Claims (19)
1. a kind of array base palte, including：
Pad area, the pad area have at least one arc-shaped side；
Multiple pads, each pad are successively set in the pad area along the arc-shaped side, and each pad includes phase
Pair and disjoint first while and when second, first side is adjacent with the arc-shaped side, and the two-end-point on first side it
Between distance and the distance between the two-end-point on second side it is unequal.
2. array base palte according to claim 1, it is characterised in that
When the pad is located at the convex side of the arc-shaped side, described first while the distance between two-end-point be less than described second while
The distance between two-end-point；
When the pad is located at the concave side of the arc-shaped side, described first while the distance between two-end-point be more than described second while
The distance between two-end-point.
3. array base palte according to claim 1, it is characterised in that
The arc-shaped side is at least two, including relative the first arc-shaped side and the second arc-shaped side, and the pad is positioned at described the
Between one arc-shaped side and second arc-shaped side, first arc-shaped side is identical with the concave and convex direction of second arc-shaped side, institute
The first side is stated close to first arc-shaped side, second side close to second arc-shaped side, the two-end-point on first side it
Between distance be less than the distance between the two-end-point on second side.
4. array base palte according to claim 3, it is characterised in that first arc-shaped side and second arc-shaped side are equal
In circular arc, and the center of circle of first arc-shaped side overlaps with the center of circle of second arc-shaped side.
5. array base palte according to claim 4, it is characterised in that described first while the length of side with described second while side
Long ratio is：
The ratio of the radius of first arc-shaped side and the radius of second arc-shaped side.
6. array base palte according to claim 4, it is characterised in that
Described first while and it is described second while at least one of be arc-shaped edges, the center of circle of the arc-shaped edges and first arc
The center of circle on side overlaps.
7. array base palte according to claim 6, it is characterised in that
Described first while and it is described second while be arc-shaped edges, first side overlaps with first arc-shaped side, described second
Side overlaps with second arc-shaped side.
8. array base palte according to claim 6, it is characterised in that
First side is straight line, and second side is arc-shaped edges, and first side and first arc-shaped side are tangent, described
Second side overlaps with second arc-shaped side.
9. array base palte according to claim 4, it is characterised in that described first while and it is described second while be straight line
Side, described first is parallel while with described second.
10. array base palte according to claim 9, it is characterised in that
First side and first arc-shaped side are tangent, and the two-end-point on second side is located on second arc-shaped side.
11. array base palte according to claim 9, it is characterised in that
The two-end-point on first side is equal with the distance between the center of circle of first arc-shaped side.
12. the array base palte according to claim 7 or 9, it is characterised in that
Each pad also include connection described first while and it is described second while the 3rd while and when the 4th, the 3rd side and institute
It is straight line to state the 4th side.
13. array base palte according to claim 12, it is characterised in that
Described 3rd while length be equal to the described 4th while length.
14. array base palte according to claim 1, it is characterised in that
Each pad is at least divided into two row's pad groups, often arrange pad group include multiple bearing of trends along the arc-shaped side according to
The pad of secondary arrangement.
15. array base palte according to claim 14, it is characterised in that
The pad in pad group described in adjacent two row shifts to install on the direction when described second is pointing to described first.
16. array base palte according to claim 1, it is characterised in that also include：
The array area adjacent with the pad area, the array area include a plurality of leads, and one end of the lead enters pad area
Electrically connected with the pad；
Border of at least one arc-shaped side between the array area and the pad area.
17. array base palte according to claim 16, it is characterised in that the array area also includes multiple film crystals
Pipe, the source electrode of the thin film transistor (TFT) or drain electrode electrically connect with the other end of the lead.
18. array base palte according to claim 16, it is characterised in that the array area also includes multiple touch control electrodes,
The touch control electrode electrically connects with the other end of the lead.
19. a kind of display panel, including the array base palte as any one of claim 1 to 18.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711047610.7A CN107808863B (en) | 2017-10-31 | 2017-10-31 | Array substrate and display panel |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711047610.7A CN107808863B (en) | 2017-10-31 | 2017-10-31 | Array substrate and display panel |
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| CN107808863A true CN107808863A (en) | 2018-03-16 |
| CN107808863B CN107808863B (en) | 2020-04-21 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019200654A1 (en) * | 2018-04-19 | 2019-10-24 | 武汉华星光电半导体显示技术有限公司 | Display panel and display apparatus provided with same |
| US10546912B2 (en) | 2018-04-19 | 2020-01-28 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Display panel and display device |
| WO2020253427A1 (en) * | 2019-06-21 | 2020-12-24 | 京东方科技集团股份有限公司 | Display apparatus and electronic device |
| CN113421491A (en) * | 2021-06-17 | 2021-09-21 | 合肥维信诺科技有限公司 | Chip on film, display panel and display device |
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| CN105044960A (en) * | 2015-09-15 | 2015-11-11 | 京东方科技集团股份有限公司 | Substrate for display and wearable equipment |
| US20170168463A1 (en) * | 2015-12-15 | 2017-06-15 | Qualcomm Incorporated | Display panel with minimum borders |
| CN206363681U (en) * | 2016-10-20 | 2017-07-28 | 昆山国显光电有限公司 | Display device, display panel, flexible PCB |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105044960A (en) * | 2015-09-15 | 2015-11-11 | 京东方科技集团股份有限公司 | Substrate for display and wearable equipment |
| US20170168463A1 (en) * | 2015-12-15 | 2017-06-15 | Qualcomm Incorporated | Display panel with minimum borders |
| CN206363681U (en) * | 2016-10-20 | 2017-07-28 | 昆山国显光电有限公司 | Display device, display panel, flexible PCB |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019200654A1 (en) * | 2018-04-19 | 2019-10-24 | 武汉华星光电半导体显示技术有限公司 | Display panel and display apparatus provided with same |
| US10546912B2 (en) | 2018-04-19 | 2020-01-28 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Display panel and display device |
| WO2020253427A1 (en) * | 2019-06-21 | 2020-12-24 | 京东方科技集团股份有限公司 | Display apparatus and electronic device |
| US11329038B2 (en) | 2019-06-21 | 2022-05-10 | Boe Technology Group Co., Ltd. | Display device and electronic equipment |
| CN113421491A (en) * | 2021-06-17 | 2021-09-21 | 合肥维信诺科技有限公司 | Chip on film, display panel and display device |
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| Publication number | Publication date |
|---|---|
| CN107808863B (en) | 2020-04-21 |
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